JP5789882B2 - Manufacturing method of cylindrical current fuse - Google Patents

Manufacturing method of cylindrical current fuse Download PDF

Info

Publication number
JP5789882B2
JP5789882B2 JP2011123869A JP2011123869A JP5789882B2 JP 5789882 B2 JP5789882 B2 JP 5789882B2 JP 2011123869 A JP2011123869 A JP 2011123869A JP 2011123869 A JP2011123869 A JP 2011123869A JP 5789882 B2 JP5789882 B2 JP 5789882B2
Authority
JP
Japan
Prior art keywords
wire
solder
tension
ceramic cylinder
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011123869A
Other languages
Japanese (ja)
Other versions
JP2012252846A (en
Inventor
一成 根橋
一成 根橋
晃之 豊住
晃之 豊住
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koa Corp
Original Assignee
Koa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koa Corp filed Critical Koa Corp
Priority to JP2011123869A priority Critical patent/JP5789882B2/en
Priority to CN201210176052.5A priority patent/CN102810433B/en
Publication of JP2012252846A publication Critical patent/JP2012252846A/en
Application granted granted Critical
Publication of JP5789882B2 publication Critical patent/JP5789882B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Fuses (AREA)

Description

本発明は、電子機器等の基板に表面実装して用いるのに好適な筒形電流ヒューズの製造方法に関する。   The present invention relates to a method for manufacturing a cylindrical current fuse suitable for surface mounting on a substrate of an electronic device or the like.

プリント基板等へ表面実装が可能な小型電流ヒューズは、従来から様々な形式のものが提案されている。例えば、特許文献１には、内部に貫通孔を設けた筒形のセラミックスからなるケース本体に可溶体ワイヤを張架し、金属製のキャップを嵌着させた後で加熱しワイヤを固定する方法で製造する小型電流ヒューズが開示されている。   Various types of small current fuses that can be surface-mounted on a printed circuit board have been proposed. For example, Patent Document 1 discloses a method in which a fusible wire is stretched around a case main body made of a cylindrical ceramic with a through-hole provided therein, a metal cap is fitted, and then heated to fix the wire. A small current fuse manufactured by is disclosed.

しかしながら、このヒューズでは、可溶体ワイヤを張架するときにワイヤ端部を外に引き出して、キャップを嵌着し、加熱してワイヤを接続固定してからワイヤを切断する方式が採用されている。このため、セラミックス筒体にキャップ電極を嵌着する場合に、可溶体ワイヤとキャップの摩擦力で可溶体ワイヤに過大な張力（嵌着による張力）をかけてしまう場合がある。また、可溶体ワイヤに力を掛け過ぎないようワイヤを弛ませて張ると、キャップ電極嵌着時の摩擦でワイヤが移動する量が一定しないために、ワイヤの弛みがばらつくという問題がある。ワイヤが弛むとワイヤ長さが安定しないばかりか、ワイヤがセラミックス筒体の側面に付着することで溶断特性が安定しない不具合がある。さらに、セラミックスケースに可溶体ワイヤを収める溝を加工する必要があり、構造が複雑となるという問題がある。   However, this fuse employs a system in which when a fusible wire is stretched, the wire end is pulled out, a cap is fitted, the wire is connected and fixed by heating, and then the wire is cut. . For this reason, when a cap electrode is fitted to the ceramic cylinder, an excessive tension (tension by fitting) may be applied to the fusible wire due to the frictional force between the fusible wire and the cap. Further, if the wire is loosened and stretched so as not to apply too much force to the fusible wire, the amount of movement of the wire due to friction when the cap electrode is fitted is not constant, and there is a problem that the looseness of the wire varies. When the wire is loosened, the wire length is not stable, and the fusing property is not stable because the wire adheres to the side surface of the ceramic cylinder. Furthermore, it is necessary to process a groove for accommodating the soluble wire in the ceramic case, which causes a problem that the structure becomes complicated.

特許文献２には、ハンダ付けまたはスポット溶接等で、外側キャップ嵌合前にワイヤを仮固定する方法が開示されている（図１，図２）。しかし、ハンダ付けでのワイヤ仮固定は、ワイヤを曲げてワイヤの剛性で保持するだけであり、不安定である上、ワイヤ線は太く剛性のある材料に限定される。また、スポット溶接でワイヤを片側ずつ仮固定する方法（図５）は、ワイヤを溶接するために内側キャップを予め接着剤で接着することが必要であり、キャップが２重になるためにコストが掛かるうえに、ワイヤ張架、ワイヤ仮固定、ワイヤ切断が複雑で多段階となるために製造工程が簡便な方法とはいえない。また、内キャップの角でワイヤが傷つく恐れがあり、ワイヤに傷を付けないよう仮固定して弛み無く張る課題の解決方法については示唆していない。   Patent Document 2 discloses a method of temporarily fixing a wire before fitting an outer cap by soldering or spot welding (FIGS. 1 and 2). However, wire temporary fixing by soldering only bends the wire and holds it with the rigidity of the wire, and is unstable, and the wire wire is limited to a thick and rigid material. In addition, the method of temporarily fixing the wires one side at a time by spot welding (FIG. 5) requires that the inner cap be bonded with an adhesive in advance in order to weld the wires, and the cost is increased because the cap is doubled In addition, since the wire stretching, wire temporary fixing, and wire cutting are complicated and multistage, it cannot be said that the manufacturing process is a simple method. Moreover, there is a possibility that the wire may be damaged at the corner of the inner cap, and there is no suggestion of a solution to the problem of temporarily fixing the wire so as not to damage the wire and stretching it without slack.

