JP5674373B2 - 洗浄組成物、これを用いた洗浄方法及び半導体素子の製造方法 - Google Patents

洗浄組成物、これを用いた洗浄方法及び半導体素子の製造方法 Download PDF

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Publication number: JP5674373B2
Authority: JP; Japan
Prior art keywords: cleaning composition; acid; cleaning; compound; residue
Prior art date: 2010-07-30
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

JP2010172954A

Other languages

English (en)

Japanese (ja)

Other versions

JP2012033774A (ja

Inventor

智威高橋

稲葉　正

正稲葉

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Fujifilm Corp

Original Assignee

Fujifilm Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2010-07-30

Filing date

2010-07-30

Publication date

2015-02-25

2010-07-30 Application filed by Fujifilm Corp filed Critical Fujifilm Corp

2010-07-30 Priority to JP2010172954A priority Critical patent/JP5674373B2/ja

2011-07-28 Priority to TW100126795A priority patent/TWI504740B/zh

2012-02-16 Publication of JP2012033774A publication Critical patent/JP2012033774A/ja

2015-02-25 Application granted granted Critical

2015-02-25 Publication of JP5674373B2 publication Critical patent/JP5674373B2/ja

Status Active legal-status Critical Current

2030-07-30 Anticipated expiration legal-status Critical

Links

238000004140 cleaning Methods 0.000 title claims description 174
239000000203 mixture Substances 0.000 title claims description 133
239000004065 semiconductor Substances 0.000 title claims description 94
238000000034 method Methods 0.000 title claims description 49
238000004519 manufacturing process Methods 0.000 title claims description 38
238000004380 ashing Methods 0.000 claims description 63
239000000758 substrate Substances 0.000 claims description 60
238000001020 plasma etching Methods 0.000 claims description 54
-1 nitrogen-containing compound Chemical class 0.000 claims description 46
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239000012459 cleaning agent Substances 0.000 claims description 24
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150000007514 bases Chemical class 0.000 claims description 17
QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 16
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