JP5710158B2 - 研磨剤組成物および磁気ディスク基板の研磨方法 - Google Patents
研磨剤組成物および磁気ディスク基板の研磨方法 Download PDFInfo
- Publication number
- JP5710158B2 JP5710158B2 JP2010139545A JP2010139545A JP5710158B2 JP 5710158 B2 JP5710158 B2 JP 5710158B2 JP 2010139545 A JP2010139545 A JP 2010139545A JP 2010139545 A JP2010139545 A JP 2010139545A JP 5710158 B2 JP5710158 B2 JP 5710158B2
- Authority
- JP
- Japan
- Prior art keywords
- alumina
- acid
- polishing
- abrasive
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005498 polishing Methods 0.000 title claims description 68
- 239000000203 mixture Substances 0.000 title claims description 50
- 239000000758 substrate Substances 0.000 title claims description 27
- 238000000034 method Methods 0.000 title claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 75
- ABLZXFCXXLZCGV-UHFFFAOYSA-N phosphonic acid group Chemical group P(O)(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims description 26
- 239000003945 anionic surfactant Substances 0.000 claims description 20
- 239000002253 acid Substances 0.000 claims description 19
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 16
- 239000002738 chelating agent Substances 0.000 claims description 14
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 12
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- 239000003638 chemical reducing agent Substances 0.000 claims description 12
- 239000007800 oxidant agent Substances 0.000 claims description 10
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 8
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 7
- 150000007513 acids Chemical class 0.000 claims description 6
- DBVJJBKOTRCVKF-UHFFFAOYSA-N Etidronic acid Chemical compound OP(=O)(O)C(O)(C)P(O)(O)=O DBVJJBKOTRCVKF-UHFFFAOYSA-N 0.000 claims description 5
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 5
- 229910017604 nitric acid Inorganic materials 0.000 claims description 5
- 229910018104 Ni-P Inorganic materials 0.000 claims description 4
- 229910018536 Ni—P Inorganic materials 0.000 claims description 4
- 150000001450 anions Chemical class 0.000 claims description 4
- 229920000058 polyacrylate Polymers 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 2
- 239000003082 abrasive agent Substances 0.000 claims 1
- -1 phosphate ester Chemical class 0.000 description 16
- 150000003839 salts Chemical group 0.000 description 13
- 229910019142 PO4 Inorganic materials 0.000 description 6
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000010452 phosphate Substances 0.000 description 6
- 239000004094 surface-active agent Substances 0.000 description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 5
- 150000007522 mineralic acids Chemical class 0.000 description 5
- 230000003746 surface roughness Effects 0.000 description 5
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 150000007524 organic acids Chemical class 0.000 description 3
- 150000002978 peroxides Chemical class 0.000 description 3
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- SZHQPBJEOCHCKM-UHFFFAOYSA-N 2-phosphonobutane-1,2,4-tricarboxylic acid Chemical compound OC(=O)CCC(P(O)(O)=O)(C(O)=O)CC(O)=O SZHQPBJEOCHCKM-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- YDONNITUKPKTIG-UHFFFAOYSA-N [Nitrilotris(methylene)]trisphosphonic acid Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CP(O)(O)=O YDONNITUKPKTIG-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 2
