JP5879564B2 - Light emitting device and lighting apparatus using the same - Google Patents

Light emitting device and lighting apparatus using the same Download PDF

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JP5879564B2
JP5879564B2 JP2012038744A JP2012038744A JP5879564B2 JP 5879564 B2 JP5879564 B2 JP 5879564B2 JP 2012038744 A JP2012038744 A JP 2012038744A JP 2012038744 A JP2012038744 A JP 2012038744A JP 5879564 B2 JP5879564 B2 JP 5879564B2
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emitting device
light emitting
light
insulating cover
mounting substrate
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JP2013175350A (en
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博司 海路
博司 海路
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Priority to PCT/JP2012/079909 priority patent/WO2013125112A1/en
Priority to CN201290001191.8U priority patent/CN204042478U/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/10—Outdoor lighting
    • F21W2131/103—Outdoor lighting of streets or roads
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Description

本発明は、発光装置およびそれを用いた照明器具に関するものである。   The present invention relates to a light emitting device and a lighting fixture using the same.

発光ダイオード（以下、ＬＥＤと略称する）は、このＬＥＤの温度上昇に起因して光出力が低下したり寿命が短くなったりする可能性がある。したがって、光源としてＬＥＤを用いた発光装置では、ＬＥＤの温度上昇を抑制することが求められている。   A light emitting diode (hereinafter abbreviated as LED) may cause a decrease in light output or a shortened life due to an increase in temperature of the LED. Therefore, in the light-emitting device using LED as a light source, it is calculated | required to suppress the temperature rise of LED.

従来から、ＬＥＤのような発光素子を用いた発光装置およびそれを用いた照明装置が提案されている（例えば、特許文献１）。   Conventionally, a light emitting device using a light emitting element such as an LED and an illumination device using the same have been proposed (for example, Patent Document 1).

特許文献１には、屋内および屋外で使用される照明装置の一例として、図８に示す構成を有するＬＥＤランプ８１が記載されている。   Patent Document 1 describes an LED lamp 81 having the configuration shown in FIG. 8 as an example of an illumination device used indoors and outdoors.

ＬＥＤランプ８１は、ランプ本体８２、グローブ８３、Ｅ型の口金８４、点灯装置８５およびＣＯＢ（chip on board）型の発光装置８６を備えている。   The LED lamp 81 includes a lamp body 82, a globe 83, an E-type base 84, a lighting device 85, and a COB (chip on board) type light-emitting device 86.

ランプ本体８２は、金属材料で構成され、放熱部材としての機能を兼ね備えている。なお、特許文献１には、ランプ本体８２の外周面に、複数の放熱フィン８７が一体に形成されている旨が記載されている。また、特許文献１には、ランプ本体８２の支持面８２ａに、発光装置８６が取り付けられることが記載されている。   The lamp body 82 is made of a metal material and has a function as a heat radiating member. Patent Document 1 describes that a plurality of heat radiation fins 87 are integrally formed on the outer peripheral surface of the lamp body 82. Patent Document 1 describes that a light emitting device 86 is attached to a support surface 82a of a lamp body 82.

発光装置８６は、矩形状の基板８８を備えている（図９参照）。   The light emitting device 86 includes a rectangular substrate 88 (see FIG. 9).

基板８８は、白色系のセラミックス材料で形成され、電気絶縁性を有している。また、基板８８は、一表面側（図９では、上面側）の中央部に、配線パターン（図示せず）が形成された実装領域８８ａを有している。この実装領域８８ａには、複数の発光ダイオードチップ８９（図８参照）が配置されている。ここにおいて、特許文献１には、各発光ダイオードチップ８９の各々が、上記配線パターンと隣り合うように規則的に並んでいることが記載されている。また、特許文献１には、各発光ダイオードチップ８９の各々が、シリコーン系の接着剤を用いて実装領域８８ａに接着されていることが記載されている。また、特許文献１には、各発光ダイオードチップ８９のプラス側電極およびマイナス側電極それぞれが、ボンディングワイヤ（図示せず）を介して隣り合う上記配線パターンと電気的に接続されていることが記載されている。また、特許文献１には、上記配線パターンおよび各発光ダイオードチップ８９が、封止材９０で覆われていることが記載されている。ここで、封止材９０は、光透過性を有する樹脂材料（エポキシ樹脂あるいはシリコーン樹脂）により構成されている。   The substrate 88 is made of a white ceramic material and has electrical insulation. In addition, the substrate 88 has a mounting region 88a in which a wiring pattern (not shown) is formed in the central portion on one surface side (the upper surface side in FIG. 9). A plurality of light emitting diode chips 89 (see FIG. 8) are arranged in the mounting region 88a. Here, Patent Document 1 describes that each of the light emitting diode chips 89 is regularly arranged so as to be adjacent to the wiring pattern. Patent Document 1 describes that each of the light emitting diode chips 89 is bonded to the mounting region 88a using a silicone-based adhesive. Patent Document 1 describes that the plus side electrode and the minus side electrode of each light emitting diode chip 89 are electrically connected to the adjacent wiring patterns via bonding wires (not shown). Has been. Patent Document 1 describes that the wiring pattern and each light-emitting diode chip 89 are covered with a sealing material 90. Here, the sealing material 90 is made of a light-transmissive resin material (epoxy resin or silicone resin).

また、ランプ本体８２の支持面８２ａには、一対の押圧部材９１，９２が、ねじ９３により取り付けられている。各押圧部材９１，９２の各々は、ステンレス鋼板を階段状に折り曲げた板ばねにより構成されている。また、各押圧部材９１，９２の各々は、固定部９１ａ，９２ａ、起立部９１ｂ，９２ｂおよび押圧部９１ｃ，９２ｃを有している（図９参照）。ここにおいて、特許文献１には、各押圧部材９１，９２の押圧部９１ｃ，９２ｃの各々が、基板８８の周部（実装領域８８ａ以外の部位）に、配置される旨が記載されている。また、特許文献１には、各押圧部材９１，９２の押圧部９１ｃ，９２ｃの各々が、ランプ本体８２の支持面８２ａに向かって発光装置８６を弾性的に押圧する旨が記載されている。また、特許文献１には、基板８８の他表面（図９では、下面）とランプ本体８２の支持面８２ａとの間に、熱伝導性グリース（図示せず）を充填することが望ましい旨が記載されている。   A pair of pressing members 91 and 92 are attached to the support surface 82 a of the lamp body 82 by screws 93. Each of the pressing members 91 and 92 is configured by a leaf spring obtained by bending a stainless steel plate in a step shape. Each of the pressing members 91 and 92 has fixing portions 91a and 92a, standing portions 91b and 92b, and pressing portions 91c and 92c (see FIG. 9). Here, Patent Document 1 describes that each of the pressing portions 91c and 92c of the pressing members 91 and 92 is disposed on a peripheral portion (a portion other than the mounting region 88a) of the substrate 88. Patent Document 1 describes that each of the pressing portions 91 c and 92 c of the pressing members 91 and 92 elastically presses the light emitting device 86 toward the support surface 82 a of the lamp body 82. Patent Document 1 also states that it is desirable to fill a thermally conductive grease (not shown) between the other surface of the substrate 88 (the lower surface in FIG. 9) and the support surface 82a of the lamp body 82. Have been described.

特開２０１１−８２１４１号公報JP 2011-82141 A

ところで、図８に示した構成のＬＥＤランプ８１では、各押圧部材９１，９２の押圧部９１ｃ，９２ｃの各々が、ランプ本体８２の支持面８２ａに向かって発光装置８６を弾性的に押圧するので、発光装置８６の基板８８がランプ本体８２と熱的に接続される。これにより、上述のＬＥＤランプ８１では、発光ダイオードチップ８９の発光時に、発光ダイオードチップ８９で発生した熱を、ランプ本体８２の各放熱フィン８７からＬＥＤランプ８１の外部へ放熱することが可能となり、発光ダイオードチップ８９の温度上昇を抑制することが可能となる。   Incidentally, in the LED lamp 81 having the configuration shown in FIG. 8, each of the pressing portions 91c, 92c of the pressing members 91, 92 elastically presses the light emitting device 86 toward the support surface 82a of the lamp body 82. The substrate 88 of the light emitting device 86 is thermally connected to the lamp body 82. Thereby, in the above-mentioned LED lamp 81, when the light emitting diode chip 89 emits light, the heat generated in the light emitting diode chip 89 can be dissipated from the heat radiation fins 87 of the lamp body 82 to the outside of the LED lamp 81. It becomes possible to suppress the temperature rise of the light emitting diode chip 89.

しかしながら、図８に示した構成のＬＥＤランプ８１では、ステンレス鋼板の板ばねにより構成された各押圧部材９１，９２の各々が、ねじ９３を用いて金属製のランプ本体８２に取り付けられている。そのため、このＬＥＤランプ８１では、基板８８の充電部（上記配線パターン）の絶縁性能を高めようとすると、各押圧部９１ｃ，９２ｃと、封止材９０により覆われた上記配線パターンおよび各発光ダイオードチップ８９との間の沿面距離が長くなり、基板８８の平面サイズが大きくなるという懸念がある。   However, in the LED lamp 81 having the configuration shown in FIG. 8, each of the pressing members 91 and 92 formed of a stainless steel plate spring is attached to a metal lamp body 82 using a screw 93. Therefore, in this LED lamp 81, in order to improve the insulation performance of the charging portion (the wiring pattern) of the substrate 88, the wiring patterns and the light emitting diodes covered with the pressing portions 91c and 92c and the sealing material 90 are used. There is a concern that the creepage distance to the chip 89 is increased, and the planar size of the substrate 88 is increased.

本発明は上記事由に鑑みて為されたものであり、その目的は、実装基板の平面サイズを大きくすることなく、実装基板の充電部の絶縁性能を高めることが可能な発光装置およびそれを用いた照明器具を提供することにある。   The present invention has been made in view of the above reasons, and an object of the present invention is to provide a light-emitting device capable of improving the insulation performance of the charging part of the mounting board without increasing the planar size of the mounting board, and to use the same. It is to provide the lighting equipment that was.

