JP2002043476A - Structure of heat sink - Google Patents
Structure of heat sinkInfo
- Publication number
- JP2002043476A JP2002043476A JP2000222346A JP2000222346A JP2002043476A JP 2002043476 A JP2002043476 A JP 2002043476A JP 2000222346 A JP2000222346 A JP 2000222346A JP 2000222346 A JP2000222346 A JP 2000222346A JP 2002043476 A JP2002043476 A JP 2002043476A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- microcomputer
- heat
- pressure
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電気的動作時にお
ける電子部品の発熱を外部へ放出する放熱板の構造に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a heat radiating plate for radiating heat generated from electronic components to the outside during an electric operation.
【０００２】[0002]
【従来の技術】図７は従来のプリント基板の実装構造を
示す図である。2. Description of the Related Art FIG. 7 is a diagram showing a conventional printed circuit board mounting structure.
【０００３】図８は図７におけるＡ−Ａ断面図である。FIG. 8 is a sectional view taken along the line AA in FIG.
【０００４】プリント基板４上のランドにマイクロコン
ピュータ( 以下マイコンと称する)３等の発熱しうる電
子部品のリード端子１１がはんだによりはんだ付けされ
ている。電気的動作時にはマイコン３等は高温の熱( ８
０〜９０℃程度) を発生し、そのままではマイコン３等
は熱によって壊れてしまう恐れがある。そこで放熱手段
としてプリント基板４の面積に相当し且つ厚さ２ミリの
シリコン製の熱伝導シート２がマイコン３等の上面に対
して密着され、更にその熱伝導シート２の上面にプリン
ト基板４の面積に相当し且つその厚さが熱伝導シート２
よりも若干大きいアルミ製の放熱板１が密着されるよう
に構成してある。このように、プリント基板４の上面全
体に対し熱伝導シート２を介して放熱板１が密着されて
おり、そして図７に示すように放熱板１はネジ９によっ
てプリント基板４を介し、図示せぬシャーシ( 本体) に
固定されている。A lead terminal 11 of a heat-generating electronic component such as a microcomputer 3 is soldered to a land on the printed circuit board 4 by soldering. At the time of electrical operation, the microcomputer 3 etc.
(About 0 to 90 ° C.), and the microcomputer 3 or the like may be broken by heat as it is. Therefore, a heat conductive sheet 2 made of silicon and having a thickness of 2 mm, which is equivalent to the area of the printed circuit board 4 and is closely attached to the upper surface of the microcomputer 3 or the like, and Area corresponding to the area and the thickness of the heat conductive sheet 2
The heat sink 1 made of aluminum, which is slightly larger than the heat sink 1, is configured to be in close contact with the heat sink. In this way, the heat radiating plate 1 is in close contact with the entire upper surface of the printed board 4 via the heat conductive sheet 2, and as shown in FIG. Is fixed to a solid chassis (main body).
【０００５】尚、放熱板１はプリント基板４を全面に覆
っているため、マイコン３等から発生するノイズを外部
へ漏れるのを防止する等電気シールドの役割も兼ねてい
る。Since the heat radiating plate 1 covers the entire surface of the printed circuit board 4, the radiating plate 1 also serves as an electric shield, for example, to prevent noise generated from the microcomputer 3 from leaking to the outside.
【０００６】このようにして実装を行うが、プリント基
板４と放熱板１の間には隙間が生じる事が有り、そのま
までは放熱板１に熱が伝わりにくく、マイコン３自体の
発熱温度が上昇してしまう恐れがある。Although mounting is performed in this manner, a gap may be formed between the printed circuit board 4 and the heat radiating plate 1 and heat is difficult to be transmitted to the heat radiating plate 1 as it is, and the heat generation temperature of the microcomputer 3 itself increases. There is a risk that it will.
