JP5614575B2 - Multilayer circuit board manufacturing method - Google Patents

Multilayer circuit board manufacturing method Download PDF

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JP5614575B2
JP5614575B2 JP2010125925A JP2010125925A JP5614575B2 JP 5614575 B2 JP5614575 B2 JP 5614575B2 JP 2010125925 A JP2010125925 A JP 2010125925A JP 2010125925 A JP2010125925 A JP 2010125925A JP 5614575 B2 JP5614575 B2 JP 5614575B2
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adhesive layer
resin
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substrate body
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中井　基生
基生 中井
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JTEKT Corp
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本発明は、多層回路基板の製造方法に関する。   The present invention relates to a method for manufacturing a multilayer circuit board.

片面のみに導体パターンを形成した複数層の樹脂フィルムを熱可塑性樹脂からなるシート部材を介してヒートシンクに積層した後、両面から加熱プレスして多層回路基板を得ることが提案されている（例えば特許文献１を参照）。
また、ヒートシンク付きの半導体素子が半田ボールを介して実装された多層回路基板が提案されている（例えば特許文献２を参照）。 It has been proposed that a multilayer circuit board is obtained by laminating a plurality of resin films, each having a conductor pattern formed only on one side, on a heat sink via a sheet member made of a thermoplastic resin and then heat-pressing from both sides (for example, a patent) Reference 1).
In addition, a multilayer circuit board on which a semiconductor element with a heat sink is mounted via solder balls has been proposed (see, for example, Patent Document 2).

特開２００３−１７８５９号公報JP 2003-17859 A 特開２００１−２４４３７９号公報JP 2001-244379 A

片面実装型の多層回路基板において、多層回路基板の表面に実装された電子部品の熱を多層回路基板の裏面側からヒートシンクへ逃がす場合、多層の分だけ放熱経路が長くなり、放熱性が低下する。
多層回路基板の本体をヒートシンクに接着するために両者間に介在する樹脂層の樹脂が、例えば熱硬化性樹脂である場合、加熱プレスの工程において、十分に硬化する前の樹脂が加圧の影響を受けるため、樹脂層の厚みが薄くなる。このため、熱硬化後の接着層の厚みが薄くなる傾向にある。 In a single-sided multilayer circuit board, when the heat of the electronic components mounted on the surface of the multilayer circuit board is released from the back side of the multilayer circuit board to the heat sink, the heat radiation path becomes longer and the heat radiation performance is reduced. .
When the resin of the resin layer interposed between the two in order to adhere the multilayer circuit board body to the heat sink is, for example, a thermosetting resin, the resin before being sufficiently cured is affected by the pressure in the heating press process. Therefore, the thickness of the resin layer is reduced. For this reason, it exists in the tendency for the thickness of the contact bonding layer after thermosetting to become thin.

しかも、多層回路基板の本体の最下層には、導体パターンのある部分と無い部分で凹凸があるので、十分に硬化する前の上記の樹脂層が、導体パターンの特にエッジ部で強く加圧される。強く加圧された部分では、樹脂層の厚みが非常に薄くなり、場合によっては、導体パターンがヒートシンクに接触し、短絡故障の原因となる。
本発明は、かかる背景のもとでなされたもので、放熱性が良く短絡故障のおそれがない多層回路基板の製造方法を提供することを目的とする。 In addition, since the lowermost layer of the multilayer circuit board body has irregularities in the portions with and without the conductor pattern, the resin layer before being sufficiently cured is strongly pressed particularly at the edge portion of the conductor pattern. The In the portion where the pressure is strongly applied, the thickness of the resin layer becomes very thin, and in some cases, the conductive pattern comes into contact with the heat sink, causing a short circuit failure.
The present invention has been made under such a background, and an object of the present invention is to provide a method for manufacturing a multilayer circuit board that has good heat dissipation and does not cause a short circuit failure.

上記目的を達成するため、本発明は、複数の導体層（１１，１２，１３，１４）を絶縁層（２１，２２，２３）を介して積層してなる基板本体（２）と、放熱板（３）とが、絶縁性の第１および第２の接着層（４，５）を介して接合され、上記複数の導体層のうちの最下導体層（１４）は、上記基板本体の周縁から離隔した端面と、上記放熱板に対向する対向面と、上記対向面と上記端面とで形成されるエッジ部と、を有する導体パターン（１４１〜１４５）を含む、多層回路基板（１）の製造方法であって、第１の樹脂（４０）を硬化させて上記基板本体および上記放熱板の何れか一方に接合された第１の接着層を形成する工程と、上記基板本体および上記放熱板を積層方向（Ｘ１）に加圧しつつ、上記最下導体層の上記導体パターンの上記対向面と上記放熱板との間に上記第１の接着層が介在する状態で上記基板本体と上記第１の接着層との間に介在させた第２の樹脂（５０）を硬化させて第２の接着層を形成する工程と、を含むものである。 In order to achieve the above object, the present invention provides a substrate body (2) in which a plurality of conductor layers (11, 12, 13, 14) are laminated via insulating layers (21, 22, 23), and a heat sink. (3) are bonded via the insulating first and second adhesive layers (4, 5), and the lowermost conductor layer (14) of the plurality of conductor layers is a peripheral edge of the substrate body. Of the multilayer circuit board ( 1) , including a conductor pattern (141 to 145) having an end surface spaced from the heat sink, an opposing surface facing the heat sink, and an edge portion formed by the opposing surface and the end surface A manufacturing method comprising: curing a first resin (40) to form a first adhesive layer bonded to one of the substrate body and the heat sink; and the substrate body and the heat sink while pressing the stacking direction (X1) and the conductor pattern of the lowermost conductive layer In a state where the first adhesive layer is interposed cured second resin (50) which is interposed between the substrate present body and the first adhesive layer between the serial facing surface and the heat radiating plate Forming a second adhesive layer.