本発明の発光装置は、放熱部材と、前記放熱部材の一面側に配置されてなり前記放熱部材側とは反対の一表面側の中央部にＬＥＤと電気的に接続される充電部を有する実装基板と、前記実装基板の側部および前記一表面の周部を覆う絶縁カバーと、前記実装基板を、前記絶縁カバーを介して前記放熱部材側に押圧する押圧部材とを備えてなり、前記押圧部材は、前記放熱部材に取り付けられてなり、当該押圧部材に、前記実装基板の厚み方向に交差する所定方向における前記絶縁カバーの移動を規制する規制部が設けられてなり、前記規制部は、前記所定方向において前記絶縁カバーの両側に、前記絶縁カバーに接触するように配置されることを特徴とする。 The light emitting device of the present invention has a heat radiating member and a charging unit that is disposed on one surface side of the heat radiating member and that is electrically connected to the LED at the center of one surface side opposite to the heat radiating member side. a substrate, an insulating cover for covering the periphery of the side and said one surface of said mounting substrate, said mounting substrate, Ri Na and a pressing member for pressing the heat radiating member side through the insulating cover, wherein The pressing member is attached to the heat radiating member, and the pressing member is provided with a restricting portion that restricts the movement of the insulating cover in a predetermined direction intersecting the thickness direction of the mounting substrate. The insulating cover is disposed on both sides of the insulating cover in the predetermined direction so as to contact the insulating cover .

本発明の照明器具は、前記発光装置と、前記発光装置を保持する器具本体とを備えてなることを特徴とする。   The lighting fixture of the present invention includes the light-emitting device and a fixture main body that holds the light-emitting device.

本発明の発光装置においては、実装基板の平面サイズを大きくすることなく、実装基板の充電部の絶縁性能を高めることが可能となる。   In the light emitting device of the present invention, it is possible to improve the insulation performance of the charging portion of the mounting board without increasing the planar size of the mounting board.

本発明の照明器具においては、実装基板の平面サイズを大きくすることなく、実装基板の充電部の絶縁性能を高めることが可能な発光装置を用いた照明器具を提供することができる。   In the lighting fixture of this invention, the lighting fixture using the light-emitting device which can improve the insulation performance of the charging part of a mounting board | substrate can be provided, without enlarging the planar size of a mounting board | substrate.

実施形態の発光装置の概略断面図である。It is a schematic sectional drawing of the light-emitting device of embodiment. 同上の発光装置の一部破断した概略斜視図である。It is the schematic perspective view which a part fracture | ruptured of the light-emitting device same as the above. 同上の発光装置を示し、図２のＡ−Ａ断面図である。FIG. 3 is a cross-sectional view taken along the line AA in FIG. 同上の発光装置の押圧部材を示し、（ａ）は概略斜視図、（ｂ）は（ａ）のＢ−Ｂ断面図である。The pressing member of a light-emitting device same as the above is shown, (a) is a schematic perspective view, (b) is BB sectional drawing of (a). 実施形態の照明器具の一部破断した概略斜視図である。It is the schematic perspective view which fractured | ruptured partially the lighting fixture of embodiment. 同上の照明器具の他の構成例を示し、（ａ）は概略斜視図、（ｂ）は発光装置を取り外した状態の概略斜視図である。The other structural example of a lighting fixture same as the above is shown, (a) is a schematic perspective view, (b) is a schematic perspective view of the state which removed the light-emitting device. 同上の照明器具の他の構成例において、発光装置の発光面側から見た概略平面図である。In other structural examples of the same lighting fixture, it is the schematic plan view seen from the light emission surface side of the light-emitting device. 従来例の照明装置の断面図である。It is sectional drawing of the illuminating device of a prior art example. 同上の照明装置の一部を示す斜視図である。It is a perspective view which shows a part of illumination apparatus same as the above.

以下、本実施形態の発光装置について、図１〜図５を参照しながら説明する。   Hereinafter, the light-emitting device of the present embodiment will be described with reference to FIGS.

本実施形態の発光装置１０は、例えば、照明器具３０（図５参照）の光源として用いることができる。発光装置１０は、放熱部材１と、ＬＥＤ（図示せず）が実装される実装基板２ｂと、実装基板２ｂの側部および一表面（図１では、上面）の周部を覆う絶縁カバー３と、実装基板２ｂを、絶縁カバー３を介して放熱部材１側に押圧する押圧部材４とを備えている。   The light-emitting device 10 of this embodiment can be used as a light source of the lighting fixture 30 (refer FIG. 5), for example. The light emitting device 10 includes a heat dissipating member 1, a mounting substrate 2b on which an LED (not shown) is mounted, an insulating cover 3 that covers a side portion of the mounting substrate 2b and a peripheral portion of one surface (the upper surface in FIG. 1). And a pressing member 4 that presses the mounting substrate 2b toward the heat radiating member 1 via the insulating cover 3.

放熱部材１は、板状に形成されている。この放熱部材１は、樹脂に比べて熱伝導率が高い材料（例えば、アルミニウム、銅、ステンレスなどの金属材料）により形成することができる。   The heat dissipation member 1 is formed in a plate shape. The heat radiating member 1 can be formed of a material (for example, a metal material such as aluminum, copper, and stainless steel) having a higher thermal conductivity than the resin.

実装基板２ｂは、例えば、白色系のセラミック材料（例えば、酸化アルミニウム、窒化アルミニウムなど）により形成された電気絶縁性を有するセラミック基板である。また、実装基板２ｂには、ＬＥＤに電気的に接続可能な導体パターン（図示せず）が設けられている。なお、本実施形態の発光装置１０では、実装基板２ｂの外周形状を、矩形状に形成しているが、この形状を特に限定するものではない。また、本実施形態では、実装基板２ｂとして、セラミック基板を用いているが、これに限らず、例えば、ガラスエポキシ樹脂などからなる絶縁性基材により形成されたプリント配線板などを用いてもよい。   The mounting substrate 2b is an electrically insulating ceramic substrate formed of, for example, a white ceramic material (for example, aluminum oxide, aluminum nitride, etc.). The mounting board 2b is provided with a conductor pattern (not shown) that can be electrically connected to the LED. In the light emitting device 10 of this embodiment, the outer peripheral shape of the mounting substrate 2b is formed in a rectangular shape, but this shape is not particularly limited. In this embodiment, a ceramic substrate is used as the mounting substrate 2b. However, the present invention is not limited to this, and for example, a printed wiring board formed of an insulating base material made of glass epoxy resin or the like may be used. .

実装基板２ｂの上記一表面側の中央部には、１個ないし複数個のＬＥＤが実装されている。   One or a plurality of LEDs are mounted on the central portion on the one surface side of the mounting substrate 2b.

ＬＥＤとしては、例えば、青色光を放射するＬＥＤチップ（以下、青色ＬＥＤチップと称する）と、青色ＬＥＤチップから放射された青色光により励起されブロードな黄色光を放射する黄色蛍光体からなる蛍光体とを組み合わせて白色光を得る白色ＬＥＤを用いることができる。このような白色ＬＥＤは、青色ＬＥＤチップを覆い黄色蛍光体を含有した第１の透光性材料からなる色変換部（図示せず）を有している。第１の透光性材料としては、例えば、シリコーン樹脂、エポキシ樹脂、ガラスなどを採用することができる。   As the LED, for example, a phosphor composed of an LED chip that emits blue light (hereinafter referred to as a blue LED chip) and a yellow phosphor that emits broad yellow light that is excited by the blue light emitted from the blue LED chip. Can be used to obtain white light. Such a white LED has a color conversion part (not shown) made of a first light-transmitting material that covers a blue LED chip and contains a yellow phosphor. As the first light transmissive material, for example, a silicone resin, an epoxy resin, glass, or the like can be employed.

本実施形態の発光装置１０では、第２の透光性材料からなる封止部２ａが、青色ＬＥＤチップおよび上記色変換部を封止している。第２の透光性材料としては、例えば、シリコーン樹脂、エポキシ樹脂、ガラスなどを採用することができる。また、本実施形態では、封止部２ａの外周形状を、矩形状としているが、この形状を特に限定するものではなく、例えば、円形状などであってもよい。   In the light emitting device 10 of the present embodiment, the sealing portion 2a made of the second light transmissive material seals the blue LED chip and the color conversion portion. As the second light transmissive material, for example, silicone resin, epoxy resin, glass or the like can be employed. Moreover, in this embodiment, although the outer peripheral shape of the sealing part 2a is made into the rectangular shape, this shape is not specifically limited, For example, a circular shape etc. may be sufficient.

ここにおいて、ＬＥＤの蛍光体は、黄色蛍光体に限らず、例えば、赤色蛍光体と緑色蛍光体とを採用してもよい。また、ＬＥＤは、紫〜近紫外線を放射するＬＥＤチップと、赤色蛍光体、緑色蛍光体および青色蛍光体とを組み合わせて白色光を得る白色ＬＥＤを用いてもよい。また、ＬＥＤは、赤色光を放射するＬＥＤチップと緑色光を放射するＬＥＤチップと青色ＬＥＤチップとを組み合わせて白色光を得る白色ＬＥＤを用いてもよい。また、ＬＥＤの発光色は、白色に限るものではない。以下、本実施形態では、説明の便宜上、封止部２ａと封止部２ａで封止されたＬＥＤと実装基板２ｂとを合わせて、光源部２と称することもある。なお、本実施形態の発光装置１０では、封止部２ａの前面（図１では、上面）が、光源部２の発光面を構成している。   Here, the phosphor of the LED is not limited to the yellow phosphor, and, for example, a red phosphor and a green phosphor may be employed. The LED may be a white LED that obtains white light by combining an LED chip that emits purple to near-ultraviolet light and a red phosphor, a green phosphor, and a blue phosphor. The LED may be a white LED that obtains white light by combining an LED chip that emits red light, an LED chip that emits green light, and a blue LED chip. Further, the emission color of the LED is not limited to white. Hereinafter, in this embodiment, for convenience of explanation, the sealing portion 2a, the LED sealed with the sealing portion 2a, and the mounting substrate 2b may be collectively referred to as the light source portion 2. In the light emitting device 10 of the present embodiment, the front surface (upper surface in FIG. 1) of the sealing unit 2 a constitutes the light emitting surface of the light source unit 2.

また、実装基板２ｂの上記一表面側の中央部には、ＬＥＤを電気的に接続する一対の第１電極部（図示せず）が、上記導体パターンの一部により形成されている。本実施形態の発光装置１０では、ＬＥＤのアノード側が、上記一対の第１電極部の一方と電気的に接続されている。また、本実施形態では、ＬＥＤのカソード側が、上記一対の第１電極部の他方と電気的に接続されている。なお、本実施形態の発光装置１０では、上記一対の第１電極部が、ＬＥＤと電気的に接続される充電部を構成している。   In addition, a pair of first electrode portions (not shown) for electrically connecting the LEDs are formed by part of the conductor pattern at the central portion on the one surface side of the mounting substrate 2b. In the light emitting device 10 of the present embodiment, the anode side of the LED is electrically connected to one of the pair of first electrode portions. In the present embodiment, the cathode side of the LED is electrically connected to the other of the pair of first electrode portions. In the light emitting device 10 according to the present embodiment, the pair of first electrode portions constitutes a charging portion that is electrically connected to the LED.

