JP6027058B2 - 積層セラミックキャパシタ及びその実装基板 - Google Patents
積層セラミックキャパシタ及びその実装基板 Download PDFInfo
- Publication number
- JP6027058B2 JP6027058B2 JP2014144795A JP2014144795A JP6027058B2 JP 6027058 B2 JP6027058 B2 JP 6027058B2 JP 2014144795 A JP2014144795 A JP 2014144795A JP 2014144795 A JP2014144795 A JP 2014144795A JP 6027058 B2 JP6027058 B2 JP 6027058B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic body
- ceramic capacitor
- multilayer ceramic
- disposed
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000003985 ceramic capacitor Substances 0.000 title claims description 70
- 239000000919 ceramic Substances 0.000 claims description 144
- 239000000758 substrate Substances 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000010304 firing Methods 0.000 description 5
- 239000002002 slurry Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130084041A KR20140038872A (ko) | 2013-07-17 | 2013-07-17 | 적층 세라믹 커패시터 및 그 실장 기판 |
KR10-2013-0084041 | 2013-07-17 | ||
KR1020140080924A KR101659152B1 (ko) | 2013-07-17 | 2014-06-30 | 적층 세라믹 커패시터 및 그 실장 기판 |
KR10-2014-0080924 | 2014-06-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015023287A JP2015023287A (ja) | 2015-02-02 |
JP6027058B2 true JP6027058B2 (ja) | 2016-11-16 |
Family
ID=50647000
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014144795A Active JP6027058B2 (ja) | 2013-07-17 | 2014-07-15 | 積層セラミックキャパシタ及びその実装基板 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6027058B2 (ko) |
KR (3) | KR20140038872A (ko) |
CN (1) | CN104299779A (ko) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015019083A (ja) | 2014-08-13 | 2015-01-29 | 株式会社村田製作所 | 積層コンデンサ及び積層コンデンサの実装構造体 |
JP2014222783A (ja) | 2014-08-13 | 2014-11-27 | 株式会社村田製作所 | 積層コンデンサ及び積層コンデンサの実装構造体 |
JP2014239259A (ja) | 2014-08-13 | 2014-12-18 | 株式会社村田製作所 | 積層コンデンサ及び積層コンデンサの実装構造体 |
JP2015019079A (ja) | 2014-08-13 | 2015-01-29 | 株式会社村田製作所 | 積層セラミック電子部品 |
JP2014220528A (ja) | 2014-08-13 | 2014-11-20 | 株式会社村田製作所 | 積層コンデンサ |
JP2014241452A (ja) | 2014-08-13 | 2014-12-25 | 株式会社村田製作所 | 積層セラミック電子部品 |
JP2015065455A (ja) | 2014-11-13 | 2015-04-09 | 株式会社村田製作所 | 3端子型コンデンサ |
JP2015035630A (ja) | 2014-11-13 | 2015-02-19 | 株式会社村田製作所 | 3端子型コンデンサ |
JP2015079980A (ja) | 2014-12-04 | 2015-04-23 | 株式会社村田製作所 | 3端子型コンデンサ |
US9214282B1 (en) | 2014-12-08 | 2015-12-15 | Murata Manufacturing Co., Ltd. | Three-terminal capacitor |
KR101771798B1 (ko) | 2015-08-26 | 2017-08-25 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
KR102198538B1 (ko) * | 2015-12-29 | 2021-01-06 | 삼성전기주식회사 | 적층 전자 부품 |
KR101813365B1 (ko) | 2016-03-22 | 2017-12-28 | 삼성전기주식회사 | 적층형 커패시터 및 그 실장 기판 |
KR102483618B1 (ko) | 2016-03-23 | 2023-01-02 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
JP6851174B2 (ja) * | 2016-10-26 | 2021-03-31 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