特開平６−３４２６２３号公報JP-A-6-342623 特許第３１４６０１２号公報Japanese Patent No. 3146012

本発明は、上述の事情に基づいてなされたもので、セラミックス筒体の貫通孔に斜めに弛み無く傷を付けないように可溶体ワイヤを張り、該ワイヤの両端部を前記筒体両端面に仮止め固定して切断する工程を連続的に行う、筒形電流ヒューズの製造方法を提供することを目的とする。   The present invention has been made based on the above-mentioned circumstances, and a fusible body wire is stretched so as not to be slanted and slackened in the through hole of the ceramic cylinder body, and both ends of the wire are attached to both end faces of the cylinder body. It is an object of the present invention to provide a method for manufacturing a cylindrical current fuse, in which a process of temporarily fixing and cutting is continuously performed.

本発明の筒形電流ヒューズの製造方法は、貫通孔を備えたセラミックス筒体の前記貫通孔に連通する開口部にハンダを被着するハンダ形成工程と、セラミックス筒体の貫通孔に、可溶体であるワイヤを通すワイヤ通線工程と、セラミックス筒体に通したワイヤの端部をチャックで掴み、所定の張力を加えた状態でワイヤを貫通孔内に斜めに張るワイヤ張架工程と、ワイヤを、セラミックス筒体の開口部へ前記ハンダを介して固定し、切断するワイヤ接合工程と、を含み、ワイヤ接合工程は、ワイヤをセラミックス筒体の開口部に当接させ、ワイヤの当該当接部分を加熱して、セラミックス筒体の開口部にハンダを介して固定するとともに張力を印加してワイヤを破断することを特徴とする。 The method for manufacturing a cylindrical current fuse of the present invention includes a solder forming step of attaching solder to an opening communicating with the through hole of a ceramic cylinder having a through hole, and a fusible body in the through hole of the ceramic cylinder. A wire passing step for passing the wire, a wire stretching step for gripping the end of the wire passed through the ceramic cylinder with a chuck, and obliquely stretching the wire in the through hole in a state where a predetermined tension is applied, and a wire A wire bonding step of fixing the wire to the opening of the ceramic cylinder through the solder and cutting the wire, the wire bonding step bringing the wire into contact with the opening of the ceramic tube, and the contact of the wire The portion is heated and fixed to the opening of the ceramic cylinder through solder, and the tension is applied to break the wire .

ワイヤの固定は、ワイヤの一次側（先の）端面固定では、ワイヤに張架張力を印加しながらワイヤの端面への固定部を加熱チップが直接接触してハンダに固定してワイヤを破断する。ワイヤの二次側（後の）端面固定では、加熱チップ先端がワイヤに直接触れないよう加熱して、二次側端面で張架張力を印加しながらワイヤの端面固定部をハンダに固定して破断する。二次側端面でのワイヤ切断は、セラミックス筒体端面沿面から筒体の方向へ角度を持つ方向にワイヤに張力を印加しながらワイヤを破断させる。   The wire is fixed at the primary (front) end surface of the wire by applying tension tension to the wire, and the fixing portion to the end surface of the wire is directly brought into contact with the heating chip and fixed to the solder to break the wire. . When fixing the secondary side (rear) end surface of the wire, heat the tip of the heating tip so that it does not touch the wire directly, and fix the end surface fixing part of the wire to the solder while applying tension on the secondary side end surface. Break. The wire cutting at the secondary side end face breaks the wire while applying tension to the wire in a direction having an angle from the creeping end face of the ceramic cylinder to the direction of the cylinder.

セラミックス筒体端面にハトメ状のハンダを形成し、可溶体ワイヤを斜めに弛みなく張架し切断した段階の断面図である。It is sectional drawing of the step which formed eyelet-like solder on the ceramic cylinder end surface, and stretched and cut | disconnected the soluble body wire diagonally without slack. セラミックス筒体の貫通孔縁部にハトメ状のハンダを形成した段階の断面図である。It is sectional drawing of the step which formed eyelet-like solder in the through-hole edge part of a ceramic cylinder. セラミックス筒体の貫通孔に、ワイヤガイドに覆われた可溶体ワイヤを挿入した段階の断面図である。It is sectional drawing of the step which inserted the soluble body wire covered with the wire guide in the through-hole of the ceramic cylinder. 可溶体ワイヤの一端をチャックで一時保持し、ワイヤガイドを引き抜く段階の断面図である。It is sectional drawing of the step which hold | maintains one end of a soluble body wire temporarily with a chuck | zipper, and pulls out a wire guide. 可溶体ワイヤをセラミックス筒体内部に通線し、ワイヤの両端をチャックで保持し、回転ジグの把持部でセラミックス筒体を保持した段階の断面図である。FIG. 5 is a cross-sectional view of a stage in which a fusible wire is passed through a ceramic cylinder, both ends of the wire are held by a chuck, and the ceramic cylinder is held by a gripping portion of a rotary jig. セラミックス筒体を回転ジグにより９０度回転させて、ワイヤをセラミックス筒体内で斜めに張った段階の断面図である。It is sectional drawing of the step which rotated the ceramic cylinder 90 degree | times with the rotation jig, and tensioned the wire diagonally in the ceramic cylinder. セラミックス筒体の両端面にヒーターチップを押し当てて支持した段階の断面図である。It is sectional drawing of the step which pressed and supported the heater chip | tip on the both end surfaces of the ceramic cylinder. 一次側端面におけるワイヤをハンダに固定する段階の断面図である。It is sectional drawing of the step of fixing the wire in a primary side end surface to solder. 一次側端面におけるワイヤをハンダに固定して切断する段階の断面図である。It is sectional drawing of the step of fixing and cutting the wire in a primary side end surface to solder. 二次側端面におけるワイヤをハンダに固定する段階の断面図である。It is sectional drawing of the step of fixing the wire in a secondary side end surface to solder. 二次側端面におけるワイヤをハンダに固定して切断する段階の断面図である。It is sectional drawing of the step which fixes and cut | disconnects the wire in a secondary side end surface to solder.