【０００７】その為、プリント基板４と放熱板１との間
を埋めて、熱伝導率を上げる必要が有り、実装時におい
て放熱板１の上方から機械により、圧力を加えプリント
基板４と放熱板１との間を密着させるようにしている。Therefore, it is necessary to fill the gap between the printed board 4 and the heat sink 1 to increase the thermal conductivity. At the time of mounting, a pressure is applied from above the heat sink 1 to the printed board 4 and the heat sink by a machine. 1 is brought into close contact.
【０００８】[0008]
【発明が解決しようとする課題】放熱板１は平面である
為、熱伝導シート２を介してマイコン３等の電子部品と
の密着面積が多いが、放熱板１の上方より機械により加
えられる圧力が放熱板１の表面全体に与えられ、熱伝導
シート２を介してマイコン３等の電子部品に加わってし
まう。Since the heat radiating plate 1 is a flat surface, it has a large contact area with the electronic components such as the microcomputer 3 via the heat conductive sheet 2, but the pressure applied by the machine from above the heat radiating plate 1 is large. Is applied to the entire surface of the heat sink 1 and is added to electronic components such as the microcomputer 3 via the heat conductive sheet 2.
【０００９】この圧力によりマイコン３等のはんだ付け
リード端子１１にストレスが加わってしまい、はんだク
ラック、リード端子１１の破損等の不具合が生じる可能
性がある。Due to this pressure, stress is applied to the soldering lead terminals 11 of the microcomputer 3 or the like, and there is a possibility that defects such as solder cracks and breakage of the lead terminals 11 may occur.
【００１０】そこで本発明は上述の問題を解決する事を
目的とする。Therefore, an object of the present invention is to solve the above-mentioned problems.
【００１１】[0011]
【課題を解決するための手段】本発明は上述の課題を解
決するもので、発熱体である電子部品に対して密着され
てなる放熱板において、前記電子部品の密着面に対し、
丸型に突出した凸部が設けられ、該凸部の先端が該電子
部品の密着面へ当接してなることを特徴とするものであ
る。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and a heat radiation plate which is in close contact with an electronic component which is a heating element is provided with a contact surface of the electronic component.
A round-shaped projecting portion is provided, and the tip of the projecting portion comes into contact with the contact surface of the electronic component.
【００１２】また、該凸部が半球状で複数設けられてい
ることを特徴とするものである。[0012] Further, the present invention is characterized in that a plurality of the convex portions are provided in a hemispherical shape.
【００１３】また、該凸部が棒線状で複数設けられてい
ることを特徴とするものである。[0013] Further, a plurality of the protrusions are provided in a bar-like shape.
【００１４】また、前記電子部品の端子配列方向に並行
して前記凸部が配列されてなることを特徴とするもので
ある。[0014] Further, the projections are arranged in parallel with a terminal arrangement direction of the electronic component.
【００１５】[0015]
【発明の実施の形態】次に、本発明の第１実施の形態で
ある放熱板の構造を説明する。Next, the structure of a heat sink according to a first embodiment of the present invention will be described.
【００１６】図１は、本発明の第１実施の形態における
放熱板の構造を示す断面図である。FIG. 1 is a sectional view showing a structure of a heat sink according to a first embodiment of the present invention.
【００１７】本構成は、放熱板１０以外は従来の構成と
同じであるため、同等の構成部分には同じ符号を符し
た。プリント基板４上のランドにマイコン３等の電子部
品のリード端子１１がはんだによりはんだ付けされてい
る。電気的動作時にはマイコン３等は高温の熱( ８０〜
９０℃程度) を発生し、そのままではマイコン３等は熱
によって壊れてしまう恐れがある。そこで放熱手段とし
てプリント基板４の面積に相当し且つ厚さ２ミリのシリ
コン製の熱伝導シート２がマイコン３等の上面に対して
密着され、更にその熱伝導シート２の上面にプリント基
板４の面積に相当し且つその厚さが熱伝導シート２より
も若干大きい、アルミ製の放熱板１０が密着するように
構成してある。このように、プリント基板４の上面全体
に対し熱伝導シート２を介して放熱板１が密着されてお
り、従来技術のように放熱板１０はネジ９によってプリ
ント基板４を介し図示せぬシャーシ( 本体) に固定され
ている。This configuration is the same as the conventional configuration except for the heat radiating plate 10, and the same components are denoted by the same reference numerals. Lead terminals 11 of electronic components such as the microcomputer 3 are soldered to lands on the printed circuit board 4 by soldering. At the time of electrical operation, the microcomputer 3 etc. is heated to a high temperature (80 ~
(Approximately 90 ° C.), and the microcomputer 3 or the like may be broken by heat as it is. Therefore, a heat conductive sheet 2 made of silicon and having a thickness of 2 mm, which is equivalent to the area of the printed circuit board 4 and is closely attached to the upper surface of the microcomputer 3 or the like, and An aluminum radiator plate 10, which corresponds to the area and has a thickness slightly larger than the heat conductive sheet 2, is configured to be in close contact. As described above, the heat radiating plate 1 is in close contact with the entire upper surface of the printed circuit board 4 via the heat conductive sheet 2. (Main body).
