JP5641788B2 - 液体吐出ヘッドおよび液体吐出ヘッドの製造方法 - Google Patents
液体吐出ヘッドおよび液体吐出ヘッドの製造方法 Download PDFInfo
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Description
第1の実施形態における液体吐出ヘッドは、記録素子基板と電気配線基板との電気的な接続部の周辺の構成以外は、図1に示すヘッドと同様である。そのため、まず図1を参照して、電気的な接続部の周辺以外の構成について簡単に説明する。
次に、第2の実施形態における液体吐出ヘッドの構成について説明する。第2の実施形態では、記録素子基板と電気配線基板との電気的な接続部の周辺の構成以外は、第1の実施形態と同様の構成であり、第1の実施形態と同様の構成についてはその説明を省略する。
次に、第3の実施形態における液体吐出ヘッドの構成について説明する。第3の実施形態では、記録素子基板と電気配線基板との電気的な接続部の周辺の構成以外は、第1の実施形態と同様の構成であり、第1の実施形態と同様の構成についてはその説明を省略する。
次に、第4の実施形態における液体吐出ヘッドの構成について説明する。第4の実施形態では、記録素子基板と電気配線基板との電気的な接続部の周辺の構成以外は、第1の実施形態と同様の構成であり、第1の実施形態と同様の構成についてはその説明を省略する。
次に、第5の実施形態として、上記実施形態の液体吐出ヘッドを製造する製造方法について説明する。一実施形態における、液体吐出ヘッドの製造方法は、準備工程と、ボンディング工程と、封止工程とを含む。
H1300 電気配線基板
H1304 第1の封止材
H1305 第2の封止材
H2000a 伝達ワイヤー
H2000b 非伝達ワイヤー
Claims (6)
- 液体を吐出する吐出口が形成された記録素子基板と、液体を吐出するための電気信号を前記記録素子基板に供給する電気配線基板と、前記記録素子基板の前記吐出口が形成された吐出口面に設けられた複数の端子と前記電気配線基板に設けられた複数の端子とを接続する複数のワイヤーと、を備える液体吐出ヘッドであって、
前記複数のワイヤーは、前記記録素子基板と前記電気配線基板との間の電気信号の伝達経路に寄与する複数の伝達ワイヤーと、前記伝達経路に寄与しない複数の非伝達ワイヤーとを含み、
少なくとも前記複数の伝達ワイヤー全体を覆うように封止材が形成されており、
前記複数の非伝達ワイヤーは、前記封止材と雰囲気との界面に沿って形成されており、
前記非伝達ワイヤーは、前記伝達ワイヤーで接続された2つの前記端子間の領域において、前記伝達ワイヤーよりも前記吐出口面からの高さが高い、液体吐出ヘッド。 - 前記複数の非伝達ワイヤーのうちの互いに隣接する2つは、少なくとも1つの前記伝達ワイヤーを挟んで両側に配され、該伝達ワイヤーに沿った方向に延在している、請求項1に記載の液体吐出ヘッド。
- 各々の前記非伝達ワイヤーは、各々の前記伝達ワイヤーの直上に配され、該伝達ワイヤーに沿った方向に延在している、請求項1に記載の液体吐出ヘッド。
- 前記記録素子基板および前記電気配線基板の板面と平行な方向に沿った、前記非伝達ワイヤーの断面幅は、前記伝達ワイヤーの断面幅よりも広い、請求項1から3のいずれか1項に記載の液体吐出ヘッド。
- 前記非伝達ワイヤーは、前記記録素子基板および前記電気配線基板の板面と平行な方向に幅広の矩形の断面形状を有している、請求項1から3のいずれか1項に記載の液体吐出ヘッド。
- 液体を吐出する吐出口が形成された記録素子基板と、液体を吐出するための電気信号を前記記録素子基板に供給する電気配線基板と、を準備する準備工程と、
前記記録素子基板の前記吐出口が形成された吐出口面に設けられた複数の端子と前記電気配線基板に設けられた複数の端子とを複数のワイヤーで接続するボンディング工程であって、前記記録素子基板と前記電気配線基板との間の電気信号の伝達経路に寄与する複数の伝達ワイヤーと、前記伝達ワイヤーで接続される2つの前記端子間の領域において前記伝達ワイヤーよりも前記吐出口面からの高さが高くなるように、前記伝達経路に寄与しない複数の非伝達ワイヤーと、を接続するボンディング工程と、
少なくとも前記複数の伝達ワイヤー全体を覆う封止材を、該封止材と雰囲気との界面が前記複数の非伝達ワイヤーに保持されるように形成する工程と、を有する液体吐出ヘッドの製造方法。
Priority Applications (2)
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JP2010125115A JP5641788B2 (ja) | 2010-05-31 | 2010-05-31 | 液体吐出ヘッドおよび液体吐出ヘッドの製造方法 |
US13/097,503 US8608285B2 (en) | 2010-05-31 | 2011-04-29 | Liquid discharge head and manufacturing method therefor |
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JP6891033B2 (ja) * | 2017-04-21 | 2021-06-18 | キヤノン株式会社 | 液体吐出ヘッド |
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JPH07335680A (ja) * | 1994-06-14 | 1995-12-22 | Fujitsu Ltd | 回路基板及びその製造方法、並びに半導体装置のワイヤボンディング方法及び半導体装置の封止方法 |
JPH08336963A (ja) * | 1995-06-14 | 1996-12-24 | Matsushita Electric Ind Co Ltd | インク液噴射型プリンター用ヘッド実装構成体 |
JPH1044441A (ja) * | 1996-07-31 | 1998-02-17 | Canon Inc | インクジェットヘッドおよびインクジェットカートリッジおよびインクジェット装置ならびにインクジェットヘッドの製造方法 |
JPH11330128A (ja) * | 1998-05-19 | 1999-11-30 | Fujitsu Ltd | 半導体装置 |
JP2001138520A (ja) * | 1999-11-10 | 2001-05-22 | Canon Inc | 記録ヘッド、該記録ヘッドの製造方法およびインクジェット記録装置 |
US20040217488A1 (en) * | 2003-05-02 | 2004-11-04 | Luechinger Christoph B. | Ribbon bonding |
JP4553348B2 (ja) * | 2003-12-03 | 2010-09-29 | キヤノン株式会社 | インクジェット記録ヘッド |
JP4845415B2 (ja) * | 2005-04-18 | 2011-12-28 | キヤノン株式会社 | インクジェット記録ヘッド |
JP4939184B2 (ja) * | 2005-12-15 | 2012-05-23 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
JP2007296638A (ja) | 2006-04-27 | 2007-11-15 | Canon Inc | 液体吐出記録ヘッド、液体吐出記録ヘッドその製造方法、及び液体吐出記録装置 |
JP2007335782A (ja) * | 2006-06-19 | 2007-12-27 | Fuji Electric Fa Components & Systems Co Ltd | 半導体装置モジュールの製造方法及び半導体装置モジュール |
JP5164523B2 (ja) * | 2006-12-15 | 2013-03-21 | キヤノン株式会社 | インクジェット記録ヘッド |
JP5867985B2 (ja) * | 2010-03-01 | 2016-02-24 | キヤノン株式会社 | 記録ヘッド |
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