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000003002 pH adjusting agent Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000011163 secondary particle Substances 0.000 description 2
- 238000010333 wet classification Methods 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Natural products OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 1
- 229910005540 GaP Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229920003114 HPC-L Polymers 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- FJHMRQORVSEMOK-UHFFFAOYSA-N benzoic acid formaldehyde phenol Chemical compound O=C.OC1=CC=CC=C1.OC(=O)C1=CC=CC=C1 FJHMRQORVSEMOK-UHFFFAOYSA-N 0.000 description 1
- JTBVPHBMCXEPOX-UHFFFAOYSA-N benzoic acid;formaldehyde Chemical compound O=C.OC(=O)C1=CC=CC=C1 JTBVPHBMCXEPOX-UHFFFAOYSA-N 0.000 description 1
- 150000007942 carboxylates Chemical group 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 150000001983 dialkylethers Chemical class 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 239000001863 hydroxypropyl cellulose Substances 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000001297 nitrogen containing inorganic group Chemical group 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- 125000003703 phosphorus containing inorganic group Chemical group 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 235000011118 potassium hydroxide Nutrition 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- DVQHRBFGRZHMSR-UHFFFAOYSA-N sodium methyl 2,2-dimethyl-4,6-dioxo-5-(N-prop-2-enoxy-C-propylcarbonimidoyl)cyclohexane-1-carboxylate Chemical compound [Na+].C=CCON=C(CCC)[C-]1C(=O)CC(C)(C)C(C(=O)OC)C1=O DVQHRBFGRZHMSR-UHFFFAOYSA-N 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid Chemical compound NS(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 description 1
- 125000002153 sulfur containing inorganic group Chemical group 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- QEMXHQIAXOOASZ-UHFFFAOYSA-N tetramethylammonium Chemical compound C[N+](C)(C)C QEMXHQIAXOOASZ-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Description
成物。
を研磨する磁気ディスク基板の研磨方法。
(ii)分子中に繰り返し単位を有する分子量が500〜150000の高分子陰イオン界面活性剤
(iii)式1で表わされるポリオキシアルキレン基を有する有機リン酸エステル型陰イオン界面活性剤
α−アルミナ、中間アルミナ、アルミナ固着低減剤等を含む研磨剤組成物を作成した(表1参照)。α−アルミナは、市販のα−アルミナを粉砕、湿式分級して二次粒子を調整したものを、中間アルミナ粒子は、市販の水酸化アルミニウムを焼成、粉砕、湿式分級して二次粒子を調整したものを用いた。レーザー回折式粒度分布測定機(SALD2200、島津製作所製)にて測定したアルミナの粒径(粒子径)は、α−アルミナのD10が0.27μm、D50が0.41μm、D90が0.62μm、Dmaxが1.04μm、中間アルミナのD10が0.15μm、D50が0.34μm、D90が0.72μm、Dmaxが2.93μmであった。
NiP無電解メッキした外径3.5インチのアルミディスクを研磨対象の基板として使用した。両面研磨機(9B型両面研磨機、スピードファム(株)製)、研磨パッド((株)FILWEL社製 P1パッド)を用いて、スラリー供給速度を100ml/minとして研磨剤組成物をアルミディスク上に供給して研磨試験を行った。定盤回転数は、下定盤を22.5rpm、上定盤を−7.5rpm、加工圧力は100g/cm2とし、研磨時間は4.5分とした。
研磨レートは、研磨前後のディスクの減少質量より算出し、比較例1の値を1とした場合の相対値を表1に示す。アルミナ固着は、光学式顕微鏡(1000倍)で、研磨後のディスク内周および外周端面を観察(観察機器:オリンパス製 BX60)して、固着物の残留量を評価した。評価基準を、◎:アルミナ固着が全く見られない、○:アルミナ固着がほとんど見られない、△:アルミナ固着が所々に見られる、×:アルミナ固着が多く見られる、として、その光学式顕微鏡による写真を図1に、結果を表1に示す。
Claims (6)
- 研磨材、中間アルミナ、酸、酸化剤、および水を含み、
前記酸は、硫酸、リン酸、硝酸からなる群から選ばれる少なくとも一種で、その酸の添加量は0.1〜8質量%であり、
さらに、
(i)ホスホン酸基を二つ以上有する有機ホスホン酸キレート性化合物
(ii)分子中に繰り返し単位を有する分子量が500〜150000の高分子陰イオン界面活性剤
からなる群から選ばれる少なくとも一種である、研磨対象へのアルミナの固着を低減するアルミナ固着低減剤を含むNi−Pメッキされたアルミ磁気ディスク基板用研磨剤組成物。 - 前記研磨材がα−アルミナである請求項1に記載の研磨剤組成物。
- 前記アルミナ固着低減剤が(i)ホスホン酸基を二つ以上有する有機ホスホン酸キレート性化合物であり、
その(i)ホスホン酸基を二つ以上有する有機ホスホン酸キレート性化合物が、1−ヒドロキシエチリデン−1,1−ジホスホン酸、アミノトリスメチレンホスホン酸からなる群から選ばれる少なくとも一種である請求項1または2に記載の研磨剤組成物。 - 前記アルミナ固着低減剤が(ii)分子中に繰り返し単位を有する分子量が500〜150000の高分子陰イオン界面活性剤であり、
その(ii)分子中に繰り返し単位を有する分子量が500〜150000の高分子陰イオン界面活性剤が、ポリアクリル酸アニオンである請求項1または2に記載の研磨剤組成物。 - 前記酸化剤は、過酸化水素である請求項1〜4のいずれか1項に記載の研磨剤組成物。