また、実装基板２ｂの上記一表面側の周部には、ＬＥＤに給電するための一対の第２電極部（図示せず）が、上記導体パターンの一部により形成されている。本実施形態の発光装置１０では、実装基板２ｂの上記一対の第２電極部に、一対の電線５ａ，５ｂ（図２参照）を電気的に接続可能な一対の端子部６ａ，６ｂ（図３参照）が、半田により電気的に接続されている。具体的に説明すると、本実施形態の発光装置１０では、一対の端子部６ａ，６ｂの各々が、Ｕ字状の端子板により構成されており、これら端子板の両脚片が、実装基板２ｂの上記一対の第２電極部に半田により電気的に接続されている。なお、図３では、一対の端子部６ａ，６ｂのうち一方の端子部６ａが見えている。   In addition, a pair of second electrode portions (not shown) for supplying power to the LEDs are formed by part of the conductor pattern on the peripheral portion on the one surface side of the mounting substrate 2b. In the light emitting device 10 of the present embodiment, a pair of terminal portions 6a and 6b (FIG. 3) capable of electrically connecting a pair of electric wires 5a and 5b (see FIG. 2) to the pair of second electrode portions of the mounting substrate 2b. Are electrically connected by solder. More specifically, in the light emitting device 10 of the present embodiment, each of the pair of terminal portions 6a and 6b is configured by a U-shaped terminal plate, and both leg pieces of these terminal plates are mounted on the mounting substrate 2b. The pair of second electrode portions are electrically connected by solder. In addition, in FIG. 3, one terminal part 6a is visible among a pair of terminal parts 6a and 6b.

一対の電線５ａ，５ｂの各々は、各端子部６ａ，６ｂと電気的に接続可能な導電体５ｃ（図３参照）が絶縁被覆部５ｄ（図３参照）により覆われた被覆電線である。また、一対の電線５ａ，５ｂの各々は、各端子部６ａ，６ｂと電気的に接続される導電体５ｃの一部が露出している。本実施形態の発光装置１０では、一対の端子部６ａ，６ｂの各々に、各電線５ａ，５ｂの導電体５ｃの一部が、例えば、半田からなる接合部（図示せず）により電気的に接続されている。なお、本実施形態の発光装置１０では、一対の端子部６ａ，６ｂに電気的に接続された一対の電線５ａ，５ｂの一端部（図３では、右端部）とは反対の他端部に、コネクタ（図示せず）を有するようにしてもよい。   Each of the pair of electric wires 5a and 5b is a covered electric wire in which a conductor 5c (see FIG. 3) that can be electrically connected to the terminal portions 6a and 6b is covered with an insulating covering portion 5d (see FIG. 3). In addition, in each of the pair of electric wires 5a and 5b, a part of the conductor 5c that is electrically connected to the terminal portions 6a and 6b is exposed. In the light emitting device 10 of the present embodiment, a part of the conductor 5c of each of the electric wires 5a and 5b is electrically connected to each of the pair of terminal portions 6a and 6b by, for example, a joint portion (not shown) made of solder. It is connected. In the light emitting device 10 of the present embodiment, the other end opposite to one end (the right end in FIG. 3) of the pair of electric wires 5a and 5b electrically connected to the pair of terminal portions 6a and 6b. A connector (not shown) may be provided.

絶縁カバー３は、実装基板２ｂの上記一表面側を覆う蓋部３ａと、実装基板２ｂの側部を覆う側壁部３ｂとで構成されている。本実施形態では、絶縁カバー３の材料として、例えば、電気絶縁性を有する合成樹脂材料などを採用することができる。   The insulating cover 3 includes a lid portion 3a that covers the one surface side of the mounting substrate 2b and a side wall portion 3b that covers the side portion of the mounting substrate 2b. In the present embodiment, as the material of the insulating cover 3, for example, a synthetic resin material having electrical insulation can be adopted.

また、絶縁カバー３の蓋部３ａには、光源部２の発光面と対向する部位に、開口窓３ｃが貫設されている。本実施形態の発光装置１０では、開口窓３ｃの内周形状を、矩形状としているが、この形状を特に限定するものではなく、例えば、円形状などであってもよい。また、本実施形態では、開口窓３ｃの開口サイズが、実装基板２ｂの平面サイズよりも小さく、且つ、光源部２の発光面のサイズよりも大きく設定されている。これにより、本実施形態の発光装置１０では、絶縁カバー３が、実装基板２ｂの側部および上記一表面の周部を覆うことが可能となる。   In addition, an opening window 3 c is provided through the lid portion 3 a of the insulating cover 3 at a portion facing the light emitting surface of the light source unit 2. In the light emitting device 10 of the present embodiment, the inner peripheral shape of the opening window 3c is a rectangular shape, but this shape is not particularly limited, and may be, for example, a circular shape. In the present embodiment, the opening size of the opening window 3 c is set to be smaller than the planar size of the mounting substrate 2 b and larger than the size of the light emitting surface of the light source unit 2. Thereby, in the light emitting device 10 of the present embodiment, the insulating cover 3 can cover the side portion of the mounting substrate 2b and the peripheral portion of the one surface.

また、絶縁カバー３の側壁部３ｂの一端部（図２では、左下端部）には、実装基板２ｂに電気的に接続された一対の電線５ａ，５ｂの一部を収納する収納部３ｆが、この側壁部３ｂの上記一端部と一体に形成されている。   In addition, a storage portion 3f for storing a part of the pair of electric wires 5a and 5b electrically connected to the mounting substrate 2b is provided at one end portion (the lower left end portion in FIG. 2) of the side wall portion 3b of the insulating cover 3. The side wall 3b is formed integrally with the one end.

収納部３ｆは、放熱部材１側（図３では、下側）に、一対の電線５ａ，５ｂの一部を収納するための収納室１２が設けられている。具体的に説明すると、収納部３ｆは、各電線５ａ，５ｂの露出した導電体５ｃを収納するための第１の収納室１２ａと、各電線５ａ，５ｂの絶縁被覆部５ｄの一部を収納するための第２の収納室１２ｂとが設けられている。本実施形態の発光装置１０では、第１の収納室１２ａと第２の収納室１２ｂとが、仕切壁部１３により仕切られている。この仕切壁部１３には、実装基板２ｂに電気的に接続された一対の電線５ａ，５ｂを挿入する一対の電線挿入穴（図示せず）が設けられている。   The storage portion 3f is provided with a storage chamber 12 for storing a part of the pair of electric wires 5a and 5b on the heat radiating member 1 side (lower side in FIG. 3). Specifically, the storage portion 3f stores a first storage chamber 12a for storing the exposed conductor 5c of each of the electric wires 5a and 5b, and a part of the insulating coating portion 5d of each of the electric wires 5a and 5b. A second storage chamber 12b is provided. In the light emitting device 10 of the present embodiment, the first storage chamber 12 a and the second storage chamber 12 b are partitioned by the partition wall portion 13. The partition wall portion 13 is provided with a pair of electric wire insertion holes (not shown) for inserting the pair of electric wires 5a and 5b electrically connected to the mounting substrate 2b.

第１の収納室１２ａは、絶縁カバー３の蓋部３ａおよび側壁部３ｂにより囲まれた空間と連通している。また、第１の収納室１２ａは、仕切壁部１３に形成された上記一対の電線挿入穴を通して、第２の収納室１２ｂと連通している。   The first storage chamber 12a communicates with a space surrounded by the lid portion 3a and the side wall portion 3b of the insulating cover 3. Further, the first storage chamber 12 a communicates with the second storage chamber 12 b through the pair of electric wire insertion holes formed in the partition wall portion 13.

第１の収納室１２ａの底壁には、絶縁カバー３の開口窓３ｃ側へ近づくに従って収納部３ｆと実装基板２ｂとの間の距離が徐々に小さくなるように形成された傾斜部３ｇが設けられている。傾斜部３ｇは、絶縁カバー３の開口窓３ｃへ近づくに従って、この傾斜部３ｇにおける実装基板２ｂ側とは反対側の一表面（図３では、上面）と実装基板２ｂの上記一表面との間の距離が徐々に小さくなるように形成されている。これにより、本実施形態の発光装置１０では、光源部２のＬＥＤから出射された光が、傾斜部３ｇの上記一表面（以下、傾斜面と称する）で反射するのを低減することが可能となる。また、本実施形態の発光装置１０では、光源部２のＬＥＤから出射された光が、傾斜部３ｇの傾斜面で反射するのを低減することが可能となるので、光源部２のＬＥＤから出射される光の配光を広くすることが可能となる。なお、本実施形態の発光装置１０では、仕切壁部１３が、側壁部３ｂの一部を構成している。   The bottom wall of the first storage chamber 12a is provided with an inclined portion 3g formed such that the distance between the storage portion 3f and the mounting substrate 2b gradually decreases as the insulating cover 3 approaches the opening window 3c side. It has been. As the inclined portion 3g approaches the opening window 3c of the insulating cover 3, the surface of the inclined portion 3g opposite to the mounting substrate 2b side (upper surface in FIG. 3) and the one surface of the mounting substrate 2b are increased. The distance is formed so as to gradually decrease. Thereby, in the light-emitting device 10 of this embodiment, it is possible to reduce that the light radiate | emitted from LED of the light source part 2 reflects on the said one surface (henceforth an inclined surface) of the inclination part 3g. Become. Further, in the light emitting device 10 of the present embodiment, it is possible to reduce the light emitted from the LED of the light source unit 2 from being reflected by the inclined surface of the inclined unit 3g. It is possible to widen the light distribution of the emitted light. In addition, in the light-emitting device 10 of this embodiment, the partition wall part 13 comprises a part of side wall part 3b.