以下、本発明の実施形態について、図１乃至図６Ｂを参照して説明する。なお、各図中、同一または相当する部材または要素には、同一の符号を付して説明する。   Embodiments of the present invention will be described below with reference to FIGS. 1 to 6B. In addition, in each figure, the same code | symbol is attached | subjected and demonstrated to the same or equivalent member or element.

図１は本発明の筒形電流ヒューズにおいて、ワイヤを筒体の端部に仮固定した状態を示す。このヒューズは内部に貫通孔１２を備えたセラミックスの筒体１１と、該筒体の両端に後の工程で嵌着される、電極キャップ１８（破線にて示す）と、該筒体の内部貫通孔１２に斜めに弛みなく張架した可溶体ワイヤ１６と、を備えた筒形電流ヒューズである。筒体１１の端面から貫通孔内周面に亘って形成されたハトメ状のハンダ１５を備え、ワイヤ１６をハンダ１５の筒体の端面側に仮固定し、キャップ１８を嵌着後、加熱してワイヤ１６をキャップ１８の内面にハンダで接続固定する。   FIG. 1 shows a state in which a wire is temporarily fixed to an end of a cylindrical body in the cylindrical current fuse of the present invention. This fuse has a ceramic cylinder 11 provided with a through-hole 12 therein, an electrode cap 18 (shown by a broken line) that is fitted to both ends of the cylinder in a later step, and an internal penetration of the cylinder. It is a cylindrical current fuse provided with a fusible wire 16 stretched diagonally in the hole 12 without slack. A grommet-like solder 15 formed from the end surface of the cylindrical body 11 to the inner peripheral surface of the through hole is provided, the wire 16 is temporarily fixed to the end surface side of the cylindrical body of the solder 15, and the cap 18 is fitted and then heated. Then, the wire 16 is connected and fixed to the inner surface of the cap 18 with solder.

ワイヤ１６の端部は筒体１１の外周部まで及んでいない。すなわち、ワイヤ１６の端部は筒体１１の端面上に設けたハンダ１５に固定され、その部分で切断されている。ワイヤ１６の端部は、後のキャップ１８の接続固定時に、貫通孔１２の縁部を覆うハンダ１５とキャップ１８内に装填したハンダとが溶融し、一体となったハンダで貫通孔１２の両端部が閉塞され、ワイヤ１６の端部がキャップ１８の内面に接続固定される。なお、貫通孔１２の縁部を覆うハンダ１５のみで、ワイヤ１６の端部をキャップ１８の内面に接続固定するようにしてもよい。   The end of the wire 16 does not reach the outer periphery of the cylinder 11. That is, the end portion of the wire 16 is fixed to the solder 15 provided on the end surface of the cylindrical body 11 and is cut at that portion. At the end of the wire 16, when the cap 18 is connected and fixed later, the solder 15 covering the edge of the through hole 12 and the solder loaded in the cap 18 are melted, and both ends of the through hole 12 are integrated with the integrated solder. The end of the wire 16 is connected and fixed to the inner surface of the cap 18. Note that the end of the wire 16 may be connected and fixed to the inner surface of the cap 18 with only the solder 15 covering the edge of the through hole 12.

図２乃至図６Ｂは本発明の一実施例の筒形電流ヒューズの製造方法を示す。まず、内部に貫通孔１２を備えた外形が略角柱状のセラミックス筒体１１を準備する。そして、筒体１１を立てた状態で、筒体１１の端面上に円板状のハンダ板を配置する。ハンダ板は鉛フリーで硬度のあるＳｎ−Ｃｕ４〜１５％のハンダを用いて形成することが好ましい。   2 to 6B show a method of manufacturing a cylindrical current fuse according to an embodiment of the present invention. First, a ceramic cylinder 11 having a substantially prismatic outer shape provided with a through hole 12 therein is prepared. And in the state which stood the cylinder 11, the disk-shaped solder board is arrange | positioned on the end surface of the cylinder 11. FIG. The solder plate is preferably formed by using lead-free and hard Sn—Cu 4-15% solder.

そして、ハンダ板上から貫通孔１２にジグ（ポンチ）で打ち抜く。これにより、ハンダ板が変形し、図２に示すように、セラミックス筒体１１の端面の貫通孔１２の縁部（角部）にリング状のハンダ部分１５ａと、該ハンダ部分１５ａから貫通孔の内周面に延びたハンダ部分１５ｂからなる、ハトメ状のハンダ１５が形成される。ハトメ状のハンダ１５では、筒体１１の端面から内周面に亘って滑らかな曲面Ｒが形成される。図示のように、ハトメ状のハンダ１５を筒体１１の両端面に形成する。   Then, a punch (punching) is punched from the solder plate into the through hole 12. As a result, the solder plate is deformed, and as shown in FIG. 2, a ring-shaped solder portion 15a is formed on the edge portion (corner portion) of the through hole 12 on the end surface of the ceramic cylinder 11, and the through hole is formed from the solder portion 15a. Eyelet-like solder 15 is formed, which is composed of a solder portion 15b extending on the inner peripheral surface. In the eyelet-shaped solder 15, a smooth curved surface R is formed from the end surface of the cylindrical body 11 to the inner peripheral surface. As shown in the figure, eyelet-like solder 15 is formed on both end faces of the cylinder 11.

