JP5807969B2 - 保護素子用フラックス組成物およびそれを利用した回路保護素子 - Google Patents
保護素子用フラックス組成物およびそれを利用した回路保護素子 Download PDFInfo
- Publication number
- JP5807969B2 JP5807969B2 JP2012245144A JP2012245144A JP5807969B2 JP 5807969 B2 JP5807969 B2 JP 5807969B2 JP 2012245144 A JP2012245144 A JP 2012245144A JP 2012245144 A JP2012245144 A JP 2012245144A JP 5807969 B2 JP5807969 B2 JP 5807969B2
- Authority
- JP
- Japan
- Prior art keywords
- flux
- organic
- protection element
- base substrate
- circuit protection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/048—Fuse resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/0039—Means for influencing the rupture process of the fusible element
- H01H85/0047—Heating means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/46—Circuit arrangements not adapted to a particular application of the protective device
- H01H2085/466—Circuit arrangements not adapted to a particular application of the protective device with remote controlled forced fusing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/0039—Means for influencing the rupture process of the fusible element
- H01H85/0047—Heating means
- H01H85/0065—Heat reflective or insulating layer on the fusible element
Landscapes
- Fuses (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
Description
11,21・・・パターン電極、
12,22・・・ベース基板、
13,23・・・抵抗発熱素子、
14,24・・・ヒューズ合金、
15,25・・・有機フラックス、
16,26・・・蓋体、
17,27・・・スルーホール。
Claims (3)
- パターン電極を有する耐熱絶縁材からなるベース基板と、前記ベース基板の前記パターン電極に電気接続した可融性金属からなるヒューズ合金と、このヒューズ合金の表面に塗布した有機フラックスと、前記ヒューズ合金を覆って前記ベース基板に固着した蓋体とを備え、前記有機フラックスは、ロジンなどの熱可融性樹脂を含み、これに比較的低温域で流動性を調整するチクソ剤や、有機酸類、有機酸アミン塩類、ハロゲン化水素酸アミン塩類等の活性剤、高融点溶剤などの助剤成分を適宜選択添加して調製した有機フラックス基材に、この有機フラックス基材と反応しない不溶不融性かつ絶縁性の無機粒子からなる保持材をさらに含有したことを特徴とする回路保護素子。
- 前記保持材は、ガラス粉、セラミックス粉、炭酸カルシウム、タルク、シリカ、カオリン、酸化チタン、マイカ、モンモリロナイトの中から選択された少なくとも1つの無機粒子であることを特徴とする請求項1に記載の回路保護素子。
- 前記回路保護素子は、前記ベース基板にさらに抵抗発熱素子を設けたことを特徴とする請求項1または請求項2に記載の回路保護素子。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012245144A JP5807969B2 (ja) | 2012-11-07 | 2012-11-07 | 保護素子用フラックス組成物およびそれを利用した回路保護素子 |
CN201380058080.XA CN104781901B (zh) | 2012-11-07 | 2013-10-18 | 保护元件用助焊剂、保护元件用保险丝元件、以及电路保护元件 |
PCT/JP2013/078359 WO2014073356A1 (ja) | 2012-11-07 | 2013-10-18 | 保護素子用フラックス、保護素子用ヒューズ素子、および回路保護素子 |
KR1020157011242A KR101925669B1 (ko) | 2012-11-07 | 2013-10-18 | 보호 소자용 플럭스, 보호 소자용 퓨즈 소자, 및 회로 보호 소자 |
TW102138395A TWI586472B (zh) | 2012-11-07 | 2013-10-24 | A flux for the protection element, a fuse element for the protection element, and a circuit protection element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012245144A JP5807969B2 (ja) | 2012-11-07 | 2012-11-07 | 保護素子用フラックス組成物およびそれを利用した回路保護素子 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015071288A Division JP6219874B2 (ja) | 2015-03-31 | 2015-03-31 | 保護素子用フラックス組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014091162A JP2014091162A (ja) | 2014-05-19 |
JP5807969B2 true JP5807969B2 (ja) | 2015-11-10 |
Family
ID=50684468
