WO2013125112A1 - Light-emitting device and lighting equipment using same - Google Patents

Light-emitting device and lighting equipment using same Download PDF

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Publication number
WO2013125112A1
WO2013125112A1 PCT/JP2012/079909 JP2012079909W WO2013125112A1 WO 2013125112 A1 WO2013125112 A1 WO 2013125112A1 JP 2012079909 W JP2012079909 W JP 2012079909W WO 2013125112 A1 WO2013125112 A1 WO 2013125112A1
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WO
WIPO (PCT)
Prior art keywords
light emitting
emitting device
mounting substrate
light
pressing
Prior art date
Application number
PCT/JP2012/079909
Other languages
French (fr)
Japanese (ja)
Inventor
博司 海路
Original Assignee
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Priority to CN201290001191.8U priority Critical patent/CN204042478U/en
Publication of WO2013125112A1 publication Critical patent/WO2013125112A1/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/004Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21WINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/10Outdoor lighting
    • F21W2131/103Outdoor lighting of streets or roads
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the present invention relates to a light emitting device and a lighting fixture using the same.
  • a light emitting diode (hereinafter abbreviated as LED) may cause a decrease in light output or a shortened life due to an increase in temperature of the LED. Therefore, in the light-emitting device using LED as a light source, it is calculated
  • Document 1 describes an LED lamp 81 having the configuration shown in FIG. 10 as an example of an illumination device used indoors and outdoors.
  • the LED lamp 81 includes a lamp body 82, a globe 83, an E-type base 84, a lighting device 85, and a COB (chip-on-board) type light-emitting device 86.
  • the lamp body 82 is made of a metal material and has a function as a heat radiating member.
  • Document 1 describes that a plurality of radiating fins 87 are integrally formed on the outer peripheral surface of the lamp main body 82.
  • Document 1 describes that the light emitting device 86 is attached to the support surface 82a of the lamp body 82.
  • the light emitting device 86 includes a rectangular substrate 88 (see FIG. 11).
  • the substrate 88 is formed of a white ceramic material and has electrical insulation.
  • the substrate 88 has a mounting region 88a in which a wiring pattern (not shown) is formed in the central portion on one surface side (the upper surface side in FIG. 11).
  • a plurality of light emitting diode chips 89 are arranged in the mounting region 88a.
  • Document 1 describes that each of the light emitting diode chips 89 is regularly arranged so as to be adjacent to the wiring pattern.
  • Document 1 describes that each light emitting diode chip 89 is bonded to the mounting region 88a using a silicone-based adhesive.
  • Reference 1 also describes that each of the positive electrode and the negative electrode of each light-emitting diode chip 89 is electrically connected to the adjacent wiring pattern via a bonding wire (not shown). ing.
  • Document 1 describes that the wiring pattern and each light emitting diode chip 89 are covered with a sealing material 90.
  • the sealing material 90 is made of a light-transmissive resin material (epoxy resin or silicone resin).
  • a pair of pressing members 91 and 92 are attached to the support surface 82 a of the lamp body 82 by screws 93.
  • Each of the pressing members 91 and 92 is configured by a leaf spring obtained by bending a stainless steel plate in a step shape.
  • Each of the pressing members 91 and 92 has a fixing portion 91a and 92a, an upright portion 91b and 92b, and a pressing portion 91c and 92c (see FIG. 11).
  • document 1 describes that each of the pressing portions 91c and 92c of the pressing members 91 and 92 is disposed on a peripheral portion of the substrate 88 (a portion other than the mounting region 88a).
  • Document 1 describes that each of the pressing portions 91 c and 92 c of the pressing members 91 and 92 elastically presses the light emitting device 86 toward the support surface 82 a of the lamp body 82.
  • Reference 1 also states that it is desirable to fill a thermally conductive grease (not shown) between the other surface of the substrate 88 (the lower surface in FIG. 11) and the support surface 82a of the lamp body 82. Has been.
  • each of the pressing portions 91 c and 92 c of the pressing members 91 and 92 elastically presses the light emitting device 86 toward the support surface 82 a of the lamp body 82.
  • the substrate 88 of the light emitting device 86 is thermally connected to the lamp body 82.
  • the heat generated in the light emitting diode chip 89 can be dissipated from the heat radiation fins 87 of the lamp body 82 to the outside of the LED lamp 81. It becomes possible to suppress the temperature rise of the light emitting diode chip 89.
  • each of the pressing members 91 and 92 formed of a stainless steel plate spring is attached to a metal lamp body 82 using screws 93.
  • the wiring patterns and the light emitting diodes covered with the pressing portions 91c and 92c and the sealing material 90 are used. There is a concern that the creepage distance to the chip 89 is increased, and the planar size of the substrate 88 is increased.
  • the present invention has been made in view of the above reasons, and an object of the present invention is to provide a light-emitting device capable of improving the insulation performance of the charging part of the mounting board without increasing the planar size of the mounting board, and to use the same. It is to provide the lighting equipment that was.
  • the light emitting device of the first aspect according to the present invention includes a mounting substrate, an insulating member, and a pressing member.
  • the mounting substrate has a first surface and a second surface in the thickness direction.
  • the mounting substrate is in contact with the heat dissipation member on the first surface.
  • the mounting substrate has a light emitting element mounted on the second surface.
  • the insulating member has electrical insulation.
  • the insulating member is disposed on the second surface of the mounting substrate so as not to cover the light emitting element.
  • the pressing member is disposed so as to press the mounting substrate against the heat radiating member with the insulating member.
  • the light emitting device of the 2nd form which concerns on this invention is equipped with the said heat radiating member in a 1st form.
  • the pressing member is fixed to the heat radiating member so as to sandwich the insulating member and the mounting substrate with the heat radiating member.
  • the insulating member in the second aspect, includes a lid portion that covers the second surface of the mounting substrate.
  • the lid has an opening window that exposes the light emitting element.
  • the pressing member is formed so as to contact the lid portion of the insulating member.
  • the pressing member is disposed on both sides of the lid in a predetermined direction intersecting the thickness direction and a main body fixed to the heat radiating member.
  • a pressing portion disposed and in contact with the lid portion in the thickness direction; and an extending piece for connecting the pressing portion to the main body portion.
  • the extending piece is a spring piece that elastically contacts the pressing portion with the insulating member.
  • the pressing member is formed of an elastic metal material, and integrally includes the main body portion, the pressing portion, and the extending piece. .
  • the pressing member is a restriction that restricts the movement of the insulating member in a predetermined direction intersecting the thickness direction. A part.
  • the restricting portion is disposed on both sides of the insulating member in the predetermined direction so as to contact the insulating member.
  • the insulating member is a wall portion located on both sides of the mounting substrate in the predetermined direction, and the predetermined direction from each of the wall portions. And a flange that protrudes outward along.
  • Each of the restricting portions is disposed so as to be in contact with the wall portion in the predetermined direction and to be positioned between the restricting portion and the heat dissipation member.
  • the heat dissipation member has a recess for receiving the wall portion.
  • the mounting board includes a charging unit connected to the light emitting element on the second surface.
  • the charging unit includes a circuit unit for supplying electric power from an external power source to the light emitting element.
  • the charging unit is located at the center of the second surface.
  • the mounting substrate is formed using a ceramic substrate.
  • a luminaire of the fifteenth aspect according to the present invention includes any one light emitting device of the first to fourteenth aspects, and an instrument main body that holds the light emitting device.
  • FIG. 3 is a sectional view taken along line AA in FIG. 2.
  • FIG. 5 is a sectional view taken along line BB in FIG. 4.
  • FIG. 4 is a schematic perspective view which shows the 1st example of a lighting fixture provided with a light-emitting device same as the above.
  • FIG. 5 is a schematic perspective view of the 2nd example of a lighting fixture provided with a light-emitting device same as the above.
  • the light emitting device 10 of the present embodiment can be used as a light source of the lighting fixture 30 (see FIGS. 6 to 9), for example.
  • the light-emitting device 10 includes a heat dissipation member 1, a mounting substrate 2b on which an LED (not shown) is mounted, an insulating cover that covers a side portion of the mounting substrate 2b and a peripheral portion of one surface (upper surface in FIG. 1) 2d. Insulating member 3) and a pressing member 4 that presses the mounting substrate 2 b to the heat radiating member 1 side through the insulating cover 3.
  • the heat radiating member 1 is formed in a plate shape (for example, a rectangular plate shape).
  • the heat radiating member 1 can be formed of a material (for example, a metal material such as aluminum, copper, and stainless steel) having a higher thermal conductivity than the resin.
  • the mounting substrate 2b has a first surface (lower surface in FIG. 1) 2c and a second surface (upper surface in FIG. 1) 2d in the thickness direction (vertical direction in FIG. 1).
  • the mounting substrate 2 is formed using, for example, a ceramic substrate.
  • the mounting substrate 2b is in contact with the heat radiating member 1 on the first surface 2c.
  • the mounting substrate 2b includes a circuit portion (not shown) for supplying power to the light emitting element from an external power source (not shown) on the second surface 2d.
  • the circuit portion is a portion that is energized during use (that is, a charging portion). Therefore, the mounting substrate 2b has the light emitting element mounted on the second surface 2d.
  • the mounting substrate 2b includes a charging unit connected to the light emitting element on the second surface 2d.
  • the charging unit includes a circuit unit (not shown) that supplies power to the light emitting element from an external power source (not shown).
  • the charging unit is located at the center of the second surface 2d.
  • the light emitting element is, for example, an LED.
  • the mounting substrate 2b is an electrically insulating ceramic substrate formed of, for example, a white ceramic material (for example, aluminum oxide, aluminum nitride, etc.).
  • a white ceramic material for example, aluminum oxide, aluminum nitride, etc.
  • the mounting substrate 2b is provided with a conductor pattern (not shown) that can be electrically connected to the LED.
  • a conductor pattern is a circuit part which supplies electric power to a light emitting element (LED) from an external power supply (not shown).
  • the outer peripheral shape of the mounting substrate 2b is formed in a rectangular shape, but this shape is not particularly limited.
  • a ceramic substrate is used as the mounting substrate 2b.
  • the present invention is not limited to this, and for example, a printed wiring board formed of an insulating base material made of glass epoxy resin or the like may be used. .
  • One or a plurality of LEDs are mounted on the central portion on the one surface side (second surface 2d) of the mounting substrate 2b.
  • a phosphor composed of an LED chip that emits blue light (hereinafter referred to as a blue LED chip) and a yellow phosphor that emits broad yellow light that is excited by the blue light emitted from the blue LED chip. Can be used to obtain white light.
  • Such a white LED has a color conversion part (not shown) made of a first light-transmitting material covering a blue LED chip and containing a yellow phosphor.
  • a first light transmissive material for example, a silicone resin, an epoxy resin, glass, or the like can be employed.
  • the sealing portion 2a made of the second light transmissive material seals the blue LED chip and the color conversion portion.
  • the second light transmissive material for example, silicone resin, epoxy resin, glass or the like can be employed.
  • the outer peripheral shape of the sealing part 2a is made into the rectangular shape, this shape is not specifically limited, For example, a circular shape etc. may be sufficient.
  • the phosphor of the LED is not limited to the yellow phosphor, and, for example, a red phosphor and a green phosphor may be employed.
  • a white LED that obtains white light by combining an LED chip that emits purple to near ultraviolet light and a red phosphor, a green phosphor, and a blue phosphor may be used.
  • the LED may be a white LED that obtains white light by combining an LED chip that emits red light, an LED chip that emits green light, and a blue LED chip. Further, the emission color of the LED is not limited to white.
  • the LED sealed with the sealing portion 2a and the sealing portion 2a and the mounting substrate 2b may be collectively referred to as the light source portion 2.
  • the front surface (upper surface in FIG. 1) of the sealing portion 2a constitutes the light emitting surface of the light source unit 2.
  • first electrode portions for electrically connecting the LEDs are provided at one central portion on the one surface side (second surface 2d) of the mounting substrate 2b. It is formed by the part.
  • the anode side of the LED is electrically connected to one of the pair of first electrode portions.
  • the cathode side of the LED is electrically connected to the other of the pair of first electrode portions.
  • the pair of first electrode portions constitutes a charging portion that is electrically connected to the LED.
  • a pair of second electrode parts (not shown) for supplying power to the LEDs are part of the conductor pattern (circuit part) on the peripheral part on the one surface side (second surface 2d) of the mounting substrate 2b. It is formed by.
  • a pair of terminal portions 6a and 6b (FIG. 3) capable of electrically connecting a pair of electric wires 5a and 5b (see FIG. 2) to the pair of second electrode portions of the mounting substrate 2b. are electrically connected by solder.
  • each of the pair of terminal portions 6a and 6b is configured by a U-shaped terminal plate, and both leg pieces of these terminal plates are mounted on the mounting substrate 2b.
  • the pair of second electrode portions are electrically connected by solder.
  • one terminal part 6a is visible among a pair of terminal parts 6a and 6b.
  • Each of the pair of electric wires 5a and 5b is a covered electric wire in which a conductor 5c (see FIG. 3) that can be electrically connected to the terminal portions 6a and 6b is covered with an insulating covering portion 5d (see FIG. 3).
  • a part of the conductor 5c that is electrically connected to the terminal portions 6a and 6b is exposed.
  • a part of the conductor 5c of each of the electric wires 5a and 5b is electrically connected to each of the pair of terminal portions 6a and 6b by, for example, a joint portion (not shown) made of solder. It is connected.
  • a connector (not shown) may be provided.
  • the insulating cover (insulating member) 3 has electrical insulation and is disposed on the second surface 2d of the mounting substrate 2b so as not to cover the light emitting element.
  • the insulating cover 3 includes a lid portion 3a that covers one surface (second surface 2d) side of the mounting substrate 2b and a side wall portion 3b that covers the side portion of the mounting substrate 2b.
  • a synthetic resin material having electrical insulation can be adopted as the material of the insulating cover 3.
  • an opening window 3c is provided in the lid portion 3a of the insulating cover 3 at a portion facing the light emitting surface of the light source unit 2. That is, the lid 3a is formed so as to cover the second surface 2d of the mounting substrate 2b. The lid 3a has an opening window 3c through which the light emitting element is exposed.
  • the inner peripheral shape of the opening window 3c is a rectangular shape, but this shape is not particularly limited, and may be, for example, a circular shape.
  • the opening size of the opening window 3c is set to be smaller than the planar size of the mounting substrate 2b and larger than the size of the light emitting surface of the light source unit 2.
  • the insulating cover 3 can cover the side portion of the mounting substrate 2b and the peripheral portion of the one surface (second surface 2d).
  • the side wall part 3b has wall parts 3b1 and 3b2 respectively located on both sides of the mounting board 2b in a predetermined direction (left and right direction in FIG. 1).
  • the wall portions 3b1 and 3b2 are respectively located on both sides of the mounting substrate 2b in a predetermined direction.
  • wall part 3b1, 3b2 is each formed in the both ends of the cover part 3a in a predetermined direction.
  • the predetermined direction is a direction intersecting the thickness direction of the mounting substrate 2b.
  • the predetermined direction is a direction (left-right direction in FIG. 1) orthogonal to the thickness direction of the mounting substrate 2b.
  • the wall 3b1 is located on the first end side (left end side in FIG. 1) of the mounting board 2b in a predetermined direction.
  • the wall 3b2 is located on the second end side (the right end side in FIG. 1) of the mounting substrate 2b in the predetermined direction.
  • the side wall portion 3b has a wall portion 3b3 located on one end side of the mounting substrate 2 in the second predetermined direction intersecting the thickness direction of the mounting substrate 2 and the predetermined direction.
  • the second predetermined direction is a thickness direction of the mounting substrate 2b and a direction orthogonal to the predetermined direction (the left-right direction in FIG. 3).
  • a storage portion 3f for storing a part of the pair of electric wires 5a and 5b electrically connected to the mounting substrate 2b is provided at one end portion (the lower left end portion in FIG. 2) of the side wall portion 3b of the insulating cover 3.
  • the side wall 3b is formed integrally with the one end.
  • the housing part 3f is provided with a housing chamber 12 for housing a part of the pair of electric wires 5a and 5b on the heat radiating member 1 side (lower side in FIG. 3).
  • the storage portion 3f stores a first storage chamber 12a for storing the exposed conductor 5c of the electric wires 5a and 5b, and a part of the insulating coating portion 5d of the electric wires 5a and 5b.
  • a second storage chamber 12b is provided.
  • the first storage chamber 12 a and the second storage chamber 12 b are partitioned by the partition wall portion 13.
  • the partition wall portion 13 is provided with a pair of electric wire insertion holes (not shown) for inserting the pair of electric wires 5a and 5b electrically connected to the mounting substrate 2b.
  • the first storage chamber 12a communicates with a space surrounded by the lid portion 3a and the side wall portion 3b of the insulating cover 3. Further, the first storage chamber 12 a communicates with the second storage chamber 12 b through the pair of electric wire insertion holes formed in the partition wall portion 13.
  • the bottom wall of the first storage chamber 12a is provided with an inclined portion 3g formed such that the distance between the storage portion 3f and the mounting substrate 2b gradually decreases as the insulating cover 3 approaches the opening window 3c side. It has been.
  • the distance is formed so as to gradually decrease.
  • the light-emitting device 10 of this embodiment it is possible to reduce that the light radiate
  • the light emitting device 10 of the present embodiment it is possible to reduce the light emitted from the LED of the light source unit 2 from being reflected by the inclined surface of the inclined unit 3g. It is possible to widen the light distribution of the emitted light.
  • the partition wall part 13 comprises a part of side wall part 3b.
  • the exposed conductors 5c of the electric wires 5a and 5b are electrically connected to the pair of second electrode portions of the mounting substrate 2b via the terminal portions 6a and 6b.
  • the present invention is not limited to this, and the exposed conductor 5c of each of the electric wires 5a and 5b may be electrically connected to the pair of second electrode portions of the mounting substrate 2b directly by the joint portion. Good.
  • the light-emitting device 10 of this embodiment it becomes possible to make the inclination
  • the light-emitting device 10 of this embodiment it becomes possible to suppress that the light radiate
  • the light distribution of the emitted light can be made wider.
  • a first rib 14 is provided on the bottom wall of the second storage chamber 12b so as to protrude toward the heat radiating member 1 (lower side in FIG. 3).
  • the first rib 14 sandwiches a part of the electric wire 5a inserted into one of the pair of electric wire insertion holes of the partition wall 13 with the inner peripheral wall of the second storage chamber 12b.
  • a second rib protruding toward the heat radiating member 1 is provided on the bottom wall of the second storage chamber 12b. This 2nd rib clamps a part of electric wire 5b inserted in the other electric wire insertion hole among said pair of electric wire insertion holes of the partition wall part 13 with the inner peripheral wall of the 2nd storage chamber 12b.