次に、図３Ａに示すように、ワイヤ通線ステージにおいて、ハンダ１５を形成したセラミックス筒体１１内部に、ワイヤガイド２１に覆われた可溶体ワイヤ１６を挿入する。ワイヤ１６が細いため、剛性を有するワイヤガイド２１で支持することで、良好な作業性が得られる。そして、図３Ｂに示すように、ワイヤ一時保持チャック２５でワイヤ１６の先端部を掴んで保持した後で、ワイヤガイド２１を引き抜いてワイヤ１６をセラミックス筒体内部に通線する。そして、反対側をワイヤ一時保持チャック２６で掴んで保持した後図示しない手段でワイヤを切断する。なお、ワイヤガイド２１は内部にワイヤを通した状態で、図中左側の図示しない部分に移動する。   Next, as shown in FIG. 3A, the fusible wire 16 covered with the wire guide 21 is inserted into the ceramic cylinder 11 in which the solder 15 is formed in the wire passing stage. Since the wire 16 is thin, good workability can be obtained by supporting it with the wire guide 21 having rigidity. Then, as shown in FIG. 3B, after the wire 16 is held and held by the temporary wire holding chuck 25, the wire guide 21 is pulled out to pass the wire 16 into the ceramic cylinder. Then, after the opposite side is held and held by the wire temporary holding chuck 26, the wire is cut by means not shown. Note that the wire guide 21 moves to a portion (not shown) on the left side in the drawing in a state where the wire is passed through the inside.

次に、図４Ａに示すように、ワイヤ１６が通線され両側を一時保持されたセラミックス筒体１１は張力を維持したままワイヤ張架ステージへ移され、ワイヤ１６をワイヤ保持チャック２２，２３で保持する。セラミックス筒体１１は回転ジグ２４の把持部２４ａ，２４ｂで保持される。把持部２４ａ，２４ｂは円盤状の回転ジグ２４に固定され、回転ジグ２４は図中破線の円で示す方向に回転可能となっている。   Next, as shown in FIG. 4A, the ceramic cylinder 11 through which the wire 16 is passed and both sides are temporarily held is moved to the wire stretching stage while maintaining the tension, and the wire 16 is moved by the wire holding chucks 22 and 23. Hold. The ceramic cylinder 11 is held by the gripping portions 24 a and 24 b of the rotary jig 24. The gripping portions 24a and 24b are fixed to a disk-shaped rotating jig 24, and the rotating jig 24 is rotatable in a direction indicated by a broken-line circle in the drawing.

この時セラミックス筒体１１とワイヤ１６は平行に配置されており、お互いに接触しない位置関係にある。またワイヤ保持チャック２２，２３は図中の矢印方向にスライド可能となるような可動軸を持って配置されており、必要な範囲内で自由に移動ができる。また、ワイヤ保持チャック２２，２３はバネ等の弾性部材により外側方向へ張架張力Ｆを持たせてあるため、セラミック筒体に通した可溶体ワイヤ１６はまっすぐに張られている。これで、セラミックス筒体１１の内部にワイヤ１６の通線が完了する。なお、張架張力Ｆはワイヤ１６をまっすぐに張ることができる最小限の力で充分である。   At this time, the ceramic cylinder 11 and the wire 16 are arranged in parallel, and are in a positional relationship not in contact with each other. The wire holding chucks 22 and 23 are arranged with a movable shaft that can slide in the direction of the arrow in the figure, and can be freely moved within a necessary range. Further, since the wire holding chucks 22 and 23 are provided with a tension tension F in the outward direction by an elastic member such as a spring, the fusible wire 16 passed through the ceramic cylinder is stretched straight. This completes the wire 16 through the ceramic cylinder 11. In addition, the tension | tensile_strength tension F is enough with the minimum force which can stretch | stretch the wire 16 straightly.

次に、図４Ｂに示すように、ワイヤ１６の両端部をワイヤ保持チャック２２，２３で挟んだまま、セラミックス筒体１１を回転ジグ２４により９０度（上面から見て反時計回り）回転させて、ワイヤ１６をセラミックス筒体１１内で斜めに張る。この時、ワイヤ１６は両端を張架張力Ｆで引かれているためセラミックス筒体１１内に弛み無く張られる。ワイヤ保持チャック２２，２３はワイヤ１６が張架張力Ｆで引かれるのに合わせて移動し、ワイヤに張架張力Ｆ以上の力が掛かるのを防ぐ。また、セラミックス筒体１１の内縁部にはハトメ状のハンダ１５が形成されているのでセラミックス筒体内縁部と可溶体ワイヤ１６が直接擦れないために傷を付けることがない。   Next, as shown in FIG. 4B, the ceramic cylinder 11 is rotated 90 degrees (counterclockwise as viewed from above) by the rotating jig 24 while the both ends of the wire 16 are sandwiched between the wire holding chucks 22 and 23. The wire 16 is slanted in the ceramic cylinder 11. At this time, since both ends of the wire 16 are pulled with the tension tension F, the wire 16 is stretched in the ceramic cylinder 11 without slack. The wire holding chucks 22 and 23 move as the wire 16 is pulled by the tension tension F, and prevents a force exceeding the tension tension F from being applied to the wire. In addition, since the eyelet-like solder 15 is formed on the inner edge of the ceramic cylinder 11, the ceramic cylinder inner edge and the fusible wire 16 are not directly rubbed so that they are not damaged.