ここにおいて、本実施形態の発光装置１０では、各電線５ａ，５ｂの露出した導電体５ｃを、各端子部６ａ，６ｂを介して、実装基板２ｂの上記一対の第２電極部に電気的に接続しているが、これに限らず、各電線５ａ，５ｂの露出した導電体５ｃを、上記接合部により、直接、実装基板２ｂの上記一対の第２電極部に電気的に接続してもよい。これにより、本実施形態の発光装置１０では、傾斜部３ｇの傾斜面において実装基板２ｂの上記一表面に対する傾斜角を、より小さくすることが可能となり、光源部２のＬＥＤから出射された光が、傾斜部３ｇの傾斜面で反射するのを抑制することが可能となる。また、本実施形態の発光装置１０では、光源部２のＬＥＤから出射された光が、傾斜部３ｇの傾斜面で反射するのを抑制することが可能となるので、光源部２のＬＥＤから出射される光の配光をより広くすることが可能となる。   Here, in the light emitting device 10 of the present embodiment, the exposed conductors 5c of the electric wires 5a and 5b are electrically connected to the pair of second electrode portions of the mounting substrate 2b via the terminal portions 6a and 6b. However, the present invention is not limited to this, and the exposed conductor 5c of each of the electric wires 5a and 5b may be electrically connected to the pair of second electrode portions of the mounting substrate 2b directly by the joint portion. Good. Thereby, in the light-emitting device 10 of this embodiment, it becomes possible to make the inclination | tilt angle with respect to the said one surface of the mounting substrate 2b smaller in the inclined surface of the inclination part 3g, and the light radiate | emitted from LED of the light source part 2 is made. It is possible to suppress reflection on the inclined surface of the inclined portion 3g. Moreover, in the light-emitting device 10 of this embodiment, it becomes possible to suppress that the light radiate | emitted from LED of the light source part 2 reflects on the inclined surface of the inclination part 3g, Therefore It radiate | emits from LED of the light source part 2. The light distribution of the emitted light can be made wider.

第２の収納室１２ｂの底壁には、放熱部材１側（図３では、下側）へ突出する第１のリブ１４が設けられている。この第１のリブ１４は、仕切壁部１３の上記一対の電線挿入穴のうち一方の電線挿入穴に挿入した電線５ａの一部を、第２の収納室１２ｂの内周壁とで挟持する。また、第２の収納室１２ｂの底壁には、放熱部材１側へ突出する第２のリブ（図示せず）が設けられている。この第２のリブは、仕切壁部１３の上記一対の電線挿入穴のうち他方の電線挿入穴に挿入した電線５ｂの一部を、第２の収納室１２ｂの内周壁とで挟持する。つまり、本実施形態の発光装置１０では、第１のリブ１４および上記第２のリブの各々が、一対の電線５ａ，５ｂの一部を第２の収納室１２ｂの内周壁とで挟持する張力止部を構成している。これにより、本実施形態の発光装置１０では、一対の電線５ａ，５ｂに作用する張力を低減するための別部品が不要となり、低コストで一対の電線５ａ，５ｂの張力止め機能を付与することが可能となる。また、本実施形態の発光装置１０では、一対の電線５ａ，５ｂに作用する張力を低減することが可能となるので、一対の電線５ａ，５ｂにおける露出した導電体５ｃの各々と一対の端子部６ａ，６ｂとの上記接合部の各々に応力が作用して断線するのを防止することが可能となる。   A first rib 14 is provided on the bottom wall of the second storage chamber 12b so as to protrude toward the heat dissipating member 1 (lower side in FIG. 3). The first rib 14 sandwiches a part of the electric wire 5a inserted into one of the pair of electric wire insertion holes of the partition wall 13 with the inner peripheral wall of the second storage chamber 12b. Further, a second rib (not shown) is provided on the bottom wall of the second storage chamber 12b so as to protrude toward the heat radiating member 1 side. This 2nd rib clamps a part of electric wire 5b inserted in the other electric wire insertion hole among said pair of electric wire insertion holes of the partition wall part 13 with the inner peripheral wall of the 2nd storage chamber 12b. That is, in the light emitting device 10 according to the present embodiment, the first rib 14 and the second rib each have a tension that holds a part of the pair of electric wires 5a and 5b with the inner peripheral wall of the second storage chamber 12b. It constitutes a stop. Thereby, in the light-emitting device 10 of this embodiment, the separate part for reducing the tension | tensile_strength which acts on a pair of electric wire 5a, 5b becomes unnecessary, and the tension stop function of a pair of electric wire 5a, 5b is provided at low cost. Is possible. Further, in the light emitting device 10 of the present embodiment, it is possible to reduce the tension acting on the pair of electric wires 5a and 5b, so that each of the exposed conductors 5c and the pair of terminal portions in the pair of electric wires 5a and 5b. It is possible to prevent the stress from acting on each of the joint portions with 6a and 6b and disconnecting them.

また、第２の収納室１２ｂの一側壁（図３では、左側壁）には、実装基板２ｂに電気的に接続された一対の電線５ａ，５ｂを導出する一対の導出穴３ｈ，３ｈ（図２参照）が形成されている。本実施形態の発光装置１０では、実装基板２ｂに電気的に接続された一対の電線５ａ，５ｂを収納部３ｆの一対の導出穴３ｈ，３ｈから導出した後に、例えば、シリコーン樹脂などを第２の収納室１２ｂの内部に充填してもよい。これにより、本実施形態の発光装置１０では、収納部３ｆの一対の導出穴３ｈ，３ｈを通して収納室１２の内部に水などが浸入するのを防止することが可能となる。   Further, a pair of lead-out holes 3h and 3h (see FIG. 3) for leading out the pair of electric wires 5a and 5b electrically connected to the mounting substrate 2b are provided on one side wall (left side wall in FIG. 3) of the second storage chamber 12b. 2) is formed. In the light emitting device 10 according to the present embodiment, after the pair of electric wires 5a and 5b electrically connected to the mounting substrate 2b are led out from the pair of lead holes 3h and 3h of the housing portion 3f, for example, a second resin such as silicone resin is used. The inside of the storage chamber 12b may be filled. Thereby, in the light emitting device 10 of the present embodiment, it is possible to prevent water and the like from entering the inside of the storage chamber 12 through the pair of lead-out holes 3h, 3h of the storage portion 3f.

本実施形態の発光装置１０では、放熱部材１の側部（図２では、左下側部）に、収納部３ｆの一対の導出穴３ｈ，３ｈから導出した一対の電線５ａ，５ｂを、発光装置１０の外部へ導出する導出部１６が設けられている。   In the light emitting device 10 of the present embodiment, a pair of electric wires 5a and 5b led out from the pair of lead-out holes 3h and 3h of the housing portion 3f are provided on the side portion (lower left side portion in FIG. 2) of the heat radiating member 1. Deriving unit 16 for deriving 10 outside is provided.

導出部１６は、放熱部材１の側部の一部に形成された切欠き部であって、放熱部材１の上記一面（図２では、上面）、側面（図２では、左下側面）および他面（図２では、下面）それぞれの一部が開放されている。   The lead-out part 16 is a notch part formed in a part of the side part of the heat radiating member 1, and the one surface (upper surface in FIG. 2), side surface (lower left side surface in FIG. 2) and others of the heat radiating member 1. A part of each surface (the lower surface in FIG. 2) is open.

また、絶縁カバー３の側壁部３ｂは、一対の電線５ａ，５ｂを導出した方向（図２では、左下方向）に直交する方向の両側壁部（図２では、左上側壁部および右下側壁部）の各々に、外方へ突出した鍔部３ｄ（図１参照）が設けられている。これら各鍔部３ｄの各々は、上記両側壁部の一端側（図１では、下端側）に配置されている。   Further, the side wall portion 3b of the insulating cover 3 has both side wall portions (in FIG. 2, the upper left side wall portion and the lower right side wall portion in a direction orthogonal to the direction in which the pair of electric wires 5a and 5b are led out (the lower left direction in FIG. 2). ) Is provided with a flange 3d (see FIG. 1) protruding outward. Each of the flange portions 3d is disposed on one end side (the lower end side in FIG. 1) of the both side wall portions.

押圧部材４は、平面視形状がＵ字状に形成された板状の本体部４ａと、この本体部４ａに延設された板状の延設片４ｂと、延設片４ｂの先端部に設けられ絶縁カバー３を押圧する板状の押圧部４ｃとを有している（図１，２，４参照）。この押圧部材４は、金属板（例えば、ステンレス鋼板など）により形成することができる。本実施形態の発光装置１０では、押圧部材４の厚み寸法を、０．３ｍｍとしているが、この数値を特に限定するものではない。また、本実施形態では、押圧部材４が、延設片４ｂを複数個（本実施形態では、４個）備えている。また、本実施形態では、各延設片４ｂにおける本体部４ａの一表面（図４（ｂ）では、上面）に対する傾斜角が、９０度よりも小さな角度に設定されている。これにより、本実施形態の発光装置１０では、押圧部材４の各押圧部４ｃの各々が、各延設片４ｂの押圧部４ｃ側とは反対側の端部を支点として、絶縁カバー３を放熱部材１側に向かって弾性的に押圧することが可能となる。   The pressing member 4 has a plate-like main body portion 4a formed in a U shape in plan view, a plate-like extension piece 4b extended to the main body portion 4a, and a distal end portion of the extension piece 4b. And a plate-like pressing portion 4c that presses the insulating cover 3 (see FIGS. 1, 2, and 4). The pressing member 4 can be formed of a metal plate (for example, a stainless steel plate). In the light emitting device 10 of the present embodiment, the thickness dimension of the pressing member 4 is 0.3 mm, but this numerical value is not particularly limited. In the present embodiment, the pressing member 4 includes a plurality of extended pieces 4b (four in the present embodiment). Moreover, in this embodiment, the inclination angle with respect to one surface (the upper surface in FIG. 4B) of the main body portion 4a in each extending piece 4b is set to an angle smaller than 90 degrees. Thereby, in the light emitting device 10 according to the present embodiment, each pressing portion 4c of the pressing member 4 radiates heat from the insulating cover 3 with the end portion of each extending piece 4b opposite to the pressing portion 4c side as a fulcrum. It becomes possible to press elastically toward the member 1 side.

本体部４ａは、２つの脚片４ａ１，４ａ２と、各脚片４ａ１，４ａ２の一端部（図４（ａ）では、右上端部）の各々に連結された連結片４ａ３とで構成されている。   The main body 4a is composed of two leg pieces 4a1 and 4a2 and a connecting piece 4a3 connected to one end of each leg piece 4a1 and 4a2 (the upper right end in FIG. 4A). .

本体部４ａの脚片４ａ１は、対向する脚片４ａ２側の端部（図４（ａ）では、右下端部）に、２個の延設片４ｂが設けられている。また、本体部４ａの脚片４ａ２は、対向する脚片４ａ１側の端部（図４（ａ）では、左上端部）に、２個の延設片４ｂが設けられている。   The leg piece 4a1 of the main body 4a is provided with two extending pieces 4b at the end (on the right lower end in FIG. 4A) on the opposite leg piece 4a2 side. Further, the leg piece 4a2 of the main body part 4a is provided with two extending pieces 4b at the end on the side of the opposing leg piece 4a1 (the upper left end in FIG. 4A).