【００１８】放熱板１０はアルミ部材からなり、プレス
加工によりマイコン３に相当する位置が凹まされ凹部５
として形成されている。そして放熱板１０の凹部５が熱
伝導シート２を介してマイコン３の上面に、密着するよ
うに形成されている。そして凹部５のマイコン３上の密
着面側には、マイコン３へ突出した丸型形状の凸部６が
マイコン３の表面積内において一定間隔で複数形成され
ており、この凸部６の先端が熱伝導シート２を介してマ
イコン３の上面に密着されている。The heat radiating plate 10 is made of an aluminum member.
It is formed as. The concave portion 5 of the heat sink 10 is formed so as to be in close contact with the upper surface of the microcomputer 3 via the heat conductive sheet 2. A plurality of round-shaped protrusions 6 protruding toward the microcomputer 3 are formed at regular intervals in the surface area of the microcomputer 3 on the contact surface side of the recess 5 on the microcomputer 3. The conductive sheet 2 is in close contact with the upper surface of the microcomputer 3.
【００１９】本実施の形態では凸部６を丸ピンによりプ
レス加工して形成する。このような丸ピンによるプレス
加工によれば、丸ピンを一方向にプレスするだけで凸部
６が形成できるので、手間をかけることなく容易に形成
することができる。In this embodiment, the convex portion 6 is formed by pressing with a round pin. According to the press working using such a round pin, the convex portion 6 can be formed only by pressing the round pin in one direction, so that it can be easily formed without any trouble.
【００２０】図２は図１の上面図である。放熱板１０の
凹部５内に設けられた凸部６のそれぞれは、上面から見
ると円形状であり、これらが複数設けられるようになっ
ている。更に詳細に説明すると図３で示すように、凸部
６はマイコン３へ半球状に突出して形成されている。
尚、本例では１つの凹部５につき８個の凸部を設けるよ
うにしたが、これに限らず凹部の大きさに合わせて適度
その数を設定すれば良い。FIG. 2 is a top view of FIG. Each of the convex portions 6 provided in the concave portion 5 of the heat sink 10 has a circular shape when viewed from the top, and a plurality of these are provided. More specifically, as shown in FIG. 3, the convex portion 6 is formed so as to project hemispherically to the microcomputer 3.
In the present example, eight projections are provided for one recess 5. However, the number is not limited to this, and the number may be appropriately set according to the size of the recess.
【００２１】次に作用について説明する。まずプリント
基板４上にマイコン３を搭載し、リード端子１１をはん
だ付けする。そしてそのマイコン３上面より熱伝導シー
ト２を被せ、更にその上部に放熱板１０を搭載する。こ
の時、放熱板１０の位置は、凹部５とマイコン３とが対
応するように設置する。Next, the operation will be described. First, the microcomputer 3 is mounted on the printed board 4, and the lead terminals 11 are soldered. Then, the heat conductive sheet 2 is put on the microcomputer 3 from above, and a heat sink 10 is mounted on the heat conductive sheet 2. At this time, the position of the heat sink 10 is set so that the recess 5 and the microcomputer 3 correspond to each other.