- 請求項1〜5のいずれか1項に記載の研磨剤組成物を用いて磁気ディスク基板を研磨する磁気ディスク基板の研磨方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010139545A JP5710158B2 (ja) | 2010-06-18 | 2010-06-18 | 研磨剤組成物および磁気ディスク基板の研磨方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010139545A JP5710158B2 (ja) | 2010-06-18 | 2010-06-18 | 研磨剤組成物および磁気ディスク基板の研磨方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012000734A JP2012000734A (ja) | 2012-01-05 |
JP5710158B2 true JP5710158B2 (ja) | 2015-04-30 |
Family
ID=45533323
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010139545A Active JP5710158B2 (ja) | 2010-06-18 | 2010-06-18 | 研磨剤組成物および磁気ディスク基板の研磨方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5710158B2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013157442A1 (ja) * | 2012-04-18 | 2013-10-24 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
JP2014029752A (ja) * | 2012-07-31 | 2014-02-13 | Kao Corp | 磁気ディスク基板の製造方法 |
JP2014029753A (ja) * | 2012-07-31 | 2014-02-13 | Kao Corp | 磁気ディスク基板の製造方法 |
TWI652336B (zh) * | 2014-05-08 | 2019-03-01 | 日商花王股份有限公司 | Sapphire plate slurry composition |
JP6373069B2 (ja) * | 2014-05-30 | 2018-08-15 | 山口精研工業株式会社 | 精密研磨剤組成物 |
CN106147616A (zh) * | 2015-04-28 | 2016-11-23 | 天津西美半导体材料有限公司 | 溶剂型表面改性氧化铝抛光液的制备方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4273475B2 (ja) * | 1999-09-21 | 2009-06-03 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
JP2008186898A (ja) * | 2007-01-29 | 2008-08-14 | Nissan Chem Ind Ltd | 研磨用組成物 |
JP5049249B2 (ja) * | 2008-10-31 | 2012-10-17 | 花王株式会社 | 研磨液組成物 |
JP4949432B2 (ja) * | 2009-05-15 | 2012-06-06 | 花王株式会社 | ハードディスク用基板の製造方法 |
JP5613422B2 (ja) * | 2010-02-12 | 2014-10-22 | 花王株式会社 | 磁気ディスク基板用研磨液組成物 |
-
2010
- 2010-06-18 JP JP2010139545A patent/JP5710158B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2012000734A (ja) | 2012-01-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5710158B2 (ja) | 研磨剤組成物および磁気ディスク基板の研磨方法 | |
JP5925454B2 (ja) | 磁気ディスク基板用研磨液組成物 | |
KR20000035505A (ko) | 연마용 조성물 및 린스용 조성물 | |
SG173972A1 (en) | Polishing composition and polishing method using the same | |
JP5576634B2 (ja) | 研磨剤組成物及び磁気ディスク基板の研磨方法 | |
JP2011241109A (ja) | ガラスエッチング組成物、ガラスポリッシング加工用組成物及びガラスポリッシング加工方法 | |
KR101907229B1 (ko) | 연마용 조성물 및 그것을 이용한 연마 방법 | |
JPWO2016143323A1 (ja) | 研磨用組成物及びシリコン基板の研磨方法 | |
CN103180902B (zh) | 玻璃硬盘基板的制造方法 | |
JP5979744B2 (ja) | ハードディスク製造方法 | |
JP6425303B2 (ja) | 研磨液組成物 | |
JP2015040228A (ja) | 磁気ディスク基板用研磨液組成物 | |
US20050136807A1 (en) | Polishing composition for magnetic disk | |
JP6437303B2 (ja) | ガラスハードディスク基板用研磨液組成物 | |
JP6321360B2 (ja) | ガラスハードディスク基板用研磨液組成物 | |
JP2014124760A (ja) | 電子材料用研磨液 | |
JP5748331B2 (ja) | ガラスハードディスク基板用研磨液組成物 | |
JP6457259B2 (ja) | ガラスハードディスク基板用酸性洗浄剤組成物 | |
JP6239973B2 (ja) | ガラスハードディスク基板の製造方法 | |
JP2014029753A (ja) | 磁気ディスク基板の製造方法 | |
JP2014029752A (ja) | 磁気ディスク基板の製造方法 | |
JP2015103263A (ja) | 研磨液組成物 | |
JP2019067471A (ja) | 研磨処理方法および研磨用組成物 | |
JPWO2017061109A1 (ja) | 磁気ディスク用研磨材及び磁気ディスクの製造方法 | |
KR20090065847A (ko) | 웨이퍼 연마용 슬러리 분산제 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20130313 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140604 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140617 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140728 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150224 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150304 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5710158 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |