JP5619421B2 - 光電子読取りヘッド - Google Patents
光電子読取りヘッド Download PDFInfo
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- JP5619421B2 JP5619421B2 JP2009533947A JP2009533947A JP5619421B2 JP 5619421 B2 JP5619421 B2 JP 5619421B2 JP 2009533947 A JP2009533947 A JP 2009533947A JP 2009533947 A JP2009533947 A JP 2009533947A JP 5619421 B2 JP5619421 B2 JP 5619421B2
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Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
- G01D5/32—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light
- G01D5/34—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells
- G01D5/347—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells using displacement encoding scales
- G01D5/34707—Scales; Discs, e.g. fixation, fabrication, compensation
- G01D5/34715—Scale reading or illumination devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0262—Photo-diodes, e.g. transceiver devices, bidirectional devices
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Optical Transform (AREA)
Description
Claims (29)
- スケール読取り装置の読取りヘッドであって、光源と、光検出器要素のアレイとを含み、前記光源および光検出器要素のアレイは、基板上に配置されている単一の格子整合半導体化合物中に製造されていることを特徴とする読取りヘッド。
- 前記基板は、前記光検出器要素および光源が製造された前記半導体化合物と格子整合していることを特徴とする請求項1に記載の読取りヘッド。
- 前記光源は、前記基板の表面へのエピタキシ構造の追加によって半導体化合物中に製造された少なくとも1つの発光構造を含むことを特徴とする請求項1または2に記載の読取りヘッド。
- 前記光源と前記光検出器要素のアレイは、前記エピタキシ構造の別々の層に位置していることを特徴とする請求項3に記載の読取りヘッド。
- 前記光源は、前記基板への少なくとも1つの量子井戸構造ならびに障壁およびコンタクト層の追加によって半導体化合物中に製造された少なくとも1つの発光構造を含むことを特徴とする請求項1から3のいずれかに記載の読取りヘッド。
- 前記少なくとも1つの量子井戸構造は、前記光検出器が前記光検出器のピークレスポンシビティの60%以内にある波長の光を発射するように構成されていることを特徴とする請求項5に記載の読取りヘッド。
- 前記読取りヘッドは少なくとも1つの格子を含み、前記少なくとも1つの格子は、前記光検出器要素上と前記光源要素上のうちの一方または両方に統合されていることを特徴とする請求項1から6のいずれかに記載の読取りヘッド。
- 前記読取りヘッドがスケール読取り装置中で使用されているとき、前記少なくとも1つの格子は、前記格子整合半導体化合物のスケールに隣接した側に配置されていることを特徴とする請求項7に記載の読取りヘッド。
- 前記格子整合半導体化合物はIII−V族であることを特徴とする請求項1から8のいずれかに記載の読取りヘッド。
- 前記格子整合半導体化合物はインジウムリン化合物を含むことを特徴とする請求項9に記載の読取りヘッド。
- 前記格子整合半導体化合物はガリウムヒ素化合物を含むことを特徴とする請求項9に記載の読取りヘッド。
- 前記格子整合半導体化合物は3元または4元化合物であることを特徴とする請求項9から11のいずれかに記載の読取りヘッド。
- 前記光源および光検出器のアレイを形成した前記格子整合半導体は基板上に配置されており、前記基板はインジウムリンを含むことを特徴とする請求項9から11のいずれかに記載の読取りヘッド。
- 前記格子整合半導体化合物は半導体の単結晶を含むことを特徴とする請求項1から13のいずれかに記載の読取りヘッド。
- 前記読取りヘッドがスケール読取り装置中で使用されているときに、前記基板の前記スケールに隣接していない側に電気コンタクトが配置されていることを特徴とする請求項1から13のいずれかに記載の読取りヘッド。
- 前記読取りヘッドからの光出力信号を生成する発光要素が配置されていることを特徴とする請求項1から15のいずれかに記載の読取りヘッド。
- 前記発光要素は、前記格子整合半導体化合物と統合されていることを特徴とする請求項16に記載の読取りヘッド。
- 前記読取りヘッドからの信号を光伝送する光ファイバが配置されていることを特徴とする請求項1から17のいずれかに記載の読取りヘッド。
- 前記光検出器要素のアレイは2次元アレイとして配置されていることを特徴とする請求項1から18のいずれかに記載の読取りヘッド。
- 前記光検出器要素のアレイは斜めストライプパターンとして配置されていることを特徴とする請求項1から19のいずれかに記載の読取りヘッド。
- 前記光検出器要素のアレイはシェブロンパターンとして配置されていることを特徴とする請求項1から20のいずれかに記載の読取りヘッド。
- 同様の位相の信号を出力する複数の光検出器要素が共通に電気接続されていることを特徴とする請求項1から21のいずれかに記載の読取りヘッド。
- 前記読取りヘッドは、前記光検出器要素のアレイからの異なるフィーチャの検出用の少なくとも1つの追加の光検出器要素を含むことを特徴とする請求項1から22のいずれかに記載の読取りヘッド。
- 前記少なくとも1つの追加の光検出器要素は、前記格子整合半導体化合物と統合されていることを特徴とする請求項23に記載の読取りヘッド。
- 前記読取りヘッドは、前記光源からの異なるフィーチャの照明用の少なくとも1つの追加の発光要素を含むことを特徴とする請求項1から24のいずれかに記載の読取りヘッド。