  • the first rib 14 and the second rib each have a tension that holds a part of the pair of electric wires 5a and 5b with the inner peripheral wall of the second storage chamber 12b. It constitutes a stop.
  • tensile_strength which acts on a pair of electric wire 5a, 5b becomes unnecessary, and the tension
  • a pair of lead-out holes 3h and 3h (see FIG. 3) for leading out the pair of electric wires 5a and 5b electrically connected to the mounting substrate 2b are provided on one side wall (the left side wall in FIG. 3) of the second storage chamber 12b. 2) is formed.
  • a second resin such as silicone resin is used.
  • the inside of the storage chamber 12b may be filled.
  • the light emitting device 10 of the present embodiment it is possible to prevent water or the like from entering the storage chamber 12 through the pair of lead-out holes 3h, 3h of the storage portion 3f.
  • a pair of electric wires 5a and 5b led out from the pair of lead-out holes 3h and 3h of the housing portion 3f are provided on the side portion (lower left side portion in FIG. 2) of the heat dissipation member 1.
  • Deriving unit 16 for deriving 10 outside is provided.
  • the lead-out part 16 is a notch part formed in a part of the side part of the heat radiating member 1, and the one surface (upper surface in FIG. 2), side surface (lower left side surface in FIG. 2) and others of the heat radiating member 1. A part of each surface (the lower surface in FIG. 2) is open.
  • the side wall portion 3b of the insulating cover 3 has both wall portions 3b1 and 3b2 (in FIG. 2, the upper left wall portion 3b1 and the left upper wall portion 3b1) in a direction perpendicular to the direction (the lower left direction in FIG.
  • Each lower right wall portion 3b2) is provided with a flange portion 3d (see FIG. 1) protruding outward.
  • Each of the flange portions 3d is disposed on one end side (the lower end side in FIG. 1) of both wall portions 3b1 and 3b2.
  • the flange portions 3d and 3d protrude outward from the respective wall portions 3b1 and 3b2 along a predetermined direction.
  • the flange portions 3d and 3d are formed at the tip portions (lower end portions in FIG. 1) of the wall portions 3b1 and 3b2.
  • the heat radiating member 1 has the recessed part 1b which receives wall part 3b1, 3b2. In the present embodiment, as shown in FIG. 1, the end portions (lower end portions in FIG. 1) of the wall portions 3b1 and 3b2 enter the recess 1b.
  • the pressing member 4 is configured to press the mounting substrate 2 b against the heat radiating member 1 with the insulating member 3.
  • the pressing member 4 is fixed to the heat radiating member 1 so as to sandwich the insulating member 3 and the mounting substrate 2 b with the heat radiating member 1.
  • the pressing member 4 is formed so as to contact the lid portion 3 a of the insulating member 3.
  • the pressing member 4 has a plate-like main body portion 4a formed in a U shape in plan view, a plate-like extension piece 4b extended to the main body portion 4a, and a distal end portion of the extension piece 4b. And a plate-like pressing portion 4c that presses the insulating cover 3 (see FIGS. 1, 2, 4, and 5).
  • the pressing member 4 can be formed of a metal plate (for example, a stainless steel plate). That is, the pressing member 4 is formed of a metal material having elasticity, and integrally includes a main body portion 4a, a pressing portion 4c, an extending piece 4b, and protruding portions 4e and 4f.
  • the thickness dimension of the press member 4 is 0.3 mm, this numerical value is not specifically limited.
  • the pressing member 4 includes a plurality of extended pieces 4b (four in the present embodiment).
  • the inclination angle of each extended piece 4b with respect to one surface (the upper surface in FIG. 5) of the main body 4a is set to an angle smaller than 90 degrees.
  • each pressing portion 4c of the pressing member 4 radiates heat from the insulating cover 3 with the end portion of each extending piece 4b opposite to the pressing portion 4c side as a fulcrum. It becomes possible to press elastically toward the member 1 side.
  • the main body 4 a is fixed to the heat radiating member 1.
  • the pressing portions 4c are arranged on both sides of the lid portion 3a in a predetermined direction intersecting the thickness direction of the mounting substrate 2b, and are in contact with the lid portion 3a in the thickness direction of the mounting substrate 2b.
  • the extending piece 4b is configured to connect the pressing portion 4c to the main body portion 4a.
  • the extended piece 4 b is a spring piece that elastically contacts the pressing portion 4 c with the insulating member 3.
  • the main body portion 4a includes two leg pieces 4a1 and 4a2 and a connecting piece 4a3 connected to each of one end portions (the upper right end portion in FIG. 4) of each leg piece 4a1 and 4a2. Has been.
  • the leg piece 4a1 of the main body part 4a is provided with two extending pieces 4b at the end (on the right lower end in FIG. 4) on the opposite leg piece 4a2 side. Further, the leg piece 4a2 of the main body part 4a is provided with two extending pieces 4b at the end (on the left upper end in FIG. 4) on the side of the opposing leg piece 4a1.
  • each of the pressing portions 4c of each extending piece 4b of the leg piece 4a1 protrudes toward the pressing portion 4c side (right side in FIG. 5) of the opposing extending piece 4b.
  • each of the pressing portions 4c of each extending piece 4b of the leg piece 4a2 protrudes toward the pressing portion 4c side (left side in FIG. 5) of the opposing extending piece 4b.
  • the number of the extended pieces 4b is four, but this number is not particularly limited, and the number of the extended pieces 4b is the number of the leg pieces 4a1 and 4a2. There may be at least one for each. That is, the main body portion 4a of the pressing member 4 only needs to have at least a pair of extending pieces 4b and 4b. In other words, in the light emitting device 10 of the present embodiment, the pressing member 4 only needs to have at least a pair of pressing portions 4c and 4c.
  • the pair of pressing portions 4c and 4c are arranged at symmetrical positions. Thereby, in the light emitting device 10 of the present embodiment, the pair of pressing portions 4c, 4c of the pressing member 4 can press the insulating cover 3 substantially uniformly, and the insulating cover 3 loads the mounting substrate 2b substantially uniformly. Can be applied.
  • the insulating cover 3 can apply a load to the mounting substrate 2b substantially uniformly, so that heat generated by the LEDs of the light source unit 2 is efficiently conducted to the heat radiating member 1. It becomes possible to do. Furthermore, in the light emitting device 10 of the present embodiment, the insulating cover 3 can apply a load to the mounting substrate 2b substantially uniformly, so that it is possible to reduce cracks in the mounting substrate 2b.
  • leg piece 4a1 is provided with a first projecting portion 4e projecting toward the facing leg piece 4a2 side at an end portion (a lower right end portion in FIG. 4) on the facing leg piece 4a2 side.
  • the first projecting portion 4e is disposed between the two extended pieces 4b extended to the leg pieces 4a1.
  • the 1st protrusion part 4e is arrange
  • leg piece 4a2 is provided with a second projecting portion 4f projecting toward the facing leg piece 4a1 side at an end (on the upper left end in FIG. 4) on the facing leg piece 4a1 side.
  • the second projecting portion 4f is disposed between the two extended pieces 4b extended to the leg pieces 4a2.
  • the 2nd protrusion part 4f is arrange
  • the protruding portions 4e and 4f constitute a restricting portion that restricts the movement of the insulating member 3 in a predetermined direction (left and right direction in FIG. 1) intersecting the thickness direction of the mounting substrate 2b.
  • the protruding portions (regulating portions) 4e and 4f are disposed on both sides of the insulating member 3 in a predetermined direction so as to contact the insulating member 3.
  • the protruding portions (regulating portions) 4e and 4f are in contact with the wall portions 3b1 and 3b2 in a predetermined direction, respectively, and between the protruding portions (restricting portions) 4e and 4f and the heat radiating member 1 It arrange
  • the pressing member 4 As a manufacturing method of the pressing member 4, for example, first, a shape corresponding to a development view of the pressing member 4 is punched from a metal plate, and each extended piece 4b of the pressing member 4 punched is bent. . And the press part 4c is formed by bending each of the front-end
  • a first recess 1a for disposing the main body 4a of the pressing member 4 is provided at the center of one surface side (the upper surface side in FIG. 1) of the heat radiating member 1.
  • the thickness dimension of each leg piece 4a1, 4a2 and connecting piece 4a3 is set smaller than the depth dimension of the first recess 1a.
  • a plurality of first fixing screw holes (not shown) for screwing a first fixing screw 11 for fixing the pressing member 4 to the heat radiating member 1 are provided in the inner bottom wall of the first recess 1a. (Two places in this embodiment).
  • the main body portion 4 a of the pressing member 4 is a first portion through which the first fixing screw 11 is inserted into each of the positions corresponding to the first fixing screw holes in the first recess 1 a of the heat radiating member 1.
  • the fixing screw insertion hole 4d (see FIGS. 4 and 5) is provided therethrough.
  • the above-described first fixing screw insertion hole 4d is provided in each of the leg pieces 4a1 and 4a2.
  • the first fixing screw 11 is inserted into each first fixing screw insertion hole 4d in the main body portion 4a of the pressing member 4, and each of the first fixing screws 11 of the heat radiation member 1 is inserted.
  • the pressing member 4 can be fixed to the heat radiating member 1 by being screwed into the fixing screw hole. In short, the pressing member 4 is attached to the heat radiating member 1.
  • the said one surface side of the heat radiating member 1 is for arrange
  • a second recess 1b (see FIGS. 1 and 3) is provided. That is, the heat radiating member 1 has a recess (second recess) 1 b that accommodates the walls 3 b 1 and 3 b 2 of the insulating cover 3.
  • the inner peripheral shape of the second recess 1b is formed in a rectangular shape.
  • the peripheral portion on the one surface side of the heat radiating member 1 is a third recess 1g (see FIGS. 2 and 3) for disposing the storage portion 3f in a portion facing the second storage chamber 12b of the storage portion 3f. ) Is provided.
  • the third recess 1g is formed so as to communicate with the second recess 1b.
  • the third recess 1 g is formed so as to communicate with the lead-out portion 16.
  • each of the second recess 1b and the third recess 1g is set larger than the depth dimension of the first recess 1a.
  • the outer peripheral shape of the protrusion 1c is formed in a rectangular shape, but this shape is not particularly limited.
  • the mounting substrate 2b is disposed on the tip surface 1e side of the projecting portion 1c.
  • the mounting substrate 2b is disposed on the one surface side of the heat radiating member 1 (the front end surface 1e side of the protruding portion 1c of the heat radiating member 1).
  • the planar size of the mounting substrate 2b is such that when the side portion of the mounting substrate 2b and the peripheral portion of the one surface are covered with the insulating cover 3, the side portion of the mounting substrate 2b is the side wall portion 3b of the insulating cover 3 and the partition wall. It is set to abut against the portion 13. Thereby, in the light-emitting device 10 of this embodiment, it becomes possible to control that the mounting substrate 2b moves to the side.
  • planar size of the protrusion part 1c of the heat radiating member 1 is set smaller than the planar size of the mounting substrate 2b, it may be set to the same size as the planar size of the mounting substrate 2b. Good. Thereby, in the light-emitting device 10 of this embodiment, it becomes possible to efficiently conduct the heat generated by the LEDs of the light source unit 2 to the heat radiating member 1.
  • each flange 3d of the insulating cover 3 is set to be smaller than the distance between the side surface of the projecting portion 1c of the heat radiating member 1 and the inner side surface of the second recess 1b of the heat radiating member 1. (See FIG. 1).
  • each collar part 3d is set smaller than the projecting dimension of the projecting part 1c (see FIG. 1).
  • peripheral portion of the lid portion 3a of the insulating cover 3 is disposed on each of the end portions in the orthogonal direction (the upper left end portion and the lower right end portion in FIG. 2) on the heat radiating member 1 side (the lower side in FIG. 2).
  • Convex part 3e (refer to Drawing 1) which protrudes to is provided.
  • Each convex portion 3 e sandwiches the mounting substrate 2 b with the protruding portion 1 c of the heat radiating member 1.
  • the projecting dimensions of the projecting parts 4 e and 4 f of the pressing member 4 are set to dimensions that allow contact with the outside of the side wall part 3 b of the insulating cover 3 when the pressing member 4 is fixed to the heat radiating member 1. (See FIG. 1).
  • each of the protrusions 4e and 4f constitutes a restricting portion that restricts the insulating cover 3 from moving to the side of the mounting substrate 2b.
  • the insulating cover 3 is moved to the light emitting side (upper side in FIG. 1) of the LED of the light source unit 2 due to elastic deformation of each extending piece 4b of the pressing member 4. In this case, since each flange 3d of the insulating cover 3 hits the projecting portions 4e and 4f of the pressing member 4, it is possible to prevent the insulating cover 3 from being detached from the pressing member 4.
  • attachment portions 1f for attaching the light emitting device 10 to the fixture body 20 (see FIG. 6) of the lighting fixture 30 are provided on the side of the heat radiating member 1. Is extended to the side.
  • Each of the attachment portions 1f is provided with a first attachment screw insertion hole 1d through which a first attachment screw (not shown) for attaching the light emitting device 10 to the instrument body 20 is inserted.
  • the number of the attaching parts 1f is 3, the number is not particularly limited.
  • the insulating cover 3 covers the side portion of the mounting substrate 2b and the peripheral portion of the one surface. At this time, the sealing portion 2 a of the light source unit 2 is exposed from the opening window 3 c of the insulating cover 3.
  • the mounting substrate 2b of the light source unit 2 is disposed on the tip end surface 1e side of the projecting portion 1c of the heat radiating member 1, and the insulating cover 3 is placed in the second and third recesses 1b and 1b of the heat radiating member 1. Place 1g.
  • the light emitting device 10 is assembled by disposing the main body portion 4 a of the pressing member 4 in the first recess 1 a of the heat radiating member 1 and fixing the pressing member 4 to the heat radiating member 1 with the first fixing screw 11. It is done.
  • each of the pressing portions 4c of the pressing member 4 can press the insulating cover 3 toward the heat radiating member 1 side. That is, in the light emitting device 10 of the present embodiment, the pressing member 4 can press the mounting substrate 2b to the heat radiating member 1 side through the insulating cover 3.
  • the pressing member 4 can press the mounting substrate 2b to the heat radiating member 1 side via the insulating cover 3, the heat generated by the LEDs of the light source unit 2 Can be efficiently conducted to the heat radiating member 1 through the mounting substrate 2b, and the temperature rise of the LED can be suppressed.
  • a heat conductive member such as a heat radiating grease or a heat conductive sheet is provided between the mounting substrate 2b and the protruding portion 1c of the heat radiating member 1. ) Is preferably arranged.
  • the heat generated by the LED of the light source unit 2 can be more efficiently conducted to the heat radiating member 1 through the mounting substrate 2b and the heat conductive member. It becomes possible to improve the heat dissipation of 2.
  • the heat dissipating member 1 and the one surface opposite to the heat dissipating member 1 side which is disposed on the one surface side of the heat dissipating member 1 (the front end surface 1e side of the protrusion 1c).
  • a mounting substrate 2b having a charging portion (the pair of first electrode portions) electrically connected to the LED at the center of the side, and an insulating cover 3 covering the side portion of the mounting substrate 2b and the peripheral portion of the one surface; And a pressing member 4 that presses the mounting substrate 2b toward the heat radiating member 1 via the insulating cover 3.
  • the light emitting device 10 of the present embodiment includes the mounting substrate 2b, the insulating member (insulating cover) 3, and the pressing member 4.
  • the mounting substrate 2b has a first surface 2c and a second surface 2d in the thickness direction.
  • the mounting substrate 2b is in contact with the heat radiating member 1 on the first surface 2c.
  • the mounting substrate 2b has a light emitting element mounted on the second surface 2d.
  • the insulating member 3 has electrical insulation.
  • the insulating member 3 is disposed on the second surface 2d of the mounting substrate 2b so as not to cover the light emitting element.
  • the pressing member 4 is disposed so as to press the mounting substrate 2 b against the heat radiating member 1 with the insulating member 3.
  • each pressing portion 4c of the pressing member 4 and the mounting substrate can be formed without increasing the planar size of the mounting substrate 2b as compared with the LED lamp 81 of the conventional example shown in FIG. It is possible to increase the creepage distance between the charging unit 2b.
  • the light-emitting device 10 of this embodiment since it becomes possible to lengthen the creeping distance between each press part 4c of the press member 4, and the said charging part of the mounting board 2b, it improves lightning surge resistance. Thus, the electrical insulation performance of the charging part of the mounting substrate 2b can be improved.
  • the light emitting device 10 of the present embodiment it is possible to improve the insulation performance of the charging unit of the mounting board 2b without increasing the planar size of the mounting board 2b.
  • the light emitting device 10 of the present embodiment includes the heat radiating member 1.
  • the pressing member 4 is fixed to the heat radiating member 1 so as to sandwich the insulating member 3 and the mounting substrate 2b with the heat radiating member 1. This configuration is arbitrary.
  • the insulating member 3 includes a lid portion 3a that covers the second surface 2d of the mounting substrate 2b.
  • the lid 3a has an opening window 3c through which the light emitting element is exposed.
  • the pressing member 4 is formed so as to contact the lid portion 3 a of the insulating member 3. This configuration is arbitrary.
  • the pressing member 4 is disposed on both sides of the lid portion 3a in the predetermined direction intersecting the thickness direction with the main body portion 4a fixed to the heat radiating member 1, and the lid portion 3a in the thickness direction. Pressing portions 4c, 4c that are in contact with each other, and extending pieces 4b that connect the pressing portions 4c, 4c to the main body portion 4a, respectively.
  • This configuration is arbitrary.
  • the extended piece 4b is a spring piece that elastically contacts the pressing portion 4c with the insulating member 3. This configuration is arbitrary.
  • the pressing member 4 is formed of an elastic metal material, and integrally includes a main body portion 4a, a pressing portion 4c, and an extending piece 4b. This configuration is arbitrary.
  • the mounting substrate 2b includes a charging unit connected to the light emitting element on the second surface 2d. This configuration is arbitrary.
  • the charging unit includes a circuit unit that supplies power to the light emitting element from an external power source. This configuration is arbitrary.
  • the charging unit is located at the center of the second surface 2d. This configuration is arbitrary.
  • the mounting substrate 2b is formed using a ceramic substrate. This configuration is arbitrary.
  • the pressing member 4 is provided with restriction portions (respective protrusions 4e and 4f) that restrict the insulating cover 3 from moving to the side of the mounting substrate 2b.
  • the pressing member 4 is attached to the heat radiating member 1, and a restricting portion (protruding portion) that restricts the pressing member 4 from moving the insulating cover 3 to the side of the mounting substrate 2 b. ) 4e and 4f are provided.
  • the pressing member 4 includes restriction portions (protrusion portions) 4e and 4f that restrict the movement of the insulating member 3 in a predetermined direction that intersects the thickness direction.