次に、図４Ｃに示すように、セラミックス筒体１１の一次側（図中の下側）端面にヒーターチップ１７を、二次側（図中の上側）端面にヒーターチップ２７を押し当てて固定する。この時、１番目にワイヤ固定する一次側端面ではヒーターチップ１７を筒体１１の端面全体にかかるように押し当て、２番目にワイヤ固定する二次側端面ではヒーターチップ２７をワイヤ１６の固定部分１６ａにかからないように偏心して押し当てる。   Next, as shown in FIG. 4C, the heater chip 17 is pressed against the primary side (lower side in the figure) end surface of the ceramic cylinder 11 and the heater chip 27 is fixed to the secondary side (upper side in the figure) end surface. To do. At this time, the heater chip 17 is pressed so as to cover the entire end surface of the cylindrical body 11 at the primary end surface where the wire is first fixed, and the heater chip 27 is fixed to the wire 16 at the secondary end surface where the second wire is fixed. Eccentrically press so that it does not cover 16a.

図５Ａおよび図５Ｂは一次側端面におけるワイヤのハンダへの固定と切断の状態を示す。ヒーターチップ１７に通電することで、一次側端面のワイヤ固定部分１６ａを加熱すると、ワイヤ固定部分が軟化すると共にハンダ１５が溶融する。そして、ワイヤ保持チャック２２，２３はワイヤに張架張力Ｆが掛かるように自由に動く可動軸と、ワイヤを引きちぎるために張架張力Ｆ以上に大きな力Ｆａの掛かる可動軸の両方を持つ。ここで、大きな力Ｆａを加えることで、ワイヤが破断し、ヒーターチップ１７の通電を停止することで、ハンダ１５が固化し、ワイヤ１６の端部が一次側端面のハンダ１５に固定される。すなわち、ワイヤの一次側の接合は、ワイヤの両側のチャック２２，２３で張力を印加しながら、ヒーターチップ１７の先端がワイヤに直接触れ、ワイヤの一次側をセラミックス筒体の開口部にハンダ１５を介して固定するとともに、ワイヤの一次側チャック２３から大きな力Ｆａを加えることでワイヤが破断することで行われる。   5A and 5B show a state of fixing and cutting the wire to the solder on the primary side end face. When the wire fixing portion 16a on the primary side end surface is heated by energizing the heater chip 17, the wire fixing portion is softened and the solder 15 is melted. The wire holding chucks 22 and 23 have both a movable shaft that freely moves so that the tension tension F is applied to the wire and a movable shaft that applies a force Fa greater than the tension tension F to tear the wire. Here, by applying a large force Fa, the wire breaks, and when the heater chip 17 is de-energized, the solder 15 is solidified, and the end of the wire 16 is fixed to the solder 15 on the primary side end face. That is, in joining the primary side of the wire, while applying tension with the chucks 22 and 23 on both sides of the wire, the tip of the heater chip 17 directly touches the wire, and the primary side of the wire is soldered to the opening of the ceramic cylinder. The wire is broken by applying a large force Fa from the primary side chuck 23 of the wire.

図６Ａおよび図６Ｂは二次側端面におけるワイヤのハンダへの固定と切断の状態を示す。一次側ワイヤ端部の固定が終了し、溶融したハンダが硬化するのを待って、二次側ヒーターチップ２７に通電して、ワイヤ保持チャック２２を角度Ａで筒体側方向に引き、ワイヤ固定部分１６ａをハンダ１５に固定し、その先端で切断する。すなわち、ワイヤの二次側の接合は、ヒーターチップ２７の先端がワイヤ１６に直接触れないようにハンダ１５を加熱し、且つ、ワイヤの二次側チャック２２で張力を印加しながら、ワイヤの二次側をセラミックス筒体の他の開口部にハンダ１５を介して固定するとともに、ワイヤの二次側チャック２２から大きな力Ｆａを加えることでワイヤが破断することで行われる。   6A and 6B show the state of fixing and cutting the wire to the solder on the secondary side end face. After the fixing of the end of the primary side wire is completed and the melted solder is cured, the secondary side heater chip 27 is energized, and the wire holding chuck 22 is pulled in the cylinder side direction at an angle A to thereby fix the wire fixing portion. 16a is fixed to the solder 15 and cut at its tip. That is, the bonding of the secondary side of the wire is performed by heating the solder 15 so that the tip of the heater chip 27 does not directly touch the wire 16 and applying a tension with the secondary side chuck 22 of the wire. The secondary side is fixed to the other opening of the ceramic cylinder through the solder 15 and the wire is broken by applying a large force Fa from the secondary side chuck 22 of the wire.

ヒーターチップ２７はセラミックス筒体１１の円筒中心よりやや偏心して配置されている。ヒーターチップ２７の通電の熱でハンダが溶融した場合でも、ヒーターチップ２７はワイヤを押さえ付けない。そのため、通電加熱でハンダが溶融した時にワイヤがハンダに食い込むと同時に張架張力Ｆで外側に引かれ張架張力Ｆを維持したままセラミックス筒体内部に斜めに弛みなく張架される。なお、ハンダ１５はヒーターチップ２７で押さえる力を加えなくても、溶融した時の表面張力でセラミックス筒体内側縁部に集まる。そして、仮にワイヤの斜め張架の際に傷が生じたとしても溶融して固化したハンダに埋め込まれる。   The heater chip 27 is arranged slightly eccentric from the cylindrical center of the ceramic cylinder 11. Even when the solder is melted by the heat applied by the heater chip 27, the heater chip 27 does not press the wire. Therefore, when the solder is melted by the energization heating, the wire bites into the solder, and at the same time, is pulled outward by the tension tension F and is stretched diagonally and slackly inside the ceramic cylinder while maintaining the tension tension F. Note that the solder 15 gathers at the inner edge of the ceramic cylinder body by the surface tension when melted without applying the force pressed by the heater chip 27. And even if a flaw occurs during the oblique stretching of the wire, it is buried in the solder that has melted and solidified.