【００２２】次にマイコン３と放熱板１０の間を密着さ
せる為、実装時において放熱板１０の上から圧力機で圧
力を加える。この時、圧力を加えながら密着させつつ
も、過度の圧力が加わらないようにする。これと共に図
７に示すネジ９によりプリント基板４及び放熱板１０を
図示せぬシャーシに固定する。Next, in order to bring the microcomputer 3 into close contact with the radiator plate 10, pressure is applied from above the radiator plate 10 by a pressure machine during mounting. At this time, an excessive pressure is prevented from being applied while the pressure is applied and the substrates are brought into close contact with each other. At the same time, the printed circuit board 4 and the heat sink 10 are fixed to a chassis (not shown) by screws 9 shown in FIG.
【００２３】以上説明したように第一実施の形態におい
て、圧力機で放熱板１０の上から圧力をかけるが、放熱
板１０の凹部５に設けられた凸部６が半球状であるた
め、放熱板１０の熱伝導シート２を介してマイコン３に
当接する面は点接触であり、上よりかけられた圧力は、
凸部６の半球状に沿って各方向に分散し、マイコン３に
直接真下に加わる圧力は小さくなる。これにより、マイ
コン３のはんだ付けリード端子１１部にかかるストレス
が少なくなり、はんだクラックやリード端子１１の破損
等の不具合の発生を回避できる。As described above, in the first embodiment, pressure is applied from above the heat radiating plate 10 by the pressure machine. However, since the convex portion 6 provided in the concave portion 5 of the heat radiating plate 10 is hemispheric, The surface of the plate 10 that contacts the microcomputer 3 via the heat conductive sheet 2 is a point contact, and the pressure applied from above is
The light is dispersed in each direction along the hemisphere of the convex portion 6, and the pressure applied directly below the microcomputer 3 is reduced. Accordingly, stress applied to the soldering lead terminals 11 of the microcomputer 3 is reduced, and it is possible to avoid problems such as solder cracks and breakage of the lead terminals 11.
【００２４】しかも、凸部６先端は熱伝導シート２を介
してマイコン３の上面に密接されたままであり、放熱性
も損なわれない。Moreover, the tip of the convex portion 6 is kept in close contact with the upper surface of the microcomputer 3 via the heat conductive sheet 2, and the heat radiation is not impaired.
【００２５】本実施の形態では放熱板１０の該凸部６の
形状を半球状にしているが、これだけにこだわらず、図
４に示すように、該凸部７の形状を先端が丸みを帯びた
長い棒線状を複数並列的に配列したり、図５に示すよう
に、該凸部８の形状を先端が丸みを帯びた短い棒線状を
千鳥状に配列するようにしても良い。In the present embodiment, the shape of the convex portion 6 of the heat sink 10 is hemispherical. However, the shape of the convex portion 7 is not limited to this, but may be rounded at the tip as shown in FIG. A plurality of long rods may be arranged in parallel, or as shown in FIG. 5, the protruding portions 8 may be arranged in a staggered short rod shape with a rounded tip.
【００２６】以上説明した実施の形態では、その四方向
にそれぞれリード端子が配列されているマイコン３につ
いて説明したが、更に図６に示すように電子部品のリー
ド端子が２方向のみに設けられている時は、凸部６、凸
部７、凸部８をリード端子１１の配列方向（α) に沿っ
て並行に配列すれば良い（図６(a) 及至(c))。このよう
にすればリード端子１１に対する圧力を効率よく分散さ
せることができる。尚、本実施の形態においてはマイコ
ン３に適用したが、これに限らずトランジスタＩＣ等に
適用しても良い。また仕様によっては熱伝導シート２を
設けず、直接凸部と電子部品とを密着させても良い。In the embodiment described above, the microcomputer 3 in which the lead terminals are arranged in the four directions is described. However, as shown in FIG. 6, the lead terminals of the electronic parts are provided only in two directions. In this case, the protrusions 6, 7, and 8 may be arranged in parallel along the arrangement direction (α) of the lead terminals 11 (FIGS. 6A to 6C). In this way, the pressure on the lead terminals 11 can be efficiently dispersed. In the present embodiment, the present invention is applied to the microcomputer 3, but is not limited thereto, and may be applied to a transistor IC or the like. Further, depending on the specification, the convex portion and the electronic component may be directly adhered without providing the heat conductive sheet 2.