  • restriction portions protrusion portions
  • the restricting portions 4e and 4f are arranged on both sides of the insulating member 3 in a predetermined direction so as to contact the insulating member 3. This configuration is arbitrary.
  • the insulating member 3 is disposed outwardly along the predetermined direction from the wall portions 3b1 and 3b2 respectively located on both sides of the mounting substrate 2b in the predetermined direction and the wall portions 3b1 and 3b2. 3d, 3d projecting to the top.
  • the restricting portions 4e and 4f are arranged such that they come into contact with the wall portions 3b1 and 3b2 in a predetermined direction, and the flange portions 3d and 3d are located between the restricting portions 4e and 4f and the heat radiating member 1. .
  • This configuration is arbitrary.
  • the heat dissipating member 1 has a recess 1b that accommodates the walls 3b1 and 3b2. This configuration is arbitrary.
  • the lighting apparatus 30 (30A) in the first example is a street lamp.
  • the lighting fixture 30 ⁇ / b> A includes the above-described light emitting device 10, a fixture main body 20 that holds the light emitting device 10, and a translucent glove 21 that covers the light emitting device 10 held by the fixture main body 20.
  • a plurality of (four in this embodiment) light emitting devices 10 are held in one fixture body 20. Further, in the lighting fixture 30A, the number of the light emitting devices 10 is four, but may be one.
  • the instrument body 20 can be formed of a metal material such as stainless steel, for example.
  • the instrument main body 20 includes a bowl-shaped main body portion 20a having an opening surface on the lower side, and a holding portion 20b that is fixed to the inner bottom wall of the main body portion 20a and holds each light emitting device 10.
  • the holding part 20b is formed in a hollow quadrangular frustum shape.
  • the bottom part (the upper surface part in FIG. 6) of the holding part 20b is provided with a flange part 20c for fixing the holding part 20b to the main body part 20a.
  • the outer peripheral shape of the flange portion 20c is formed in a circular shape.
  • maintenance part 20b is formed in the shape of a quadrangular pyramid, this shape is not specifically limited.
  • the outer peripheral shape of the collar part 20c is formed in circular shape, this shape is not specifically limited.
  • the flange portion 20c of the holding portion 20b has a plurality of second fixing screw insertion holes (not shown) through which the second fixing screw 23 for fixing the holding portion 20b to the main body portion 20a is inserted (in the lighting fixture 30A). 4 places).
  • the second fixing screw 23 is inserted into the second fixing screw insertion holes in the flange portion 20c of the holding portion 20b, and is screwed into the second fixing screw holes of the main body portion 20a.
  • maintenance part 20b can be fixed to the main-body part 20a.
  • one end portion (the lower surface portion in FIG. 6) of the holding portion 20b on the opposite side to the bottom surface portion side is, for example, one end portion (the upper end portion in FIG. 6) of the columnar pole 22 standing on the road or the like.
  • a fixing portion (not shown) that can detachably fix the lighting fixture 30A is provided.
  • each light emitting device 10 is held by each side surface portion of the holding portion 20b.
  • the first mounting screws are screwed into the side portions of the holding portion 20b at positions corresponding to the first mounting screw insertion holes 1d in the heat dissipation member 1 of the light emitting device 10.
  • a first mounting screw hole (not shown) is provided.
  • the first mounting screws are inserted into the first mounting screw insertion holes 1d in the heat dissipation member 1 of the light emitting device 10 and screwed into the first mounting screw holes of the holding portion 20b.
  • each of the light emitting devices 10 is fixed to the holding portion 20b.
  • the holding unit 20 b can hold the light emitting device 10.
  • the light emitting device 10 is provided with a protrusion 15 for positioning the light emitting device 10 on the holding portion 20b on the other surface side (the lower surface side in FIGS. 1 and 3) of the heat radiating member 1.
  • a recess (not shown) is provided on each side surface of the holding portion 20 b at a position corresponding to each of the protrusions 15 of the heat radiating member 1 of the light emitting device 10.
  • the light emitting device 10 when the light emitting device 10 is attached to the holding portion 20b, the light emitting device 10 can be positioned to the holding portion 20b, and workability for attaching the light emitting device 10 to the holding portion 20b is improved. Is possible.
  • the number of protrusions 15 is three, but the number is not particularly limited.
  • a lighting device (not shown) for lighting each light emitting device 10 is disposed inside the holding portion 20b.
  • the pair of electric wires 5a and 5b of each light-emitting device 10 is electrically connected to the lighting device.
  • illustration of a pair of electric wire 5a, 5b of each light-emitting device 10 is abbreviate
  • the globe 21 is formed in a bowl shape having an opening surface on the upper side.
  • a translucent material is used as the material of the globe 21.
  • a light-transmitting resin for example, ABS resin, acrylic resin, polystyrene resin, or the like
  • glass or the like can be used as the material of the globe 21.
  • the size of the opening surface of the globe 21 is set to be smaller than the size of the opening surface of the main body 20a.
  • An insertion hole 21 a for inserting the pole 22 is formed in the bottom wall of the globe 21.
  • the outer peripheral wall on the upper side of the globe 21 is provided with a plurality of second attachment screw holes 21b for screwing second attachment screws (not shown) for attaching the globe 21 to the instrument body 20.
  • the lower peripheral wall of the main body 20a of the instrument main body 20 is a second mounting screw through which the second mounting screw is inserted at a position corresponding to each of the second mounting screw holes 21b of the globe 21.
  • An insertion hole 20d is provided therethrough.
  • the second mounting screws are inserted into the second mounting screw insertion holes 20 d in the main body portion 20 a of the fixture body 20, and screwed into the second mounting screw holes 21 b of the globe 21.
  • the glove 21 is attached to the instrument body 20.
  • the fixture body 20 and the globe 21 are fixed by the second mounting screw via a fastener (metal fitting) not shown.
  • the fastener and the second attachment screw are used as means for attaching the globe 21 to the appliance main body 20, but this means is not particularly limited.
  • the lighting fixture 30 using the light emitting device 10 is not limited to the lighting fixture 30 (30A) having the configuration shown in FIG. 6, and for example, the lighting fixture 30 (30B) having the configuration shown in FIGS. But you can.
  • the lighting fixture 30 (30B) of the second example is a projector, and is a light-transmitting device that covers the above-described light-emitting device 10, the fixture main body 50 that holds the light-emitting device 10, and the light-emitting device 10 that is held by the fixture main body 50. Cover (not shown).
  • a plurality of (for example, eight) light emitting devices 10 are held in one fixture body 50.
  • the number of the light emitting devices 10 is eight, but may be one.
  • the appliance main body 50 includes a box-shaped main body 51 having an attachment portion 51 a for attaching each light emitting device 10, a fixture 53 for fixing the lighting fixture 30 ⁇ / b> B to a construction surface of a wall surface, for example, It has the connection part 52 which connects the fixing tool 53 rotatably.
  • a lighting device (not shown) for lighting each light emitting device 10 is disposed inside the main body 51.
  • the lighting fixture 30 (30A, 30B) of the present embodiment described above includes the above-described light emitting device 10 and the fixture main body (20, 50) that holds the light emitting device 10.
  • the lighting fixture 30 using the light emitting device 10 that can improve the insulation performance of the charging portion of the mounting board 2b without increasing the planar size of the mounting board 2b.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

A light-emitting device according to the present invention comprises a mounting substrate, an insulating member and a pressing member. The mounting substrate has first and second surfaces in the thickness direction. The first surface of the mounting substrate is in contact with a heat dissipation member (1). A charging unit connected to a light-emitting element is provided on the second surface of the mounting substrate. The insulating member has electrical insulation properties and is disposed on the second surface of the mounting substrate so as not to cover the light-emitting element. The pressing member is disposed such that the insulating member presses the mounting substrate against the heat dissipation member.

Description

発光装置およびそれを用いた照明器具Light emitting device and lighting apparatus using the same
 本発明は、発光装置およびそれを用いた照明器具に関するものである。 The present invention relates to a light emitting device and a lighting fixture using the same.
 発光ダイオード(以下、LEDと略称する)は、このLEDの温度上昇に起因して光出力が低下したり寿命が短くなったりする可能性がある。したがって、光源としてLEDを用いた発光装置では、LEDの温度上昇を抑制することが求められている。 A light emitting diode (hereinafter abbreviated as LED) may cause a decrease in light output or a shortened life due to an increase in temperature of the LED. Therefore, in the light-emitting device using LED as a light source, it is calculated | required to suppress the temperature rise of LED.
 従来から、LEDのような発光素子を用いた発光装置およびそれを用いた照明装置が提案されている(例えば、文献1[日本国公開特許公報第2011-82141号])。 Conventionally, a light-emitting device using a light-emitting element such as an LED and a lighting device using the same have been proposed (for example, Document 1 [Japanese Patent Publication No. 2011-82141]).
 文献1には、屋内および屋外で使用される照明装置の一例として、図10に示す構成を有するLEDランプ81が記載されている。 Document 1 describes an LED lamp 81 having the configuration shown in FIG. 10 as an example of an illumination device used indoors and outdoors.
 LEDランプ81は、ランプ本体82、グローブ83、E型の口金84、点灯装置85およびCOB(chip on board)型の発光装置86を備えている。 The LED lamp 81 includes a lamp body 82, a globe 83, an E-type base 84, a lighting device 85, and a COB (chip-on-board) type light-emitting device 86.
 ランプ本体82は、金属材料で構成され、放熱部材としての機能を兼ね備えている。 The lamp body 82 is made of a metal material and has a function as a heat radiating member.
 なお、文献1には、ランプ本体82の外周面に、複数の放熱フィン87が一体に形成されている旨が記載されている。 Note that Document 1 describes that a plurality of radiating fins 87 are integrally formed on the outer peripheral surface of the lamp main body 82.
 また、文献1には、ランプ本体82の支持面82aに、発光装置86が取り付けられることが記載されている。 Further, Document 1 describes that the light emitting device 86 is attached to the support surface 82a of the lamp body 82.
 発光装置86は、矩形状の基板88を備えている(図11参照)。 The light emitting device 86 includes a rectangular substrate 88 (see FIG. 11).
 基板88は、白色系のセラミックス材料で形成され、電気絶縁性を有している。 The substrate 88 is formed of a white ceramic material and has electrical insulation.
 また、基板88は、一表面側(図11では、上面側)の中央部に、配線パターン(図示せず)が形成された実装領域88aを有している。この実装領域88aには、複数の発光ダイオードチップ89(図10参照)が配置されている。 Further, the substrate 88 has a mounting region 88a in which a wiring pattern (not shown) is formed in the central portion on one surface side (the upper surface side in FIG. 11). A plurality of light emitting diode chips 89 (see FIG. 10) are arranged in the mounting region 88a.
 ここにおいて、文献1には、各発光ダイオードチップ89の各々が、上記配線パターンと隣り合うように規則的に並んでいることが記載されている。 Here, Document 1 describes that each of the light emitting diode chips 89 is regularly arranged so as to be adjacent to the wiring pattern.
 また、文献1には、各発光ダイオードチップ89の各々が、シリコーン系の接着剤を用いて実装領域88aに接着されていることが記載されている。 Further, Document 1 describes that each light emitting diode chip 89 is bonded to the mounting region 88a using a silicone-based adhesive.
 また、文献1には、各発光ダイオードチップ89のプラス側電極およびマイナス側電極それぞれが、ボンディングワイヤ(図示せず)を介して隣り合う上記配線パターンと電気的に接続されていることが記載されている。 Reference 1 also describes that each of the positive electrode and the negative electrode of each light-emitting diode chip 89 is electrically connected to the adjacent wiring pattern via a bonding wire (not shown). ing.
 また、文献1には、上記配線パターンおよび各発光ダイオードチップ89が、封止材90で覆われていることが記載されている。ここで、封止材90は、光透過性を有する樹脂材料(エポキシ樹脂あるいはシリコーン樹脂)により構成されている。 Further, Document 1 describes that the wiring pattern and each light emitting diode chip 89 are covered with a sealing material 90. Here, the sealing material 90 is made of a light-transmissive resin material (epoxy resin or silicone resin).
 また、ランプ本体82の支持面82aには、一対の押圧部材91,92が、ねじ93により取り付けられている。各押圧部材91,92の各々は、ステンレス鋼板を階段状に折り曲げた板ばねにより構成されている。また、各押圧部材91,92の各々は、固定部91a,92a、起立部91b,92bおよび押圧部91c,92cを有している(図11参照)。 In addition, a pair of pressing members 91 and 92 are attached to the support surface 82 a of the lamp body 82 by screws 93. Each of the pressing members 91 and 92 is configured by a leaf spring obtained by bending a stainless steel plate in a step shape. Each of the pressing members 91 and 92 has a fixing portion 91a and 92a, an upright portion 91b and 92b, and a pressing portion 91c and 92c (see FIG. 11).
 ここにおいて、文献1には、各押圧部材91,92の押圧部91c,92cの各々が、基板88の周部(実装領域88a以外の部位)に、配置される旨が記載されている。 Here, document 1 describes that each of the pressing portions 91c and 92c of the pressing members 91 and 92 is disposed on a peripheral portion of the substrate 88 (a portion other than the mounting region 88a).
 また、文献1には、各押圧部材91,92の押圧部91c,92cの各々が、ランプ本体82の支持面82aに向かって発光装置86を弾性的に押圧する旨が記載されている。 Further, Document 1 describes that each of the pressing portions 91 c and 92 c of the pressing members 91 and 92 elastically presses the light emitting device 86 toward the support surface 82 a of the lamp body 82.
 また、文献1には、基板88の他表面(図11では、下面)とランプ本体82の支持面82aとの間に、熱伝導性グリース(図示せず)を充填することが望ましい旨が記載されている。 Reference 1 also states that it is desirable to fill a thermally conductive grease (not shown) between the other surface of the substrate 88 (the lower surface in FIG. 11) and the support surface 82a of the lamp body 82. Has been.
 ところで、図10に示した構成のLEDランプ81では、各押圧部材91,92の押圧部91c,92cの各々が、ランプ本体82の支持面82aに向かって発光装置86を弾性的に押圧するので、発光装置86の基板88がランプ本体82と熱的に接続される。 Incidentally, in the LED lamp 81 having the configuration shown in FIG. 10, each of the pressing portions 91 c and 92 c of the pressing members 91 and 92 elastically presses the light emitting device 86 toward the support surface 82 a of the lamp body 82. The substrate 88 of the light emitting device 86 is thermally connected to the lamp body 82.
 これにより、上述のLEDランプ81では、発光ダイオードチップ89の発光時に、発光ダイオードチップ89で発生した熱を、ランプ本体82の各放熱フィン87からLEDランプ81の外部へ放熱することが可能となり、発光ダイオードチップ89の温度上昇を抑制することが可能となる。 Thereby, in the above-mentioned LED lamp 81, when the light emitting diode chip 89 emits light, the heat generated in the light emitting diode chip 89 can be dissipated from the heat radiation fins 87 of the lamp body 82 to the outside of the LED lamp 81. It becomes possible to suppress the temperature rise of the light emitting diode chip 89.
 しかしながら、図10に示した構成のLEDランプ81では、ステンレス鋼板の板ばねにより構成された各押圧部材91,92の各々が、ねじ93を用いて金属製のランプ本体82に取り付けられている。 However, in the LED lamp 81 having the configuration shown in FIG. 10, each of the pressing members 91 and 92 formed of a stainless steel plate spring is attached to a metal lamp body 82 using screws 93.
 そのため、このLEDランプ81では、基板88の充電部(上記配線パターン)の絶縁性能を高めようとすると、各押圧部91c,92cと、封止材90により覆われた上記配線パターンおよび各発光ダイオードチップ89との間の沿面距離が長くなり、基板88の平面サイズが大きくなるという懸念がある。 Therefore, in this LED lamp 81, in order to improve the insulation performance of the charging portion (the wiring pattern) of the substrate 88, the wiring patterns and the light emitting diodes covered with the pressing portions 91c and 92c and the sealing material 90 are used. There is a concern that the creepage distance to the chip 89 is increased, and the planar size of the substrate 88 is increased.
 本発明は上記事由に鑑みて為されたものであり、その目的は、実装基板の平面サイズを大きくすることなく、実装基板の充電部の絶縁性能を高めることが可能な発光装置およびそれを用いた照明器具を提供することにある。 The present invention has been made in view of the above reasons, and an object of the present invention is to provide a light-emitting device capable of improving the insulation performance of the charging part of the mounting board without increasing the planar size of the mounting board, and to use the same. It is to provide the lighting equipment that was.
 本発明に係る第1の形態の発光装置は、実装基板と、絶縁部材と、押圧部材と、を備える。前記実装基板は、厚み方向の第1面および第2面を有する。前記実装基板は、前記第1面で放熱部材に接触される。前記実装基板は、前記第2面に発光素子が実装される。前記絶縁部材は、電気絶縁性を有する。前記絶縁部材は、前記発光素子を覆わないように前記実装基板の前記第2面上に配置される。前記押圧部材は、前記絶縁部材で前記実装基板を前記放熱部材に押し付けるように配置される。 The light emitting device of the first aspect according to the present invention includes a mounting substrate, an insulating member, and a pressing member. The mounting substrate has a first surface and a second surface in the thickness direction. The mounting substrate is in contact with the heat dissipation member on the first surface. The mounting substrate has a light emitting element mounted on the second surface. The insulating member has electrical insulation. The insulating member is disposed on the second surface of the mounting substrate so as not to cover the light emitting element. The pressing member is disposed so as to press the mounting substrate against the heat radiating member with the insulating member.
 本発明に係る第2の形態の発光装置は、第1の形態において、前記放熱部材を備える。前記押圧部材は、前記放熱部材とで前記絶縁部材および前記実装基板を挟むように、前記放熱部材に固定される。 The light emitting device of the 2nd form which concerns on this invention is equipped with the said heat radiating member in a 1st form. The pressing member is fixed to the heat radiating member so as to sandwich the insulating member and the mounting substrate with the heat radiating member.
 本発明に係る第3の形態の発光装置では、第2の形態において、前記絶縁部材は、前記実装基板の前記第2面を覆う蓋部を備える。前記蓋部は、前記発光素子を露出させる開口窓を有する。前記押圧部材は、前記絶縁部材の前記蓋部に接触するように形成される。 In the light emitting device of the third aspect according to the present invention, in the second aspect, the insulating member includes a lid portion that covers the second surface of the mounting substrate. The lid has an opening window that exposes the light emitting element. The pressing member is formed so as to contact the lid portion of the insulating member.