脚片４ａ１の各延設片４ｂの押圧部４ｃの各々は、対向する延設片４ｂの押圧部４ｃ側（図４（ｂ）では、右側）に向かって突設されている。また、脚片４ａ２の各延設片４ｂの押圧部４ｃの各々は、対向する延設片４ｂの押圧部４ｃ側（図４（ｂ）では、左側）に向かって突設されている。   Each of the pressing portions 4c of each extending piece 4b of the leg piece 4a1 protrudes toward the pressing portion 4c side (on the right side in FIG. 4B) of the opposing extending piece 4b. Each of the pressing portions 4c of each extending piece 4b of the leg piece 4a2 protrudes toward the pressing portion 4c side (left side in FIG. 4B) of the opposing extending piece 4b.

ここにおいて、本実施形態の発光装置１０では、延設片４ｂの個数を４個としているが、この個数を特に限定するものではなく、延設片４ｂの個数は、各脚片４ａ１，４ａ２の各々に少なくとも１個ずつあればよい。つまり、押圧部材４の本体部４ａに、少なくとも一対の延設片４ｂ，４ｂがあればよい。言い換えれば、本実施形態の発光装置１０では、押圧部材４が、少なくとも一対の押圧部４ｃ，４ｃを有していればよい。また、本実施形態の発光装置１０では、一対の押圧部４ｃ，４ｃが、対称となる位置に配置されることが好ましい。これにより、本実施形態の発光装置１０では、押圧部材４の一対の押圧部４ｃ，４ｃが絶縁カバー３を略均一に押圧することが可能となり、絶縁カバー３が実装基板２ｂへ略均一に負荷をかけることが可能となる。また、本実施形態の発光装置１０では、絶縁カバー３が実装基板２ｂへ略均一に負荷をかけることが可能となるので、光源部２のＬＥＤで発生した熱を、放熱部材１へ効率よく伝導することが可能となる。さらに、本実施形態の発光装置１０では、絶縁カバー３が実装基板２ｂへ略均一に負荷をかけることが可能となるので、実装基板２ｂの割れを低減することも可能となる。   Here, in the light emitting device 10 of the present embodiment, the number of the extended pieces 4b is four, but this number is not particularly limited, and the number of the extended pieces 4b is the number of the leg pieces 4a1 and 4a2. There may be at least one for each. That is, the main body portion 4a of the pressing member 4 only needs to have at least a pair of extending pieces 4b and 4b. In other words, in the light emitting device 10 of the present embodiment, the pressing member 4 only needs to have at least a pair of pressing portions 4c and 4c. Moreover, in the light-emitting device 10 of this embodiment, it is preferable that a pair of press part 4c, 4c is arrange | positioned in the symmetrical position. Thereby, in the light emitting device 10 of the present embodiment, the pair of pressing portions 4c, 4c of the pressing member 4 can press the insulating cover 3 substantially uniformly, and the insulating cover 3 loads the mounting substrate 2b substantially uniformly. Can be applied. Further, in the light emitting device 10 of the present embodiment, the insulating cover 3 can apply a load to the mounting substrate 2b substantially uniformly, so that heat generated by the LEDs of the light source unit 2 is efficiently conducted to the heat radiating member 1. It becomes possible to do. Furthermore, in the light emitting device 10 of the present embodiment, the insulating cover 3 can apply a load to the mounting substrate 2b substantially uniformly, so that it is possible to reduce cracks in the mounting substrate 2b.

また、脚片４ａ１は、対向する脚片４ａ２側の端部（図４（ａ）では、右下端部）に、対向する脚片４ａ２側へ突出する第１の突出部４ｅが設けられている。本実施形態では、第１の突出部４ｅが、脚片４ａ１に延設された２個の延設片４ｂの間に配置されている。言い換えれば、第１の突出部４ｅは、脚片４ａ１の各延設片４ｂの各々とは異なる位置に配置されている。   In addition, the leg piece 4a1 is provided with a first projecting portion 4e projecting toward the facing leg piece 4a2 at an end portion on the facing leg piece 4a2 side (the lower right end portion in FIG. 4A). . In this embodiment, the 1st protrusion part 4e is arrange | positioned between the two extended pieces 4b extended by the leg piece 4a1. In other words, the 1st protrusion part 4e is arrange | positioned in the position different from each of each extension piece 4b of the leg piece 4a1.

また、脚片４ａ２は、対向する脚片４ａ１側の端部（図４（ａ）では、左上端部）に、対向する脚片４ａ１側へ突出する第２の突出部４ｆが設けられている。本実施形態では、第２の突出部４ｆが、脚片４ａ２に延設された２個の延設片４ｂの間に配置されている。言い換えれば、第２の突出部４ｆは、脚片４ａ２の各延設片４ｂの各々とは異なる位置に配置されている。   In addition, the leg piece 4a2 is provided with a second projecting portion 4f that projects toward the facing leg piece 4a1 at the end on the facing leg piece 4a1 side (the upper left end portion in FIG. 4A). . In this embodiment, the 2nd protrusion part 4f is arrange | positioned between the two extended pieces 4b extended by the leg piece 4a2. In other words, the 2nd protrusion part 4f is arrange | positioned in the position different from each of each extension piece 4b of the leg piece 4a2.

押圧部材４の作製方法としては、例えば、まず、金属板から押圧部材４の展開図に相当する形を打ち抜き加工し、打ち抜き加工された押圧部材４の各延設片４ｂの各々を曲げ加工する。そして、この曲げ加工された各延設片４ｂの先端部の各々を曲げ加工することによって、押圧部４ｃがそれぞれ形成される。   As a manufacturing method of the pressing member 4, for example, first, a shape corresponding to a development view of the pressing member 4 is punched from a metal plate, and each extended piece 4b of the pressing member 4 punched is bent. . And the press part 4c is formed by bending each of the front-end | tip part of each extended piece 4b bent.

ところで、放熱部材１の一面側（図１では、上面側）の中央部には、押圧部材４の本体部４ａを配置するための第１の凹所１ａが設けられている。ここにおいて、各脚片４ａ１，４ａ２および連結片４ａ３の各々の厚み寸法は、第１の凹所１ａの深さ寸法よりも小さく設定されている。   By the way, the 1st recessed part 1a for arrange | positioning the main-body part 4a of the press member 4 is provided in the center part of the one surface side (FIG. 1 upper surface side) of the thermal radiation member 1. As shown in FIG. Here, the thickness dimension of each leg piece 4a1, 4a2 and connecting piece 4a3 is set smaller than the depth dimension of the first recess 1a.

第１の凹所１ａの内底壁には、押圧部材４を放熱部材１に固定するための第１の固定ねじ１１を螺合する第１の固定ねじ穴（図示せず）が、複数箇所（本実施形態では、２箇所）に形成されている。ここにおいて、押圧部材４の本体部４ａは、放熱部材１の第１の凹所１ａにおける上記各第１の固定ねじ穴に対応する位置の各々に、第１の固定ねじ１１を挿通する第１の固定ねじ挿通孔４ｄ（図４参照）が貫設されている。具体的に説明すると、押圧部材４の本体部４ａは、各脚片４ａ１，４ａ２の各々に、上述の第１の固定ねじ挿通孔４ｄが貫設されている。これにより、本実施形態の発光装置１０では、第１の固定ねじ１１を、押圧部材４の本体部４ａにおける各第１の固定ねじ挿通孔４ｄに挿通して、放熱部材１の上記各第１の固定ねじ穴に螺合することによって、押圧部材４を放熱部材１に固定することができる。要するに、押圧部材４は、放熱部材１に取り付けられる。   A plurality of first fixing screw holes (not shown) for screwing a first fixing screw 11 for fixing the pressing member 4 to the heat radiating member 1 are provided in the inner bottom wall of the first recess 1a. (Two places in this embodiment). Here, the main body portion 4 a of the pressing member 4 is a first portion through which the first fixing screw 11 is inserted into each of the positions corresponding to the first fixing screw holes in the first recess 1 a of the heat radiating member 1. The fixing screw insertion hole 4d (see FIG. 4) is penetrated. More specifically, in the main body portion 4a of the pressing member 4, the first fixing screw insertion hole 4d described above is provided in each of the leg pieces 4a1 and 4a2. Thereby, in the light emitting device 10 of the present embodiment, the first fixing screw 11 is inserted into each first fixing screw insertion hole 4d in the main body portion 4a of the pressing member 4, and each of the first fixing screws 11 of the heat radiation member 1 is inserted. The pressing member 4 can be fixed to the heat radiating member 1 by being screwed into the fixing screw hole. In short, the pressing member 4 is attached to the heat radiating member 1.

また、放熱部材１の上記一面側は、押圧部材４が放熱部材１に固定された状態において各脚片４ａ１，４ａ２と連結片４ａ３とで囲まれた部位に、絶縁カバー３を配置するための第２の凹所１ｂ（図１，３参照）が設けられている。第２の凹所１ｂの内周形状は、矩形状に形成されている。また、放熱部材１の上記一面側の周部は、収納部３ｆの第２の収納室１２ｂと対向する部位に、収納部３ｆを配置するための第３の凹所１ｇ（図２，３参照）が設けられている。第３の凹所１ｇは、第２の凹所１ｇと連通するように形成されている。また、第３の凹所１ｇは、導出部１６と連通するように形成されている。なお、第２の凹所１ｂおよび第３の凹所１ｇの各々の深さ寸法は、第１の凹所１ａの深さ寸法よりも大きく設定されている。   Moreover, the said one surface side of the heat radiating member 1 is for arrange | positioning the insulating cover 3 in the site | part enclosed by each leg piece 4a1, 4a2 and the connection piece 4a3 in the state in which the press member 4 was fixed to the heat radiating member 1. A second recess 1b (see FIGS. 1 and 3) is provided. The inner peripheral shape of the second recess 1b is formed in a rectangular shape. Further, the peripheral portion on the one surface side of the heat radiating member 1 is a third recess 1g (see FIGS. 2 and 3) for disposing the storage portion 3f in a portion facing the second storage chamber 12b of the storage portion 3f. ) Is provided. The third recess 1g is formed so as to communicate with the second recess 1g. The third recess 1 g is formed so as to communicate with the lead-out portion 16. The depth dimension of each of the second recess 1b and the third recess 1g is set larger than the depth dimension of the first recess 1a.

