JP5919200B2 - 硬化性エポキシ樹脂組成物 - Google Patents
硬化性エポキシ樹脂組成物 Download PDFInfo
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- JP5919200B2 JP5919200B2 JP2012551829A JP2012551829A JP5919200B2 JP 5919200 B2 JP5919200 B2 JP 5919200B2 JP 2012551829 A JP2012551829 A JP 2012551829A JP 2012551829 A JP2012551829 A JP 2012551829A JP 5919200 B2 JP5919200 B2 JP 5919200B2
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- epoxy resin
- optical semiconductor
- compound
- curable epoxy
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- 150000001875 compounds Chemical class 0.000 claims description 70
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- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
- Led Device Packages (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
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JP2011002481 | 2011-01-07 | ||
JP2011002481 | 2011-01-07 | ||
PCT/JP2011/079688 WO2012093590A1 (ja) | 2011-01-07 | 2011-12-21 | 硬化性エポキシ樹脂組成物 |
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JP5919200B2 true JP5919200B2 (ja) | 2016-05-18 |
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JP (1) | JP5919200B2 (zh) |
KR (1) | KR20140009201A (zh) |
CN (1) | CN103168060A (zh) |
TW (1) | TW201235375A (zh) |
WO (1) | WO2012093590A1 (zh) |
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JP5988791B2 (ja) * | 2012-09-12 | 2016-09-07 | 株式会社ダイセル | 硬化性エポキシ樹脂組成物 |
TWI661037B (zh) * | 2014-12-03 | 2019-06-01 | 日商信越化學工業股份有限公司 | 光半導體元件封裝用熱固性環氧樹脂組合物及使用其的光半導體裝置 |
CN106151521B (zh) * | 2016-08-18 | 2018-08-28 | 福建东南造船有限公司 | 一种船用空气流量计的裂纹密封方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2002003582A (ja) * | 2000-04-17 | 2002-01-09 | Mitsubishi Electric Corp | 液状熱硬化性樹脂組成物およびこれを用いた絶縁コイルの製造方法 |
JP2003277591A (ja) * | 2002-03-26 | 2003-10-02 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物、プリプレグ及び積層板 |
JP2007051217A (ja) * | 2005-08-18 | 2007-03-01 | Daicel Chem Ind Ltd | 硬化性樹脂組成物及び光導波路 |
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JP3477111B2 (ja) * | 1999-06-01 | 2003-12-10 | 四国化成工業株式会社 | 熱硬化性エポキシ樹脂組成物 |
JP5638812B2 (ja) * | 2010-02-01 | 2014-12-10 | 株式会社ダイセル | 硬化性エポキシ樹脂組成物 |
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2011
- 2011-12-21 KR KR1020137013077A patent/KR20140009201A/ko not_active Application Discontinuation
- 2011-12-21 CN CN201180048618XA patent/CN103168060A/zh active Pending
- 2011-12-21 JP JP2012551829A patent/JP5919200B2/ja active Active
- 2011-12-21 WO PCT/JP2011/079688 patent/WO2012093590A1/ja active Application Filing
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2002003582A (ja) * | 2000-04-17 | 2002-01-09 | Mitsubishi Electric Corp | 液状熱硬化性樹脂組成物およびこれを用いた絶縁コイルの製造方法 |
JP2003277591A (ja) * | 2002-03-26 | 2003-10-02 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物、プリプレグ及び積層板 |
JP2007051217A (ja) * | 2005-08-18 | 2007-03-01 | Daicel Chem Ind Ltd | 硬化性樹脂組成物及び光導波路 |
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KR20140009201A (ko) | 2014-01-22 |
WO2012093590A1 (ja) | 2012-07-12 |
CN103168060A (zh) | 2013-06-19 |
TW201235375A (en) | 2012-09-01 |
JPWO2012093590A1 (ja) | 2014-06-09 |
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