本発明によれば、第２の接着層を形成する工程では、既に硬化している第１の接着層は、基板本体と放熱板との間で加圧されても、所要の厚み（ｔ４）を確保することができる。したがって、第２の接着層を形成する工程において、第２の接着層の厚みが、加圧の影響で、具体的には最下層の導体パターンのエッジ部で特に強く加圧されることによる影響で、部分的に薄くなるようなことがあっても、基板本体と放熱板との間に、第１の接着層の上記所要の厚み以上の距離を確保することができる。したがって、製造された多層回路基板において、導体パターンと放熱板とを確実に絶縁しておくことができる。このように絶縁性の確保の信頼性が高いので、可及的に、両接着層の厚みを十分に薄くすることが可能となり、その結果、放熱板への放熱性を高くすることができる。 According to the present invention, in the step of forming the second adhesive layer, even if the already cured first adhesive layer is pressed between the substrate body and the heat sink, the required thickness (t 4 ) Can be secured. Accordingly, in the step of forming the second adhesive layer, the thickness of the second adhesive layer is affected by the pressurization, specifically, the influence of being particularly strongly pressed at the edge portion of the lowermost conductor pattern. Thus, even when the thickness is partially reduced, a distance greater than the required thickness of the first adhesive layer can be ensured between the substrate body and the heat sink. Therefore, in the manufactured multilayer circuit board, the conductor pattern and the heat sink can be reliably insulated. Thus, since the reliability of ensuring insulation is high, the thickness of both adhesive layers can be made sufficiently thin as much as possible, and as a result, the heat dissipation to the heat sink can be enhanced.

また、上記第１の接着層および上記第２の接着層は、第１の樹脂（４０）および第２の樹脂（５０）を熱硬化させて形成される場合がある（請求項２）。この場合、第１の接着層を形成する工程において、基板本体に熱負荷をかけないで済むので、基板本体の絶縁層を構成する樹脂に悪影響を及ぼすおそれがない。
また、本発明は、複数の導体層（１１，１２，１３，１４）を絶縁層（２１，２２，２３）を介して積層してなる基板本体（２）と、放熱板（３）とが、絶縁性の第１および第２の接着層（４Ａ，５Ａ）を介して接合され、上記複数の導体層のうちの最下導体層（１４）は、上記基板本体の周縁から離隔した端面と、上記放熱板に対向する対向面と、上記対向面と上記端面とで形成されるエッジ部と、を有する導体パターン（１４１〜１４５）を含む、多層回路基板（１）の製造方法であって、第１の樹脂を硬化させて、上記最下絶縁層の上記下面と上記導体パターンの上記端面および上記対向面とを覆うように上記基板本体に接合された第１の接着層を形成する工程と、上記基板本体および上記放熱板を積層方向に加圧しつつ上記放熱板と上記第１の接着層との間に介在させた第２の樹脂を硬化させて第２の接着層を形成する工程と、を含むものである（請求項３）。
本発明によれば、第２の接着層を形成する工程では、既に硬化している第１の接着層は、基板本体と放熱板との間で加圧されても、所要の厚み（ｔ４Ａ）を確保することができる。したがって、第２の接着層を形成する工程において、第２の接着層の厚みが、加圧の影響で、具体的には最下層の導体パターンのエッジ部で特に強く加圧されることによる影響で、部分的に薄くなるようなことがあっても、基板本体と放熱板との間に、第１の接着層の上記所要の厚み以上の距離を確保することができる。したがって、製造された多層回路基板において、導体パターンと放熱板とを確実に絶縁しておくことができる。このように絶縁性の確保の信頼性が高いので、可及的に、両接着層の厚みを十分に薄くすることが可能となり、その結果、放熱板への放熱性を高くすることができる。
また、上記第１の接着層および上記第２の接着層の合計厚みの最大値（ｔsummax）が、上記基板本体の各絶縁層の厚み（ｔ１，ｔ２，ｔ３）よりも薄くされている場合がある（請求項４）。上述したように、基板本体と放熱板との間には、第１の接着層の上記所要の厚み（ｔ４；ｔ４Ａ）以上の距離を確保することができる。したがって、上記第１の接着層および上記第２の接着層の合計厚みの最大値を基板本体の各絶縁層の厚みよりも薄くすることが実質的に可能となり、その結果、基板本体を放熱板に十分に近づけて配置することができ、放熱性をより向上することができる。 The first adhesive layer and the second adhesive layer may be formed by thermosetting the first resin (40) and the second resin (50) (claim 2). In this case, in the step of forming the first adhesive layer, it is not necessary to apply a thermal load to the substrate body, so that there is no possibility of adversely affecting the resin constituting the insulating layer of the substrate body.
The present invention also includes a substrate body (2) formed by laminating a plurality of conductor layers (11, 12, 13, 14) via insulating layers (21, 22, 23), and a heat sink (3). Are joined via insulating first and second adhesive layers (4A, 5A), and the lowermost conductor layer (14) of the plurality of conductor layers has an end face separated from the peripheral edge of the substrate body. A method for producing a multilayer circuit board (1), comprising a conductor pattern (141 to 145) having a facing surface facing the heat radiating plate and an edge formed by the facing surface and the end surface. And curing the first resin to form a first adhesive layer bonded to the substrate body so as to cover the lower surface of the lowermost insulating layer, the end surface of the conductor pattern, and the opposing surface. And the heat sink while pressurizing the substrate body and the heat sink in the stacking direction. Forming a second adhesive layer by curing the second resin is interposed between the serial first adhesive layer, it is intended to include (claim 3).
According to the present invention, in the step of forming the second adhesive layer, even if the already cured first adhesive layer is pressed between the substrate body and the heat sink, the required thickness (t4A) Can be secured. Accordingly, in the step of forming the second adhesive layer, the thickness of the second adhesive layer is affected by the pressurization, specifically, the influence of being particularly strongly pressed at the edge portion of the lowermost conductor pattern. Thus, even when the thickness is partially reduced, a distance greater than the required thickness of the first adhesive layer can be ensured between the substrate body and the heat sink. Therefore, in the manufactured multilayer circuit board, the conductor pattern and the heat sink can be reliably insulated. Thus, since the reliability of ensuring insulation is high, the thickness of both adhesive layers can be made sufficiently thin as much as possible, and as a result, the heat dissipation to the heat sink can be enhanced.
The maximum value (tsummax) of the total thickness of the first adhesive layer and the second adhesive layer may be thinner than the thickness (t1, t2, t3) of each insulating layer of the substrate body. (Claim 4 ). As described above, a distance equal to or greater than the required thickness (t4; t4A) of the first adhesive layer can be ensured between the substrate body and the heat sink. Therefore, it is possible to make the maximum value of the total thickness of the first adhesive layer and the second adhesive layer substantially smaller than the thickness of each insulating layer of the substrate body. It is possible to arrange them close enough to each other, and the heat dissipation can be further improved.