 本発明に係る第4の形態の発光装置では、第3の形態において、前記押圧部材は、前記放熱部材に固定される本体部と、前記厚み方向に交差する所定方向において前記蓋部の両側に配置され前記厚み方向において前記蓋部に接触される押圧部と、前記押圧部を前記本体部にそれぞれ連結する延設片と、を備える。 In the light emitting device of the fourth aspect according to the present invention, in the third aspect, the pressing member is disposed on both sides of the lid in a predetermined direction intersecting the thickness direction and a main body fixed to the heat radiating member. A pressing portion disposed and in contact with the lid portion in the thickness direction; and an extending piece for connecting the pressing portion to the main body portion.
 本発明に係る第5の形態の発光装置では、第4の形態において、前記延設片は、前記押圧部を前記絶縁部材に弾性的に接触させるばね片である。 In the light emitting device of the fifth aspect according to the present invention, in the fourth aspect, the extending piece is a spring piece that elastically contacts the pressing portion with the insulating member.
 本発明に係る第6の形態の発光装置では、第5の形態において、前記押圧部材は、弾性を有する金属材料により形成され、前記本体部と前記押圧部と前記延設片とを一体に備える。 In the light emitting device of the sixth aspect according to the present invention, in the fifth aspect, the pressing member is formed of an elastic metal material, and integrally includes the main body portion, the pressing portion, and the extending piece. .
 本発明に係る第7の形態の発光装置では、第1~第6の形態のいずれか1つにおいて、前記押圧部材は、前記厚み方向に交差する所定方向における前記絶縁部材の移動を規制する規制部を備える。 In a light emitting device according to a seventh aspect of the present invention, in any one of the first to sixth aspects, the pressing member is a restriction that restricts the movement of the insulating member in a predetermined direction intersecting the thickness direction. A part.
 本発明に係る第8の形態の発光装置では、第7の形態において、前記規制部は、前記所定方向において前記絶縁部材の両側に、前記絶縁部材に接触するように配置される。 In the light emitting device of the eighth aspect according to the present invention, in the seventh aspect, the restricting portion is disposed on both sides of the insulating member in the predetermined direction so as to contact the insulating member.
 本発明に係る第9の形態の発光装置では、第8の形態において、前記絶縁部材は、前記所定方向において前記実装基板の両側にそれぞれ位置する壁部と、前記壁部のそれぞれから前記所定方向に沿って外方に突出する鍔部と、を備える。前記規制部は、それぞれ、前記所定方向において前記壁部に接触し、かつ、前記規制部と前記放熱部材との間に前記鍔部が位置するように、配置される。 In the light emitting device of the ninth aspect according to the present invention, in the eighth aspect, the insulating member is a wall portion located on both sides of the mounting substrate in the predetermined direction, and the predetermined direction from each of the wall portions. And a flange that protrudes outward along. Each of the restricting portions is disposed so as to be in contact with the wall portion in the predetermined direction and to be positioned between the restricting portion and the heat dissipation member.
 本発明に係る第10の形態の発光装置では、第9の形態において、前記放熱部材は、前記壁部を受ける凹所を有する。 In the light emitting device of the tenth aspect according to the present invention, in the ninth aspect, the heat dissipation member has a recess for receiving the wall portion.
 本発明に係る第11の形態の発光装置では、第1~第10の形態のいずれか1つにおいて、前記実装基板は、前記発光素子に接続される充電部を前記第2面に備える。 In the light emitting device of the eleventh aspect according to the present invention, in any one of the first to tenth aspects, the mounting board includes a charging unit connected to the light emitting element on the second surface.
 本発明に係る第12の形態の発光装置では、第11の形態において、前記充電部は、外部電源から前記発光素子に電力を供給する回路部を含む。 In the light emitting device of the twelfth aspect according to the present invention, in the eleventh aspect, the charging unit includes a circuit unit for supplying electric power from an external power source to the light emitting element.
 本発明に係る第13の形態の発光装置では、第11の形態または第12の形態において、前記充電部は、前記第2面の中央部に位置する。 In the thirteenth form of the light emitting device according to the present invention, in the eleventh form or the twelfth form, the charging unit is located at the center of the second surface.
 本発明に係る第14の形態の発光装置では、第1~第13の形態のいずれか1つにおいて、前記実装基板は、セラミック基板を用いて形成される。 In the light emitting device of the fourteenth aspect according to the present invention, in any one of the first to thirteenth aspects, the mounting substrate is formed using a ceramic substrate.
 本発明に係る第15の形態の照明器具は、第1~第14の形態のいずれか1つの発光装置と、前記発光装置を保持する器具本体と、を備える。 A luminaire of the fifteenth aspect according to the present invention includes any one light emitting device of the first to fourteenth aspects, and an instrument main body that holds the light emitting device.
本発明に係る一実施形態の発光装置の概略断面図である。It is a schematic sectional drawing of the light-emitting device of one Embodiment which concerns on this invention. 同上の発光装置の一部破断した概略斜視図である。It is the schematic perspective view which a part fracture | ruptured of the light-emitting device same as the above. 図2のA-A線断面図である。FIG. 3 is a sectional view taken along line AA in FIG. 2. 同上の発光装置の押圧部材の概略斜視図である。It is a schematic perspective view of the pressing member of a light-emitting device same as the above. 図4のB-B線断面図である。FIG. 5 is a sectional view taken along line BB in FIG. 4. 同上の発光装置を備える照明器具の第1例を示す概略斜視図である。It is a schematic perspective view which shows the 1st example of a lighting fixture provided with a light-emitting device same as the above. 同上の発光装置を備える照明器具の第2例の概略斜視図である。It is a schematic perspective view of the 2nd example of a lighting fixture provided with a light-emitting device same as the above. 上記照明器具の第2例の概略斜視図である。It is a schematic perspective view of the 2nd example of the said lighting fixture. 上記照明器具の第2例の発光面を示す概略平面図である。It is a schematic plan view which shows the light emission surface of the 2nd example of the said lighting fixture. 従来例の照明装置の断面図である。It is sectional drawing of the illuminating device of a prior art example. 上記従来例の照明装置の一部を示す斜視図である。It is a perspective view which shows a part of lighting apparatus of the said prior art example.
 以下、本発明に係る一実施形態の発光装置について、図1~図9を参照しながら説明する。 Hereinafter, a light emitting device according to an embodiment of the present invention will be described with reference to FIGS.
 本実施形態の発光装置10は、例えば、照明器具30(図6~図9参照)の光源として用いることができる。 The light emitting device 10 of the present embodiment can be used as a light source of the lighting fixture 30 (see FIGS. 6 to 9), for example.
 発光装置10は、放熱部材1と、LED(図示せず)が実装される実装基板2bと、実装基板2bの側部および一表面(図1では、上面)2dの周部を覆う絶縁カバー(絶縁部材)3と、実装基板2bを、絶縁カバー3を介して放熱部材1側に押圧する押圧部材4とを備えている。 The light-emitting device 10 includes a heat dissipation member 1, a mounting substrate 2b on which an LED (not shown) is mounted, an insulating cover that covers a side portion of the mounting substrate 2b and a peripheral portion of one surface (upper surface in FIG. 1) 2d. Insulating member 3) and a pressing member 4 that presses the mounting substrate 2 b to the heat radiating member 1 side through the insulating cover 3.
 放熱部材1は、板状(例えば、矩形板状)に形成されている。この放熱部材1は、樹脂に比べて熱伝導率が高い材料(例えば、アルミニウム、銅、ステンレスなどの金属材料)により形成することができる。 The heat radiating member 1 is formed in a plate shape (for example, a rectangular plate shape). The heat radiating member 1 can be formed of a material (for example, a metal material such as aluminum, copper, and stainless steel) having a higher thermal conductivity than the resin.
 実装基板2bは、厚み方向(図1における上下方向)の第1面(図1における下面)2cおよび第2面(図1における上面)2dを有する。実装基板2は、例えば、セラミック基板を用いて形成される。 The mounting substrate 2b has a first surface (lower surface in FIG. 1) 2c and a second surface (upper surface in FIG. 1) 2d in the thickness direction (vertical direction in FIG. 1). The mounting substrate 2 is formed using, for example, a ceramic substrate.
 実装基板2bは、第1面2cで放熱部材1に接触される。 The mounting substrate 2b is in contact with the heat radiating member 1 on the first surface 2c.
 実装基板2bは、第2面2dに、外部電源(図示せず)から発光素子に電力を供給するための回路部(図示せず)を備える。回路部は、使用時に通電される部分(すなわち充電部)である。したがって、実装基板2bは、第2面2dに発光素子が実装される。 The mounting substrate 2b includes a circuit portion (not shown) for supplying power to the light emitting element from an external power source (not shown) on the second surface 2d. The circuit portion is a portion that is energized during use (that is, a charging portion). Therefore, the mounting substrate 2b has the light emitting element mounted on the second surface 2d.
 すなわち、実装基板2bは、発光素子に接続される充電部を第2面2dに備える。充電部は、外部電源(図示せず)から発光素子に電力を供給する回路部(図示せず)を含む。充電部は、第2面2dの中央部に位置する。発光素子は、例えば、LEDである。 That is, the mounting substrate 2b includes a charging unit connected to the light emitting element on the second surface 2d. The charging unit includes a circuit unit (not shown) that supplies power to the light emitting element from an external power source (not shown). The charging unit is located at the center of the second surface 2d. The light emitting element is, for example, an LED.
 実装基板2bは、例えば、白色系のセラミック材料(例えば、酸化アルミニウム、窒化アルミニウムなど)により形成された電気絶縁性を有するセラミック基板である。 The mounting substrate 2b is an electrically insulating ceramic substrate formed of, for example, a white ceramic material (for example, aluminum oxide, aluminum nitride, etc.).
 また、実装基板2bには、LEDに電気的に接続可能な導体パターン(図示せず)が設けられている。導体パターンは、外部電源(図示せず)から発光素子(LED)に電力を供給する回路部である。 The mounting substrate 2b is provided with a conductor pattern (not shown) that can be electrically connected to the LED. A conductor pattern is a circuit part which supplies electric power to a light emitting element (LED) from an external power supply (not shown).
 なお、本実施形態の発光装置10では、実装基板2bの外周形状を、矩形状に形成しているが、この形状を特に限定するものではない。 In the light emitting device 10 of this embodiment, the outer peripheral shape of the mounting substrate 2b is formed in a rectangular shape, but this shape is not particularly limited.
 また、本実施形態では、実装基板2bとして、セラミック基板を用いているが、これに限らず、例えば、ガラスエポキシ樹脂などからなる絶縁性基材により形成されたプリント配線板などを用いてもよい。 In this embodiment, a ceramic substrate is used as the mounting substrate 2b. However, the present invention is not limited to this, and for example, a printed wiring board formed of an insulating base material made of glass epoxy resin or the like may be used. .
 実装基板2bの一表面側(第2面2d)の中央部には、1個ないし複数個のLEDが実装されている。 One or a plurality of LEDs are mounted on the central portion on the one surface side (second surface 2d) of the mounting substrate 2b.
 LEDとしては、例えば、青色光を放射するLEDチップ(以下、青色LEDチップと称する)と、青色LEDチップから放射された青色光により励起されブロードな黄色光を放射する黄色蛍光体からなる蛍光体とを組み合わせて白色光を得る白色LEDを用いることができる。 As the LED, for example, a phosphor composed of an LED chip that emits blue light (hereinafter referred to as a blue LED chip) and a yellow phosphor that emits broad yellow light that is excited by the blue light emitted from the blue LED chip. Can be used to obtain white light.
 このような白色LEDは、青色LEDチップを覆い黄色蛍光体を含有した第1の透光性材料からなる色変換部(図示せず)を有している。第1の透光性材料としては、例えば、シリコーン樹脂、エポキシ樹脂、ガラスなどを採用することができる。 Such a white LED has a color conversion part (not shown) made of a first light-transmitting material covering a blue LED chip and containing a yellow phosphor. As the first light transmissive material, for example, a silicone resin, an epoxy resin, glass, or the like can be employed.
 本実施形態の発光装置10では、第2の透光性材料からなる封止部2aが、青色LEDチップおよび上記色変換部を封止している。第2の透光性材料としては、例えば、シリコーン樹脂、エポキシ樹脂、ガラスなどを採用することができる。また、本実施形態では、封止部2aの外周形状を、矩形状としているが、この形状を特に限定するものではなく、例えば、円形状などであってもよい。 In the light emitting device 10 of the present embodiment, the sealing portion 2a made of the second light transmissive material seals the blue LED chip and the color conversion portion. As the second light transmissive material, for example, silicone resin, epoxy resin, glass or the like can be employed. Moreover, in this embodiment, although the outer peripheral shape of the sealing part 2a is made into the rectangular shape, this shape is not specifically limited, For example, a circular shape etc. may be sufficient.
 ここにおいて、LEDの蛍光体は、黄色蛍光体に限らず、例えば、赤色蛍光体と緑色蛍光体とを採用してもよい。また、LEDは、紫~近紫外線を放射するLEDチップと、赤色蛍光体、緑色蛍光体および青色蛍光体とを組み合わせて白色光を得る白色LEDを用いてもよい。また、LEDは、赤色光を放射するLEDチップと緑色光を放射するLEDチップと青色LEDチップとを組み合わせて白色光を得る白色LEDを用いてもよい。また、LEDの発光色は、白色に限るものではない。 Here, the phosphor of the LED is not limited to the yellow phosphor, and, for example, a red phosphor and a green phosphor may be employed. Further, as the LED, a white LED that obtains white light by combining an LED chip that emits purple to near ultraviolet light and a red phosphor, a green phosphor, and a blue phosphor may be used. The LED may be a white LED that obtains white light by combining an LED chip that emits red light, an LED chip that emits green light, and a blue LED chip. Further, the emission color of the LED is not limited to white.
 以下、本実施形態では、説明の便宜上、封止部2aと封止部2aで封止されたLEDと実装基板2bとを合わせて、光源部2と称することもある。 Hereinafter, in this embodiment, for convenience of explanation, the LED sealed with the sealing portion 2a and the sealing portion 2a and the mounting substrate 2b may be collectively referred to as the light source portion 2.
 なお、本実施形態の発光装置10では、封止部2aの前面(図1では、上面)が、光源部2の発光面を構成している。 In the light emitting device 10 of the present embodiment, the front surface (upper surface in FIG. 1) of the sealing portion 2a constitutes the light emitting surface of the light source unit 2.
 また、実装基板2bの一表面側(第2面2d)の中央部には、LEDを電気的に接続する一対の第1電極部(図示せず)が、上記導体パターン(回路部)の一部により形成されている。 In addition, a pair of first electrode portions (not shown) for electrically connecting the LEDs are provided at one central portion on the one surface side (second surface 2d) of the mounting substrate 2b. It is formed by the part.
 本実施形態の発光装置10では、LEDのアノード側が、上記一対の第1電極部の一方と電気的に接続されている。また、本実施形態では、LEDのカソード側が、上記一対の第1電極部の他方と電気的に接続されている。なお、本実施形態の発光装置10では、上記一対の第1電極部が、LEDと電気的に接続される充電部を構成している。 In the light emitting device 10 of this embodiment, the anode side of the LED is electrically connected to one of the pair of first electrode portions. In the present embodiment, the cathode side of the LED is electrically connected to the other of the pair of first electrode portions. In the light emitting device 10 according to the present embodiment, the pair of first electrode portions constitutes a charging portion that is electrically connected to the LED.
 また、実装基板2bの一表面側(第2面2d)の周部には、LEDに給電するための一対の第2電極部(図示せず)が、上記導体パターン(回路部)の一部により形成されている。 A pair of second electrode parts (not shown) for supplying power to the LEDs are part of the conductor pattern (circuit part) on the peripheral part on the one surface side (second surface 2d) of the mounting substrate 2b. It is formed by.
 本実施形態の発光装置10では、実装基板2bの上記一対の第2電極部に、一対の電線5a,5b(図2参照)を電気的に接続可能な一対の端子部6a,6b(図3参照)が、半田により電気的に接続されている。 In the light emitting device 10 of the present embodiment, a pair of terminal portions 6a and 6b (FIG. 3) capable of electrically connecting a pair of electric wires 5a and 5b (see FIG. 2) to the pair of second electrode portions of the mounting substrate 2b. Are electrically connected by solder.
 具体的に説明すると、本実施形態の発光装置10では、一対の端子部6a,6bの各々が、U字状の端子板により構成されており、これら端子板の両脚片が、実装基板2bの上記一対の第2電極部に半田により電気的に接続されている。なお、図3では、一対の端子部6a,6bのうち一方の端子部6aが見えている。 More specifically, in the light emitting device 10 of the present embodiment, each of the pair of terminal portions 6a and 6b is configured by a U-shaped terminal plate, and both leg pieces of these terminal plates are mounted on the mounting substrate 2b. The pair of second electrode portions are electrically connected by solder. In addition, in FIG. 3, one terminal part 6a is visible among a pair of terminal parts 6a and 6b.
 一対の電線5a,5bの各々は、各端子部6a,6bと電気的に接続可能な導電体5c(図3参照)が絶縁被覆部5d(図3参照)により覆われた被覆電線である。また、一対の電線5a,5bの各々は、各端子部6a,6bと電気的に接続される導電体5cの一部が露出している。 Each of the pair of electric wires 5a and 5b is a covered electric wire in which a conductor 5c (see FIG. 3) that can be electrically connected to the terminal portions 6a and 6b is covered with an insulating covering portion 5d (see FIG. 3). In addition, in each of the pair of electric wires 5a and 5b, a part of the conductor 5c that is electrically connected to the terminal portions 6a and 6b is exposed.
 本実施形態の発光装置10では、一対の端子部6a,6bの各々に、各電線5a,5bの導電体5cの一部が、例えば、半田からなる接合部(図示せず)により電気的に接続されている。 In the light emitting device 10 of the present embodiment, a part of the conductor 5c of each of the electric wires 5a and 5b is electrically connected to each of the pair of terminal portions 6a and 6b by, for example, a joint portion (not shown) made of solder. It is connected.
 なお、本実施形態の発光装置10では、一対の端子部6a,6bに電気的に接続された一対の電線5a,5bの一端部(図3では、右端部)とは反対の他端部に、コネクタ(図示せず)を有するようにしてもよい。 In the light emitting device 10 of the present embodiment, the other end opposite to one end (the right end in FIG. 3) of the pair of electric wires 5a and 5b electrically connected to the pair of terminal portions 6a and 6b. A connector (not shown) may be provided.
 絶縁カバー(絶縁部材)3は、電気絶縁性を有し、発光素子を覆わないように実装基板2bの第2面2d上に配置される。絶縁カバー3は、実装基板2bの一表面(第2面2d)側を覆う蓋部3aと、実装基板2bの側部を覆う側壁部3bとで構成されている。本実施形態では、絶縁カバー3の材料として、例えば、電気絶縁性を有する合成樹脂材料などを採用することができる。 The insulating cover (insulating member) 3 has electrical insulation and is disposed on the second surface 2d of the mounting substrate 2b so as not to cover the light emitting element. The insulating cover 3 includes a lid portion 3a that covers one surface (second surface 2d) side of the mounting substrate 2b and a side wall portion 3b that covers the side portion of the mounting substrate 2b. In the present embodiment, as the material of the insulating cover 3, for example, a synthetic resin material having electrical insulation can be adopted.