二次側でワイヤを破断（引張り切断）する時に、ワイヤ１６はセラミックス筒体端面沿面よりも筒体側方向へ角度Ａを持って破断張力Ｆａで引っ張られる。この角度Ａは、特に好ましくは４０度〜５０度である。これにより、ワイヤ１６をハトメ状のハンダ１５部分または、セラミックス筒体１１の外周端面で適切に引きちぎることができる。二次側では、張力Ｆの可動軸方向と張力Ｆａの可動軸方向が４５度傾けて設定されているため、セラミックス筒体１１を回転ジグ２４を用いて回転させた時に、セラミックス筒体１１の端面とチャック２２との間で付与された角度Ａを維持したまま張力Ｆａを印加することができる。   When the wire is broken (tensile cut) on the secondary side, the wire 16 is pulled with a breaking tension Fa at an angle A in the cylinder side direction from the creeping surface of the ceramic cylinder end surface. This angle A is particularly preferably 40 to 50 degrees. Thereby, the wire 16 can be appropriately torn off at the part of the eyelet-like solder 15 or the outer peripheral end face of the ceramic cylinder 11. On the secondary side, since the movable axis direction of the tension F and the movable axis direction of the tension Fa are set to be inclined by 45 degrees, when the ceramic cylinder 11 is rotated using the rotary jig 24, the ceramic cylinder 11 The tension Fa can be applied while maintaining the angle A applied between the end face and the chuck 22.

一次側固定時のワイヤ破断は、ヒーターチップ１７により直接押さえられた個所においてワイヤ１６が切断するため、ワイヤ１６の引っ張り方向に左右されるものではないが、セラミックス筒体の端面の沿面に対して二次側と同様に角度をつけて引っ張ることで、より確実にセラミックス筒体の端面において破断させることができる。また、一次側では、張力Ｆの可動軸方向と張力Ｆａの可動軸方向は同じである。それにより、角度Ａを付与した状態で張力Ｆａを印加しワイヤ保持チャック２２を引くと、角度Ａが小さくなる方向に変化するが、角度Ａの変化は小さく、前記の理由で問題は無い。これにより機構をより量産に適したものとすることができるメリットがある。なお、ワイヤ１６の切断の方法としては、上述の張力Ｆａにより切断する方法（破断）の他、刃物等の切断器具を用いた切断がある。   The wire breakage at the time of fixing on the primary side is not affected by the pulling direction of the wire 16 because the wire 16 is cut at a place directly pressed by the heater chip 17, but is not affected by the creeping direction of the end surface of the ceramic cylinder. By pulling at an angle similarly to the secondary side, the end surface of the ceramic cylinder can be more reliably broken. On the primary side, the movable axis direction of the tension F and the movable axis direction of the tension Fa are the same. Accordingly, when the tension Fa is applied with the angle A applied and the wire holding chuck 22 is pulled, the angle A changes in a decreasing direction. However, the change in the angle A is small and there is no problem for the above reason. As a result, there is an advantage that the mechanism can be made more suitable for mass production. In addition, as a method of cutting the wire 16, there is a method of cutting using a cutting tool such as a blade in addition to a method of cutting (breaking) with the above-described tension Fa.

次に、ワイヤ１６が内部に張架されたセラミックス筒体１１の両端には、ハンダを予め装着した金属製キャップ１８が嵌着される（図１参照）。この時、ワイヤ端部がセラミックス筒体の外周部分に出ない構造であるため、キャップ嵌着時にはワイヤに嵌着による張力が掛からない。そして、嵌着したキャップの外側から短時間加熱することにより、ワイヤを固定したハトメ状のハンダとキャップ内に装着したハンダとが溶融し、一体化してワイヤとキャップが接続固定される。これにて、本発明の電流ヒューズが完成する。   Next, metal caps 18 fitted with solder in advance are fitted to both ends of the ceramic cylinder 11 with the wires 16 stretched inside (see FIG. 1). At this time, since the end portion of the wire does not protrude from the outer peripheral portion of the ceramic cylinder, no tension is applied to the wire when the cap is fitted. Then, by heating for a short time from the outside of the fitted cap, the eyelet-like solder to which the wire is fixed and the solder attached in the cap are melted and integrated to fix the wire and the cap. This completes the current fuse of the present invention.

これにより、従来はワイヤを筒体の外周面に引き出し、外周面に設けた溝等に収容していたが、そのような複雑な構造が不要となる。また、セラミックス筒体端面のハンダに固定し、ハンダで貫通孔を閉塞するので、内部に有機物が一切存在しない。従って、ワイヤに張力を与えた状態で、斜めに弛みなく張ることができると共に、従来の筒体外周面に設けた溝等が不要となり、構造を簡素化すると共に、有機物を内部に含まない筒形電流ヒューズが得られる。   As a result, the wire is conventionally drawn out to the outer peripheral surface of the cylinder and accommodated in a groove or the like provided on the outer peripheral surface, but such a complicated structure is not necessary. Moreover, since it fixes to the solder of the ceramic cylinder end surface, and a through-hole is obstruct | occluded with solder, there is no organic substance inside. Therefore, it is possible to stretch the wire without slacking in a state where tension is applied to the wire, and it is unnecessary to use a groove or the like provided on the outer peripheral surface of the conventional cylinder, simplifying the structure, and not including an organic substance inside. A shaped current fuse is obtained.