第２の凹所１ｂの内底壁の中央部には、放熱部材１の上記一面側（図１では、上側）へ突出した突台部１ｃが設けられている。本実施形態の発光装置１０では、突台部１ｃの外周形状を、矩形状に形成しているが、この形状を特に限定するものではない。また、本実施形態では、突台部１ｃの先端面１ｅ側に、実装基板２ｂが配置される。要するに、本実施形態の発光装置１０では、実装基板２ｂが、放熱部材１の一面側（放熱部材１の突台部１ｃの先端面１ｅ側）に配置される。ここで、実装基板２ｂの平面サイズは、実装基板２ｂの側部および上記一表面の周部を絶縁カバー３により覆うときに、実装基板２ｂの側部が絶縁カバー３の側壁部３ｂおよび仕切壁部１３に当接するように設定されている。これにより、本実施形態の発光装置１０では、実装基板２ｂが側方へ移動するのを規制することが可能となる。また、本実施形態では、放熱部材１の突台部１ｃの平面サイズを、実装基板２ｂの平面サイズよりも小さく設定しているが、実装基板２ｂの平面サイズと同じ大きさに設定してもよい。これにより、本実施形態の発光装置１０では、光源部２のＬＥＤで発生した熱を、放熱部材１へ効率よく伝導することが可能となる。   At the center of the inner bottom wall of the second recess 1b, a projecting portion 1c that protrudes toward the one surface side (the upper side in FIG. 1) of the heat radiating member 1 is provided. In the light emitting device 10 of the present embodiment, the outer peripheral shape of the protrusion 1c is formed in a rectangular shape, but this shape is not particularly limited. In the present embodiment, the mounting substrate 2b is disposed on the front end surface 1e side of the projecting portion 1c. In short, in the light emitting device 10 of the present embodiment, the mounting substrate 2b is disposed on the one surface side of the heat radiating member 1 (the front end surface 1e side of the protruding portion 1c of the heat radiating member 1). Here, the planar size of the mounting substrate 2b is such that when the side portion of the mounting substrate 2b and the peripheral portion of the one surface are covered with the insulating cover 3, the side portion of the mounting substrate 2b is the side wall portion 3b of the insulating cover 3 and the partition wall. It is set to abut against the portion 13. Thereby, in the light-emitting device 10 of this embodiment, it becomes possible to control that the mounting substrate 2b moves to the side. Moreover, in this embodiment, although the planar size of the protrusion part 1c of the heat radiating member 1 is set smaller than the planar size of the mounting substrate 2b, it may be set to the same size as the planar size of the mounting substrate 2b. Good. Thereby, in the light-emitting device 10 of this embodiment, it becomes possible to efficiently conduct the heat generated by the LEDs of the light source unit 2 to the heat radiating member 1.

ここにおいて、絶縁カバー３の各鍔部３ｄの突出寸法は、放熱部材１の突台部１ｃの側面と、放熱部材１の第２の凹所１ｂの内側面との間の距離よりも小さく設定されている（図１参照）。また、各鍔部３ｄの厚み寸法は、突台部１ｃの突出寸法よりも小さく設定されている（図１参照）。また、絶縁カバー３の蓋部３ａの周部は、上記直交する方向の両端部（図２では、左上端部および右下端部）の各々に、放熱部材１側（図２では、下側）へ突出する凸部３ｅ（図１参照）が設けられている。各凸部３ｅは、放熱部材１の突台部１ｃとで実装基板２ｂを挟持する。   Here, the projecting dimension of each flange 3d of the insulating cover 3 is set to be smaller than the distance between the side surface of the projecting portion 1c of the heat radiating member 1 and the inner side surface of the second recess 1b of the heat radiating member 1. (See FIG. 1). Moreover, the thickness dimension of each collar part 3d is set smaller than the protrusion dimension of the protrusion part 1c (refer FIG. 1). Further, the peripheral portion of the lid portion 3a of the insulating cover 3 is disposed on each of the end portions in the orthogonal direction (the upper left end portion and the lower right end portion in FIG. 2) on the heat radiating member 1 side (the lower side in FIG. 2). Convex part 3e (refer to Drawing 1) which protrudes to is provided. Each convex portion 3 e sandwiches the mounting substrate 2 b with the protruding portion 1 c of the heat radiating member 1.

また、押圧部材４の各突出部４ｅ，４ｆの突出寸法は、押圧部材４が放熱部材１に固定されたときに、絶縁カバー３の側壁部３ｂの外側と接触可能な寸法に設定されている（図１参照）。なお、本実施形態の発光装置１０では、各突出部４ｅ，４ｆの各々が、絶縁カバー３が実装基板２ｂの側方へ移動するのを規制する規制部を構成している。   The projecting dimensions of the projecting parts 4 e and 4 f of the pressing member 4 are set to dimensions that allow contact with the outside of the side wall part 3 b of the insulating cover 3 when the pressing member 4 is fixed to the heat radiating member 1. (See FIG. 1). In the light emitting device 10 of the present embodiment, each of the protrusions 4e and 4f constitutes a restricting portion that restricts the insulating cover 3 from moving to the side of the mounting substrate 2b.

本実施形態の発光装置１０では、仮に、押圧部材４の各延設片４ｂの弾性変形に起因して絶縁カバー３が光源部２のＬＥＤの光出射側（図１では、上側）へ移動する場合、絶縁カバー３の各鍔部３ｄが押圧部材４の各突出部４ｅ，４ｆに当たるので、絶縁カバー３が押圧部材４から外れるのを防ぐことが可能となる。   In the light emitting device 10 of the present embodiment, the insulating cover 3 is moved to the light emitting side (upper side in FIG. 1) of the LED of the light source unit 2 due to elastic deformation of each extending piece 4b of the pressing member 4. In this case, since each flange 3d of the insulating cover 3 hits the projecting portions 4e and 4f of the pressing member 4, it is possible to prevent the insulating cover 3 from being detached from the pressing member 4.

また、放熱部材１の側部には、発光装置１０を照明器具３０の器具本体２０（図５参照）に取り付けるための複数（本実施形態では、３個）の取付部１ｆ（図２，３参照）が、側方へ延設されている。各取付部１ｆの各々には、発光装置１０を器具本体２０に取り付けるための第１の取付ねじ（図示せず）を挿通する第１の取付ねじ挿通孔１ｄが設けられている。なお、本実施形態では、取付部１ｆの個数を、３個としているが、この個数を特に限定するものではない。   Further, a plurality (three in this embodiment) of attachment portions 1f (FIGS. 2 and 3) for attaching the light emitting device 10 to the fixture body 20 (see FIG. 5) of the lighting fixture 30 are provided on the side of the heat radiating member 1. Is extended to the side. Each of the attachment portions 1f is provided with a first attachment screw insertion hole 1d through which a first attachment screw (not shown) for attaching the light emitting device 10 to the instrument body 20 is inserted. In the present embodiment, the number of attachment portions 1f is three, but the number is not particularly limited.

以下、本実施形態の発光装置１０を組み立てる手順について説明する。なお、本実施形態では、一対の電線５ａ，５ｂが、実装基板２ｂに予め電気的に接続されているものとして説明する。   Hereinafter, a procedure for assembling the light emitting device 10 of the present embodiment will be described. In the present embodiment, a pair of electric wires 5a and 5b will be described as being electrically connected to the mounting substrate 2b in advance.

本実施形態の発光装置１０では、まず、実装基板２ｂの側部および上記一表面の周部を絶縁カバー３により覆う。このとき、絶縁カバー３の開口窓３ｃから光源部２の封止部２ａが露出される。次に、光源部２の実装基板２ｂを、放熱部材１の突台部１ｃの先端面１ｅ側に配置して、絶縁カバー３を放熱部材１の第２の凹所１ｂおよび第３の凹所１ｇに配置する。そして、押圧部材４の本体部４ａを放熱部材１の第１の凹所１ａに配置して、第１の固定ねじ１１により押圧部材４を放熱部材１に固定することによって、発光装置１０が組み立てられる。これにより、本実施形態の発光装置１０では、押圧部材４の各押圧部４ｃの各々が、絶縁カバー３を放熱部材１側に向かって押圧することが可能となる。つまり、本実施形態の発光装置１０では、押圧部材４が、実装基板２ｂを、絶縁カバー３を介して放熱部材１側に押圧することが可能となる。また、本実施形態の発光装置１０では、押圧部材４が、実装基板２ｂを、絶縁カバー３を介して放熱部材１側に押圧することが可能となるので、光源部２のＬＥＤで発生した熱を、実装基板２ｂを通して、放熱部材１へ効率よく伝導することが可能となり、ＬＥＤの温度上昇を抑制することが可能となる。ここにおいて、本実施形態の発光装置１０では、実装基板２ｂと放熱部材１の突台部１ｃとの間に、例えば、放熱用のグリースや熱伝導性シートなどの熱伝導性部材（図示せず）を配置することが好ましい。これにより、本実施形態の発光装置１０では、光源部２のＬＥＤで発生した熱を、実装基板２ｂおよび上記熱伝導性部材を通して、放熱部材１へさらに効率よく伝導することが可能となり、光源部２の放熱性を高めることが可能となる。   In the light emitting device 10 of the present embodiment, first, the side portion of the mounting substrate 2 b and the peripheral portion of the one surface are covered with the insulating cover 3. At this time, the sealing portion 2 a of the light source unit 2 is exposed from the opening window 3 c of the insulating cover 3. Next, the mounting substrate 2b of the light source unit 2 is disposed on the tip end surface 1e side of the projecting portion 1c of the heat radiating member 1, and the insulating cover 3 is placed in the second and third recesses 1b and 1b of the heat radiating member 1. Place 1g. Then, the light emitting device 10 is assembled by disposing the main body portion 4 a of the pressing member 4 in the first recess 1 a of the heat radiating member 1 and fixing the pressing member 4 to the heat radiating member 1 with the first fixing screw 11. It is done. Thereby, in the light-emitting device 10 of this embodiment, each pressing part 4c of the pressing member 4 can press the insulating cover 3 toward the heat radiating member 1 side. That is, in the light emitting device 10 of the present embodiment, the pressing member 4 can press the mounting substrate 2b to the heat radiating member 1 side through the insulating cover 3. Moreover, in the light-emitting device 10 of this embodiment, since the pressing member 4 can press the mounting substrate 2b to the heat radiating member 1 side via the insulating cover 3, the heat generated by the LEDs of the light source unit 2 Can be efficiently conducted to the heat radiating member 1 through the mounting substrate 2b, and the temperature rise of the LED can be suppressed. Here, in the light emitting device 10 according to the present embodiment, a heat conductive member (not shown) such as a heat radiating grease or a heat conductive sheet is provided between the mounting substrate 2b and the protruding portion 1c of the heat radiating member 1. ) Is preferably arranged. Thereby, in the light emitting device 10 of the present embodiment, the heat generated by the LED of the light source unit 2 can be more efficiently conducted to the heat radiating member 1 through the mounting substrate 2b and the heat conductive member. It becomes possible to improve the heat dissipation of 2.