 また、絶縁カバー3の蓋部3aには、光源部2の発光面と対向する部位に、開口窓3cが貫設されている。すなわち、蓋部3aは、実装基板2bの第2面2dを覆うように形成される。蓋部3aは、発光素子を露出させる開口窓3cを有する。 Further, an opening window 3c is provided in the lid portion 3a of the insulating cover 3 at a portion facing the light emitting surface of the light source unit 2. That is, the lid 3a is formed so as to cover the second surface 2d of the mounting substrate 2b. The lid 3a has an opening window 3c through which the light emitting element is exposed.
 本実施形態の発光装置10では、開口窓3cの内周形状を、矩形状としているが、この形状を特に限定するものではなく、例えば、円形状などであってもよい。 In the light emitting device 10 of the present embodiment, the inner peripheral shape of the opening window 3c is a rectangular shape, but this shape is not particularly limited, and may be, for example, a circular shape.
 また、本実施形態では、開口窓3cの開口サイズが、実装基板2bの平面サイズよりも小さく、且つ、光源部2の発光面のサイズよりも大きく設定されている。これにより、本実施形態の発光装置10では、絶縁カバー3が、実装基板2bの側部および一表面(第2面2d)の周部を覆うことが可能となる。 In this embodiment, the opening size of the opening window 3c is set to be smaller than the planar size of the mounting substrate 2b and larger than the size of the light emitting surface of the light source unit 2. Thereby, in the light emitting device 10 of the present embodiment, the insulating cover 3 can cover the side portion of the mounting substrate 2b and the peripheral portion of the one surface (second surface 2d).
 側壁部3bは、所定方向(図1における左右方向)において実装基板2bの両側にそれぞれ位置する壁部3b1,3b2を有する。 The side wall part 3b has wall parts 3b1 and 3b2 respectively located on both sides of the mounting board 2b in a predetermined direction (left and right direction in FIG. 1).
 壁部3b1,3b2は、所定方向において実装基板2bの両側にそれぞれ位置する。本実施形態では、壁部3b1,3b2は、所定方向における蓋部3aの両端部に、それぞれ形成される。所定方向は、実装基板2bの厚み方向に交差する方向である。特に、本実施形態では、所定方向は、実装基板2bの厚み方向に直交する方向(図1における左右方向)である。図1に示すように、壁部3b1は、所定方向における実装基板2bの第1端側(図1における左端側)に位置する。壁部3b2は、所定方向における実装基板2bの第2端側(図1における右端側)に位置する。 The wall portions 3b1 and 3b2 are respectively located on both sides of the mounting substrate 2b in a predetermined direction. In this embodiment, wall part 3b1, 3b2 is each formed in the both ends of the cover part 3a in a predetermined direction. The predetermined direction is a direction intersecting the thickness direction of the mounting substrate 2b. In particular, in the present embodiment, the predetermined direction is a direction (left-right direction in FIG. 1) orthogonal to the thickness direction of the mounting substrate 2b. As shown in FIG. 1, the wall 3b1 is located on the first end side (left end side in FIG. 1) of the mounting board 2b in a predetermined direction. The wall 3b2 is located on the second end side (the right end side in FIG. 1) of the mounting substrate 2b in the predetermined direction.
 また、側壁部3bは、実装基板2の厚み方向および所定方向に交差する第2所定方向における実装基板2の一端側に位置する壁部3b3を有する。本実施形態では、第2所定方向は、実装基板2bの厚み方向および所定方向に直交する方向(図3における左右方向)である。 Further, the side wall portion 3b has a wall portion 3b3 located on one end side of the mounting substrate 2 in the second predetermined direction intersecting the thickness direction of the mounting substrate 2 and the predetermined direction. In the present embodiment, the second predetermined direction is a thickness direction of the mounting substrate 2b and a direction orthogonal to the predetermined direction (the left-right direction in FIG. 3).
 また、絶縁カバー3の側壁部3bの一端部(図2では、左下端部)には、実装基板2bに電気的に接続された一対の電線5a,5bの一部を収納する収納部3fが、この側壁部3bの上記一端部と一体に形成されている。 In addition, a storage portion 3f for storing a part of the pair of electric wires 5a and 5b electrically connected to the mounting substrate 2b is provided at one end portion (the lower left end portion in FIG. 2) of the side wall portion 3b of the insulating cover 3. The side wall 3b is formed integrally with the one end.
 収納部3fは、放熱部材1側(図3では、下側)に、一対の電線5a,5bの一部を収納するための収納室12が設けられている。 The housing part 3f is provided with a housing chamber 12 for housing a part of the pair of electric wires 5a and 5b on the heat radiating member 1 side (lower side in FIG. 3).
 具体的に説明すると、収納部3fは、各電線5a,5bの露出した導電体5cを収納するための第1の収納室12aと、各電線5a,5bの絶縁被覆部5dの一部を収納するための第2の収納室12bとが設けられている。 More specifically, the storage portion 3f stores a first storage chamber 12a for storing the exposed conductor 5c of the electric wires 5a and 5b, and a part of the insulating coating portion 5d of the electric wires 5a and 5b. A second storage chamber 12b is provided.
 本実施形態の発光装置10では、第1の収納室12aと第2の収納室12bとが、仕切壁部13により仕切られている。この仕切壁部13には、実装基板2bに電気的に接続された一対の電線5a,5bを挿入する一対の電線挿入穴(図示せず)が設けられている。 In the light emitting device 10 of the present embodiment, the first storage chamber 12 a and the second storage chamber 12 b are partitioned by the partition wall portion 13. The partition wall portion 13 is provided with a pair of electric wire insertion holes (not shown) for inserting the pair of electric wires 5a and 5b electrically connected to the mounting substrate 2b.
 第1の収納室12aは、絶縁カバー3の蓋部3aおよび側壁部3bにより囲まれた空間と連通している。また、第1の収納室12aは、仕切壁部13に形成された上記一対の電線挿入穴を通して、第2の収納室12bと連通している。 The first storage chamber 12a communicates with a space surrounded by the lid portion 3a and the side wall portion 3b of the insulating cover 3. Further, the first storage chamber 12 a communicates with the second storage chamber 12 b through the pair of electric wire insertion holes formed in the partition wall portion 13.
 第1の収納室12aの底壁には、絶縁カバー3の開口窓3c側へ近づくに従って収納部3fと実装基板2bとの間の距離が徐々に小さくなるように形成された傾斜部3gが設けられている。 The bottom wall of the first storage chamber 12a is provided with an inclined portion 3g formed such that the distance between the storage portion 3f and the mounting substrate 2b gradually decreases as the insulating cover 3 approaches the opening window 3c side. It has been.
 傾斜部3gは、絶縁カバー3の開口窓3cへ近づくに従って、この傾斜部3gにおける実装基板2b側とは反対側の一表面(図3では、上面)と実装基板2bの一表面2dとの間の距離が徐々に小さくなるように形成されている。 As the inclined portion 3g approaches the opening window 3c of the insulating cover 3, the surface between the one surface (upper surface in FIG. 3) opposite to the mounting substrate 2b side of the inclined portion 3g and the one surface 2d of the mounting substrate 2b. The distance is formed so as to gradually decrease.
 これにより、本実施形態の発光装置10では、光源部2のLEDから出射された光が、傾斜部3gの上記一表面(以下、傾斜面と称する)で反射するのを低減することが可能となる。 Thereby, in the light-emitting device 10 of this embodiment, it is possible to reduce that the light radiate | emitted from LED of the light source part 2 reflects on the said one surface (henceforth an inclined surface) of the inclination part 3g. Become.
 また、本実施形態の発光装置10では、光源部2のLEDから出射された光が、傾斜部3gの傾斜面で反射するのを低減することが可能となるので、光源部2のLEDから出射される光の配光を広くすることが可能となる。 Further, in the light emitting device 10 of the present embodiment, it is possible to reduce the light emitted from the LED of the light source unit 2 from being reflected by the inclined surface of the inclined unit 3g. It is possible to widen the light distribution of the emitted light.
 なお、本実施形態の発光装置10では、仕切壁部13が、側壁部3bの一部を構成している。 In addition, in the light-emitting device 10 of this embodiment, the partition wall part 13 comprises a part of side wall part 3b.
 ここにおいて、本実施形態の発光装置10では、各電線5a,5bの露出した導電体5cを、各端子部6a,6bを介して、実装基板2bの上記一対の第2電極部に電気的に接続しているが、これに限らず、各電線5a,5bの露出した導電体5cを、上記接合部により、直接、実装基板2bの上記一対の第2電極部に電気的に接続してもよい。 Here, in the light emitting device 10 of the present embodiment, the exposed conductors 5c of the electric wires 5a and 5b are electrically connected to the pair of second electrode portions of the mounting substrate 2b via the terminal portions 6a and 6b. However, the present invention is not limited to this, and the exposed conductor 5c of each of the electric wires 5a and 5b may be electrically connected to the pair of second electrode portions of the mounting substrate 2b directly by the joint portion. Good.
 これにより、本実施形態の発光装置10では、傾斜部3gの傾斜面において実装基板2bの上記一表面に対する傾斜角を、より小さくすることが可能となり、光源部2のLEDから出射された光が、傾斜部3gの傾斜面で反射するのを抑制することが可能となる。 Thereby, in the light-emitting device 10 of this embodiment, it becomes possible to make the inclination | tilt angle with respect to the said one surface of the mounting substrate 2b smaller in the inclined surface of the inclination part 3g, and the light radiate | emitted from LED of the light source part 2 is made. It is possible to suppress reflection on the inclined surface of the inclined portion 3g.
 また、本実施形態の発光装置10では、光源部2のLEDから出射された光が、傾斜部3gの傾斜面で反射するのを抑制することが可能となるので、光源部2のLEDから出射される光の配光をより広くすることが可能となる。 Moreover, in the light-emitting device 10 of this embodiment, it becomes possible to suppress that the light radiate | emitted from LED of the light source part 2 reflects on the inclined surface of the inclination part 3g, Therefore It radiate | emits from LED of the light source part 2. The light distribution of the emitted light can be made wider.
 第2の収納室12bの底壁には、放熱部材1側(図3では、下側)へ突出する第1のリブ14が設けられている。この第1のリブ14は、仕切壁部13の上記一対の電線挿入穴のうち一方の電線挿入穴に挿入した電線5aの一部を、第2の収納室12bの内周壁とで挟持する。 A first rib 14 is provided on the bottom wall of the second storage chamber 12b so as to protrude toward the heat radiating member 1 (lower side in FIG. 3). The first rib 14 sandwiches a part of the electric wire 5a inserted into one of the pair of electric wire insertion holes of the partition wall 13 with the inner peripheral wall of the second storage chamber 12b.
 また、第2の収納室12bの底壁には、放熱部材1側へ突出する第2のリブ(図示せず)が設けられている。この第2のリブは、仕切壁部13の上記一対の電線挿入穴のうち他方の電線挿入穴に挿入した電線5bの一部を、第2の収納室12bの内周壁とで挟持する。 Further, a second rib (not shown) protruding toward the heat radiating member 1 is provided on the bottom wall of the second storage chamber 12b. This 2nd rib clamps a part of electric wire 5b inserted in the other electric wire insertion hole among said pair of electric wire insertion holes of the partition wall part 13 with the inner peripheral wall of the 2nd storage chamber 12b.
 つまり、本実施形態の発光装置10では、第1のリブ14および上記第2のリブの各々が、一対の電線5a,5bの一部を第2の収納室12bの内周壁とで挟持する張力止部を構成している。 That is, in the light emitting device 10 according to the present embodiment, the first rib 14 and the second rib each have a tension that holds a part of the pair of electric wires 5a and 5b with the inner peripheral wall of the second storage chamber 12b. It constitutes a stop.
 これにより、本実施形態の発光装置10では、一対の電線5a,5bに作用する張力を低減するための別部品が不要となり、低コストで一対の電線5a,5bの張力止め機能を付与することが可能となる。また、本実施形態の発光装置10では、一対の電線5a,5bに作用する張力を低減することが可能となるので、一対の電線5a,5bにおける露出した導電体5cの各々と一対の端子部6a,6bとの上記接合部の各々に応力が作用して断線するのを防止することが可能となる。 Thereby, in the light-emitting device 10 of this embodiment, the separate part for reducing the tension | tensile_strength which acts on a pair of electric wire 5a, 5b becomes unnecessary, and the tension | tensile_strength stop function of a pair of electric wire 5a, 5b is provided at low cost. Is possible. Further, in the light emitting device 10 of the present embodiment, it is possible to reduce the tension acting on the pair of electric wires 5a and 5b, so that each of the exposed conductors 5c and the pair of terminal portions in the pair of electric wires 5a and 5b. It is possible to prevent the stress from acting on each of the joint portions with 6a and 6b and disconnecting them.
 また、第2の収納室12bの一側壁(図3では、左側壁)には、実装基板2bに電気的に接続された一対の電線5a,5bを導出する一対の導出穴3h,3h(図2参照)が形成されている。 A pair of lead- out holes 3h and 3h (see FIG. 3) for leading out the pair of electric wires 5a and 5b electrically connected to the mounting substrate 2b are provided on one side wall (the left side wall in FIG. 3) of the second storage chamber 12b. 2) is formed.
 本実施形態の発光装置10では、実装基板2bに電気的に接続された一対の電線5a,5bを収納部3fの一対の導出穴3h,3hから導出した後に、例えば、シリコーン樹脂などを第2の収納室12bの内部に充填してもよい。 In the light emitting device 10 according to the present embodiment, after the pair of electric wires 5a and 5b electrically connected to the mounting substrate 2b is led out from the pair of lead holes 3h and 3h of the storage portion 3f, for example, a second resin such as silicone resin is used. The inside of the storage chamber 12b may be filled.
 これにより、本実施形態の発光装置10では、収納部3fの一対の導出穴3h,3hを通して収納室12の内部に水などが浸入するのを防止することが可能となる。 Thereby, in the light emitting device 10 of the present embodiment, it is possible to prevent water or the like from entering the storage chamber 12 through the pair of lead- out holes 3h, 3h of the storage portion 3f.
 本実施形態の発光装置10では、放熱部材1の側部(図2では、左下側部)に、収納部3fの一対の導出穴3h,3hから導出した一対の電線5a,5bを、発光装置10の外部へ導出する導出部16が設けられている。 In the light emitting device 10 of the present embodiment, a pair of electric wires 5a and 5b led out from the pair of lead- out holes 3h and 3h of the housing portion 3f are provided on the side portion (lower left side portion in FIG. 2) of the heat dissipation member 1. Deriving unit 16 for deriving 10 outside is provided.
 導出部16は、放熱部材1の側部の一部に形成された切欠き部であって、放熱部材1の上記一面(図2では、上面)、側面(図2では、左下側面)および他面(図2では、下面)それぞれの一部が開放されている。 The lead-out part 16 is a notch part formed in a part of the side part of the heat radiating member 1, and the one surface (upper surface in FIG. 2), side surface (lower left side surface in FIG. 2) and others of the heat radiating member 1. A part of each surface (the lower surface in FIG. 2) is open.
 また、絶縁カバー3の側壁部3bは、一対の電線5a,5bを導出した方向(図2では、左下方向)に直交する方向の両壁部3b1,3b2(図2では、左上壁部3b1および右下壁部3b2)の各々に、外方へ突出した鍔部3d(図1参照)が設けられている。これら各鍔部3dの各々は、両壁部3b1,3b2の一端側(図1では、下端側)に配置されている。 Further, the side wall portion 3b of the insulating cover 3 has both wall portions 3b1 and 3b2 (in FIG. 2, the upper left wall portion 3b1 and the left upper wall portion 3b1) in a direction perpendicular to the direction (the lower left direction in FIG. Each lower right wall portion 3b2) is provided with a flange portion 3d (see FIG. 1) protruding outward. Each of the flange portions 3d is disposed on one end side (the lower end side in FIG. 1) of both wall portions 3b1 and 3b2.
 このように、鍔部3d,3dは、壁部3b1,3b2のそれぞれから所定方向に沿って外方に突出する。本実施形態では、鍔部3d,3dは、壁部3b1,3b2の先端部(図1における下端部)に形成される。なお、放熱部材1は、壁部3b1,3b2を受ける凹所1bを有する。本実施形態では、図1に示すように、凹所1bには、壁部3b1,3b2の先端部(図1における下端部)が入り込む。 Thus, the flange portions 3d and 3d protrude outward from the respective wall portions 3b1 and 3b2 along a predetermined direction. In the present embodiment, the flange portions 3d and 3d are formed at the tip portions (lower end portions in FIG. 1) of the wall portions 3b1 and 3b2. In addition, the heat radiating member 1 has the recessed part 1b which receives wall part 3b1, 3b2. In the present embodiment, as shown in FIG. 1, the end portions (lower end portions in FIG. 1) of the wall portions 3b1 and 3b2 enter the recess 1b.
 押圧部材4は、絶縁部材3で実装基板2bを放熱部材1に押し付けるように構成される。特に、押圧部材4は、放熱部材1とで絶縁部材3および実装基板2bを挟むように、放熱部材1に固定される。また、押圧部材4は、絶縁部材3の蓋部3aに接触するように形成される。 The pressing member 4 is configured to press the mounting substrate 2 b against the heat radiating member 1 with the insulating member 3. In particular, the pressing member 4 is fixed to the heat radiating member 1 so as to sandwich the insulating member 3 and the mounting substrate 2 b with the heat radiating member 1. The pressing member 4 is formed so as to contact the lid portion 3 a of the insulating member 3.
 押圧部材4は、平面視形状がU字状に形成された板状の本体部4aと、この本体部4aに延設された板状の延設片4bと、延設片4bの先端部に設けられ絶縁カバー3を押圧する板状の押圧部4cとを有している(図1,2,4,5参照)。 The pressing member 4 has a plate-like main body portion 4a formed in a U shape in plan view, a plate-like extension piece 4b extended to the main body portion 4a, and a distal end portion of the extension piece 4b. And a plate-like pressing portion 4c that presses the insulating cover 3 (see FIGS. 1, 2, 4, and 5).