上記製造工程は生産自動化を前提としたものである。まず、ハトメ状のハンダ１５の形成はセラミックス筒体１１の端面にハンダ円板を配置し、ジグ（ポンチ）で抜くので、自動化が容易である。次に、セラミックス筒体に可溶体ワイヤを通すワイヤ通線工程は、ワイヤガイド２１に覆われた可溶体ワイヤ１６をセラミックス筒体内部に挿入し、ワイヤガイド２１のみを引き抜き、ワイヤ両端をチャック２５，２６で一時保持することで行える。次に、ワイヤをセラミックス筒体内に斜めに張るワイヤ張架工程は、回転ジグ２４の把持部２４ａ，２４ｂでセラミックス筒体１１を保持し、回転ジグ２４を９０度回転させることで一動作で行える。   The above manufacturing process is premised on production automation. First, the formation of the eyelet-like solder 15 is easy to automate because a solder disk is disposed on the end face of the ceramic cylinder 11 and is removed by a jig (punch). Next, in the wire passing step of passing the fusible wire through the ceramic cylinder, the fusible wire 16 covered with the wire guide 21 is inserted into the ceramic cylinder, only the wire guide 21 is pulled out, and both ends of the wire are chucked 25 , 26 for temporary holding. Next, the wire stretching process of slanting the wire into the ceramic cylinder can be performed in one operation by holding the ceramic cylinder 11 with the gripping portions 24a and 24b of the rotary jig 24 and rotating the rotary jig 24 by 90 degrees. .

そして、ワイヤをセラミックス筒体の端部へ固定し切断するワイヤ接合工程は、ワイヤ１６に張架張力Ｆを印加しつつヒーターチップで加熱することで、ワイヤが張力を維持しつつハンダ溶融により弛みなく張った状態で筒体端面のハンダに固定でき、張力Ｆａを印加することで破断によりワイヤを筒体端面で切断できる。従って、上記製造工程によれば、上記ヒューズを高い生産性で量産できる。   In the wire bonding step of fixing and cutting the wire to the end of the ceramic cylinder, the wire 16 is heated by the heater chip while applying the tension tension F to the wire 16, so that the wire is loosened by melting the solder while maintaining the tension. The wire can be cut at the end face of the cylinder by breaking by applying a tension Fa by applying tension T Fa. Therefore, according to the manufacturing process, the fuse can be mass-produced with high productivity.

これまで本発明の一実施形態について説明したが、本発明は上述の実施形態に限定されず、その技術的思想の範囲内において種々異なる形態にて実施されてよいことは言うまでもない。   Although one embodiment of the present invention has been described so far, it is needless to say that the present invention is not limited to the above-described embodiment, and may be implemented in various forms within the scope of the technical idea.

本発明は、表面実装に好適な筒形電流ヒューズの製造に利用可能である。   The present invention can be used for manufacturing a cylindrical current fuse suitable for surface mounting.

Claims (5)

貫通孔を備えたセラミックス筒体の前記貫通孔に連通する開口部にハンダを被着するハンダ形成工程と、
セラミックス筒体の貫通孔に、可溶体であるワイヤを通すワイヤ通線工程と、
セラミックス筒体に通したワイヤの端部をチャックで掴み、所定の張力を加えた状態でワイヤを貫通孔内に斜めに張るワイヤ張架工程と、
ワイヤを、セラミックス筒体の開口部へ前記ハンダを介して固定し、切断するワイヤ接合工程と、を含み、
ワイヤ接合工程は、ワイヤをセラミックス筒体の開口部に当接させ、ワイヤの当該当接部分を加熱して、セラミックス筒体の開口部にハンダを介して固定するとともに張力を印加してワイヤを破断することを特徴とする筒形電流ヒューズの製造方法。 A solder forming step of attaching solder to an opening communicating with the through hole of the ceramic cylindrical body provided with the through hole;
A wire passing step of passing a wire that is a soluble material into the through hole of the ceramic cylinder;
A wire stretching step in which the end of the wire passed through the ceramic cylinder is gripped by a chuck, and the wire is slanted into the through hole in a state where a predetermined tension is applied;
A wire bonding step of fixing the wire to the opening of the ceramic cylinder via the solder and cutting the wire,
In the wire bonding process, the wire is brought into contact with the opening of the ceramic cylinder, the contact portion of the wire is heated , fixed to the opening of the ceramic cylinder via solder, and tension is applied to apply the wire. A method of manufacturing a cylindrical current fuse, characterized by breaking . ワイヤ接合工程は、ワイヤの一次側の接合と、ワイヤの二次側の接合とを含み、
ワイヤの一次側の接合は、ワイヤの両側のチャックで張力を印加しながら、ヒーターチップ先端がワイヤに直接触れ、ワイヤの一次側をセラミックス筒体の開口部にハンダを介して固定するとともに、ワイヤの一次側チャックから張力より大きな力を加えることでワイヤが破断し、
ワイヤの二次側の接合は、ヒーターチップ先端がワイヤに直接触れないようにハンダを加熱し、且つ、ワイヤの二次側チャックで張力を印加しながら、ワイヤの二次側をセラミックス筒体の他の開口部にハンダを介して固定するとともに、ワイヤの二次側チャックから張力より大きな力を加えることでワイヤが破断すること、を特徴とする請求項１に記載の筒形電流ヒューズの製造方法。 The wire bonding process includes bonding of the primary side of the wire and bonding of the secondary side of the wire,
Bonding the primary side of the wire is performed by applying tension with chucks on both sides of the wire while the tip of the heater chip directly touches the wire and fixes the primary side of the wire to the opening of the ceramic cylinder via solder. The wire breaks by applying a force larger than the tension from the primary side chuck,
The secondary side of the wire is joined by heating the solder so that the tip of the heater chip does not directly touch the wire, and applying the tension with the secondary side chuck of the wire while the secondary side of the wire is connected to the ceramic cylinder. 2. The cylindrical current fuse according to claim 1, wherein the wire breaks by being fixed to another opening via solder and applying a force larger than the tension from the secondary chuck of the wire. Method. ワイヤ接合工程におけるワイヤ切断は、セラミックス筒体の端面沿面から筒体の方向へ角度を持つ方向にワイヤに張力を印加しながら破断させることを特徴とする請求項１または２に記載の筒形電流ヒューズの製造方法。   3. The cylindrical current according to claim 1, wherein the wire cutting in the wire joining step is performed by applying a tension to the wire in a direction having an angle from a creeping end surface of the ceramic cylindrical body toward the cylindrical body. Fuse manufacturing method. 前記ワイヤ通線工程は、ワイヤガイドに覆われたワイヤを挿入し、ワイヤ先端部を保持し、次いでワイヤガイドを引き抜き、ワイヤのもう一方の端部を保持してからワイヤを切断することを特徴とする請求項１乃至３のいずれかに記載の筒形電流ヒューズの製造方法。   The wire passing step inserts a wire covered with a wire guide, holds the wire tip, then pulls out the wire guide, holds the other end of the wire, and then cuts the wire A method for manufacturing a cylindrical current fuse according to any one of claims 1 to 3. 前記ワイヤ張架工程は、セラミックス筒体を回動させることでワイヤを斜めに張ることを特徴とする請求項１乃至４のいずれかに記載の筒形電流ヒューズの製造方法。   5. The method of manufacturing a cylindrical current fuse according to claim 1, wherein in the wire stretching step, the wire is slanted by rotating the ceramic cylinder.
JP2011123869A 2011-06-02 2011-06-02 Manufacturing method of cylindrical current fuse Active JP5789882B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011123869A JP5789882B2 (en) 2011-06-02 2011-06-02 Manufacturing method of cylindrical current fuse
CN201210176052.5A CN102810433B (en) 2011-06-02 2012-05-31 The manufacture method of cylindric electric current fuse