上記第１の樹脂および上記第２の樹脂は異なる材料からなっていてもよいが、上記第１の樹脂および上記第２の樹脂は同じ材料からなる場合には（請求項５）、両樹脂のなじみがよいので、第１の接着層と第２の接着層の間の接着力を高くできるうえで好ましい。
上記第１の樹脂および上記第２の樹脂の少なくとも一方として、接着剤として公知のエポキシ系樹脂を用いることができる。また、第１の樹脂および第２の樹脂の少なくとも一方に、熱伝導性を高めるためにセラミックが含有されていてもよい。また、第１および第２の樹脂の少なくとも一方に、絶縁抵抗を下げない範囲で熱伝導性を高めるために、金属およびカーボンの少なくとも一方が含有されていてもよい。 The first resin and the second resin may be made of different materials, but when the first resin and the second resin are made of the same material (Claim 5 ), Since familiarity is good, it is preferable because the adhesive force between the first adhesive layer and the second adhesive layer can be increased.
As at least one of the first resin and the second resin, a known epoxy resin can be used as an adhesive. In addition, ceramic may be contained in at least one of the first resin and the second resin in order to increase thermal conductivity. In addition, at least one of a metal and carbon may be contained in at least one of the first and second resins in order to increase the thermal conductivity within a range where the insulation resistance is not lowered.

なお、上記において、括弧内の数字等は、後述する実施形態における対応構成要素の参照符号を表すものであるが、これらの参照符号により特許請求の範囲を限定する趣旨ではない。   In addition, in the above, the numbers in parentheses represent reference numerals of corresponding components in the embodiments described later, but the scope of the claims is not limited by these reference numerals.

本発明の一実施形態に係る多層回路基板の製造方法により製造された多層回路基板の概略断面図である。It is a schematic sectional drawing of the multilayer circuit board manufactured by the manufacturing method of the multilayer circuit board which concerns on one Embodiment of this invention. 図１の実施の形態の多層回路基板の製造工程を順次に示す概略断面図である。FIG. 3 is a schematic cross-sectional view sequentially showing manufacturing steps of the multilayer circuit board of the embodiment of FIG. 1. 本発明の別の実施の形態に係る多層回路基板の製造工程を順次に示す概略断面図である。It is a schematic sectional drawing which shows the manufacturing process of the multilayer circuit board based on another embodiment of this invention in order.