 この押圧部材4は、金属板(例えば、ステンレス鋼板など)により形成することができる。すなわち、押圧部材4は、弾性を有する金属材料により形成され、本体部4aと押圧部4cと延設片4bと突出部4e,4fを一体に備える。なお、本実施形態の発光装置10では、押圧部材4の厚み寸法を、0.3mmとしているが、この数値を特に限定するものではない。 The pressing member 4 can be formed of a metal plate (for example, a stainless steel plate). That is, the pressing member 4 is formed of a metal material having elasticity, and integrally includes a main body portion 4a, a pressing portion 4c, an extending piece 4b, and protruding portions 4e and 4f. In addition, in the light-emitting device 10 of this embodiment, although the thickness dimension of the press member 4 is 0.3 mm, this numerical value is not specifically limited.
 また、本実施形態では、押圧部材4が、延設片4bを複数個(本実施形態では、4個)備えている。 In the present embodiment, the pressing member 4 includes a plurality of extended pieces 4b (four in the present embodiment).
 また、本実施形態では、各延設片4bにおける本体部4aの一表面(図5では、上面)に対する傾斜角が、90度よりも小さな角度に設定されている。 In the present embodiment, the inclination angle of each extended piece 4b with respect to one surface (the upper surface in FIG. 5) of the main body 4a is set to an angle smaller than 90 degrees.
 これにより、本実施形態の発光装置10では、押圧部材4の各押圧部4cの各々が、各延設片4bの押圧部4c側とは反対側の端部を支点として、絶縁カバー3を放熱部材1側に向かって弾性的に押圧することが可能となる。 Thereby, in the light emitting device 10 according to the present embodiment, each pressing portion 4c of the pressing member 4 radiates heat from the insulating cover 3 with the end portion of each extending piece 4b opposite to the pressing portion 4c side as a fulcrum. It becomes possible to press elastically toward the member 1 side.
 押圧部材4において、本体部4aは、放熱部材1に固定される。押圧部4cは、実装基板2bの厚み方向に交差する所定方向において蓋部3aの両側に配置され実装基板2bの厚み方向において蓋部3aに接触される。延設片4bは、押圧部4cを本体部4aにそれぞれ連結するように構成される。例えば、延設片4bは、押圧部4cを絶縁部材3に弾性的に接触させるばね片である。 In the pressing member 4, the main body 4 a is fixed to the heat radiating member 1. The pressing portions 4c are arranged on both sides of the lid portion 3a in a predetermined direction intersecting the thickness direction of the mounting substrate 2b, and are in contact with the lid portion 3a in the thickness direction of the mounting substrate 2b. The extending piece 4b is configured to connect the pressing portion 4c to the main body portion 4a. For example, the extended piece 4 b is a spring piece that elastically contacts the pressing portion 4 c with the insulating member 3.
 より詳細に説明すると、本体部4aは、2つの脚片4a1,4a2と、各脚片4a1,4a2の一端部(図4では、右上端部)の各々に連結された連結片4a3とで構成されている。 More specifically, the main body portion 4a includes two leg pieces 4a1 and 4a2 and a connecting piece 4a3 connected to each of one end portions (the upper right end portion in FIG. 4) of each leg piece 4a1 and 4a2. Has been.
 本体部4aの脚片4a1は、対向する脚片4a2側の端部(図4では、右下端部)に、2個の延設片4bが設けられている。また、本体部4aの脚片4a2は、対向する脚片4a1側の端部(図4では、左上端部)に、2個の延設片4bが設けられている。 The leg piece 4a1 of the main body part 4a is provided with two extending pieces 4b at the end (on the right lower end in FIG. 4) on the opposite leg piece 4a2 side. Further, the leg piece 4a2 of the main body part 4a is provided with two extending pieces 4b at the end (on the left upper end in FIG. 4) on the side of the opposing leg piece 4a1.
 脚片4a1の各延設片4bの押圧部4cの各々は、対向する延設片4bの押圧部4c側(図5では、右側)に向かって突設されている。また、脚片4a2の各延設片4bの押圧部4cの各々は、対向する延設片4bの押圧部4c側(図5では、左側)に向かって突設されている。 Each of the pressing portions 4c of each extending piece 4b of the leg piece 4a1 protrudes toward the pressing portion 4c side (right side in FIG. 5) of the opposing extending piece 4b. In addition, each of the pressing portions 4c of each extending piece 4b of the leg piece 4a2 protrudes toward the pressing portion 4c side (left side in FIG. 5) of the opposing extending piece 4b.
 ここにおいて、本実施形態の発光装置10では、延設片4bの個数を4個としているが、この個数を特に限定するものではなく、延設片4bの個数は、各脚片4a1,4a2の各々に少なくとも1個ずつあればよい。つまり、押圧部材4の本体部4aに、少なくとも一対の延設片4b,4bがあればよい。言い換えれば、本実施形態の発光装置10では、押圧部材4が、少なくとも一対の押圧部4c,4cを有していればよい。 Here, in the light emitting device 10 of the present embodiment, the number of the extended pieces 4b is four, but this number is not particularly limited, and the number of the extended pieces 4b is the number of the leg pieces 4a1 and 4a2. There may be at least one for each. That is, the main body portion 4a of the pressing member 4 only needs to have at least a pair of extending pieces 4b and 4b. In other words, in the light emitting device 10 of the present embodiment, the pressing member 4 only needs to have at least a pair of pressing portions 4c and 4c.
 また、本実施形態の発光装置10では、一対の押圧部4c,4cが、対称となる位置に配置されることが好ましい。これにより、本実施形態の発光装置10では、押圧部材4の一対の押圧部4c,4cが絶縁カバー3を略均一に押圧することが可能となり、絶縁カバー3が実装基板2bへ略均一に負荷をかけることが可能となる。 Further, in the light emitting device 10 of the present embodiment, it is preferable that the pair of pressing portions 4c and 4c are arranged at symmetrical positions. Thereby, in the light emitting device 10 of the present embodiment, the pair of pressing portions 4c, 4c of the pressing member 4 can press the insulating cover 3 substantially uniformly, and the insulating cover 3 loads the mounting substrate 2b substantially uniformly. Can be applied.
 また、本実施形態の発光装置10では、絶縁カバー3が実装基板2bへ略均一に負荷をかけることが可能となるので、光源部2のLEDで発生した熱を、放熱部材1へ効率よく伝導することが可能となる。さらに、本実施形態の発光装置10では、絶縁カバー3が実装基板2bへ略均一に負荷をかけることが可能となるので、実装基板2bの割れを低減することも可能となる。 Further, in the light emitting device 10 of the present embodiment, the insulating cover 3 can apply a load to the mounting substrate 2b substantially uniformly, so that heat generated by the LEDs of the light source unit 2 is efficiently conducted to the heat radiating member 1. It becomes possible to do. Furthermore, in the light emitting device 10 of the present embodiment, the insulating cover 3 can apply a load to the mounting substrate 2b substantially uniformly, so that it is possible to reduce cracks in the mounting substrate 2b.
 また、脚片4a1は、対向する脚片4a2側の端部(図4では、右下端部)に、対向する脚片4a2側へ突出する第1の突出部4eが設けられている。 Further, the leg piece 4a1 is provided with a first projecting portion 4e projecting toward the facing leg piece 4a2 side at an end portion (a lower right end portion in FIG. 4) on the facing leg piece 4a2 side.
 本実施形態では、第1の突出部4eが、脚片4a1に延設された2個の延設片4bの間に配置されている。言い換えれば、第1の突出部4eは、脚片4a1の各延設片4bの各々とは異なる位置に配置されている。 In the present embodiment, the first projecting portion 4e is disposed between the two extended pieces 4b extended to the leg pieces 4a1. In other words, the 1st protrusion part 4e is arrange | positioned in the position different from each of each extension piece 4b of the leg piece 4a1.
 また、脚片4a2は、対向する脚片4a1側の端部(図4では、左上端部)に、対向する脚片4a1側へ突出する第2の突出部4fが設けられている。 Further, the leg piece 4a2 is provided with a second projecting portion 4f projecting toward the facing leg piece 4a1 side at an end (on the upper left end in FIG. 4) on the facing leg piece 4a1 side.
 本実施形態では、第2の突出部4fが、脚片4a2に延設された2個の延設片4bの間に配置されている。言い換えれば、第2の突出部4fは、脚片4a2の各延設片4bの各々とは異なる位置に配置されている。 In the present embodiment, the second projecting portion 4f is disposed between the two extended pieces 4b extended to the leg pieces 4a2. In other words, the 2nd protrusion part 4f is arrange | positioned in the position different from each of each extension piece 4b of the leg piece 4a2.
 突出部4e,4fは、実装基板2bの厚み方向に交差する所定方向(図1における左右方向)における絶縁部材3の移動を規制する規制部を構成する。突出部(規制部)4e,4fは、所定方向において絶縁部材3の両側に、絶縁部材3に接触するように配置される。本実施形態では、突出部(規制部)4e,4fは、それぞれ、所定方向において壁部3b1,3b2に接触し、かつ、突出部(規制部)4e,4fと放熱部材1との間に鍔部3d,3dが位置するように、配置される。 The protruding portions 4e and 4f constitute a restricting portion that restricts the movement of the insulating member 3 in a predetermined direction (left and right direction in FIG. 1) intersecting the thickness direction of the mounting substrate 2b. The protruding portions (regulating portions) 4e and 4f are disposed on both sides of the insulating member 3 in a predetermined direction so as to contact the insulating member 3. In the present embodiment, the protruding portions (regulating portions) 4e and 4f are in contact with the wall portions 3b1 and 3b2 in a predetermined direction, respectively, and between the protruding portions (restricting portions) 4e and 4f and the heat radiating member 1 It arrange | positions so that the parts 3d and 3d may be located.
 押圧部材4の作製方法としては、例えば、まず、金属板から押圧部材4の展開図に相当する形を打ち抜き加工し、打ち抜き加工された押圧部材4の各延設片4bの各々を曲げ加工する。そして、この曲げ加工された各延設片4bの先端部の各々を曲げ加工することによって、押圧部4cがそれぞれ形成される。 As a manufacturing method of the pressing member 4, for example, first, a shape corresponding to a development view of the pressing member 4 is punched from a metal plate, and each extended piece 4b of the pressing member 4 punched is bent. . And the press part 4c is formed by bending each of the front-end | tip part of each extended piece 4b bent.
 ところで、放熱部材1の一面側(図1では、上面側)の中央部には、押圧部材4の本体部4aを配置するための第1の凹所1aが設けられている。ここにおいて、各脚片4a1,4a2および連結片4a3の各々の厚み寸法は、第1の凹所1aの深さ寸法よりも小さく設定されている。 Incidentally, a first recess 1a for disposing the main body 4a of the pressing member 4 is provided at the center of one surface side (the upper surface side in FIG. 1) of the heat radiating member 1. Here, the thickness dimension of each leg piece 4a1, 4a2 and connecting piece 4a3 is set smaller than the depth dimension of the first recess 1a.
 第1の凹所1aの内底壁には、押圧部材4を放熱部材1に固定するための第1の固定ねじ11を螺合する第1の固定ねじ穴(図示せず)が、複数箇所(本実施形態では、2箇所)に形成されている。 A plurality of first fixing screw holes (not shown) for screwing a first fixing screw 11 for fixing the pressing member 4 to the heat radiating member 1 are provided in the inner bottom wall of the first recess 1a. (Two places in this embodiment).
 ここにおいて、押圧部材4の本体部4aは、放熱部材1の第1の凹所1aにおける上記各第1の固定ねじ穴に対応する位置の各々に、第1の固定ねじ11を挿通する第1の固定ねじ挿通孔4d(図4,5参照)が貫設されている。 Here, the main body portion 4 a of the pressing member 4 is a first portion through which the first fixing screw 11 is inserted into each of the positions corresponding to the first fixing screw holes in the first recess 1 a of the heat radiating member 1. The fixing screw insertion hole 4d (see FIGS. 4 and 5) is provided therethrough.
 具体的に説明すると、押圧部材4の本体部4aは、各脚片4a1,4a2の各々に、上述の第1の固定ねじ挿通孔4dが貫設されている。 Specifically, in the main body portion 4a of the pressing member 4, the above-described first fixing screw insertion hole 4d is provided in each of the leg pieces 4a1 and 4a2.
 これにより、本実施形態の発光装置10では、第1の固定ねじ11を、押圧部材4の本体部4aにおける各第1の固定ねじ挿通孔4dに挿通して、放熱部材1の上記各第1の固定ねじ穴に螺合することによって、押圧部材4を放熱部材1に固定することができる。要するに、押圧部材4は、放熱部材1に取り付けられる。 Thereby, in the light emitting device 10 of the present embodiment, the first fixing screw 11 is inserted into each first fixing screw insertion hole 4d in the main body portion 4a of the pressing member 4, and each of the first fixing screws 11 of the heat radiation member 1 is inserted. The pressing member 4 can be fixed to the heat radiating member 1 by being screwed into the fixing screw hole. In short, the pressing member 4 is attached to the heat radiating member 1.
 また、放熱部材1の上記一面側は、押圧部材4が放熱部材1に固定された状態において各脚片4a1,4a2と連結片4a3とで囲まれた部位に、絶縁カバー3を配置するための第2の凹所1b(図1,3参照)が設けられている。つまり、放熱部材1は、絶縁カバー3の壁部3b1,3b2を収容する凹所(第2の凹所)1bを有する。第2の凹所1bの内周形状は、矩形状に形成されている。 Moreover, the said one surface side of the heat radiating member 1 is for arrange | positioning the insulating cover 3 in the site | part enclosed by each leg piece 4a1, 4a2 and the connection piece 4a3 in the state in which the press member 4 was fixed to the heat radiating member 1. A second recess 1b (see FIGS. 1 and 3) is provided. That is, the heat radiating member 1 has a recess (second recess) 1 b that accommodates the walls 3 b 1 and 3 b 2 of the insulating cover 3. The inner peripheral shape of the second recess 1b is formed in a rectangular shape.
 また、放熱部材1の上記一面側の周部は、収納部3fの第2の収納室12bと対向する部位に、収納部3fを配置するための第3の凹所1g(図2,3参照)が設けられている。第3の凹所1gは、第2の凹所1bと連通するように形成されている。また、第3の凹所1gは、導出部16と連通するように形成されている。 Further, the peripheral portion on the one surface side of the heat radiating member 1 is a third recess 1g (see FIGS. 2 and 3) for disposing the storage portion 3f in a portion facing the second storage chamber 12b of the storage portion 3f. ) Is provided. The third recess 1g is formed so as to communicate with the second recess 1b. The third recess 1 g is formed so as to communicate with the lead-out portion 16.
 なお、第2の凹所1bおよび第3の凹所1gの各々の深さ寸法は、第1の凹所1aの深さ寸法よりも大きく設定されている。 In addition, the depth dimension of each of the second recess 1b and the third recess 1g is set larger than the depth dimension of the first recess 1a.
 第2の凹所1bの内底壁の中央部には、放熱部材1の上記一面側(図1では、上側)へ突出した突台部1cが設けられている。本実施形態の発光装置10では、突台部1cの外周形状を、矩形状に形成しているが、この形状を特に限定するものではない。 At the center of the inner bottom wall of the second recess 1b, a projecting portion 1c that protrudes toward the one surface side (the upper side in FIG. 1) of the heat radiating member 1 is provided. In the light emitting device 10 of the present embodiment, the outer peripheral shape of the protrusion 1c is formed in a rectangular shape, but this shape is not particularly limited.
 また、本実施形態では、突台部1cの先端面1e側に、実装基板2bが配置される。要するに、本実施形態の発光装置10では、実装基板2bが、放熱部材1の一面側(放熱部材1の突台部1cの先端面1e側)に配置される。 Further, in the present embodiment, the mounting substrate 2b is disposed on the tip surface 1e side of the projecting portion 1c. In short, in the light emitting device 10 of the present embodiment, the mounting substrate 2b is disposed on the one surface side of the heat radiating member 1 (the front end surface 1e side of the protruding portion 1c of the heat radiating member 1).
 ここで、実装基板2bの平面サイズは、実装基板2bの側部および上記一表面の周部を絶縁カバー3により覆うときに、実装基板2bの側部が絶縁カバー3の側壁部3bおよび仕切壁部13に当接するように設定されている。これにより、本実施形態の発光装置10では、実装基板2bが側方へ移動するのを規制することが可能となる。 Here, the planar size of the mounting substrate 2b is such that when the side portion of the mounting substrate 2b and the peripheral portion of the one surface are covered with the insulating cover 3, the side portion of the mounting substrate 2b is the side wall portion 3b of the insulating cover 3 and the partition wall. It is set to abut against the portion 13. Thereby, in the light-emitting device 10 of this embodiment, it becomes possible to control that the mounting substrate 2b moves to the side.
 また、本実施形態では、放熱部材1の突台部1cの平面サイズを、実装基板2bの平面サイズよりも小さく設定しているが、実装基板2bの平面サイズと同じ大きさに設定してもよい。これにより、本実施形態の発光装置10では、光源部2のLEDで発生した熱を、放熱部材1へ効率よく伝導することが可能となる。 Moreover, in this embodiment, although the planar size of the protrusion part 1c of the heat radiating member 1 is set smaller than the planar size of the mounting substrate 2b, it may be set to the same size as the planar size of the mounting substrate 2b. Good. Thereby, in the light-emitting device 10 of this embodiment, it becomes possible to efficiently conduct the heat generated by the LEDs of the light source unit 2 to the heat radiating member 1.
 ここにおいて、絶縁カバー3の各鍔部3dの突出寸法は、放熱部材1の突台部1cの側面と、放熱部材1の第2の凹所1bの内側面との間の距離よりも小さく設定されている(図1参照)。 Here, the projecting dimension of each flange 3d of the insulating cover 3 is set to be smaller than the distance between the side surface of the projecting portion 1c of the heat radiating member 1 and the inner side surface of the second recess 1b of the heat radiating member 1. (See FIG. 1).
 また、各鍔部3dの厚み寸法は、突台部1cの突出寸法よりも小さく設定されている(図1参照)。 Moreover, the thickness dimension of each collar part 3d is set smaller than the projecting dimension of the projecting part 1c (see FIG. 1).
 また、絶縁カバー3の蓋部3aの周部は、上記直交する方向の両端部(図2では、左上端部および右下端部)の各々に、放熱部材1側(図2では、下側)へ突出する凸部3e(図1参照)が設けられている。各凸部3eは、放熱部材1の突台部1cとで実装基板2bを挟持する。 Further, the peripheral portion of the lid portion 3a of the insulating cover 3 is disposed on each of the end portions in the orthogonal direction (the upper left end portion and the lower right end portion in FIG. 2) on the heat radiating member 1 side (the lower side in FIG. 2). Convex part 3e (refer to Drawing 1) which protrudes to is provided. Each convex portion 3 e sandwiches the mounting substrate 2 b with the protruding portion 1 c of the heat radiating member 1.