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011123869A JP5789882B2 (en) 2011-06-02 2011-06-02 Manufacturing method of cylindrical current fuse

Publications (2)

Publication Number Publication Date
JP2012252846A JP2012252846A (en) 2012-12-20
JP5789882B2 true JP5789882B2 (en) 2015-10-07

Family

ID=47234118

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011123869A Active JP5789882B2 (en) 2011-06-02 2011-06-02 Manufacturing method of cylindrical current fuse

Country Status (2)

Country Link
JP (1) JP5789882B2 (en)
CN (1) CN102810433B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6036288B2 (en) * 2012-12-28 2016-11-30 Koa株式会社 Manufacturing method of small current fuse
CN103903929B (en) * 2014-04-01 2016-08-31 南京萨特科技发展有限公司 A kind of chip-shaped protection element and batch fabrication method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL151209B (en) * 1972-06-22 1976-10-15 Olvis Nv MELTING SAFETY AND METHOD OF MANUFACTURING SUCH MELTING SAFETY.
TW345672B (en) * 1996-08-01 1998-11-21 Bel Fuse Ine Conductive epoxy fuse and method of making
US20060119465A1 (en) * 2004-12-03 2006-06-08 Dietsch G T Fuse with expanding solder
CN201041791Y (en) * 2007-03-30 2008-03-26 李风雷 Device for fuse assembly
CN102290302A (en) * 2011-07-04 2011-12-21 东莞市贝特电子科技有限公司 Fuse used for plug and manufacture method thereof

Also Published As

Publication number Publication date
CN102810433A (en) 2012-12-05
CN102810433B (en) 2016-08-24
JP2012252846A (en) 2012-12-20

Similar Documents

Publication Publication Date Title
JP4080492B2 (en) Bonded body and bonding method
JP5622480B2 (en) Fast blow fuse
JP5740768B2 (en) Manufacturing method of cylindrical current fuse
JP5789882B2 (en) Manufacturing method of cylindrical current fuse
JP2013131735A (en) Bonding method and semiconductor device manufacturing method
JP2011146332A (en) Terminal processing method of electric wire
TWI501368B (en) Apparatus and methods for forming bump
JP6275275B2 (en) Coupling method, combined body, stator of rotating electric machine, and method of manufacturing stator of rotating electric machine
JP2007214185A (en) Lead frame
JP2006059568A (en) Fuse and circuit board
JP2009122042A (en) Method for manufacturing magnetostrictive torque sensor shaft
JP2007035424A (en) Connection method of wire
JP2003059550A (en) Terminal and welding method of terminal and wire
JP2009054950A (en) Bump forming method
JP4036630B2 (en) Fuse and method for manufacturing fuse
JP2009031111A (en) Semiconductor integrated device socket module
JP2014221523A (en) Joining method, and joined body produced thereby
JP2002367497A (en) Thermal fuse and manufacturing method
JP6286176B2 (en) Manufacturing method of fuse fuse
JP6302206B2 (en) Fusible fuse and method for manufacturing the same
JP2009010070A (en) Lead wire connection device for electrode foil for capacitor
JP3068571B2 (en) Thermal-sensitive electric circuit interrupter
JP2010176967A (en) Wire connection terminal, and method for connecting wire, wire connection structure and electromagnetic relay using the wire connection terminal
JP2001145306A (en) Small motor with lead and manufacturing method thereof
JP2009076599A (en) Method and device for manufacturing coil component

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140424

RD13 Notification of appointment of power of sub attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7433

Effective date: 20150108

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20150126

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150303

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150402

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150707

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150714

R150 Certificate of patent or registration of utility model

Ref document number: 5789882

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250