以上説明した本実施形態の発光装置１０では、放熱部材１と、放熱部材１の一面側（突台部１ｃの先端面１ｅ側）に配置されてなり放熱部材１側とは反対の上記一表面側の中央部にＬＥＤと電気的に接続される充電部（上記一対の第１電極部）を有する実装基板２ｂと、実装基板２ｂの側部および上記一表面の周部を覆う絶縁カバー３と、実装基板２ｂを、絶縁カバー３を介して放熱部材１側に押圧する押圧部材４とを備えているので、図８に示した従来例のＬＥＤランプ８１に比べて、実装基板２ｂの平面サイズを大きくすることなく、押圧部材４の各押圧部４ｃと、実装基板２ｂの上記充電部との間の沿面距離を長くすることが可能となる。また、本実施形態の発光装置１０では、押圧部材４の各押圧部４ｃと、実装基板２ｂの上記充電部との間の沿面距離を長くすることが可能となるので、耐雷サージ性を高めることが可能となり、実装基板２ｂの上記充電部の電気的な絶縁性能を高めることも可能となる。要するに、本実施形態の発光装置１０では、実装基板２ｂの平面サイズを大きくすることなく、実装基板２ｂの上記充電部の絶縁性能を高めることが可能となる。   In the light emitting device 10 of the present embodiment described above, the heat dissipating member 1 and the one surface opposite to the heat dissipating member 1 side, which is disposed on one surface side of the heat dissipating member 1 (the front end surface 1e side of the protrusion 1c). A mounting substrate 2b having a charging portion (the pair of first electrode portions) electrically connected to the LED at a central portion on the side, and an insulating cover 3 covering the side portion of the mounting substrate 2b and the peripheral portion of the one surface; Since the mounting board 2b is provided with the pressing member 4 that presses the mounting board 2b toward the heat radiating member 1 through the insulating cover 3, the planar size of the mounting board 2b is larger than the LED lamp 81 of the conventional example shown in FIG. It is possible to increase the creeping distance between each pressing portion 4c of the pressing member 4 and the charging portion of the mounting board 2b without increasing the height. Moreover, in the light-emitting device 10 of this embodiment, since it becomes possible to lengthen the creeping distance between each press part 4c of the press member 4, and the said charging part of the mounting board 2b, it improves lightning surge resistance. Thus, the electrical insulation performance of the charging part of the mounting substrate 2b can be improved. In short, in the light emitting device 10 of the present embodiment, it is possible to improve the insulating performance of the charging unit of the mounting substrate 2b without increasing the planar size of the mounting substrate 2b.

また、本実施形態の発光装置１０では、押圧部材４に、絶縁カバー３が実装基板２ｂの側方へ移動するのを規制する規制部（各突出部４ｅ，４ｆ）を設けているので、絶縁カバー３が実装基板２ｂの側方へ移動するのを規制することが可能となり、上述の沿面距離を略一定に保つことが可能となる。これにより、本実施形態の発光装置１０では、実装基板２ｂの上記充電部の電気的な絶縁性能をより高めることが可能となる。   Further, in the light emitting device 10 of the present embodiment, the pressing member 4 is provided with the restriction portions (respective protrusions 4e and 4f) that restrict the insulating cover 3 from moving to the side of the mounting substrate 2b. It is possible to regulate the movement of the cover 3 to the side of the mounting substrate 2b, and the above creepage distance can be kept substantially constant. Thereby, in the light-emitting device 10 of this embodiment, it becomes possible to improve the electrical insulation performance of the said charging part of the mounting board | substrate 2b more.

以下、本実施形態の発光装置１０を用いた照明器具の一例について、図５に基づいて説明する。   Hereinafter, an example of a lighting fixture using the light emitting device 10 of the present embodiment will be described with reference to FIG.

本実施形態の照明器具３０は、街路灯である。この照明器具３０は、上述の発光装置１０と、この発光装置１０を保持する器具本体２０と、器具本体２０に保持された発光装置１０を覆う透光性のグローブ２１とを備えている。なお、本実施形態の照明器具３０では、１個の器具本体２０に、複数個（本実施形態では、４個）の発光装置１０が保持されている。また、本実施形態では、発光装置１０の個数を、４個としているが、１個であってもよい。   The lighting fixture 30 of this embodiment is a street lamp. The lighting fixture 30 includes the above-described light emitting device 10, a fixture main body 20 that holds the light emitting device 10, and a translucent globe 21 that covers the light emitting device 10 held by the fixture main body 20. In the lighting fixture 30 of the present embodiment, a plurality of (four in the present embodiment) light emitting devices 10 are held in one fixture body 20. In the present embodiment, the number of light emitting devices 10 is four, but may be one.

器具本体２０は、例えば、ステンレスなどの金属材料により形成することができる。また、器具本体２０は、下側に開口面を有する椀状の本体部２０ａと、この本体部２０ａの内底壁に固定され各発光装置１０を保持する保持部２０ｂとを有している。   The instrument body 20 can be formed of a metal material such as stainless steel, for example. The instrument main body 20 includes a bowl-shaped main body portion 20a having an opening surface on the lower side, and a holding portion 20b that is fixed to the inner bottom wall of the main body portion 20a and holds each light emitting device 10.

保持部２０ｂは、中空の四角錐台形状に形成されている。   The holding | maintenance part 20b is formed in the hollow square frustum shape.

保持部２０ｂの底面部（図５では、上面部）には、この保持部２０ｂを本体部２０ａに固定するための鍔部２０ｃが設けられている。本実施形態では、鍔部２０ｃの外周形状が、円形状に形成されている。なお、本実施形態の照明器具３０では、保持部２０ｂの形状を、四角錐台形状に形成しているが、この形状を特に限定するものではない。また、本実施形態では、鍔部２０ｃの外周形状を、円形状に形成しているが、この形状を特に限定するものではない。   On the bottom surface portion (upper surface portion in FIG. 5) of the holding portion 20b, a flange portion 20c for fixing the holding portion 20b to the main body portion 20a is provided. In the present embodiment, the outer peripheral shape of the flange portion 20c is formed in a circular shape. In addition, in the lighting fixture 30 of this embodiment, although the shape of the holding | maintenance part 20b is formed in the shape of a square frustum, this shape is not specifically limited. Moreover, in this embodiment, although the outer periphery shape of the collar part 20c is formed in circular shape, this shape is not specifically limited.

保持部２０ｂの鍔部２０ｃには、この保持部２０ｂを本体部２０ａに固定する第２の固定ねじ２３を挿通する第２の固定ねじ挿通孔（図示せず）が複数箇所（本実施形態では、４箇所）に設けられている。ここにおいて、本体部２０ａの内底壁には、鍔部２０ｃの上記各第２の固定ねじ挿通孔の各々に対応する位置に、第２の固定ねじ２３を螺合する第２の固定ねじ穴（図示せず）が設けられている。本実施形態の照明器具３０では、第２の固定ねじ２３を、保持部２０ｂの鍔部２０ｃにおける上記各第２の固定ねじ挿通孔に挿通して、本体部２０ａの上記各第２の固定ねじ穴に螺合することによって、保持部２０ｂを本体部２０ａに固定することができる。   The flange portion 20c of the holding portion 20b has a plurality of second fixing screw insertion holes (not shown) through which the second fixing screws 23 for fixing the holding portion 20b to the main body portion 20a are inserted (in the present embodiment). 4 places). Here, the second fixing screw hole into which the second fixing screw 23 is screwed into the inner bottom wall of the main body portion 20a at a position corresponding to each of the second fixing screw insertion holes of the flange portion 20c. (Not shown) is provided. In the lighting fixture 30 of the present embodiment, the second fixing screws 23 are inserted through the respective second fixing screw insertion holes in the flange portion 20c of the holding portion 20b, and the second fixing screws of the main body portion 20a. The holding part 20b can be fixed to the main body part 20a by being screwed into the hole.

保持部２０ｂの底面部側とは反対側の一面部（図５では、下面部）には、例えば、道路などに立てられた円柱状のポール２２の一端部（図５では、上端部）に、照明器具３０を着脱自在に固定することが可能な固定部（図示せず）が設けられている。   On one surface (on the lower surface in FIG. 5) opposite to the bottom surface of the holding portion 20b, for example, at one end (upper end in FIG. 5) of a cylindrical pole 22 standing on a road or the like. In addition, a fixing portion (not shown) capable of detachably fixing the lighting fixture 30 is provided.

本実施形態の照明器具３０では、各発光装置１０の各々が、保持部２０ｂの各側面部で保持されている。具体的に説明すると、保持部２０ｂの各側面部には、発光装置１０の放熱部材１における各第１の取付ねじ挿通孔１ｄの各々に対応する位置に、上記第１の取付ねじを螺合する第１の取付ねじ穴（図示せず）が設けられている。本実施形態の照明器具３０では、上記第１の取付ねじを、発光装置１０の放熱部材１における各第１の取付ねじ挿通孔１ｄに挿通して、保持部２０ｂの上記各第１の取付ねじ穴に螺合することによって、各発光装置１０の各々が保持部２０ｂに固定される。これにより、保持部２０ｂは、発光装置１０を保持することができる。   In the lighting fixture 30 of the present embodiment, each light emitting device 10 is held by each side surface portion of the holding portion 20b. More specifically, the first mounting screws are screwed into the side portions of the holding portion 20b at positions corresponding to the first mounting screw insertion holes 1d in the heat radiating member 1 of the light emitting device 10. A first mounting screw hole (not shown) is provided. In the lighting fixture 30 of the present embodiment, the first mounting screws are inserted into the first mounting screw insertion holes 1d of the heat dissipation member 1 of the light emitting device 10, and the first mounting screws of the holding portion 20b. Each light emitting device 10 is fixed to the holding portion 20b by being screwed into the hole. Thereby, the holding unit 20 b can hold the light emitting device 10.