 また、押圧部材4の各突出部4e,4fの突出寸法は、押圧部材4が放熱部材1に固定されたときに、絶縁カバー3の側壁部3bの外側と接触可能な寸法に設定されている(図1参照)。 The projecting dimensions of the projecting parts 4 e and 4 f of the pressing member 4 are set to dimensions that allow contact with the outside of the side wall part 3 b of the insulating cover 3 when the pressing member 4 is fixed to the heat radiating member 1. (See FIG. 1).
 なお、本実施形態の発光装置10では、各突出部4e,4fの各々が、絶縁カバー3が実装基板2bの側方へ移動するのを規制する規制部を構成している。 In the light emitting device 10 of the present embodiment, each of the protrusions 4e and 4f constitutes a restricting portion that restricts the insulating cover 3 from moving to the side of the mounting substrate 2b.
 本実施形態の発光装置10では、仮に、押圧部材4の各延設片4bの弾性変形に起因して絶縁カバー3が光源部2のLEDの光出射側(図1では、上側)へ移動する場合、絶縁カバー3の各鍔部3dが押圧部材4の各突出部4e,4fに当たるので、絶縁カバー3が押圧部材4から外れるのを防ぐことが可能となる。 In the light emitting device 10 of the present embodiment, the insulating cover 3 is moved to the light emitting side (upper side in FIG. 1) of the LED of the light source unit 2 due to elastic deformation of each extending piece 4b of the pressing member 4. In this case, since each flange 3d of the insulating cover 3 hits the projecting portions 4e and 4f of the pressing member 4, it is possible to prevent the insulating cover 3 from being detached from the pressing member 4.
 また、放熱部材1の側部には、発光装置10を照明器具30の器具本体20(図6参照)に取り付けるための複数(本実施形態では、3個)の取付部1f(図2,3参照)が、側方へ延設されている。 Further, a plurality (three in this embodiment) of attachment portions 1f (FIGS. 2 and 3) for attaching the light emitting device 10 to the fixture body 20 (see FIG. 6) of the lighting fixture 30 are provided on the side of the heat radiating member 1. Is extended to the side.
 各取付部1fの各々には、発光装置10を器具本体20に取り付けるための第1の取付ねじ(図示せず)を挿通する第1の取付ねじ挿通孔1dが設けられている。 Each of the attachment portions 1f is provided with a first attachment screw insertion hole 1d through which a first attachment screw (not shown) for attaching the light emitting device 10 to the instrument body 20 is inserted.
 なお、本実施形態では、取付部1fの個数を、3個としているが、この個数を特に限定するものではない。 In addition, in this embodiment, although the number of the attaching parts 1f is 3, the number is not particularly limited.
 以下、本実施形態の発光装置10を組み立てる手順について説明する。なお、本実施形態では、一対の電線5a,5bが、実装基板2bに予め電気的に接続されているものとして説明する。 Hereinafter, a procedure for assembling the light emitting device 10 of the present embodiment will be described. In the present embodiment, a pair of electric wires 5a and 5b will be described as being electrically connected to the mounting substrate 2b in advance.
 本実施形態の発光装置10では、まず、実装基板2bの側部および上記一表面の周部を絶縁カバー3により覆う。このとき、絶縁カバー3の開口窓3cから光源部2の封止部2aが露出される。 In the light emitting device 10 of the present embodiment, first, the insulating cover 3 covers the side portion of the mounting substrate 2b and the peripheral portion of the one surface. At this time, the sealing portion 2 a of the light source unit 2 is exposed from the opening window 3 c of the insulating cover 3.
 次に、光源部2の実装基板2bを、放熱部材1の突台部1cの先端面1e側に配置して、絶縁カバー3を放熱部材1の第2の凹所1bおよび第3の凹所1gに配置する。 Next, the mounting substrate 2b of the light source unit 2 is disposed on the tip end surface 1e side of the projecting portion 1c of the heat radiating member 1, and the insulating cover 3 is placed in the second and third recesses 1b and 1b of the heat radiating member 1. Place 1g.
 そして、押圧部材4の本体部4aを放熱部材1の第1の凹所1aに配置して、第1の固定ねじ11により押圧部材4を放熱部材1に固定することによって、発光装置10が組み立てられる。 Then, the light emitting device 10 is assembled by disposing the main body portion 4 a of the pressing member 4 in the first recess 1 a of the heat radiating member 1 and fixing the pressing member 4 to the heat radiating member 1 with the first fixing screw 11. It is done.
 これにより、本実施形態の発光装置10では、押圧部材4の各押圧部4cの各々が、絶縁カバー3を放熱部材1側に向かって押圧することが可能となる。つまり、本実施形態の発光装置10では、押圧部材4が、実装基板2bを、絶縁カバー3を介して放熱部材1側に押圧することが可能となる。 Thereby, in the light emitting device 10 of the present embodiment, each of the pressing portions 4c of the pressing member 4 can press the insulating cover 3 toward the heat radiating member 1 side. That is, in the light emitting device 10 of the present embodiment, the pressing member 4 can press the mounting substrate 2b to the heat radiating member 1 side through the insulating cover 3.
 また、本実施形態の発光装置10では、押圧部材4が、実装基板2bを、絶縁カバー3を介して放熱部材1側に押圧することが可能となるので、光源部2のLEDで発生した熱を、実装基板2bを通して、放熱部材1へ効率よく伝導することが可能となり、LEDの温度上昇を抑制することが可能となる。 Moreover, in the light-emitting device 10 of this embodiment, since the pressing member 4 can press the mounting substrate 2b to the heat radiating member 1 side via the insulating cover 3, the heat generated by the LEDs of the light source unit 2 Can be efficiently conducted to the heat radiating member 1 through the mounting substrate 2b, and the temperature rise of the LED can be suppressed.
 ここにおいて、本実施形態の発光装置10では、実装基板2bと放熱部材1の突台部1cとの間に、例えば、放熱用のグリースや熱伝導性シートなどの熱伝導性部材(図示せず)を配置することが好ましい。 Here, in the light emitting device 10 according to the present embodiment, a heat conductive member (not shown) such as a heat radiating grease or a heat conductive sheet is provided between the mounting substrate 2b and the protruding portion 1c of the heat radiating member 1. ) Is preferably arranged.
 これにより、本実施形態の発光装置10では、光源部2のLEDで発生した熱を、実装基板2bおよび上記熱伝導性部材を通して、放熱部材1へさらに効率よく伝導することが可能となり、光源部2の放熱性を高めることが可能となる。 Thereby, in the light emitting device 10 of the present embodiment, the heat generated by the LED of the light source unit 2 can be more efficiently conducted to the heat radiating member 1 through the mounting substrate 2b and the heat conductive member. It becomes possible to improve the heat dissipation of 2.
 以上説明した本実施形態の発光装置10では、放熱部材1と、放熱部材1の一面側(突台部1cの先端面1e側)に配置されてなり放熱部材1側とは反対の上記一表面側の中央部にLEDと電気的に接続される充電部(上記一対の第1電極部)を有する実装基板2bと、実装基板2bの側部および上記一表面の周部を覆う絶縁カバー3と、実装基板2bを、絶縁カバー3を介して放熱部材1側に押圧する押圧部材4とを備えている。 In the light emitting device 10 of the present embodiment described above, the heat dissipating member 1 and the one surface opposite to the heat dissipating member 1 side, which is disposed on the one surface side of the heat dissipating member 1 (the front end surface 1e side of the protrusion 1c). A mounting substrate 2b having a charging portion (the pair of first electrode portions) electrically connected to the LED at the center of the side, and an insulating cover 3 covering the side portion of the mounting substrate 2b and the peripheral portion of the one surface; And a pressing member 4 that presses the mounting substrate 2b toward the heat radiating member 1 via the insulating cover 3.
 換言すれば、本実施形態の発光装置10は、実装基板2bと、絶縁部材(絶縁カバー)3と、押圧部材4と、を備える。実装基板2bは、厚み方向の第1面2cおよび第2面2dを有する。実装基板2bは、第1面2cで放熱部材1に接触される。実装基板2bは、第2面2dに発光素子が実装される。絶縁部材3は、電気絶縁性を有する。絶縁部材3は、発光素子を覆わないように実装基板2bの第2面2d上に配置される。押圧部材4は、絶縁部材3で実装基板2bを放熱部材1に押し付けるように配置される。 In other words, the light emitting device 10 of the present embodiment includes the mounting substrate 2b, the insulating member (insulating cover) 3, and the pressing member 4. The mounting substrate 2b has a first surface 2c and a second surface 2d in the thickness direction. The mounting substrate 2b is in contact with the heat radiating member 1 on the first surface 2c. The mounting substrate 2b has a light emitting element mounted on the second surface 2d. The insulating member 3 has electrical insulation. The insulating member 3 is disposed on the second surface 2d of the mounting substrate 2b so as not to cover the light emitting element. The pressing member 4 is disposed so as to press the mounting substrate 2 b against the heat radiating member 1 with the insulating member 3.
 本実施形態の発光装置10によれば、図10に示した従来例のLEDランプ81に比べて、実装基板2bの平面サイズを大きくすることなく、押圧部材4の各押圧部4cと、実装基板2bの上記充電部との間の沿面距離を長くすることが可能となる。 According to the light emitting device 10 of the present embodiment, each pressing portion 4c of the pressing member 4 and the mounting substrate can be formed without increasing the planar size of the mounting substrate 2b as compared with the LED lamp 81 of the conventional example shown in FIG. It is possible to increase the creepage distance between the charging unit 2b.
 また、本実施形態の発光装置10では、押圧部材4の各押圧部4cと、実装基板2bの上記充電部との間の沿面距離を長くすることが可能となるので、耐雷サージ性を高めることが可能となり、実装基板2bの上記充電部の電気的な絶縁性能を高めることも可能となる。 Moreover, in the light-emitting device 10 of this embodiment, since it becomes possible to lengthen the creeping distance between each press part 4c of the press member 4, and the said charging part of the mounting board 2b, it improves lightning surge resistance. Thus, the electrical insulation performance of the charging part of the mounting substrate 2b can be improved.
 要するに、本実施形態の発光装置10では、実装基板2bの平面サイズを大きくすることなく、実装基板2bの上記充電部の絶縁性能を高めることが可能となる。 In short, in the light emitting device 10 of the present embodiment, it is possible to improve the insulation performance of the charging unit of the mounting board 2b without increasing the planar size of the mounting board 2b.
 また、本実施形態の発光装置10は、放熱部材1を備える。押圧部材4は、放熱部材1とで絶縁部材3および実装基板2bを挟むように、放熱部材1に固定される。なお、この構成は任意である。 Further, the light emitting device 10 of the present embodiment includes the heat radiating member 1. The pressing member 4 is fixed to the heat radiating member 1 so as to sandwich the insulating member 3 and the mounting substrate 2b with the heat radiating member 1. This configuration is arbitrary.
 特に、本実施形態の発光装置10では、絶縁部材3は、実装基板2bの第2面2dを覆う蓋部3aを備える。蓋部3aは、発光素子を露出させる開口窓3cを有する。押圧部材4は、絶縁部材3の蓋部3aに接触するように形成される。なお、この構成は任意である。 In particular, in the light emitting device 10 of the present embodiment, the insulating member 3 includes a lid portion 3a that covers the second surface 2d of the mounting substrate 2b. The lid 3a has an opening window 3c through which the light emitting element is exposed. The pressing member 4 is formed so as to contact the lid portion 3 a of the insulating member 3. This configuration is arbitrary.
 特に、本実施形態の発光装置10では、押圧部材4は、放熱部材1に固定される本体部4aと、厚み方向に交差する所定方向において蓋部3aの両側に配置され厚み方向において蓋部3aに接触される押圧部4c,4cと、押圧部4c,4cを本体部4aにそれぞれ連結する延設片4bと、を備える。なお、この構成は任意である。 In particular, in the light emitting device 10 of the present embodiment, the pressing member 4 is disposed on both sides of the lid portion 3a in the predetermined direction intersecting the thickness direction with the main body portion 4a fixed to the heat radiating member 1, and the lid portion 3a in the thickness direction. Pressing portions 4c, 4c that are in contact with each other, and extending pieces 4b that connect the pressing portions 4c, 4c to the main body portion 4a, respectively. This configuration is arbitrary.
 特に、本実施形態の発光装置10では、延設片4bは、押圧部4cを絶縁部材3に弾性的に接触させるばね片である。なお、この構成は任意である。 In particular, in the light emitting device 10 of the present embodiment, the extended piece 4b is a spring piece that elastically contacts the pressing portion 4c with the insulating member 3. This configuration is arbitrary.
 特に、本実施形態の発光装置10は、押圧部材4は、弾性を有する金属材料により形成され、本体部4aと押圧部4cと延設片4bとを一体に備える。なお、この構成は任意である。 Particularly, in the light emitting device 10 of the present embodiment, the pressing member 4 is formed of an elastic metal material, and integrally includes a main body portion 4a, a pressing portion 4c, and an extending piece 4b. This configuration is arbitrary.
 また、本実施形態の発光装置10では、実装基板2bは、発光素子に接続される充電部を第2面2dに備える。なお、この構成は任意である。 Moreover, in the light emitting device 10 of the present embodiment, the mounting substrate 2b includes a charging unit connected to the light emitting element on the second surface 2d. This configuration is arbitrary.
 また、本実施形態の発光装置10では、充電部は、外部電源から発光素子に電力を供給する回路部を含む。なお、この構成は任意である。 Further, in the light emitting device 10 of the present embodiment, the charging unit includes a circuit unit that supplies power to the light emitting element from an external power source. This configuration is arbitrary.
 また、本実施形態の発光装置10では、充電部は、第2面2dの中央部に位置する。なお、この構成は任意である。 Further, in the light emitting device 10 of the present embodiment, the charging unit is located at the center of the second surface 2d. This configuration is arbitrary.
 また、本実施形態の発光装置10では、実装基板2bは、セラミック基板を用いて形成される。なお、この構成は任意である。 Further, in the light emitting device 10 of this embodiment, the mounting substrate 2b is formed using a ceramic substrate. This configuration is arbitrary.
 また、本実施形態の発光装置10では、押圧部材4に、絶縁カバー3が実装基板2bの側方へ移動するのを規制する規制部(各突出部4e,4f)を設けている。 Further, in the light emitting device 10 of the present embodiment, the pressing member 4 is provided with restriction portions ( respective protrusions 4e and 4f) that restrict the insulating cover 3 from moving to the side of the mounting substrate 2b.
 つまり、この発光装置10において、押圧部材4は、放熱部材1に取り付けられてなり、当該押圧部材4に、絶縁カバー3が実装基板2bの側方へ移動するのを規制する規制部(突出部)4e,4fが設けられてなる。 In other words, in the light emitting device 10, the pressing member 4 is attached to the heat radiating member 1, and a restricting portion (protruding portion) that restricts the pressing member 4 from moving the insulating cover 3 to the side of the mounting substrate 2 b. ) 4e and 4f are provided.
 換言すれば、本実施形態の発光装置10では、押圧部材4は、厚み方向に交差する所定方向における絶縁部材3の移動を規制する規制部(突出部)4e,4fを備える。なお、この構成は任意である。 In other words, in the light emitting device 10 of the present embodiment, the pressing member 4 includes restriction portions (protrusion portions) 4e and 4f that restrict the movement of the insulating member 3 in a predetermined direction that intersects the thickness direction. This configuration is arbitrary.
 特に、本実施形態の発光装置10では、規制部4e,4fは、所定方向において絶縁部材3の両側に、絶縁部材3に接触するように配置される。なお、この構成は任意である。 In particular, in the light emitting device 10 of the present embodiment, the restricting portions 4e and 4f are arranged on both sides of the insulating member 3 in a predetermined direction so as to contact the insulating member 3. This configuration is arbitrary.
 特に、本実施形態の発光装置10では、絶縁部材3は、所定方向において実装基板2bの両側にそれぞれ位置する壁部3b1,3b2と、壁部3b1,3b2のそれぞれから所定方向に沿って外方に突出する鍔部3d,3dと、を備える。規制部4e,4fは、それぞれ、所定方向において壁部3b1,3b2に接触し、かつ、規制部4e,4fと放熱部材1との間に鍔部3d,3dが位置するように、配置される。なお、この構成は任意である。 In particular, in the light emitting device 10 according to the present embodiment, the insulating member 3 is disposed outwardly along the predetermined direction from the wall portions 3b1 and 3b2 respectively located on both sides of the mounting substrate 2b in the predetermined direction and the wall portions 3b1 and 3b2. 3d, 3d projecting to the top. The restricting portions 4e and 4f are arranged such that they come into contact with the wall portions 3b1 and 3b2 in a predetermined direction, and the flange portions 3d and 3d are located between the restricting portions 4e and 4f and the heat radiating member 1. . This configuration is arbitrary.
 特に、本実施形態の発光装置10では、放熱部材1は、壁部3b1,3b2を収容する凹所1bを有する。なお、この構成は任意である。 In particular, in the light emitting device 10 of the present embodiment, the heat dissipating member 1 has a recess 1b that accommodates the walls 3b1 and 3b2. This configuration is arbitrary.
 この構成により、絶縁カバー3が実装基板2bの側方へ移動するのを規制することが可能となり、上述の沿面距離を略一定に保つことが可能となる。これにより、本実施形態の発光装置10では、実装基板2bの上記充電部の電気的な絶縁性能をより高めることが可能となる。 With this configuration, it is possible to regulate the movement of the insulating cover 3 to the side of the mounting substrate 2b, and the above creepage distance can be kept substantially constant. Thereby, in the light-emitting device 10 of this embodiment, it becomes possible to improve the electrical insulation performance of the said charging part of the mounting board | substrate 2b more.
 以下、本実施形態の発光装置10を用いた照明器具の一例(第1例)について、図6に基づいて説明する。 Hereinafter, an example (first example) of a lighting fixture using the light emitting device 10 of the present embodiment will be described with reference to FIG.
 第1例の照明器具30(30A)は、街路灯である。この照明器具30Aは、上述の発光装置10と、この発光装置10を保持する器具本体20と、器具本体20に保持された発光装置10を覆う透光性のグローブ21とを備えている。 The lighting apparatus 30 (30A) in the first example is a street lamp. The lighting fixture 30 </ b> A includes the above-described light emitting device 10, a fixture main body 20 that holds the light emitting device 10, and a translucent glove 21 that covers the light emitting device 10 held by the fixture main body 20.
 なお、照明器具30Aでは、1個の器具本体20に、複数個(本実施形態では、4個)の発光装置10が保持されている。また、照明器具30Aでは、発光装置10の個数を、4個としているが、1個であってもよい。 In the lighting fixture 30A, a plurality of (four in this embodiment) light emitting devices 10 are held in one fixture body 20. Further, in the lighting fixture 30A, the number of the light emitting devices 10 is four, but may be one.