【００２７】[0027]
【発明の効果】以上詳細に説明したように、本発明によ
れば、放熱板において、発熱体である電子部品に相当す
る位置に、丸型形状の凸部を形成する事で、電子部品に
加わる圧力を減らすことができ、放熱性を損なうことな
くリード端子等の破損を防止することができる。As described above in detail, according to the present invention, by forming a round-shaped convex portion on a heat sink at a position corresponding to an electronic component which is a heating element, an electronic component can be formed. The applied pressure can be reduced, and damage to the lead terminals and the like can be prevented without impairing the heat radiation.
【図１】本発明の第１実施の形態の放熱板の構成を示す
断面図である。FIG. 1 is a cross-sectional view illustrating a configuration of a heat sink according to a first embodiment of the present invention.
【図２】本発明の第１実施の形態の放熱板を示す上面図
である。FIG. 2 is a top view showing the heat sink according to the first embodiment of the present invention.
【図３】本発明の第１実施の形態の放熱板の凹部を示す
構造図である。FIG. 3 is a structural view showing a concave portion of the heat sink according to the first embodiment of the present invention.
【図４】本発明の第１実施の形態の放熱板の凹部の変形
例を示す構造図である。FIG. 4 is a structural view showing a modification of the concave portion of the heat sink according to the first embodiment of the present invention.
【図５】本発明の第１実施の形態の放熱板の凹部の更な
る変形例を示す構造図である。FIG. 5 is a structural view showing a further modified example of the concave portion of the heat sink according to the first embodiment of the present invention.
【図６】電子部品に対する放熱板の凸部の配置図であ
る。FIG. 6 is an arrangement diagram of a convex portion of a heat sink with respect to an electronic component.
【図７】従来のプリント基板の実装構造図である。FIG. 7 is a mounting structure diagram of a conventional printed circuit board.
【図８】図７におけるＡ−Ａ断面図である。8 is a sectional view taken along the line AA in FIG. 7;
１、１０・・・・放熱板 ２・・・・熱伝導シート ３・・・・マイコン ４・・・・プリント基板 ５・・・・凹部 ６・・・・凸部 ７・・・第二形状の凸部 ８・・・第三形状の凸部 ９・・・ネジ １１・・・リード端子 1, 10,... Radiator plate 2,... Thermal conductive sheet 3,... Microcomputer 4,... Printed circuit board 5,. Projection 8 of third shape projection 9 Screw 11 Lead terminal
Claims (4)
てなる放熱板の構造において、前記電子部品の密着面に
対し、丸型に突出した凸部が設けられ、該凸部の先端が
該電子部品の密着面へ当接してなることを特徴とする放
熱板の構造。In a structure of a heat radiating plate which is in close contact with an electronic component which is a heating element, a round-shaped projecting portion is provided on a contact surface of said electronic component, and a tip of said projecting portion is provided. A structure of a heat sink, wherein the heat sink is in contact with a contact surface of the electronic component.
とを特徴とする請求項１記載の放熱板の構造。2. The structure of a heat sink according to claim 1, wherein a plurality of said convex portions are provided in a hemispherical shape.
とを特徴とする請求項１記載の放熱板の構造。3. The structure of a heat sink according to claim 1, wherein a plurality of said protrusions are provided in a bar shape.
