JP5555226B2 - 半導体加工中のフレキシブル基板のwarpおよびbowを減少させるアセンブリおよび方法 - Google Patents
半導体加工中のフレキシブル基板のwarpおよびbowを減少させるアセンブリおよび方法 Download PDFInfo
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78603—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the insulating substrate or support
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/016—Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31786—Of polyester [e.g., alkyd, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31942—Of aldehyde or ketone condensation product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Thin Film Transistor (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Description
(関連出願)
本願は、その全体が本明細書に援用される2008年4月8日に出願された米国仮出願出願番号第61/043223号の優先権を主張する。
(政府資金の記述)
本研究は、米国陸軍研究所(ARL)の助成番号第W911NF−04−2−005号により少なくとも一部支援された。米国政府は本発明において一定の権利を有する。
む接着層で剛性支持体に取り付けられている、アセンブリを提供する。
を乾燥させることが可能である。いずれの加熱工程でも、実質的にすべての溶媒が取り除かれるまで、層は約10〜120分間加熱することが可能である。当業者には、接着剤材料、フレキシブル基板および/または剛性キャリヤが加熱中に安定なままであるとすると、任意の加熱工程でより高い温度(例えば300℃以下)を使用できることが理解されるだろう。
に限定されない。好ましい絶縁層は、プラズマ増強化学蒸着法(PECVD)により成膜可能な層、例えばSiNとSiO2が含まれる。そのような金属膜は、通常、約50Å〜
約10,000Åの範囲の厚さを有し得る。ある実施形態では、厚さは約100Å〜約5000Å、または約500Å〜約5000Å、または約1000Å〜約5000Åである。
00Åの範囲の厚さを有し得る。ある実施形態では、厚さは約100Å〜約5000Å、または約500Å〜約5000Å、または約1000Å〜約5000Åである。
含まれる。好ましい両面接着テープには、両面が粉末コーティングされたシリコーン接着テープ(Argon PC500ファミリー)または高性能シリコーン接着テープ(dhesive Research Arcare 7876)が含まれるがこれらに限定されない。
実施例
様々な例証的なキャリヤを、例証的な感圧性接着材料(アクリル、ポリアクリレートおよびシリコーンを含む)を使用して、表1に記載されているような厚みを有する2つの例証的なフレキシブル基板(PENまたはステンレス鋼(SS))のうちの1つに結合した。接着材料はスピンオン接着剤および接着テープを含む。
Claims (14)
- フレキシブル基板アセンブリの製造方法であって、
180℃よりも低いガラス転移温度および220℃よりも高い分解温度を有する粘弾性ポリマーを含む接着層を用いて、剛性支持体にフレキシブル基板を取り付ける取付工程であって、前記接着層は、ポリアクリル、アクリル、ウレタン、エポキシ、フェノール、ビスマレイミド、シリコーン、シロキサン、n−アクリル酸ブチル、ポリシロキサン、またはポリシリコーンを含む、前記取付工程と、
前記フレキシブル基板の表面に、1つまたは複数の薄膜トランジスタ、有機発光ダイオード、無機発光ダイオード、電極アレイ、電界効果トランジスタ、パッシブ構造およびそれらの組み合わせを形成する形成工程と、を含む方法。 - 前記取付工程は、
前記剛性支持体の表面に前記接着層を堆積させる工程と、
前記接着層が前記剛性支持体と前記フレキシブル基板の間に存在するように、前記剛性支持体と前記フレキシブル基板とを結合する工程と、
を含む請求項1に記載の方法。 - 前記接着層は、約10〜約1000ppm/℃の範囲の熱膨張率を有する請求項1または2に記載の方法。
- 前記接着層は、約27mPaリットル/秒未満の割合で脱気される請求項1−3のいずれか一項に記載の方法。
- 前記剛性支持体は、半導体ウェーハ、アルミナ、ガラス、または熱膨張率がフレキシブル基板に適合した材料を含む請求項1−4のいずれか一項に記載の方法。
- 前記フレキシブル基板は、プラスチック基板または金属基板である請求項1−5のいずれか一項に記載の方法。
- 前記フレキシブル基板と前記剛性支持体を接続する前に、
前記接着層上に絶縁層または金属層を直接形成する工程と、
前記絶縁層または前記金属層上に両面接着テープを直接配置する工程と
をさらに含む請求項1−6のいずれか一項に記載の方法。 - 前記形成工程の後に前記剛性支持体を前記フレキシブル基板から取り外す工程をさらに含む請求項1−7のいずれか一項に記載の方法。
- フレキシブル基板、剛性支持体、および接着層を備えたアセンブリであって、
前記フレキシブル基板は、該フレキシブル基板と剛性支持体の間において、接着層を用いて前記剛性支持体に取り付けられており、前記接着層が、180℃よりも低いガラス転移温度および220℃よりも高い分解温度を有する粘弾性ポリマーの接着層を含み、前記接着層は、ポリアクリル、アクリル、ウレタン、エポキシ、フェノール、ビスマレイミド、シリコーン、シロキサン、n−アクリル酸ブチル、ポリシロキサン、またはポリシリコーンを含む、アセンブリ。 - 前記接着層は、約10〜約1000ppm/℃の範囲の熱膨張率を有する請求項9に記載のアセンブリ。
- 前記接着層は、約27mPaリットル/秒未満の割合で脱気される請求項9または10に記載のアセンブリ。
- 前記剛性支持体は、半導体ウェーハ、アルミナ、ガラス、または熱膨張率がフレキシブル基板に適合した材料を含む請求項9−11のいずれか一項に記載のアセンブリ。
- 前記接着層上に直接形成された絶縁層または金属層と、
前記絶縁層または前記金属層上に直接形成された両面接着テープとをさらに備え、
前記フレキシブル基板が両面接着テープに接触している請求項9−12のいずれか一項に記載のアセンブリ。 - フレキシブルディスプレイの処理方法であって、
フレキシブルディスプレイを提供する工程と、
請求項1−9のいずれか一項に記載の剛性基板に、前記フレキシブルディスプレイを取り付ける工程であって、前記フレキシブルディスプレイが前記フレキシブル基板である、前記工程と、
を含む方法。
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US4322308P | 2008-04-08 | 2008-04-08 | |
US61/043,223 | 2008-04-08 | ||
PCT/US2009/039577 WO2009126544A1 (en) | 2008-04-08 | 2009-04-06 | Assemblies and methods for reducing warp and bow of a flexible substrate during semiconductor processing |
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JP2011520248A5 JP2011520248A5 (ja) | 2012-05-24 |
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US (1) | US8685201B2 (ja) |
EP (1) | EP2274162A1 (ja) |
JP (1) | JP5555226B2 (ja) |
KR (1) | KR101517263B1 (ja) |
CN (1) | CN101980861B (ja) |
SG (1) | SG188921A1 (ja) |
TW (1) | TWI488750B (ja) |
WO (1) | WO2009126544A1 (ja) |
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-
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- 2009-04-06 CN CN200980111340.9A patent/CN101980861B/zh active Active
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US20110064953A1 (en) | 2011-03-17 |
US8685201B2 (en) | 2014-04-01 |
CN101980861A (zh) | 2011-02-23 |
KR20110053921A (ko) | 2011-05-24 |
JP2011520248A (ja) | 2011-07-14 |
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TWI488750B (zh) | 2015-06-21 |
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