JP6078700B1 - プリント回路基板、回路、及び回路を製造するための方法 - Google Patents
プリント回路基板、回路、及び回路を製造するための方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 11
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000004065 semiconductor Substances 0.000 claims abstract description 75
- 239000000758 substrate Substances 0.000 claims description 116
- 229910052751 metal Inorganic materials 0.000 claims description 80
- 239000002184 metal Substances 0.000 claims description 80
- 239000011248 coating agent Substances 0.000 claims description 50
- 238000000576 coating method Methods 0.000 claims description 50
- 239000012212 insulator Substances 0.000 claims description 39
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 27
- 229910052802 copper Inorganic materials 0.000 claims description 21
- 239000010949 copper Substances 0.000 claims description 21
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 9
- 239000011810 insulating material Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 8
- 238000001816 cooling Methods 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 229910000881 Cu alloy Inorganic materials 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004922 lacquer Substances 0.000 description 3
- 238000003801 milling Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003187 abdominal effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
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- H01L23/367—Cooling facilitated by shape of device
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Abstract
Description
Claims (22)
- − 金属ベース基板と、
− 1つの表面上で前記金属ベース基板を電気的に絶縁する絶縁層と、
を有するプリント回路基板であって、
前記ベース基板には少なくとも1つの接続領域において前記絶縁層が無く、
− 前記ベース基板は、前記接続領域において金属コーティングされる、
プリント回路基板であって、
− 半導体部品の接点は、前記接続領域の前記金属コーティング上で電気的に接触され、
− 前記半導体部品の非導電領域は前記絶縁層上に乗る、
ことを特徴とするプリント回路基板。 - 前記絶縁層はソルダーレジストであることを特徴とする請求項1に記載のプリント回路基板。
- 前記絶縁層は前記ベース基板にプリントされることを特徴とする請求項1または2に記載のプリント回路基板。
- 前記金属コーティングは錫層であることを特徴とする請求項1〜3の何れか一項に記載のプリント回路基板。
- 前記金属コーティングは前記絶縁層の表面に実質的に面平行であることを特徴とする請求項1〜4の何れか一項に記載のプリント回路基板。
- 前記接点は前記金属コーティングによって前記ベース基板に電気的に接触させられており、前記ベース基板は前記接点を電気回路に接触させる自由端を有することを特徴とする請求項1〜5の何れか一項に記載のプリント回路基板。
- 請求項1のプリント回路基板と、
− 金属ベース基板、
− 1つの表面上で前記金属ベース基板を電気的に絶縁する絶縁体、及び、
− 前記絶縁体上に付着された導電層、
を有する第2のプリント回路基板と、を有する回路であって、
− 前記絶縁体及び前記導電層は少なくとも1つの接触領域において切り取られ、且つ
− 少なくとも1つの金属接触パッドが、前記接触パッドが前記絶縁体及び前記導電層から周囲にわたって離されるように、前記接触領域において前記ベース基板上に配置され、且つ