ところで、発光装置１０は、放熱部材１の他面側（図１，３では、下面側）に、この発光装置１０を保持部２０ｂに位置決めするための突起１５が設けられている。また、保持部２０ｂの各側面部には、発光装置１０の放熱部材１の各突起１５の各々に対応する位置に、窪部（図示せず）が設けられている。これにより、本実施形態の照明器具３０では、発光装置１０を保持部２０ｂに取り付けるときに、発光装置１０を保持部２０ｂに位置決めすることが可能となり、発光装置１０を保持部２０ｂに取り付ける作業性を向上させることが可能となる。なお、本実施形態の照明器具３０では、突起１５の個数を３個としているが、この個数を特に限定するものではない。   By the way, the light emitting device 10 is provided with a protrusion 15 for positioning the light emitting device 10 on the holding portion 20b on the other surface side (the lower surface side in FIGS. 1 and 3) of the heat radiating member 1. In addition, a recess (not shown) is provided on each side surface of the holding portion 20 b at a position corresponding to each of the protrusions 15 of the heat dissipation member 1 of the light emitting device 10. Thereby, in the lighting fixture 30 of this embodiment, when attaching the light-emitting device 10 to the holding | maintenance part 20b, it becomes possible to position the light-emitting device 10 to the holding | maintenance part 20b, and workability | operativity which attaches the light-emitting device 10 to the holding | maintenance part 20b. Can be improved. In addition, in the lighting fixture 30 of this embodiment, although the number of the protrusions 15 is three, this number is not specifically limited.

また、本実施形態の照明器具３０では、保持部２０ｂの内部に、各発光装置１０を点灯させる点灯装置（図示せず）が配置されている。ここにおいて、各発光装置１０の一対の電線５ａ，５ｂは、上記点灯装置と電気的に接続されている。なお、図５では、各発光装置１０の一対の電線５ａ，５ｂの図示を省略している。   Moreover, in the lighting fixture 30 of this embodiment, the lighting device (not shown) which lights each light-emitting device 10 is arrange | positioned inside the holding | maintenance part 20b. Here, the pair of electric wires 5a and 5b of each light-emitting device 10 is electrically connected to the lighting device. In addition, in FIG. 5, illustration of a pair of electric wire 5a, 5b of each light-emitting device 10 is abbreviate | omitted.

グローブ２１は、上側に開口面を有する椀状に形成されている。本実施形態の照明器具３０では、グローブ２１の材料として、透光性材料を採用している。透光性材料としては、透光性の樹脂（例えば、ＡＢＳ樹脂、アクリル樹脂、ポリスチレン樹脂など）やガラスなどを採用することができる。また、本実施形態では、グローブ２１の開口面のサイズが、本体部２０ａの開口面のサイズよりも小さく設定されている。   The globe 21 is formed in a bowl shape having an opening surface on the upper side. In the lighting fixture 30 of this embodiment, a translucent material is adopted as the material of the globe 21. As the light-transmitting material, a light-transmitting resin (for example, ABS resin, acrylic resin, polystyrene resin, or the like), glass, or the like can be used. In the present embodiment, the size of the opening surface of the globe 21 is set to be smaller than the size of the opening surface of the main body 20a.

グローブ２１の底壁には、ポール２２を挿通する挿通孔２１ａが形成されている。   An insertion hole 21 a for inserting the pole 22 is formed in the bottom wall of the globe 21.

グローブ２１の上側の外周壁には、グローブ２１を器具本体２０に取り付けるための第２の取付ねじ（図示せず）を螺合する第２の取付ねじ穴２１ｂが複数設けられている。ここにおいて、器具本体２０の本体部２０ａにおける下側の周壁は、グローブ２１の各第２の取付ねじ穴２１ｂの各々に対応する位置に、上記第２の取付ねじを挿通する第２の取付ねじ挿通孔２０ｄが貫設されている。本実施形態の照明器具３０では、上記第２の取付ねじを、器具本体２０の本体部２０ａにおける各第２の取付ねじ挿通孔２０ｄに挿通して、グローブ２１の上記各第２の取付ねじ穴２１ｂに螺合することによって、グローブ２１が器具本体２０に取り付けられる。なお、本実施形態の照明器具３０では、器具本体２０とグローブ２１とが、図示しない締結具（金具）を介して上記第２の取付ねじにより固定される。また、本実施形態の照明器具３０では、グローブ２１を器具本体２０に取り付ける手段として、上記締結具および上記第２の取付ねじを用いているが、この手段を特に限定するものではない。   A plurality of second mounting screw holes 21 b for screwing second mounting screws (not shown) for mounting the globe 21 to the instrument body 20 are provided on the outer peripheral wall on the upper side of the globe 21. Here, the lower peripheral wall of the main body 20a of the instrument main body 20 is a second mounting screw through which the second mounting screw is inserted at a position corresponding to each of the second mounting screw holes 21b of the globe 21. An insertion hole 20d is provided therethrough. In the lighting fixture 30 of the present embodiment, the second mounting screws are inserted into the second mounting screw insertion holes 20d in the main body portion 20a of the fixture main body 20, and the second mounting screw holes of the globe 21 are inserted. The glove 21 is attached to the instrument body 20 by being screwed into 21b. In addition, in the lighting fixture 30 of this embodiment, the fixture main body 20 and the glove | globe 21 are fixed with the said 2nd attachment screw via the fastener (metal fitting) which is not shown in figure. Moreover, in the lighting fixture 30 of this embodiment, although the said fastener and the said 2nd attachment screw are used as a means to attach the glove | globe 21 to the instrument main body 20, this means is not specifically limited.

また、上述の発光装置１０を用いた照明器具３０は、図５に示した構成の照明器具３０に限らず、例えば、図６および図７に示した構成の照明器具３０でもよい。この照明器具３０は、投光器であり、上述の発光装置１０と、この発光装置１０を保持する器具本体５０と、器具本体２０に保持された発光装置１０を覆う透光性のカバー（図示せず）とを備えている。図６および図７に示した構成の照明器具３０では、１個の器具本体５０に、複数個（本実施形態では、８個）の発光装置１０が保持されている。なお、本実施形態では、発光装置１０の個数を、８個としているが、１個であってもよい。   Moreover, the lighting fixture 30 using the above-described light emitting device 10 is not limited to the lighting fixture 30 having the configuration shown in FIG. 5, and may be, for example, the lighting fixture 30 having the configuration shown in FIGS. 6 and 7. The lighting fixture 30 is a projector, and includes the above-described light emitting device 10, a fixture main body 50 that holds the light emitting device 10, and a translucent cover (not shown) that covers the light emitting device 10 held by the fixture main body 20. ). In the lighting fixture 30 having the configuration shown in FIGS. 6 and 7, a plurality of (eight in the present embodiment) light emitting devices 10 are held in one fixture body 50. In the present embodiment, the number of light emitting devices 10 is eight, but may be one.

器具本体５０は、各発光装置１０を取り付けるための取付部５１ａを有する箱状の本体部５１と、例えば壁面の造営面などに照明器具３０を固定するための固定具５３と、本体部５１と固定具５３とを回動自在に連結する連結部５２とを有している。図６および図７に示した構成の照明器具３０では、本体部５１の内部に、各発光装置１０を点灯させる点灯装置（図示せず）が配置されている。   The appliance main body 50 includes a box-shaped main body 51 having an attachment portion 51 a for attaching each light emitting device 10, a fixture 53 for fixing the lighting fixture 30 to, for example, a wall surface, and a main body 51. It has the connection part 52 which connects the fixing tool 53 rotatably. In the lighting fixture 30 having the configuration shown in FIGS. 6 and 7, a lighting device (not shown) for lighting each light emitting device 10 is arranged inside the main body 51.

以上説明した本実施形態の各照明器具３０では、上述の発光装置１０と、この発光装置１０を保持する器具本体２０とを備えているので、実装基板２ｂの平面サイズを大きくすることなく、実装基板２ｂの上記充電部の絶縁性能を高めることが可能な発光装置１０を用いた照明器具３０を提供することができる。   Since each lighting fixture 30 of the present embodiment described above includes the above-described light emitting device 10 and the fixture main body 20 that holds the light emitting device 10, the mounting can be performed without increasing the planar size of the mounting substrate 2b. The lighting fixture 30 using the light-emitting device 10 which can improve the insulation performance of the said charging part of the board | substrate 2b can be provided.

１ 放熱部材
２ｂ 実装基板
３ 絶縁カバー
４ 押圧部材
４ｅ 突出部（規制部）
４ｆ 突出部（規制部）
１０ 発光装置
２０ 器具本体
３０ 照明器具 DESCRIPTION OF SYMBOLS 1 Heat radiation member 2b Mounting board 3 Insulation cover 4 Pressing member 4e Protrusion part (regulation part)
4f Protruding part (regulating part)
DESCRIPTION OF SYMBOLS 10 Light-emitting device 20 Appliance main body 30 Lighting fixture

Claims (2)

放熱部材と、前記放熱部材の一面側に配置されてなり前記放熱部材側とは反対の一表面側の中央部にＬＥＤと電気的に接続される充電部を有する実装基板と、前記実装基板の側部および前記一表面の周部を覆う絶縁カバーと、前記実装基板を、前記絶縁カバーを介して前記放熱部材側に押圧する押圧部材とを備えてなり、
前記押圧部材は、前記放熱部材に取り付けられてなり、当該押圧部材に、前記実装基板の厚み方向に交差する所定方向における前記絶縁カバーの移動を規制する規制部が設けられてなり、
前記規制部は、前記所定方向において前記絶縁カバーの両側に、前記絶縁カバーに接触するように配置されることを特徴とする発光装置。 A mounting board having a heat dissipating member and a charging part that is disposed on one surface side of the heat dissipating member and is electrically connected to the LED at the center of the one surface side opposite to the heat dissipating member side; an insulating cover covering the circumference of the side and said one surface, said mounting substrate, Ri Na and a pressing member for pressing the heat radiating member side through the insulating cover,
The pressing member is attached to the heat dissipating member, and the pressing member is provided with a restricting portion that restricts the movement of the insulating cover in a predetermined direction intersecting the thickness direction of the mounting substrate.
The light emitting device according to claim 1, wherein the restricting portion is disposed on both sides of the insulating cover in the predetermined direction so as to contact the insulating cover . 請求項１記載の発光装置と、前記発光装置を保持する器具本体とを備えてなることを特徴とする照明器具。  An illumination fixture comprising: the light-emitting device according to claim 1; and a fixture main body that holds the light-emitting device.
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