JP5623721B2 - 吸着用シート - Google Patents
吸着用シート Download PDFInfo
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- JP5623721B2 JP5623721B2 JP2009220833A JP2009220833A JP5623721B2 JP 5623721 B2 JP5623721 B2 JP 5623721B2 JP 2009220833 A JP2009220833 A JP 2009220833A JP 2009220833 A JP2009220833 A JP 2009220833A JP 5623721 B2 JP5623721 B2 JP 5623721B2
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- 238000001179 sorption measurement Methods 0.000 title claims description 32
- 239000000758 substrate Substances 0.000 claims description 27
- 239000000843 powder Substances 0.000 claims description 8
- 239000004699 Ultra-high molecular weight polyethylene Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 229920000785 ultra high molecular weight polyethylene Polymers 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 8
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- 230000000087 stabilizing effect Effects 0.000 description 1
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- 230000032258 transport Effects 0.000 description 1
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- 238000003466 welding Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- B25B11/005—Vacuum work holders
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
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- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
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- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24322—Composite web or sheet
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Y10T428/24322—Composite web or sheet
- Y10T428/24331—Composite web or sheet including nonapertured component
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
- Manipulator (AREA)
- Laminated Bodies (AREA)
- Fuel Cell (AREA)
Description
超高分子量ポリエチレン粉末(分子量500万、嵩密度0.47g/cm3、平均粒子径120μm)を内径500mm、高さ500mmの金型に充填し、これを金属製耐圧容器に入れ、容器内を10hPaまで減圧した。その後、容器内に加熱された水蒸気を導入することにより、容器内を160℃、6080hPaとして5時間の加熱を行い、ついで徐冷を行って、円筒状の焼結ブロックを得た。この焼結ブロックを旋盤により種々の厚さにカットして焼結シート体を切り出し、これを100mm各にカットした。この焼結シート体をプレス機により130℃、30Paで1時間プレスして、0.025〜1.0mmの厚さの多孔質体を作製した。
焼結ブロックから切り出す焼結シート体の厚さを厚くした以外は実施例と同様にして、1.5mmの多孔質体を作製した。これを、実施例と同様に、直径6.0mmの貫通孔が設けられた基板(ポリエチレン板)に貼着して、吸着用シートを得た。なお、多孔質体については、実施例と同様にして気孔率を算出した。
実施例1〜8および比較例の吸着用シートについて、多孔質体の厚さBと基板の貫通孔の直径AからB/A2を算出した。
2 基板
2a 一方面
2b 他方面
21 貫通孔
3 多孔質体
4 吸着装置
4a 吸着面
42 窪み
42a 横溝
42b 縦溝
Claims (4)
- シートまたはフィルムである対象物を真空吸着する吸着装置の吸着面に取り付けられる吸着用シートであって、
前記吸着面に接触させられる一方面を有し、複数の貫通孔が設けられた基板と、
前記基板の他方面に前記複数の貫通孔を塞ぐように貼着された、厚さ1.4mm以下の多孔質体と、を備え、
前記多孔質体は、超高分子量ポリエチレン粉体が焼結させられることにより多孔質化されたものであり、
前記複数の貫通孔は、個々の貫通孔とこれに最も近接する貫通孔の中心間距離が65mm以下となるように配置され、
前記複数の貫通孔のそれぞれは、開口面積が64mm 2 以下のものであり、
前記貫通孔を軸方向から見たときにその輪郭に外接する最小の矩形枠における辺の長さのうち最大のものをAmm、前記多孔質体の厚さをBmmとしたときに、B/A 2 ≧0.015を満たす吸着用シート。 - 前記基板は、プラスチック板または金属板である、請求項1に記載の吸着用シート。
- 前記吸着面には、吸引用の窪みが設けられており、前記複数の貫通孔は、前記窪みに対応する位置に、当該窪みよりも小さな大きさで設けられている、請求項1または2に記載の吸着用シート。
- 前記窪みは、複数の溝で構成されている、請求項3に記載の吸着用シート。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009220833A JP5623721B2 (ja) | 2008-09-29 | 2009-09-25 | 吸着用シート |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008250761 | 2008-09-29 | ||
JP2008250761 | 2008-09-29 | ||
JP2009220833A JP5623721B2 (ja) | 2008-09-29 | 2009-09-25 | 吸着用シート |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010099826A JP2010099826A (ja) | 2010-05-06 |
JP5623721B2 true JP5623721B2 (ja) | 2014-11-12 |
Family
ID=42059784
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009220833A Active JP5623721B2 (ja) | 2008-09-29 | 2009-09-25 | 吸着用シート |
Country Status (6)
Country | Link |
---|---|
US (1) | US8414999B2 (ja) |
JP (1) | JP5623721B2 (ja) |
KR (1) | KR20110067132A (ja) |
CN (1) | CN102164719B (ja) |
TW (1) | TWI439351B (ja) |
WO (1) | WO2010035786A1 (ja) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5556352B2 (ja) * | 2010-05-17 | 2014-07-23 | 横浜ゴム株式会社 | シート部材の搬送装置及び搬送方法 |
KR101168411B1 (ko) | 2010-08-09 | 2012-07-25 | 엘지이노텍 주식회사 | 만능 이동용 패드 |
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