前記凸部が配列されてなることを特徴とする請求項２又
は請求項３記載の放熱板の構造。4. The structure of the heat radiating plate according to claim 2, wherein the projections are arranged in parallel with a terminal arrangement direction of the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000222346A JP2002043476A (en) | 2000-07-24 | 2000-07-24 | Structure of heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000222346A JP2002043476A (en) | 2000-07-24 | 2000-07-24 | Structure of heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002043476A true JP2002043476A (en) | 2002-02-08 |
Family
ID=18716601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000222346A Withdrawn JP2002043476A (en) | 2000-07-24 | 2000-07-24 | Structure of heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002043476A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100683728B1 (en) | 2004-12-06 | 2007-02-15 | 삼성에스디아이 주식회사 | Structure for heat dissipation of integrated circuit chip, and display module equipped with the same |
| JP2007201039A (en) * | 2006-01-25 | 2007-08-09 | Hitachi Communication Technologies Ltd | Heat dissipating structure of electronic equipment |
| JP2007329338A (en) * | 2006-06-08 | 2007-12-20 | Yamatake Corp | Heat dissipation structure in electronic instrument |
| KR101067980B1 (en) * | 2009-12-28 | 2011-09-26 | 주식회사 케이이씨 | Power semiconductor package and manufacture method thereof |
| WO2012008398A1 (en) * | 2010-07-16 | 2012-01-19 | シャープ株式会社 | Electronic apparatus and display unit |
| JP2013232654A (en) * | 2013-06-05 | 2013-11-14 | Denso Corp | Electronic control device |
-
2000
- 2000-07-24 JP JP2000222346A patent/JP2002043476A/en not_active Withdrawn
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100683728B1 (en) | 2004-12-06 | 2007-02-15 | 삼성에스디아이 주식회사 | Structure for heat dissipation of integrated circuit chip, and display module equipped with the same |
| JP2007201039A (en) * | 2006-01-25 | 2007-08-09 | Hitachi Communication Technologies Ltd | Heat dissipating structure of electronic equipment |
| JP2007329338A (en) * | 2006-06-08 | 2007-12-20 | Yamatake Corp | Heat dissipation structure in electronic instrument |
| KR101067980B1 (en) * | 2009-12-28 | 2011-09-26 | 주식회사 케이이씨 | Power semiconductor package and manufacture method thereof |
| WO2012008398A1 (en) * | 2010-07-16 | 2012-01-19 | シャープ株式会社 | Electronic apparatus and display unit |
| JP2013232654A (en) * | 2013-06-05 | 2013-11-14 | Denso Corp | Electronic control device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2001168562A (en) | Cooling device of circuit module, and electronic equipment therewith | |
| JPH10260230A (en) | Apparatus for cooling heat-generating body | |
| JPH06309532A (en) | Ic card | |
| JP2002043476A (en) | Structure of heat sink | |
| JP2008277327A (en) | Electronic apparatus | |
| KR100598652B1 (en) | Semiconductor device | |
| JPH06318486A (en) | Ic part mounting pin socket and collective socket | |
| JPH10294580A (en) | Heat transfer component for heat generating body | |
| JPH0997661A (en) | Receptacle for electronic part | |
| KR101281043B1 (en) | Heat sink | |
| JPH11163232A (en) | Heat radiating device of electric component | |
| JPH02278856A (en) | Semiconductor integrated circuit device | |
| JPH0439957A (en) | Heat sink of semiconductor package | |
| JPH0622995Y2 (en) | Fixed structure of semiconductor element | |
| CN218158692U (en) | DMD packaging and heat dissipation structure for optical machine, heat dissipation pressing plate and projection optical machine | |
| JP2564645Y2 (en) | Hybrid integrated circuit device having heat-generating components | |
| CN220307683U (en) | Image acquisition equipment | |
| JP2005072104A (en) | Radiation structure of power module | |
| CN111954428B (en) | Heat radiation structure and electronic component with same | |
| JP2018181686A (en) | Light emitting element module | |
| JP3813120B2 (en) | Semiconductor device package | |
| JP3714808B2 (en) | Semiconductor device | |
| JPH10242675A (en) | Heat dissipation structure in electronic apparatus | |
| JP2005093924A (en) | Electronic component mounted module | |
| JPH06209175A (en) | Heat conduction method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20071002 |