JP5662450B2 - 絶縁シート、その製造方法及びその絶縁シートを用いた構造体の製造方法 - Google Patents
絶縁シート、その製造方法及びその絶縁シートを用いた構造体の製造方法 Download PDFInfo
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Description
(絶縁シート)
以下に、本発明の第1実施形態に係る絶縁シートを、図面に基づいて詳細に説明する。
次に、上述した絶縁シート1を用いて作製された配線基板を含む実装構造体を、図面に基づいて詳細に説明する。
(1)図4に示すように、樹脂シート2上に第2樹脂層4bを形成する。具体的には、例えば以下のように行う。
(6)図8(a)に示すように、コア基板12を作製する。具体的には、例えば以下のように行う。
(10)バンプ4を介して配線基板10に電子部品9をフリップチップ実装することにより、図1に示した実装構造体8を作製することができる。
次に、本発明の第2実施形態に係る絶縁シートを、図12に基づいて詳細に説明する。なお、上述した第1実施形態と同様の構成に関しては、記載を省略する。
次に、本発明の第3実施形態に係る絶縁シートを、図13に基づいて詳細に説明する。なお、上述した第1実施形態と同様の構成に関しては、記載を省略する。
次に、本発明の第4実施形態に係る絶縁シートを用いて作製された配線基板を含む実装構造体を、図14に基づいて詳細に説明する。なお、上述した第1実施形態と同様の構成に関しては、記載を省略する。
また、上述した本発明の実施形態は、(3)の工程にて溶剤を蒸発させた後、(4)の工程にて無機絶縁ゾルを加熱する構成を例に説明したが、溶剤の蒸発と無機絶縁ゾルの加熱とを同時に行っても構わない。
2 樹脂シート
3 無機絶縁層
3a 第1無機絶縁粒子
3b 第2無機絶縁粒子
3p 突出部
4a 第1樹脂層
4b 第2樹脂層
5a 第1樹脂
5b 第2樹脂
6a 第1無機絶縁フィラー
6b 第2無機絶縁フィラー
7 樹脂部
8 実装構造体
9 電子部品
10 配線基板
11 導電バンプ
12 コア基板
13 配線層
14 樹脂基体
15 スルーホール導体
16 絶縁体
17 絶縁層
18 導電層
19 ビア導体
V1 第1空隙
V2 第2空隙
O 開口
Claims (12)
- 支持シートと、該支持シート上に形成された絶縁層と、を備え、
該絶縁層は、無機絶縁層を有し、
該無機絶縁層は、粒径が3nm以上110nm以下であり、互いに結合したアモルファス状態の第1無機絶縁粒子を含むことを特徴とする絶縁シート。 - 請求項1に記載の絶縁シートにおいて、
前記支持シートは、熱可塑性樹脂を含むことを特徴とする絶縁シート。 - 請求項1に記載の絶縁シートにおいて、
前記絶縁層は、前記無機絶縁層上に形成された、未硬化の熱硬化性樹脂を含む第1樹脂層をさらに有することを特徴とする絶縁シート。 - 請求項1に記載の絶縁シートにおいて、
前記絶縁層は、前記支持シートと前記無機絶縁層との間に形成された第2樹脂層をさらに有することを特徴とする絶縁シート。 - 請求項4に記載の絶縁シートにおいて、
前記絶縁層は、前記無機絶縁層上に形成された、未硬化の熱硬化性樹脂を含む第1樹脂層をさらに有し、
前記第2樹脂層の厚みは、前記第1樹脂層の厚みよりも小さいことを特徴とする絶縁シート。 - 請求項5に記載の絶縁シートにおいて、
前記第1樹脂層は、複数の粒子からなる第1無機絶縁フィラーを含んでおり、
前記第2樹脂層は、前記第1無機絶縁フィラーの粒子よりも粒径の小さい複数の粒子からなる第2無機絶縁フィラーを含んでいることを特徴とする絶縁シート。 - 請求項1に記載の絶縁シートにおいて、
前記無機絶縁層は、粒径が0.5μm以上5μm以下であり、前記第1無機絶縁粒子を介して互いに接着された第2無機絶縁粒子をさらに含むことを特徴とする絶縁シート。 - 粒径が3nm以上110nm以下のアモルファス状態の第1無機絶縁粒子を含む無機絶縁ゾルを直接または間接的に支持シート上に塗布する工程と、
前記第1無機絶縁粒子を、前記支持シートに含まれる樹脂の融点未満で加熱することにより、前記アモルファス状態の第1無機絶縁粒子同士を互いに結合させて無機絶縁層を形成する工程と、
を備えることを特徴とする絶縁シートの製造方法。 - 前記無機絶縁ゾルの塗布前に、
樹脂層を支持シート上に形成する工程をさらに備え、
前記樹脂層は、前記無機絶縁層と前記支持シートとの間に配置されることを特徴とする請求項8に記載の絶縁シートの製造方法。 - 請求項1に記載の絶縁シートを、前記支持シートが最外層となるように、未硬化の熱硬化性樹脂を含む第1樹脂層を介して支持部材上に積層する工程と、
前記第1樹脂層を、前記熱硬化性樹脂の硬化開始温度以上、前記支持シートに含まれる樹脂の融点未満で加熱することにより、前記無機絶縁層を、前記第1樹脂層を介して前記支持部材に接着させる工程と、
前記無機絶縁層から前記支持シートを除去する工程と、
を備えることを特徴とする構造体の製造方法。 - 請求項1に記載の絶縁シートを準備する工程と、
前記絶縁層から前記支持シートを除去する工程と、
前記絶縁層の前記支持シート側に配されていた主面上に導電層を形成する工程と、
を備えることを特徴とする構造体の製造方法。 - 請求項11に記載の構造体の製造方法において、
前記絶縁シートは、前記支持シートと前記無機絶縁層との間に形成された第2樹脂層をさらに有しており、
前記絶縁層の前記支持シート側に配されていた主面上に前記導電層を形成する工程は、前記第2樹脂層の前記支持シート側に配されていた主面上に前記導電層を形成する工程である構造体の製造方法。
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US (1) | US20130149514A1 (ja) |
JP (2) | JP5662450B2 (ja) |
KR (1) | KR101456088B1 (ja) |
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WO2014021186A1 (ja) | 2012-08-01 | 2014-02-06 | 京セラ株式会社 | 配線基板、それを備えた実装構造体および配線基板の製造方法 |
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JP6001439B2 (ja) * | 2012-12-21 | 2016-10-05 | 京セラ株式会社 | 配線基板および実装構造体 |
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JP6294024B2 (ja) * | 2013-07-30 | 2018-03-14 | 京セラ株式会社 | 配線基板およびこれを用いた実装構造体 |
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JP2015213199A (ja) * | 2015-08-11 | 2015-11-26 | 京セラ株式会社 | 部品内蔵基板 |
JP2016167637A (ja) * | 2016-06-08 | 2016-09-15 | 京セラ株式会社 | 積層配線基板および積層体 |
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JP2022177703A (ja) * | 2021-05-18 | 2022-12-01 | 新光電気工業株式会社 | 配線基板及び配線基板の製造方法 |
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WO2012014875A1 (ja) | 2012-02-02 |
US20130149514A1 (en) | 2013-06-13 |
KR101456088B1 (ko) | 2014-11-03 |
JPWO2012014875A1 (ja) | 2013-09-12 |
JP2015027801A (ja) | 2015-02-12 |
CN103052501B (zh) | 2015-08-26 |
CN103052501A (zh) | 2013-04-17 |
KR20130032383A (ko) | 2013-04-01 |
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