以下には、図面を参照して、本発明の実施形態について具体的に説明する。
図１は本発明の多層回路基板の製造方法により製造された多層回路基板の断面図である。図１に示すように、多層回路基板１は、基板本体２と、例えばアルミニウム板からなる放熱板３とを備えている。基板本体２と放熱板３とが、絶縁性の２層の接着層としての第１の接着層４および第２の接着層５を介して接続されている。 Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings.
FIG. 1 is a cross-sectional view of a multilayer circuit board manufactured by the method for manufacturing a multilayer circuit board of the present invention. As shown in FIG. 1, the multilayer circuit board 1 includes a board body 2 and a heat radiating plate 3 made of, for example, an aluminum plate. The substrate body 2 and the heat sink 3 are connected via a first adhesive layer 4 and a second adhesive layer 5 as two insulating adhesive layers.

基板本体２は、複数の導体層１１〜１４が絶縁層２１〜２３を介して積層されてなる。すなわち、基板本体２は、表面層としての第１の導体層１１、第１の絶縁層２１、第２の導体層１２、第２の絶縁層２２、第３の導体層１３、第３の絶縁層２３および第４の導体層１４が、この順で積層されることにより形成されている。
表面層としての第１の導体層１１の導体パターン１１１，１１２には、電子部品（図示せず）が実装される。基板本体２の最下層の導体層である第４の導体層１４には、複数の導体パターン１４１〜１４５が形成されている。第１の導体層１１の導体パターン１１１は、ビアホール６１，６２を介して、第４の導体層１４の導体パターン１４１，１４２に接続されている。また、第１の導体層１１の導体パターン１１２は、ビアホール６３，６４を介して、第４の導体層１４の導体パターン１４３、１４４に接続されている。発熱する電子部品を実装している表面層としての第１の導体層１１から、ビアホール６１〜６４を介して、基板本体２の最下層の第４の導体層１４へ熱が逃がされ、ひいては、放熱板３側へ放熱されるようになっている。 The substrate body 2 is formed by laminating a plurality of conductor layers 11 to 14 via insulating layers 21 to 23. That is, the substrate body 2 includes the first conductor layer 11, the first insulating layer 21, the second conductor layer 12, the second insulating layer 22, the third conductor layer 13, and the third insulating layer as surface layers. The layer 23 and the fourth conductor layer 14 are formed by being laminated in this order.
Electronic components (not shown) are mounted on the conductor patterns 111 and 112 of the first conductor layer 11 as the surface layer. A plurality of conductor patterns 141 to 145 are formed on the fourth conductor layer 14 which is the lowermost conductor layer of the substrate body 2. The conductor pattern 111 of the first conductor layer 11 is connected to the conductor patterns 141 and 142 of the fourth conductor layer 14 through via holes 61 and 62. In addition, the conductor pattern 112 of the first conductor layer 11 is connected to the conductor patterns 143 and 144 of the fourth conductor layer 14 through via holes 63 and 64. Heat is released from the first conductor layer 11 as the surface layer on which the heat generating electronic component is mounted to the fourth conductor layer 14 at the lowest layer of the substrate body 2 through the via holes 61 to 64, and consequently The heat is dissipated to the heat radiating plate 3 side.

第１の接着層４および第２の接着層５の合計厚みの最大値ｔsummaxは、各絶縁層２１〜２３の厚みｔ１，ｔ２，ｔ３よりも薄くされている。すなわち、ｔsummax＜ｔ１、ｔsummax＜ｔ２、およびｔsummax＜ｔ３の関係がそれぞれ満たされている。これにより、基板本体２と放熱板３との間の距離を短くして、放熱板３側への放熱性を高めている。
次いで、図２を参照して、本多層回路基板１の製造方法を説明する。まず、図２（ａ）に示すように、放熱板３の表面３ａに、硬化前の状態（すなわち，未硬化または半硬化の状態）にある熱硬化性樹脂としての第１の樹脂４０を例えば層状に塗布する。未硬化状態の第１の樹脂４０を繊維束に含浸させている、いわゆるプリプレグの場合は、そのプリプレグを放熱板３に貼り付けることになる。 The maximum value tsummax of the total thickness of the first adhesive layer 4 and the second adhesive layer 5 is made thinner than the thicknesses t1, t2, t3 of the insulating layers 21-23. That is, the relationships of tsummax <t1, tsummax <t2, and tsummax <t3 are satisfied. Thereby, the distance between the board | substrate body 2 and the heat sink 3 is shortened, and the heat dissipation to the heat sink 3 side is improved.
Next, a method for manufacturing the multilayer circuit board 1 will be described with reference to FIG. First, as shown in FIG. 2A, a first resin 40 as a thermosetting resin in a state before curing (that is, an uncured or semi-cured state) is applied to the surface 3a of the heat radiating plate 3, for example. Apply in layers. In the case of a so-called prepreg in which the fiber bundle is impregnated with the uncured first resin 40, the prepreg is attached to the heat sink 3.

