JP5892707B2 - Oledデバイス及び同デバイスを製造する方法 - Google Patents
Oledデバイス及び同デバイスを製造する方法 Download PDFInfo
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- JP5892707B2 JP5892707B2 JP2013519198A JP2013519198A JP5892707B2 JP 5892707 B2 JP5892707 B2 JP 5892707B2 JP 2013519198 A JP2013519198 A JP 2013519198A JP 2013519198 A JP2013519198 A JP 2013519198A JP 5892707 B2 JP5892707 B2 JP 5892707B2
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- conductive
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- transfer
- oled device
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- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000010410 layer Substances 0.000 claims description 69
- 229910052751 metal Inorganic materials 0.000 claims description 52
- 239000002184 metal Substances 0.000 claims description 52
- 239000011241 protective layer Substances 0.000 claims description 51
- 238000000034 method Methods 0.000 claims description 37
- 239000012044 organic layer Substances 0.000 claims description 18
- 238000005260 corrosion Methods 0.000 claims description 15
- 230000007797 corrosion Effects 0.000 claims description 15
- 239000000565 sealant Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 15
- 239000011888 foil Substances 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 9
- 239000008393 encapsulating agent Substances 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 2
- 229920003023 plastic Polymers 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 description 21
- 239000000853 adhesive Substances 0.000 description 20
- 239000000463 material Substances 0.000 description 17
- 150000002739 metals Chemical class 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 229910052750 molybdenum Inorganic materials 0.000 description 6
- 239000011733 molybdenum Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000013590 bulk material Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
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- 238000003825 pressing Methods 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
- H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/88—Terminals, e.g. bond pads
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
Description
Claims (9)
- OLEDデバイスを製造する方法であって、
複数の導電性ストリップを基板上に与えるステップと、
当該基板上の前記導電性ストリップによって仕切られた領域内に有機層を配置するステップと、
前記OLEDデバイスを封止するために、封止剤を前記導電性ストリップ上へ与えるステップと、
各導電性ストリップ上へ導電性の保護層を、前記封止剤の外にある導電性ストリップの表面のみが当該導電性の保護層によって保護されるように、部分的に配置するステップと、
を含み、前記導電性の保護層を与えるステップが、転写層の一部又は一連の転写層をキャリアから転写するステップを含む、方法。 - 前記キャリアがプラスチックの箔を有する、請求項1に記載の方法。
- 前記導電性ストリップ上へ前記導電性の保護層を配置するステップが、前記転写層の一部を前記キャリアから前記導電性ストリップ上に転写するためにレーザ転写を実行するステップを含む、請求項1に記載の方法。
- 前記レーザ転写を実行するステップが、前記転写層が少なくとも部分的に前記導電性ストリップ上に転写されるよう、当該転写層の特定の場所にエネルギを堆積させるステップを含む、請求項3に記載の方法。
- 前記転写層が前記有機層と直接接触するよう、前記キャリアが前記有機層に対して配置される、請求項1乃至4の何れか一項に記載の方法。
- 前記導電性の保護層を前記導電性ストリップ上へ与えるステップが、前記OLEDデバイスを封止するステップに先行する、請求項1乃至4の何れか一項に記載の方法。
- OLEDデバイスであって、
基板上へ与えられた複数の導電性ストリップと、
前記基板上の前記導電性ストリップに仕切られた領域の中に配置された有機層と、
前記導電性ストリップとの間に電気的な接触が構築されるように、当該導電性ストリップに当接するよう配置された導電性の保護層と、
前記OLEDデバイスを封止するための封止剤であって、前記導電性ストリップの表面が前記導電性の保護層により保護されるよう、前記導電性の保護層と前記導電性ストリップとの境界に与えられた封止剤と、
を有する、OLEDデバイス。 - 前記導電性の保護層が少なくとも一つの耐腐食性金属を有する、請求項7に記載のOLEDデバイス。
- 前記導電性の保護層が厚くても1.0μm、より好ましくは0.3μm、最も好ましくは100 nmの厚さを有する、請求項7に記載のOLEDデバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10169821 | 2010-07-16 | ||
EP10169821.5 | 2010-07-16 | ||
PCT/IB2011/053071 WO2012007893A1 (en) | 2010-07-16 | 2011-07-11 | An oled device and a method of manufacturing the same |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013534706A JP2013534706A (ja) | 2013-09-05 |
JP2013534706A5 JP2013534706A5 (ja) | 2014-08-28 |
JP5892707B2 true JP5892707B2 (ja) | 2016-03-23 |
Family
ID=44544293