KR102613871B1 (ko) | 2016-11-23 | 2023-12-15 | 삼성전기주식회사 | 적층형 커패시터 및 그 실장 기판 |
JP6816817B2 (ja) | 2017-03-03 | 2021-01-20 | 株式会社村田製作所 | 積層セラミックコンデンサおよびその製造方法 |
KR101939083B1 (ko) * | 2017-03-29 | 2019-01-16 | 삼성전기 주식회사 | 적층형 커패시터 및 그 제조방법 |
JP7480480B2 (ja) * | 2018-10-11 | 2024-05-10 | 株式会社村田製作所 | 電子部品 |
JP7476493B2 (ja) * | 2018-10-11 | 2024-05-01 | 株式会社村田製作所 | 電子部品 |
US11462360B2 (en) * | 2020-01-23 | 2022-10-04 | Samsung Electro-Mechanics Co., Ltd. | Multilayer electronic component |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH081875B2 (ja) * | 1989-09-08 | 1996-01-10 | 株式会社村田製作所 | 積層コンデンサ |
JPH11312624A (ja) * | 1998-04-28 | 1999-11-09 | Kyocera Corp | 積層セラミックコンデンサ |
US6950300B2 (en) * | 2003-05-06 | 2005-09-27 | Marvell World Trade Ltd. | Ultra low inductance multi layer ceramic capacitor |
JP2006086359A (ja) * | 2004-09-16 | 2006-03-30 | Taiyo Yuden Co Ltd | 積層セラミックコンデンサ |
JP2006100646A (ja) * | 2004-09-30 | 2006-04-13 | Taiyo Yuden Co Ltd | 積層コンデンサ |
JP2006100682A (ja) * | 2004-09-30 | 2006-04-13 | Taiyo Yuden Co Ltd | 3端子型積層コンデンサ実装回路基板及び3端子型積層コンデンサ |
JP2006114806A (ja) * | 2004-10-18 | 2006-04-27 | Taiyo Yuden Co Ltd | 回路基板 |
JP5023069B2 (ja) * | 2006-10-06 | 2012-09-12 | 三洋電機株式会社 | 電気素子 |
KR100900673B1 (ko) * | 2007-01-31 | 2009-06-01 | 삼성전기주식회사 | 적층형 칩 커패시터 |
US7920370B2 (en) * | 2007-02-05 | 2011-04-05 | Samsung Electro-Mechanics Co., Ltd. | Multilayer chip capacitor |
US8238116B2 (en) * | 2007-04-13 | 2012-08-07 | Avx Corporation | Land grid feedthrough low ESL technology |
JP2010177717A (ja) * | 2007-05-21 | 2010-08-12 | Sanyo Electric Co Ltd | 電気素子およびその製造方法 |
JP2009026872A (ja) * | 2007-07-18 | 2009-02-05 | Taiyo Yuden Co Ltd | 積層コンデンサ |
GB0816637D0 (en) | 2008-09-12 | 2008-10-22 | Rolls Royce Plc | Blade Pitch Control |
JP5343997B2 (ja) * | 2011-04-22 | 2013-11-13 | Tdk株式会社 | 積層コンデンサの実装構造 |
KR101525645B1 (ko) * | 2011-09-02 | 2015-06-03 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
JP5810956B2 (ja) * | 2012-02-13 | 2015-11-11 | 株式会社村田製作所 | 積層セラミックコンデンサの製造方法及び積層セラミックコンデンサ |
KR101422946B1 (ko) * | 2012-12-11 | 2014-07-23 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 제조 방법 |
-
2013
- 2013-07-17 KR KR1020130084041A patent/KR20140038872A/ko active Search and Examination
- 2013-11-11 CN CN201310556896.7A patent/CN104299779A/zh not_active Withdrawn
-
2014
- 2014-06-30 KR KR1020140080924A patent/KR101659152B1/ko active IP Right Grant
- 2014-07-15 JP JP2014144795A patent/JP6027058B2/ja active Active
-
2016
- 2016-08-26 KR KR1020160109349A patent/KR101912279B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP2015023287A (ja) | 2015-02-02 |
KR20140038872A (ko) | 2014-03-31 |
CN104299779A (zh) | 2015-01-21 |
KR20160106026A (ko) | 2016-09-09 |
KR101659152B1 (ko) | 2016-09-22 |
KR20150009922A (ko) | 2015-01-27 |
KR101912279B1 (ko) | 2018-10-29 |
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