 器具本体20は、例えば、ステンレスなどの金属材料により形成することができる。また、器具本体20は、下側に開口面を有する椀状の本体部20aと、この本体部20aの内底壁に固定され各発光装置10を保持する保持部20bとを有している。 The instrument body 20 can be formed of a metal material such as stainless steel, for example. The instrument main body 20 includes a bowl-shaped main body portion 20a having an opening surface on the lower side, and a holding portion 20b that is fixed to the inner bottom wall of the main body portion 20a and holds each light emitting device 10.
 保持部20bは、中空の四角錐台形状に形成されている。 The holding part 20b is formed in a hollow quadrangular frustum shape.
 保持部20bの底面部(図6では、上面部)には、この保持部20bを本体部20aに固定するための鍔部20cが設けられている。本実施形態では、鍔部20cの外周形状が、円形状に形成されている。 The bottom part (the upper surface part in FIG. 6) of the holding part 20b is provided with a flange part 20c for fixing the holding part 20b to the main body part 20a. In the present embodiment, the outer peripheral shape of the flange portion 20c is formed in a circular shape.
 なお、照明器具30Aでは、保持部20bの形状を、四角錐台形状に形成しているが、この形状を特に限定するものではない。また、照明器具30Aでは、鍔部20cの外周形状を、円形状に形成しているが、この形状を特に限定するものではない。 In addition, in 30 A of lighting fixtures, although the shape of the holding | maintenance part 20b is formed in the shape of a quadrangular pyramid, this shape is not specifically limited. Moreover, in 30 A of lighting fixtures, although the outer peripheral shape of the collar part 20c is formed in circular shape, this shape is not specifically limited.
 保持部20bの鍔部20cには、この保持部20bを本体部20aに固定する第2の固定ねじ23を挿通する第2の固定ねじ挿通孔(図示せず)が複数箇所(照明器具30Aでは、4箇所)に設けられている。 The flange portion 20c of the holding portion 20b has a plurality of second fixing screw insertion holes (not shown) through which the second fixing screw 23 for fixing the holding portion 20b to the main body portion 20a is inserted (in the lighting fixture 30A). 4 places).
 ここにおいて、本体部20aの内底壁には、鍔部20cの上記各第2の固定ねじ挿通孔の各々に対応する位置に、第2の固定ねじ23を螺合する第2の固定ねじ穴(図示せず)が設けられている。 Here, the second fixing screw hole into which the second fixing screw 23 is screwed into the inner bottom wall of the main body portion 20a at a position corresponding to each of the second fixing screw insertion holes of the flange portion 20c. (Not shown) is provided.
 照明器具30Aでは、第2の固定ねじ23を、保持部20bの鍔部20cにおける上記各第2の固定ねじ挿通孔に挿通して、本体部20aの上記各第2の固定ねじ穴に螺合することによって、保持部20bを本体部20aに固定することができる。 In the lighting fixture 30A, the second fixing screw 23 is inserted into the second fixing screw insertion holes in the flange portion 20c of the holding portion 20b, and is screwed into the second fixing screw holes of the main body portion 20a. By doing so, the holding | maintenance part 20b can be fixed to the main-body part 20a.
 保持部20bの底面部側とは反対側の一面部(図6では、下面部)には、例えば、道路などに立てられた円柱状のポール22の一端部(図6では、上端部)に、照明器具30Aを着脱自在に固定することが可能な固定部(図示せず)が設けられている。 For example, one end portion (the lower surface portion in FIG. 6) of the holding portion 20b on the opposite side to the bottom surface portion side is, for example, one end portion (the upper end portion in FIG. 6) of the columnar pole 22 standing on the road or the like. A fixing portion (not shown) that can detachably fix the lighting fixture 30A is provided.
 照明器具30Aでは、各発光装置10の各々が、保持部20bの各側面部で保持されている。具体的に説明すると、保持部20bの各側面部には、発光装置10の放熱部材1における各第1の取付ねじ挿通孔1dの各々に対応する位置に、上記第1の取付ねじを螺合する第1の取付ねじ穴(図示せず)が設けられている。 In the lighting fixture 30A, each light emitting device 10 is held by each side surface portion of the holding portion 20b. Specifically, the first mounting screws are screwed into the side portions of the holding portion 20b at positions corresponding to the first mounting screw insertion holes 1d in the heat dissipation member 1 of the light emitting device 10. A first mounting screw hole (not shown) is provided.
 照明器具30Aでは、上記第1の取付ねじを、発光装置10の放熱部材1における各第1の取付ねじ挿通孔1dに挿通して、保持部20bの上記各第1の取付ねじ穴に螺合することによって、各発光装置10の各々が保持部20bに固定される。これにより、保持部20bは、発光装置10を保持することができる。 In the lighting fixture 30A, the first mounting screws are inserted into the first mounting screw insertion holes 1d in the heat dissipation member 1 of the light emitting device 10 and screwed into the first mounting screw holes of the holding portion 20b. By doing so, each of the light emitting devices 10 is fixed to the holding portion 20b. Thereby, the holding unit 20 b can hold the light emitting device 10.
 ところで、発光装置10は、放熱部材1の他面側(図1,3では、下面側)に、この発光装置10を保持部20bに位置決めするための突起15が設けられている。また、保持部20bの各側面部には、発光装置10の放熱部材1の各突起15の各々に対応する位置に、窪部(図示せず)が設けられている。 By the way, the light emitting device 10 is provided with a protrusion 15 for positioning the light emitting device 10 on the holding portion 20b on the other surface side (the lower surface side in FIGS. 1 and 3) of the heat radiating member 1. In addition, a recess (not shown) is provided on each side surface of the holding portion 20 b at a position corresponding to each of the protrusions 15 of the heat radiating member 1 of the light emitting device 10.
 これにより、照明器具30Aでは、発光装置10を保持部20bに取り付けるときに、発光装置10を保持部20bに位置決めすることが可能となり、発光装置10を保持部20bに取り付ける作業性を向上させることが可能となる。 Accordingly, in the lighting fixture 30A, when the light emitting device 10 is attached to the holding portion 20b, the light emitting device 10 can be positioned to the holding portion 20b, and workability for attaching the light emitting device 10 to the holding portion 20b is improved. Is possible.
 なお、照明器具30Aでは、突起15の個数を3個としているが、この個数を特に限定するものではない。 In the lighting fixture 30A, the number of protrusions 15 is three, but the number is not particularly limited.
 また、照明器具30Aでは、保持部20bの内部に、各発光装置10を点灯させる点灯装置(図示せず)が配置されている。ここにおいて、各発光装置10の一対の電線5a,5bは、上記点灯装置と電気的に接続されている。なお、図6では、各発光装置10の一対の電線5a,5bの図示を省略している。 Further, in the lighting fixture 30A, a lighting device (not shown) for lighting each light emitting device 10 is disposed inside the holding portion 20b. Here, the pair of electric wires 5a and 5b of each light-emitting device 10 is electrically connected to the lighting device. In addition, in FIG. 6, illustration of a pair of electric wire 5a, 5b of each light-emitting device 10 is abbreviate | omitted.
 グローブ21は、上側に開口面を有する椀状に形成されている。照明器具30Aでは、グローブ21の材料として、透光性材料を採用している。透光性材料としては、透光性の樹脂(例えば、ABS樹脂、アクリル樹脂、ポリスチレン樹脂など)やガラスなどを採用することができる。また、本実施形態では、グローブ21の開口面のサイズが、本体部20aの開口面のサイズよりも小さく設定されている。 The globe 21 is formed in a bowl shape having an opening surface on the upper side. In the lighting fixture 30 </ b> A, a translucent material is used as the material of the globe 21. As the light-transmitting material, a light-transmitting resin (for example, ABS resin, acrylic resin, polystyrene resin, or the like), glass, or the like can be used. In the present embodiment, the size of the opening surface of the globe 21 is set to be smaller than the size of the opening surface of the main body 20a.
 グローブ21の底壁には、ポール22を挿通する挿通孔21aが形成されている。 An insertion hole 21 a for inserting the pole 22 is formed in the bottom wall of the globe 21.
 グローブ21の上側の外周壁には、グローブ21を器具本体20に取り付けるための第2の取付ねじ(図示せず)を螺合する第2の取付ねじ穴21bが複数設けられている。 The outer peripheral wall on the upper side of the globe 21 is provided with a plurality of second attachment screw holes 21b for screwing second attachment screws (not shown) for attaching the globe 21 to the instrument body 20.
 ここにおいて、器具本体20の本体部20aにおける下側の周壁は、グローブ21の各第2の取付ねじ穴21bの各々に対応する位置に、上記第2の取付ねじを挿通する第2の取付ねじ挿通孔20dが貫設されている。 Here, the lower peripheral wall of the main body 20a of the instrument main body 20 is a second mounting screw through which the second mounting screw is inserted at a position corresponding to each of the second mounting screw holes 21b of the globe 21. An insertion hole 20d is provided therethrough.
 照明器具30Aでは、上記第2の取付ねじを、器具本体20の本体部20aにおける各第2の取付ねじ挿通孔20dに挿通して、グローブ21の上記各第2の取付ねじ穴21bに螺合することによって、グローブ21が器具本体20に取り付けられる。 In the lighting fixture 30 </ b> A, the second mounting screws are inserted into the second mounting screw insertion holes 20 d in the main body portion 20 a of the fixture body 20, and screwed into the second mounting screw holes 21 b of the globe 21. By doing so, the glove 21 is attached to the instrument body 20.
 なお、照明器具30Aでは、器具本体20とグローブ21とが、図示しない締結具(金具)を介して上記第2の取付ねじにより固定される。また、照明器具30Aでは、グローブ21を器具本体20に取り付ける手段として、上記締結具および上記第2の取付ねじを用いているが、この手段を特に限定するものではない。 In the lighting fixture 30A, the fixture body 20 and the globe 21 are fixed by the second mounting screw via a fastener (metal fitting) not shown. In the lighting fixture 30A, the fastener and the second attachment screw are used as means for attaching the globe 21 to the appliance main body 20, but this means is not particularly limited.
 また、上述の発光装置10を用いた照明器具30は、図6に示した構成の照明器具30(30A)に限らず、例えば、図7~図9に示した構成の照明器具30(30B)でもよい。 Further, the lighting fixture 30 using the light emitting device 10 is not limited to the lighting fixture 30 (30A) having the configuration shown in FIG. 6, and for example, the lighting fixture 30 (30B) having the configuration shown in FIGS. But you can.
 図7~図9は、本実施形態の発光装置10を備える照明器具30の他例(第2例)を示す。第2例の照明器具30(30B)は、投光器であり、上述の発光装置10と、この発光装置10を保持する器具本体50と、器具本体50に保持された発光装置10を覆う透光性のカバー(図示せず)とを備えている。 7 to 9 show another example (second example) of the lighting fixture 30 including the light emitting device 10 of the present embodiment. The lighting fixture 30 (30B) of the second example is a projector, and is a light-transmitting device that covers the above-described light-emitting device 10, the fixture main body 50 that holds the light-emitting device 10, and the light-emitting device 10 that is held by the fixture main body 50. Cover (not shown).
 照明器具30Bでは、1個の器具本体50に、複数個(例えば、8個)の発光装置10が保持されている。なお、照明器具30Bでは、発光装置10の個数を、8個としているが、1個であってもよい。 In the lighting fixture 30B, a plurality of (for example, eight) light emitting devices 10 are held in one fixture body 50. In the lighting fixture 30B, the number of the light emitting devices 10 is eight, but may be one.
 器具本体50は、各発光装置10を取り付けるための取付部51aを有する箱状の本体部51と、例えば壁面の造営面などに照明器具30Bを固定するための固定具53と、本体部51と固定具53とを回動自在に連結する連結部52とを有している。 The appliance main body 50 includes a box-shaped main body 51 having an attachment portion 51 a for attaching each light emitting device 10, a fixture 53 for fixing the lighting fixture 30 </ b> B to a construction surface of a wall surface, for example, It has the connection part 52 which connects the fixing tool 53 rotatably.
 照明器具30Bでは、本体部51の内部に、各発光装置10を点灯させる点灯装置(図示せず)が配置されている。 In the lighting fixture 30B, a lighting device (not shown) for lighting each light emitting device 10 is disposed inside the main body 51.
 以上説明した本実施形態の照明器具30(30A,30B)は、上述の発光装置10と、この発光装置10を保持する器具本体(20,50)とを備えている。 The lighting fixture 30 (30A, 30B) of the present embodiment described above includes the above-described light emitting device 10 and the fixture main body (20, 50) that holds the light emitting device 10.
 したがって、実装基板2bの平面サイズを大きくすることなく、実装基板2bの上記充電部の絶縁性能を高めることが可能な発光装置10を用いた照明器具30を提供することができる。 Therefore, it is possible to provide the lighting fixture 30 using the light emitting device 10 that can improve the insulation performance of the charging portion of the mounting board 2b without increasing the planar size of the mounting board 2b.

Claims (15)

  1.  厚み方向の第1面および第2面を有し、前記第1面で放熱部材に接触され、前記第2面に発光素子が実装される実装基板と、
     電気絶縁性を有し、前記発光素子を覆わないように前記実装基板の前記第2面上に配置される絶縁部材と、
     前記絶縁部材で前記実装基板を前記放熱部材に押し付ける押圧部材と、
     を備える
     ことを特徴とする発光装置。
    A mounting substrate having a first surface and a second surface in the thickness direction, in contact with a heat dissipation member on the first surface, and a light emitting element mounted on the second surface;
    An insulating member having electrical insulation and disposed on the second surface of the mounting substrate so as not to cover the light emitting element;
    A pressing member that presses the mounting substrate against the heat dissipation member with the insulating member;
    A light emitting device comprising:
  2.  前記放熱部材を備え、
     前記押圧部材は、前記放熱部材とで前記絶縁部材および前記実装基板を挟むように、前記放熱部材に固定される
     ことを特徴とする請求項1に記載の発光装置。
    Comprising the heat dissipation member;
    The light-emitting device according to claim 1, wherein the pressing member is fixed to the heat radiating member so as to sandwich the insulating member and the mounting substrate with the heat radiating member.
  3.  前記絶縁部材は、前記実装基板の前記第2面を覆う蓋部を備え、
     前記蓋部は、前記発光素子を露出させる開口窓を有し、
     前記押圧部材は、前記絶縁部材の前記蓋部に接触するように形成される
     ことを特徴とする請求項2に記載の発光装置。
    The insulating member includes a lid that covers the second surface of the mounting substrate,
    The lid has an opening window that exposes the light emitting element;
    The light-emitting device according to claim 2, wherein the pressing member is formed so as to contact the lid portion of the insulating member.
  4.  前記押圧部材は、
      前記放熱部材に固定される本体部と、
      前記厚み方向に交差する所定方向において前記蓋部の両側に配置され前記厚み方向において前記蓋部に接触される押圧部と、
      前記押圧部を前記本体部にそれぞれ連結する延設片と、
     を備える
     ことを特徴とする請求項3に記載の発光装置。
    The pressing member is
    A main body fixed to the heat dissipation member;
    A pressing portion disposed on both sides of the lid portion in a predetermined direction intersecting the thickness direction and in contact with the lid portion in the thickness direction;
    Extending pieces connecting the pressing parts to the main body part, and
    The light-emitting device according to claim 3.
  5.  前記延設片は、前記押圧部を前記絶縁部材に弾性的に接触させるばね片である
     ことを特徴とする請求項4に記載の発光装置。
    The light emitting device according to claim 4, wherein the extending piece is a spring piece that elastically contacts the pressing portion with the insulating member.
  6.  前記押圧部材は、弾性を有する金属材料により形成され、前記本体部と前記押圧部と前記延設片とを一体に備える
     ことを特徴とする請求項5に記載の発光装置。
    The light emitting device according to claim 5, wherein the pressing member is formed of an elastic metal material, and integrally includes the main body portion, the pressing portion, and the extending piece.
  7.  前記押圧部材は、前記厚み方向に交差する所定方向における前記絶縁部材の移動を規制する規制部を備える
     ことを特徴とする請求項1に記載の発光装置。
    The light emitting device according to claim 1, wherein the pressing member includes a restricting portion that restricts movement of the insulating member in a predetermined direction intersecting the thickness direction.
  8.  前記規制部は、前記所定方向において前記絶縁部材の両側に、前記絶縁部材に接触するように配置される
     ことを特徴とする請求項7に記載の発光装置。
    The light emitting device according to claim 7, wherein the restricting portion is disposed on both sides of the insulating member in the predetermined direction so as to contact the insulating member.
  9.  前記絶縁部材は、
      前記所定方向において前記実装基板の両側にそれぞれ位置する壁部と、
      前記壁部のそれぞれから前記所定方向に沿って外方に突出する鍔部と、
     を備え、
     前記規制部は、それぞれ、前記所定方向において前記壁部に接触し、かつ、前記規制部と前記放熱部材との間に前記鍔部が位置するように、配置される
     ことを特徴とする請求項8に記載の発光装置。
    The insulating member is
    Wall portions respectively located on both sides of the mounting substrate in the predetermined direction;
    A flange that protrudes outward along the predetermined direction from each of the walls;
    With
    The said restricting part is arrange | positioned so that the said collar part may be located between the said restricting part and the said heat radiating member, respectively, in contact with the said wall part in the said predetermined direction. 9. The light emitting device according to 8.
  10.  前記放熱部材は、前記壁部を受ける凹所を有する
     ことを特徴とする請求項9に記載の発光装置。
    The light-emitting device according to claim 9, wherein the heat dissipation member has a recess that receives the wall portion.
  11.  前記実装基板は、前記発光素子に接続される充電部を前記第2面に備える
     ことを特徴とする請求項1に記載の発電装置。
    The power generation device according to claim 1, wherein the mounting board includes a charging unit connected to the light emitting element on the second surface.
  12.  前記充電部は、外部電源から前記発光素子に電力を供給する回路部を含む
     ことを特徴とする請求項11に記載の発電装置。
    The power generation device according to claim 11, wherein the charging unit includes a circuit unit that supplies electric power to the light emitting element from an external power source.
  13.  前記充電部は、前記第2面の中央部に位置する
     ことを特徴とする請求項11に記載の発電装置。
    The power generation device according to claim 11, wherein the charging unit is located in a central portion of the second surface.
  14.  前記実装基板は、セラミック基板を用いて形成される
     ことを特徴とする請求項1に記載の発光装置。
    The light emitting device according to claim 1, wherein the mounting substrate is formed using a ceramic substrate.
  15.  請求項1に記載の発光装置と、
     前記発光装置を保持する器具本体と、
     を備える
     ことを特徴とする照明器具。
    A light emitting device according to claim 1;
    An instrument body for holding the light emitting device;
    A lighting apparatus comprising:
PCT/JP2012/079909 2012-02-24 2012-11-19 Light-emitting device and lighting equipment using same WO2013125112A1 (en)

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