放熱板３に例えば塗布された第１の樹脂４０を減圧下（例えば真空状態）で加熱して第１の樹脂４０を熱硬化させ、これにより、図２（ｂ）に示すように、放熱板３に接合された第１の接着層４を形成する。減圧するのは、第１の樹脂４０内の気泡を取り除くためである。これにより、硬化後の第１の接着層４内に不要な空隙が残存することを防止でき、ひいては、絶縁不良の発生を防止することができる。   For example, the first resin 40 applied to the heat radiating plate 3 is heated under reduced pressure (for example, in a vacuum state) to thermally cure the first resin 40. As a result, as shown in FIG. First adhesive layer 4 joined to 3 is formed. The reason why the pressure is reduced is to remove bubbles in the first resin 40. Thereby, it is possible to prevent unnecessary voids from remaining in the first adhesive layer 4 after being cured, and thus it is possible to prevent the occurrence of insulation failure.

次いで、図２（ｃ）に示すように、既に硬化された第１の接着層４の表面に、硬化前の状態（すなわち，未硬化または半硬化の状態）にある熱硬化性樹脂としての第２の樹脂５０を例えば塗布する。未硬化の第１の樹脂５０を繊維束に含浸させている、いわゆるプリプレグの場合は、そのプリプレグを第１の接着層４に貼り付けることになる。
次いで、図２（ｄ）に示すように、第１の接着層４の表面に例えば塗布された第２の樹脂５０の上に、予め形成されたサブアセンブリとしての基板本体２を載せて、真空状態とする。そして、互いの間に、第１の接着層４および硬化前の第２の樹脂５０の層を介在させた基板本体２および放熱板３を上下から積層方向Ｘ１に加圧しつつ加熱する。これにより、第２の樹脂５０を熱硬化させて、図２（ｅ）に示すように、第４の導体層１４および第１の接着層４間を接合した第２の接着層５を形成するとともに、多層回路基板１を形成する。 Next, as shown in FIG. 2 (c), the first cured adhesive layer 4 has a surface as a thermosetting resin in a state before curing (that is, in an uncured or semi-cured state). For example, the second resin 50 is applied. In the case of a so-called prepreg in which the fiber bundle is impregnated with the uncured first resin 50, the prepreg is attached to the first adhesive layer 4.
Next, as shown in FIG. 2D, the substrate main body 2 as a sub-assembly formed in advance is placed on the second resin 50 applied, for example, on the surface of the first adhesive layer 4, and vacuum is applied. State. Then, the substrate main body 2 and the heat radiating plate 3 with the first adhesive layer 4 and the second resin 50 before curing interposed therebetween are heated while being pressed in the stacking direction X1 from above and below. As a result, the second resin 50 is thermally cured to form the second adhesive layer 5 in which the fourth conductor layer 14 and the first adhesive layer 4 are joined as shown in FIG. At the same time, the multilayer circuit board 1 is formed.

第１の樹脂４０および第２の樹脂５０の少なくとも一方として、接着剤として公知のエポキシ系樹脂を用いることができる。また、第１の樹脂４０および第２の樹脂５０の少なくとも一方に、熱伝導性を高めるためにセラミックが含有されていてもよい。また、第１の樹脂４０および第２の樹脂５０の少なくとも一方に、絶縁抵抗を下げない範囲で熱伝導性を高めるために、金属およびカーボンの少なくとも一方が含有されていてもよい。   As at least one of the first resin 40 and the second resin 50, a known epoxy resin can be used as an adhesive. In addition, ceramic may be contained in at least one of the first resin 40 and the second resin 50 in order to increase thermal conductivity. In addition, at least one of the metal and carbon may be contained in at least one of the first resin 40 and the second resin 50 in order to increase the thermal conductivity within a range where the insulation resistance is not lowered.

本実施の形態によれば、下記の作用効果を奏する。すなわち、図２（ｄ）に示した第２の接着層５を形成する加熱プレス工程では、既に硬化している第１の接着層４は、基板本体２と放熱板３との間で加圧されても、所要の厚みを確保することができる。
したがって、第２の接着層５を形成する工程において、加圧の影響で第２の接着層５の厚みが、例えば基板本体２の最下層である第４の導体層１４の導体パターン１４１〜１４５のエッジ部分の影響で、部分的に薄くなるようなことがあっても、基板本体２と放熱板３との間に、既に硬化している第１の接着層４の厚みｔ４〔図２（ｅ）を参照〕以上の距離を確保することができる。したがって、製造された多層回路基板において、導体パターン１４１〜１４４と放熱板３とを確実に絶縁しておくことができる。このように絶縁性の確保の信頼性を高くすることができるので、可及的に、両接着層４，５の厚みを十分に薄くすることが可能となり、その結果、放熱板３への放熱性を高くすることができる。 According to the present embodiment, the following operational effects are obtained. That is, in the hot press process for forming the second adhesive layer 5 shown in FIG. 2D, the already cured first adhesive layer 4 is pressed between the substrate body 2 and the heat sink 3. Even if it is done, a required thickness can be ensured.
Accordingly, in the step of forming the second adhesive layer 5, the thickness of the second adhesive layer 5 is, for example, the conductor patterns 141 to 145 of the fourth conductor layer 14 that is the lowermost layer of the substrate body 2 due to the influence of pressure. The thickness t4 of the first adhesive layer 4 that has already hardened between the substrate body 2 and the heat radiating plate 3 even if it becomes partially thin due to the influence of the edge portion of FIG. See e)] The above distance can be secured. Therefore, in the manufactured multilayer circuit board, the conductor patterns 141-144 and the heat sink 3 can be reliably insulated. Since the reliability of ensuring insulation can be increased in this way, the thickness of both adhesive layers 4 and 5 can be made sufficiently thin as much as possible. As a result, heat dissipation to the heat sink 3 can be achieved. Sexuality can be increased.