- 前記発光要素は、前記格子整合半導体化合物と統合されていることを特徴とする請求項25に記載の読取りヘッド。
- 前記追加の発光要素の中心と前記追加の光検出器要素の中心とを結ぶ軸は、前記読取りヘッドとスケールの相対運動の方向に対して実質的に垂直であることを特徴とする請求項25または26に記載の読取りヘッド。
- 前記光源は、前記光検出器要素のアレイの少なくとも1つの光検出器要素に隣接していることを特徴とする請求項1から27のいずれかに記載の読取りヘッド。
- スケールと、
読取りヘッドであって、光源と、光検出器要素のアレイとを含み、前記光源および光検出器要素のアレイは、基板上に配置されている単一の格子整合半導体化合物中に製造されている読取りヘッドと、
を備えたスケール読取り装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0621487.8 | 2006-10-28 | ||
GBGB0621487.8A GB0621487D0 (en) | 2006-10-28 | 2006-10-28 | Opto-electronic read head |
PCT/GB2007/004116 WO2008053184A1 (en) | 2006-10-28 | 2007-10-29 | Opto electronic read head |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010508501A JP2010508501A (ja) | 2010-03-18 |
JP5619421B2 true JP5619421B2 (ja) | 2014-11-05 |
Family
ID=37546147
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009533947A Active JP5619421B2 (ja) | 2006-10-28 | 2007-10-29 | 光電子読取りヘッド |
Country Status (6)
Country | Link |
---|---|
US (1) | US20100072456A1 (ja) |
EP (1) | EP2087321B1 (ja) |
JP (1) | JP5619421B2 (ja) |
CN (1) | CN101529212B (ja) |
GB (1) | GB0621487D0 (ja) |
WO (1) | WO2008053184A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7973941B2 (en) * | 2007-07-24 | 2011-07-05 | Mitutoyo Corporation | Reference signal generating configuration for an interferometric miniature grating encoder readhead using fiber optic receiver channels |
JP2013534318A (ja) * | 2010-08-19 | 2013-09-02 | エレスタ・リレイズ・ゲーエムベーハー | センサヘッドホルダ |
US8723103B2 (en) * | 2011-11-08 | 2014-05-13 | Mitutoyo Corporation | Optical encoder readhead configured to block stray light with dummy vias |
US9287204B2 (en) | 2012-12-20 | 2016-03-15 | Stats Chippac, Ltd. | Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form |
JP7032045B2 (ja) * | 2013-10-01 | 2022-03-08 | レニショウ パブリック リミテッド カンパニー | 測定エンコーダ |
EP3052896A1 (en) * | 2013-10-01 | 2016-08-10 | Renishaw Plc. | Position measurement encoder |
EP3015828B1 (en) * | 2014-10-30 | 2016-09-28 | Fagor, S. Coop. | Optoelectronic device and method thereof |
US9562793B2 (en) | 2014-11-17 | 2017-02-07 | Mitutoyo Corporation | Illumination portion for an optical encoder |
US9689715B2 (en) | 2015-05-19 | 2017-06-27 | Mitutoyo Corporation | Light source array used in an illumination portion of an optical encoder |
ES2742705T3 (es) * | 2015-07-30 | 2020-02-17 | Heidenhain Gmbh Dr Johannes | Dispositivo de medición de posición |
KR20180052676A (ko) | 2015-09-09 | 2018-05-18 | 레니쇼우 피엘씨 | 인코더 장치 |
JP6893819B2 (ja) * | 2017-04-06 | 2021-06-23 | 株式会社ミツトヨ | エンコーダ |
EP3623769A1 (en) * | 2018-09-12 | 2020-03-18 | Renishaw PLC | Measurement device |
Family Cites Families (20)
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US4879250A (en) * | 1988-09-29 | 1989-11-07 | The Boeing Company | Method of making a monolithic interleaved LED/PIN photodetector array |
US5155355A (en) * | 1991-04-25 | 1992-10-13 | Mitutoyo Corporation | Photoelectric encoder having a grating substrate with integral light emitting elements |