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012245144A Active JP5807969B2 (ja) | 2012-11-07 | 2012-11-07 | 保護素子用フラックス組成物およびそれを利用した回路保護素子 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5807969B2 (ja) |
KR (1) | KR101925669B1 (ja) |
CN (1) | CN104781901B (ja) |
TW (1) | TWI586472B (ja) |
WO (1) | WO2014073356A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6527323B2 (ja) * | 2014-11-11 | 2019-06-05 | デクセリアルズ株式会社 | フラックスシート、フラックス、ヒューズエレメント、ヒューズ素子、保護素子、短絡素子及び切替素子 |
KR101684083B1 (ko) * | 2015-03-31 | 2016-12-07 | 울산대학교 산학협력단 | 과전류 보호용 마이크로 퓨즈 및 그 제조 방법 |
JP6534122B2 (ja) * | 2015-12-28 | 2019-06-26 | パナソニックIpマネジメント株式会社 | 樹脂フラックスはんだペースト及び実装構造体 |
TWI597754B (zh) | 2016-05-20 | 2017-09-01 | 聚鼎科技股份有限公司 | 保護元件及其電路保護裝置 |
US10181715B2 (en) | 2016-10-05 | 2019-01-15 | Polytronics Technology Corp. | Protection device and circuit protection apparatus containing the same |
CN108274160A (zh) * | 2018-03-01 | 2018-07-13 | 合肥安力电力工程有限公司 | 一种用于电子产品生产的助焊剂及其制备方法 |
CN110549036A (zh) * | 2018-06-03 | 2019-12-10 | 湖北鹏林新材料科技有限公司 | 一种有机助焊剂及其制备方法 |
JP7349954B2 (ja) * | 2020-04-13 | 2023-09-25 | ショット日本株式会社 | 保護素子 |
EP3926647A3 (en) * | 2020-06-15 | 2022-03-16 | Littelfuse, Inc. | A method for thin-film coating packaging of device having meltable and wetting links |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59223199A (ja) * | 1983-06-02 | 1984-12-14 | Nippon Steel Corp | 潜弧溶接用溶融型フラツクス |
JPH02177210A (ja) * | 1988-12-28 | 1990-07-10 | Fujikura Ltd | 回路基板用半田ペースト |
JP2750910B2 (ja) * | 1989-07-25 | 1998-05-18 | 内橋エステック株式会社 | 合金型温度ヒューズ |
JPH05169296A (ja) * | 1991-12-20 | 1993-07-09 | Nippon Steel Corp | 低水素系被覆アーク溶接棒 |
CN1050928C (zh) * | 1997-11-18 | 2000-03-29 | 四川仪表六厂 | 一种温度保险装置 |
JP2001243863A (ja) * | 2000-02-25 | 2001-09-07 | Uchihashi Estec Co Ltd | フラックス付きヒュ−ズ |
JP2004265617A (ja) * | 2003-02-05 | 2004-09-24 | Sony Chem Corp | 保護素子 |
JP2004265618A (ja) * | 2003-02-05 | 2004-09-24 | Sony Chem Corp | 保護素子 |
JP5301298B2 (ja) * | 2009-01-21 | 2013-09-25 | デクセリアルズ株式会社 | 保護素子 |
JP5305523B2 (ja) * | 2009-07-31 | 2013-10-02 | エヌイーシー ショット コンポーネンツ株式会社 | 保護素子 |
CN101764002B (zh) * | 2009-12-25 | 2014-01-01 | 上海神沃电子有限公司 | 一种助熔剂及其制备方法与应用 |
CN101944463B (zh) * | 2010-08-31 | 2012-11-28 | 广东风华高新科技股份有限公司 | 一种薄膜片式保险丝及其制备方法 |
-
2012
- 2012-11-07 JP JP2012245144A patent/JP5807969B2/ja active Active
-
2013
- 2013-10-18 CN CN201380058080.XA patent/CN104781901B/zh active Active
- 2013-10-18 WO PCT/JP2013/078359 patent/WO2014073356A1/ja active Application Filing
- 2013-10-18 KR KR1020157011242A patent/KR101925669B1/ko active IP Right Grant
- 2013-10-24 TW TW102138395A patent/TWI586472B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN104781901A (zh) | 2015-07-15 |
KR20150082254A (ko) | 2015-07-15 |
TWI586472B (zh) | 2017-06-11 |
KR101925669B1 (ko) | 2018-12-05 |
WO2014073356A1 (ja) | 2014-05-15 |
CN104781901B (zh) | 2018-02-23 |
JP2014091162A (ja) | 2014-05-19 |
TW201427790A (zh) | 2014-07-16 |
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