また、図１を参照して、基板本体２と放熱板３との間に、第１の接着層４の厚みｔ４以上の距離を確保することができるので、第１の接着層４および第２の接着層５の合計厚みの最大値ｔsummaxを、基板本体２の各絶縁層２１〜２３の厚みｔ１，ｔ２，ｔ３よりも薄くすることが実質的に可能となり、その結果、基板本体２を放熱板３に十分に近づけて配置することができ、放熱性をより向上することができる。   In addition, referring to FIG. 1, a distance equal to or greater than the thickness t4 of the first adhesive layer 4 can be secured between the substrate body 2 and the heat radiating plate 3, so that the first adhesive layer 4 and the second adhesive layer 4 can be secured. It is possible to make the maximum value tsummax of the total thickness of the adhesive layers 5 substantially smaller than the thicknesses t1, t2, and t3 of the insulating layers 21 to 23 of the substrate body 2, and as a result, the substrate body 2 is dissipated. It can arrange | position close enough to the board 3, and can improve heat dissipation more.

また、第１の接着層４および第２の接着層５のうち放熱板３に接合される第１の接着層４を構成する第１の樹脂４０を、先に硬化させるようにしているで、第１の接着層４を形成する工程において、基板本体２に熱負荷をかけないで済む。したがって、基板本体２の各絶縁層２１〜２３を構成する樹脂に悪影響を及ぼすおそれがない。
なお、第１の接着層４および第２の接着層５を形成するための第１の樹脂４０および第２の樹脂５０は、異なる材料からなっていてもよいが、同じ材料からなっていることが好ましい。すなわち、同じ材料からなっている場合、両樹脂４０，５０のなじみがよいので、第１の接着層４と第２の接着層５の間の接着力を高くできるうえで好ましい。 Further, the first resin 40 constituting the first adhesive layer 4 to be bonded to the heat sink 3 out of the first adhesive layer 4 and the second adhesive layer 5 is cured first, In the step of forming the first adhesive layer 4, it is not necessary to apply a thermal load to the substrate body 2. Therefore, there is no possibility that the resin constituting each of the insulating layers 21 to 23 of the substrate body 2 will be adversely affected.
Note that the first resin 40 and the second resin 50 for forming the first adhesive layer 4 and the second adhesive layer 5 may be made of different materials, but are made of the same material. Is preferred. That is, in the case where they are made of the same material, the compatibility of both resins 40 and 50 is good, which is preferable in that the adhesive force between the first adhesive layer 4 and the second adhesive layer 5 can be increased.

また、本実施の形態では、図２（ｃ）に示すように第１の接着層４に第２の樹脂５０を塗布等したが、これに代えて、基板本体２の下面に第２の樹脂５０を塗布等するようにしてもよい。
次いで、図３は本発明の別の実施の形態に係る多層回路基板の製造方法を示している。その製造方法では、まず、図３（ａ）に示すように基板本体２の下面に第１の樹脂４０を塗布等する。次いで、塗布等した第１の樹脂４０を硬化させて、図３（ｂ）に示すように、基板本体２の最下層に接合された第１の接着層４Ａを形成する。 In the present embodiment, the second resin 50 is applied to the first adhesive layer 4 as shown in FIG. 2C, but instead, the second resin is applied to the lower surface of the substrate body 2. 50 may be applied.
FIG. 3 shows a method for manufacturing a multilayer circuit board according to another embodiment of the present invention. In the manufacturing method, first, the first resin 40 is applied to the lower surface of the substrate body 2 as shown in FIG. Next, the applied first resin 40 is cured to form a first adhesive layer 4A bonded to the lowermost layer of the substrate body 2 as shown in FIG.

次いで、図３（ｃ）に示すように、第１の接着層４Ａおよび放熱板３の間に第２の樹脂５０を介在させた状態で、加熱プレスすることにより、第２の樹脂５０を熱硬化させる。これにより、図３（ｄ）に示すように、第２の接着層５Ａを形成して、多層回路基板１Ａを製造する。図３（ｃ）のように第１の接着層４Ａおよび放熱板３の間に第２の樹脂５０を介在させる前段階として、第２の樹脂５０を、第１の接着層４Ａまたは放熱板３の何れか一方に塗布等しておけばよい。図３の実施の形態の構成要素において、図２の実施の形態と同じ構成要素には、図２の実施の形態と同じ参照符号を付してある。   Next, as shown in FIG. 3C, the second resin 50 is heated by pressing with the second resin 50 interposed between the first adhesive layer 4 </ b> A and the heat radiating plate 3. Harden. Thereby, as shown in FIG. 3D, the second adhesive layer 5A is formed, and the multilayer circuit board 1A is manufactured. As shown in FIG. 3 (c), as a step before the second resin 50 is interposed between the first adhesive layer 4A and the heat radiating plate 3, the second resin 50 is replaced with the first adhesive layer 4A or the heat radiating plate 3. What is necessary is just to apply | coat etc. to any one of these. In the components of the embodiment of FIG. 3, the same reference numerals as those of the embodiment of FIG. 2 are given to the same components as those of the embodiment of FIG.