− 第1のプリント回路基板は、前記第2のプリント回路基板からエアギャップまたは絶縁材料によって空間的に離される、
ことを特徴とする回路。 - 前記接触パッドは前記導電層に実質的に面平行であることを特徴とする請求項7に記載の回路。
- 前記接触パッドは前記接触領域の露光される区域に配置されることを特徴とする請求項7または8に記載の回路。
- 前記接触領域は少なくとも2つの接触パッドを収容するために形成され、且つ前記接触領域には前記絶縁体が無く、且つ/または環状の隙間が前記接触パッドと前記導電層及び/または前記絶縁体との間に配置され、特に前記接触パッドと前記導電層との間の距離は1mm未満であり、とりわけ0.5mm未満であり、好ましくは0.1mm未満であることを特徴とする請求項7〜9の何れか一項に記載の回路。
- 前記接触パッドと前記導電層及び/または前記絶縁体との間に存在する前記隙間には充填材料が無く、且つ/または前記隙間は絶縁層でコーティングされることを特徴とする請求項7〜10の何れか一項に記載の回路。
- 少なくとも1つの接続パッドが前記導電層に電気的に接続されることを特徴とする請求項7〜11の何れか一項に記載の回路。
- 前記接触パッドはパワー半導体のソースまたはドレイン接点に電気的に接触させられ、且つ前記接続パッドは前記パワー半導体のゲート接点に電気的に接触させられることを特徴とする請求項7〜12の何れか一項に記載の回路。
- 前記ソースまたはドレイン接点は、前記第2のプリント回路基板の前記接触パッドによって前記第2のプリント回路基板の前記ベース基板に電気的に接触させられ、且つ/または前記第2のプリント回路基板の前記ベース基板は、前記ソースまたはドレイン接点を電気回路に接触させる自由端を有し、且つ/または前記ゲート接点は、前記導電層に電気的に接触させられ、且つ導電トラックが、前記ゲート接点の制御回路用に前記第2のプリント回路基板の前記導電層上に形成されることを特徴とする請求項13に記載の回路。
- 前記第2のプリント回路基板の少なくとも1つの接続パッド及び/または前記第2のプリント回路基板の少なくとも1つの接触パッドが、前記第2のプリント回路基板の1つの縁の領域に配置され、且つ/または前記第2のプリント回路基板の前記接触領域は、前記第2のプリント回路基板の1つの長手方向縁に沿って配置されることを特徴とする請求項7〜14の何れか一項に記載の回路。
- 前記第2のプリント回路基板の前記接続パッド及び前記第2のプリント回路基板の前記接触パッドは実質的に互いに面平行に配置されることを特徴とする請求項7〜15の何れか一項に記載の回路。
- 前記第2のプリント回路基板の前記ベース基板は少なくとも1mm、好ましくは少なくとも1.5mm、ただし50mm未満の厚さを有すること、及び/または前記第2のプリント回路基板の前記ベース基板は銅もしくは銅合金から成ること、または前記第2のプリント回路基板の前記ベース基板はアルミニウムもしくはアルミニウム合金から成り且つ銅コーティングを有すること、及び/または前記第2のプリント回路基板の前記ベース基板には一端において前記絶縁層が無いこと、及び/または前記第2のプリント回路基板の前記ベース基板の前記自由端は電気的な接続点を形成すること、を特徴とする請求項1〜16の何れか一項に記載の回路。
- 前記プリント回路基板は少なくとも1つの半導体によって相互に機械的に接続されること、並びに/または前記接続領域を有する第1のプリント回路基板の外縁は前記接触領域を収容する前記第2のプリント回路基板の外縁に平行に延びること、並びに/または前記接触領域及び/または前記接触パッドは前記第1のプリント回路基板に対面する前記第2のプリント回路基板の前記外縁上に配置されること、並びに/または前記接続領域及び/または前記金属コーティングは前記第2のプリント回路基板に対面する前記第1のプリント回路基板の前記外縁上に配置されること、並びに/または前記第2のプリント回路基板の前記接触領域及び/または前記接触パッドと前記第1のプリント回路基板の前記接続領域及び/または前記金属コーティングとは互いに対面していること、並びに/または前記第1のプリント回路基板及び前記第2のプリント回路基板に少なくとも1つの同一の半導体が共に実装されること、を特徴とする請求項17に記載の回路。
- 請求項17に記載の回路を製造する方法であって、実装は、前記プリント回路基板間の前記ギャップを架橋する少なくとも1つの半導体を使って行われることを特徴とする方法。
- 請求項1に記載の第1のプリント回路基板及び請求項7に記載の第2のプリント回路基板は、共通の製品キャリア上で実装装置に運ばれることを特徴とする請求項19に記載の方法。
- 請求項1に記載の第1のプリント回路基板及び請求項7に記載の第2のプリント回路基板は、まずモノリシックなベース基板上に形成されること、及び2つの前記プリント回路基板を形成する前記ベース基板は、前記実装の作業の前または後に分離されることを特徴とする請求項20に記載の方法。
- 前記プリント回路基板は前記ベース基板の接続用腹板によって相互に接続されていることを特徴とする請求項21に記載の方法。
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