EP0543513B2 (en) * | 1991-11-06 | 2007-10-24 | Renishaw Transducer Systems Limited | Opto-electronic scale-reading apparatus |
US5450392A (en) * | 1992-05-01 | 1995-09-12 | General Instrument Corporation | Reduction of interchannel harmonic distortions in an analog and digital signal multiplex |
JP3196459B2 (ja) | 1993-10-29 | 2001-08-06 | キヤノン株式会社 | ロータリーエンコーダ |
GB9522491D0 (en) * | 1995-11-02 | 1996-01-03 | Renishaw Plc | Opto-electronic rotary encoder |
GB2315594B (en) * | 1996-07-22 | 2000-08-16 | Cambridge Display Tech Ltd | Sensing device |
US5926493A (en) * | 1997-05-20 | 1999-07-20 | Sdl, Inc. | Optical semiconductor device with diffraction grating structure |
DE29805392U1 (de) * | 1998-03-25 | 1999-08-05 | Dr. Johannes Heidenhain Gmbh, 83301 Traunreut | Optoelektronische Baugruppe |
IL141536A (en) * | 1998-08-21 | 2005-07-25 | Olivier M Parriaux | Device for measuring translation, rotation or velocity via light beam interference |
DE19859670A1 (de) * | 1998-12-23 | 2000-06-29 | Heidenhain Gmbh Dr Johannes | Abtastkopf und Verfahren zu dessen Herstellung |
US6573581B1 (en) * | 1999-03-01 | 2003-06-03 | Finisar Corporation | Reduced dark current pin photo diodes using intentional doping |
DE19917950A1 (de) | 1999-04-21 | 2000-10-26 | Heidenhain Gmbh Dr Johannes | Integrierter optoelektronischer Dünnschichtsensor und Verfahren zu dessen Herstellung |
GB9924331D0 (en) | 1999-10-15 | 1999-12-15 | Renishaw Plc | Scale reading apparatus |
GB9928483D0 (en) | 1999-12-03 | 2000-02-02 | Renishaw Plc | Opto-electronic scale reading apparatus |
US6608360B2 (en) * | 2000-12-15 | 2003-08-19 | University Of Houston | One-chip micro-integrated optoelectronic sensor |
DE10116599A1 (de) | 2001-04-03 | 2003-02-06 | Heidenhain Gmbh Dr Johannes | Optische Positionsmesseinrichtung |
US20030022414A1 (en) * | 2001-07-25 | 2003-01-30 | Motorola, Inc. | Structure and method for fabricating anopto-electronic device having an electrochromic switch |
US7180430B2 (en) * | 2004-11-01 | 2007-02-20 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Low-cost absolute linear optical encoder |
EP1795873B1 (en) * | 2005-12-06 | 2017-11-08 | Mitutoyo Corporation | Photoelectric Encoder |
-
2006
- 2006-10-28 GB GBGB0621487.8A patent/GB0621487D0/en not_active Ceased
-
2007
- 2007-10-29 CN CN2007800401679A patent/CN101529212B/zh active Active
- 2007-10-29 US US12/311,801 patent/US20100072456A1/en not_active Abandoned
- 2007-10-29 EP EP07824360.7A patent/EP2087321B1/en active Active
- 2007-10-29 JP JP2009533947A patent/JP5619421B2/ja active Active
- 2007-10-29 WO PCT/GB2007/004116 patent/WO2008053184A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP2010508501A (ja) | 2010-03-18 |
WO2008053184A1 (en) | 2008-05-08 |
CN101529212B (zh) | 2013-08-28 |
EP2087321B1 (en) | 2017-06-07 |
US20100072456A1 (en) | 2010-03-25 |
EP2087321A1 (en) | 2009-08-12 |
GB0621487D0 (en) | 2006-12-06 |
CN101529212A (zh) | 2009-09-09 |
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