本実施の形態によれば、下記の作用効果を奏する。すなわち、図３（ｃ）に示す加熱プレス工程では、既に硬化している第１の接着層４Ａは、基板本体２と放熱板３との間で加圧されても、所要の厚みを確保することができる。
したがって、次の第２の接着層５Ａを形成する工程において、加圧の影響で第２の接着層５Ａの厚みが、例えば基板本体２の最下層である第４の導体層１４の導体パターン１４１〜１４５のエッジ部分の影響で、部分的に薄くなるようなことがあっても、基板本体２と放熱板３との間に、既に硬化している第１の接着層４Ａの厚みｔ４〔図２（ｅ）を参照〕以上の距離を確保することができる。したがって、製造された多層回路基板１Ａにおいて、導体パターン１４１〜１４５と放熱板３とを確実に絶縁しておくことができる。このように絶縁性の確保の信頼性を高くすることができるので、可及的に、両接着層４Ａ，５Ａの厚みを十分に薄くすることが可能となり、その結果、放熱板３への放熱性を高くすることができる。 According to the present embodiment, the following operational effects are obtained. That is, in the heat press step shown in FIG. 3C, the first cured adhesive layer 4A is secured to the required thickness even if it is pressed between the substrate body 2 and the heat radiating plate 3. be able to.
Therefore, in the next step of forming the second adhesive layer 5A, the thickness of the second adhesive layer 5A is, for example, the conductor pattern 141 of the fourth conductor layer 14 which is the lowermost layer of the substrate body 2 due to the influence of pressure. The thickness t4 of the first adhesive layer 4A that has already hardened between the substrate body 2 and the heat sink 3 even though it may be partially thin due to the influence of the edge portion of ~ 145 [FIG. 2 (e) can be ensured. Therefore, in the manufactured multilayer circuit board 1A, the conductor patterns 141 to 145 and the heat sink 3 can be reliably insulated. Since the reliability of ensuring insulation can be increased in this way, the thickness of both adhesive layers 4A and 5A can be made sufficiently thin as much as possible, and as a result, heat dissipation to the heat sink 3 can be achieved. Sexuality can be increased.

また、基板本体２と放熱板３との間に、第１の接着層４Ａの厚みｔ４Ａ以上の距離を確保することができるので、第１の接着層４Ａおよび第２の接着層５Ａの合計厚みの最大値ｔＡsummaxを、基板本体２の各絶縁層２１〜２３の厚みｔ１，ｔ２，ｔ３よりも薄くすることが実質的に可能となり、その結果、基板本体２を放熱板３に十分に近づけて配置することができ、放熱性をより向上することができる。   Moreover, since the distance more than thickness t4A of 1st contact bonding layer 4A can be ensured between the board | substrate body 2 and the heat sink 3, total thickness of 4 A of 1st contact bonding layers and 5 A of 2nd contact bonding layers. Can be made substantially thinner than the thicknesses t1, t2 and t3 of the insulating layers 21 to 23 of the substrate body 2, and as a result, the substrate body 2 can be made sufficiently close to the radiator plate 3. It can arrange | position and can improve heat dissipation more.

なお、第１の接着層４Ａおよび第２の接着層５Ａを形成するための第１の樹脂４０および第２の樹脂５０は、異なる材料からなっていてもよいが、同じ材料からなっていることが好ましい。すなわち、同じ材料からなっている場合、両樹脂４０，５０のなじみがよいので、第１の接着層４Ａと第２の接着層５Ａの間の接着力を高くできるうえで好ましい。 本発明は上記各実施の形態に限定されるものではなく、請求項記載の範囲内で種々の変更を施すことができる。   Note that the first resin 40 and the second resin 50 for forming the first adhesive layer 4A and the second adhesive layer 5A may be made of different materials, but are made of the same material. Is preferred. That is, in the case where they are made of the same material, the familiarity between the two resins 40 and 50 is good, which is preferable in that the adhesive force between the first adhesive layer 4A and the second adhesive layer 5A can be increased. The present invention is not limited to the above embodiments, and various modifications can be made within the scope of the claims.

