JP5930901B2 - エポキシ樹脂の加工方法 - Google Patents
エポキシ樹脂の加工方法 Download PDFInfo
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- JP5930901B2 JP5930901B2 JP2012163766A JP2012163766A JP5930901B2 JP 5930901 B2 JP5930901 B2 JP 5930901B2 JP 2012163766 A JP2012163766 A JP 2012163766A JP 2012163766 A JP2012163766 A JP 2012163766A JP 5930901 B2 JP5930901 B2 JP 5930901B2
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- epoxy resin
- grinding
- chemical solution
- grooves
- csp
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- 239000003822 epoxy resin Substances 0.000 title claims description 44
- 229920000647 polyepoxide Polymers 0.000 title claims description 44
- 238000003672 processing method Methods 0.000 title claims description 6
- 238000000227 grinding Methods 0.000 claims description 36
- 239000000126 substance Substances 0.000 claims description 28
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 description 19
- 239000000243 solution Substances 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 239000002184 metal Substances 0.000 description 9
- 239000007788 liquid Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000000565 sealant Substances 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000008155 medical solution Substances 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Images
Landscapes
- Treatments Of Macromolecular Shaped Articles (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
12 薬液
13 シリコンウエーハ
14 スピンナ洗浄装置
15 エポキシ樹脂
16 スピンナテーブル
17 溝
32 研削ユニット
38 研削ホイール
44 研削砥石
Claims (1)
- エポキシ樹脂の加工方法であって、
エポキシ樹脂の外周縁に到達しない複数の溝をエポキシ樹脂の被研削面に形成する溝形成ステップと、
該溝形成ステップを実施した後、該複数の溝にエポキシ樹脂と反応してエポキシ樹脂を脆弱化させる薬液を充填して所定時間経過させる薬液充填ステップと、
該薬液充填ステップを実施した後、該複数の溝から該薬液を除去する薬液除去ステップと、
該薬液除去ステップを実施した後、エポキシ樹脂の被研削面を研削砥石で研削する研削ステップと、
を含むことを特徴とするエポキシ樹脂の加工方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2012163766A JP5930901B2 (ja) | 2012-07-24 | 2012-07-24 | エポキシ樹脂の加工方法 |
Applications Claiming Priority (1)
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JP2012163766A JP5930901B2 (ja) | 2012-07-24 | 2012-07-24 | エポキシ樹脂の加工方法 |
Publications (2)
Publication Number | Publication Date |
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JP2014024882A JP2014024882A (ja) | 2014-02-06 |
JP5930901B2 true JP5930901B2 (ja) | 2016-06-08 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2012163766A Active JP5930901B2 (ja) | 2012-07-24 | 2012-07-24 | エポキシ樹脂の加工方法 |
Country Status (1)
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JP (1) | JP5930901B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019077022A (ja) * | 2017-10-27 | 2019-05-23 | 株式会社ディスコ | 被加工物の加工方法 |
JP6896347B2 (ja) * | 2017-10-27 | 2021-06-30 | 株式会社ディスコ | 被加工物の加工方法 |
JP6896346B2 (ja) * | 2017-10-27 | 2021-06-30 | 株式会社ディスコ | 被加工物の加工方法 |
JP2019077020A (ja) * | 2017-10-27 | 2019-05-23 | 株式会社ディスコ | 被加工物の加工方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2011225799A (ja) * | 2010-03-30 | 2011-11-10 | Sekisui Chem Co Ltd | 研磨処理硬化物の製造方法、積層体及び積層体の製造方法 |
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- 2012-07-24 JP JP2012163766A patent/JP5930901B2/ja active Active
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JP2014024882A (ja) | 2014-02-06 |
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