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013519198A Expired - Fee Related JP5892707B2 (ja) | 2010-07-16 | 2011-07-11 | Oledデバイス及び同デバイスを製造する方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8829787B2 (ja) |
EP (1) | EP2593980B1 (ja) |
JP (1) | JP5892707B2 (ja) |
KR (1) | KR101947194B1 (ja) |
CN (1) | CN102986053B (ja) |
WO (1) | WO2012007893A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014199673A1 (ja) * | 2013-06-11 | 2014-12-18 | シャープ株式会社 | 有機エレクトロルミネッセンス表示装置 |
FR3017996A1 (fr) * | 2014-02-25 | 2015-08-28 | Commissariat Energie Atomique | Dispositif a composant electronique |
KR102422061B1 (ko) | 2017-11-28 | 2022-07-18 | 엘지디스플레이 주식회사 | Oled 조명 장치 |
KR102338064B1 (ko) | 2021-06-11 | 2021-12-13 | 주식회사 올레드링크 | Oled 패널 제조방법 |
KR102337855B1 (ko) | 2021-09-03 | 2021-12-13 | 주식회사 올레드링크 | 개선된 증착 효과를 가지는 oled 패널 제조방법 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002039513A1 (en) * | 2000-11-08 | 2002-05-16 | Koninklijke Philips Electronics N.V. | Electro-optical device |
JP4551592B2 (ja) * | 2001-08-14 | 2010-09-29 | パイオニア株式会社 | 配線付き基体 |
JP2003272832A (ja) | 2002-03-13 | 2003-09-26 | Denso Corp | 有機el素子およびその製造方法 |
JP2003297584A (ja) * | 2002-04-04 | 2003-10-17 | Asahi Glass Co Ltd | 配線付き基体形成用積層体、配線付き基体およびその形成方法 |
JP4469126B2 (ja) * | 2002-06-14 | 2010-05-26 | 龍男 内田 | ディスプレイとそれに用いる配線基板 |
JP2004047316A (ja) * | 2002-07-12 | 2004-02-12 | Sharp Corp | 有機led素子とその製造方法および表示装置 |
JP3649238B2 (ja) * | 2002-10-17 | 2005-05-18 | 旭硝子株式会社 | 積層体、配線付き基体、有機el表示素子、有機el表示素子の接続端子及びそれらの製造方法 |
CN100517797C (zh) * | 2002-10-17 | 2009-07-22 | 旭硝子株式会社 | 层压体、带配线的基体、有机el显示元件、有机el显示元件的连接端子及它们的制造方法 |
JP2005305714A (ja) * | 2004-04-19 | 2005-11-04 | Asahi Glass Co Ltd | 配線付き基体形成用積層体とその形成方法および配線付き基体 |
KR20070073824A (ko) * | 2004-09-27 | 2007-07-10 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 조명 시스템 |
KR100647677B1 (ko) * | 2005-02-04 | 2006-11-23 | 삼성에스디아이 주식회사 | 금속 보강층을 포함하는 유기 전계 발광 소자 및 그제조방법 |
FR2904508B1 (fr) * | 2006-07-28 | 2014-08-22 | Saint Gobain | Dispositif electroluminescent encapsule |
KR20070050804A (ko) * | 2006-08-28 | 2007-05-16 | 주식회사 대우일렉트로닉스 | 오엘이디 디스플레이 패널 |
EP2067191B1 (de) * | 2006-09-29 | 2020-06-17 | Osram Oled Gmbh | Beleuchtungseinrichtung |
JP2008166232A (ja) * | 2007-01-05 | 2008-07-17 | Fuji Electric Holdings Co Ltd | 有機elディスプレイの製造方法 |
CN101681998B (zh) * | 2007-03-20 | 2012-08-08 | Otb太阳能有限公司 | 用于制造有机发光装置的方法以及这样的装置 |
WO2008135902A2 (en) * | 2007-05-02 | 2008-11-13 | Philips Intellectual Property & Standards Gmbh | Method for manufacturing an oled device and such an oled device |
JP2009076437A (ja) * | 2007-08-31 | 2009-04-09 | Toshiba Matsushita Display Technology Co Ltd | 表示装置 |
JP4950870B2 (ja) * | 2007-12-21 | 2012-06-13 | ローム株式会社 | 有機発光装置 |
JP5049213B2 (ja) * | 2008-07-08 | 2012-10-17 | 株式会社ジャパンディスプレイイースト | 有機elパネルおよびその製造方法 |
US20100118243A1 (en) | 2008-11-12 | 2010-05-13 | Debasis Majumdar | Polymeric conductive donor and transfer method |
JP4849279B2 (ja) * | 2009-05-28 | 2012-01-11 | Tdk株式会社 | 有機el表示装置 |
-
2011
- 2011-07-11 CN CN201180035011.8A patent/CN102986053B/zh not_active Expired - Fee Related
- 2011-07-11 JP JP2013519198A patent/JP5892707B2/ja not_active Expired - Fee Related
- 2011-07-11 WO PCT/IB2011/053071 patent/WO2012007893A1/en active Application Filing
- 2011-07-11 US US13/810,261 patent/US8829787B2/en not_active Expired - Fee Related
- 2011-07-11 EP EP11744090.9A patent/EP2593980B1/en not_active Not-in-force
- 2011-07-11 KR KR1020137003869A patent/KR101947194B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR101947194B1 (ko) | 2019-02-12 |
US8829787B2 (en) | 2014-09-09 |
KR20130041945A (ko) | 2013-04-25 |
WO2012007893A1 (en) | 2012-01-19 |
US20130119858A1 (en) | 2013-05-16 |
CN102986053B (zh) | 2016-03-02 |
EP2593980B1 (en) | 2019-03-27 |
EP2593980A1 (en) | 2013-05-22 |
CN102986053A (zh) | 2013-03-20 |
JP2013534706A (ja) | 2013-09-05 |
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