１；１Ａ…多層回路基板、２…基板本体、３…放熱板、４；４Ａ…第１の接着層、５；５Ａ…第２の接着層、１１…第１の導体層、１１１，１１２…導体パターン、１２…第２の導体層、１３…第３の導体層、１４…第４の導体層、１４１〜１４５…導体パターン、２１…第１の絶縁層、２２…第２の絶縁層、２３…第３の絶縁層、４０…第１の樹脂、５０…第２の樹脂、Ｘ１…積層方向、ｔ１，ｔ２，ｔ３…（各絶縁層の）厚み、ｔ４；ｔ４Ａ…（第１の接着層の）厚み、ｔsummax；ｔＡsummax…（第１の接着層および第２の接着層の）合計厚みの最大値   DESCRIPTION OF SYMBOLS 1; 1A ... Multilayer circuit board, 2 ... Board | substrate body, 3 ... Heat sink, 4; 4A ... 1st contact bonding layer, 5; 5A ... 2nd contact bonding layer, 11 ... 1st conductor layer, 111, 112 ... Conductor pattern, 12 ... 2nd conductor layer, 13 ... 3rd conductor layer, 14 ... 4th conductor layer, 141-145 ... conductor pattern, 21 ... 1st insulating layer, 22 ... 2nd insulating layer, 23 ... 3rd insulating layer, 40 ... 1st resin, 50 ... 2nd resin, X1 ... Lamination direction, t1, t2, t3 ... (Each insulating layer) thickness, t4; t4A ... (1st adhesion | attachment) Thickness of layer, tsummax; tAsummax ... maximum value of total thickness (of first adhesive layer and second adhesive layer)

Claims (5)

複数の導体層を絶縁層を介して積層してなる基板本体と、放熱板とが、絶縁性の第１および第２の接着層を介して接合され、
上記複数の導体層のうちの最下導体層は、上記基板本体の周縁から離隔した端面と、上記放熱板に対向する対向面と、上記対向面と上記端面とで形成されるエッジ部と、を有する導体パターンを含む、多層回路基板
の製造方法であって、
第１の樹脂を硬化させて放熱板に接合された第１の接着層を形成する工程と、
上記基板本体および上記放熱板を積層方向に加圧しつつ、上記最下導体層の上記導体パターンの上記対向面と上記放熱板との間に上記第１の接着層が介在する状態で上記基板本体と上記第１の接着層との間に介在させた第２の樹脂を硬化させて第２の接着層を形成する工程と、を含む多層回路基板の製造方法。 A substrate body formed by laminating a plurality of conductor layers via an insulating layer, and a heat sink are joined via insulating first and second adhesive layers ,
The lowermost conductor layer of the plurality of conductor layers is an end surface spaced from the peripheral edge of the substrate body, an opposing surface facing the heat sink, an edge portion formed by the opposing surface and the end surface, A method for producing a multilayer circuit board, comprising a conductor pattern having
Forming a first adhesive layer bonded to the heat plate release by curing the first resin,
While pressing the substrate body and the heat sink in the laminating direction, the substrate book in a state where the first adhesive layer is interposed between the facing surface of the conductor pattern of the lowermost conductor layer and the heat sink. Forming a second adhesive layer by curing a second resin interposed between the body and the first adhesive layer. 請求項１において、上記第１の接着層および上記第２の接着層は、第１の樹脂および第２の樹脂を熱硬化させて形成される多層回路基板の製造方法。 Oite to claim 1, said first adhesive layer and the second adhesive layer, the first resin and second resin a method of manufacturing a multi-layer circuit board that is formed by thermally curing. 複数の導体層を絶縁層を介して積層してなる基板本体と、放熱板とが、絶縁性の第１および第２の接着層を介して接合され、A substrate body formed by laminating a plurality of conductor layers via an insulating layer, and a heat sink are joined via insulating first and second adhesive layers,
最下絶縁層の下面に形成された最下導体層は、上記基板本体の周縁から離隔した端面と、上記放熱板に対向する対向面と、上記対向面と上記端面とで形成されるエッジ部と、を有する導体パターンを含む、多層回路基板The lowermost conductor layer formed on the lower surface of the lowermost insulating layer includes an end surface spaced from the peripheral edge of the substrate body, an opposing surface facing the heat sink, and an edge portion formed by the opposing surface and the end surface A multilayer circuit board comprising a conductor pattern having
の製造方法であって、A manufacturing method of
第１の樹脂を硬化させて、上記最下絶縁層の上記下面と上記導体パターンの上記端面および上記対向面とを覆うように上記基板本体に接合された第１の接着層を形成する工程と、Curing a first resin to form a first adhesive layer bonded to the substrate body so as to cover the lower surface of the lowermost insulating layer and the end surface and the opposing surface of the conductor pattern; ,
上記基板本体および上記放熱板を積層方向に加圧しつつ上記放熱板と上記第１の接着層との間に介在させた第２の樹脂を硬化させて第２の接着層を形成する工程と、を含む多層回路基板の製造方法。Curing the second resin interposed between the heat sink and the first adhesive layer while pressurizing the substrate body and the heat sink in the stacking direction to form a second adhesive layer; A method for manufacturing a multilayer circuit board comprising: 請求項１から３の何れか一項において、上記第１の接着層および上記第２の接着層の合計厚みの最大値が、上記基板本体の各絶縁層の厚みよりも薄くされている多層回路基板の製造方法。 4. The multilayer circuit according to claim 1, wherein the maximum value of the total thickness of the first adhesive layer and the second adhesive layer is thinner than the thickness of each insulating layer of the substrate body. A method for manufacturing a substrate. 請求項１から４の何れか１項において、上記第１の樹脂および上記第２の樹脂は同じ材料からなる多層回路基板の製造方法。 In any one of claims 1 to 4, the first resin and the second resin is a method for manufacturing a multilayer circuit board made of the same material.
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