JP5539574B2 - 表示装置 - Google Patents
表示装置 Download PDFInfo
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- JP5539574B2 JP5539574B2 JP2013134323A JP2013134323A JP5539574B2 JP 5539574 B2 JP5539574 B2 JP 5539574B2 JP 2013134323 A JP2013134323 A JP 2013134323A JP 2013134323 A JP2013134323 A JP 2013134323A JP 5539574 B2 JP5539574 B2 JP 5539574B2
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- semiconductor film
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- 239000010408 film Substances 0.000 claims description 118
- 239000004065 semiconductor Substances 0.000 claims description 106
- 239000000758 substrate Substances 0.000 claims description 47
- 239000012535 impurity Substances 0.000 claims description 8
- 239000010409 thin film Substances 0.000 claims description 7
- 239000010410 layer Substances 0.000 description 75
- 238000005530 etching Methods 0.000 description 15
- 239000004973 liquid crystal related substance Substances 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 230000005611 electricity Effects 0.000 description 8
- 230000003068 static effect Effects 0.000 description 8
- 230000001681 protective effect Effects 0.000 description 7
- 101100533625 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) drc-4 gene Proteins 0.000 description 6
- 101150090425 SLD1 gene Proteins 0.000 description 6
- 101150033482 SLD2 gene Proteins 0.000 description 6
- 101100533627 Schizosaccharomyces pombe (strain 972 / ATCC 24843) drc1 gene Proteins 0.000 description 6
- 150000002500 ions Chemical class 0.000 description 6
- 102100031235 Chromodomain-helicase-DNA-binding protein 1 Human genes 0.000 description 4
- 102100031266 Chromodomain-helicase-DNA-binding protein 3 Human genes 0.000 description 4
- 101000777047 Homo sapiens Chromodomain-helicase-DNA-binding protein 1 Proteins 0.000 description 4
- 101000777071 Homo sapiens Chromodomain-helicase-DNA-binding protein 3 Proteins 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 102100031265 Chromodomain-helicase-DNA-binding protein 2 Human genes 0.000 description 3
- 101000777079 Homo sapiens Chromodomain-helicase-DNA-binding protein 2 Proteins 0.000 description 3
- 101000880945 Homo sapiens Down syndrome cell adhesion molecule Proteins 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- -1 C D2 Proteins 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
Claims (3)
- 絶縁基板の上に第一の信号線と、前記第一の信号線に隣接する第二の信号線と、第一のゲート電極と、第二のゲート電極とが形成された第一の導電層と、
前記第一の導電層の上層に設けられた第一の絶縁層と、
前記第一の絶縁層の上層に設けられ、前記第一の信号線及び前記第二の信号線と平面的に交差するアース線が形成された第二の導電層と、
前記第一の絶縁層と前記第二の導電層との間に設けられ、前記アース線と平面的に重なり互いに離間して形成された第一の半導体膜および第二の半導体膜と、前記第一のゲート電極と平面的に重なるように設けられた第三の半導体膜と、前記第二のゲート電極と平面的に重なるように設けられた第四の半導体膜とが形成された半導体層と、を含み、
前記絶縁基板は、画素に対応する画素回路が複数配置される表示領域と、前記表示領域を囲む額縁領域とを有し、
前記第一の信号線は前記額縁領域内および前記表示領域内の両方において延伸しかつ薄膜トランジスタのゲート電極に接続するゲート信号線であり、
前記第二の信号線は前記額縁領域内において延伸し前記表示領域内には形成されておらす、
前記第二の信号線は前記第二の導電層より上層に形成され前記額縁領域から前記表示領域内を延びる透明電極であるコモン電極と接続され、
前記第三の半導体膜の一端および前記第一のゲート電極と前記ゲート信号線とは電気的に接続され、前記第三の半導体膜の他端は前記アース線と電気的に接続され、
前記第四の半導体膜の一端および前記第二のゲート電極と前記アース線とは電気的に接続され、前記第四の半導体膜の他端は前記ゲート信号線と電気的に接続され、
前記第一の半導体膜は、平面的にみて前記第一の信号線と前記アース線とが交差する部分と重なり、
前記第二の半導体膜は、平面的にみて前記第二の信号線と前記アース線とが交差する部分と重なる、
ことを特徴とする表示装置。 - 前記第一の半導体膜、前記第二の半導体膜、前記第三の半導体膜、および前記第四の半導体膜は、不純物が添加された半導体の膜を含むことを特徴とする請求項1に記載の表示装置。
- 前記第一の半導体膜は、前記アース線および前記第一の信号線以外の前記第一の導電層内の配線とは平面的に重ならず、
前記第二の半導体膜は、前記アース線及び前記第二の信号線以外の前記第一の導電層内の前記配線とは平面的に重ならないことを特徴とする請求項1または2に記載の表示装置。
Priority Applications (1)
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JP2013134323A JP5539574B2 (ja) | 2013-06-26 | 2013-06-26 | 表示装置 |
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JP2013134323A JP5539574B2 (ja) | 2013-06-26 | 2013-06-26 | 表示装置 |
Related Parent Applications (1)
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JP2008294843A Division JP5306784B2 (ja) | 2008-11-18 | 2008-11-18 | 表示装置 |
Publications (2)
Publication Number | Publication Date |
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JP2013231991A JP2013231991A (ja) | 2013-11-14 |
JP5539574B2 true JP5539574B2 (ja) | 2014-07-02 |
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JP2013134323A Active JP5539574B2 (ja) | 2013-06-26 | 2013-06-26 | 表示装置 |
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Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09297321A (ja) * | 1996-04-30 | 1997-11-18 | Hitachi Ltd | 液晶表示基板および液晶表示装置 |
JPH10282518A (ja) * | 1997-04-02 | 1998-10-23 | Hitachi Ltd | 液晶表示装置 |
JP2003131258A (ja) * | 2001-10-30 | 2003-05-08 | Matsushita Electric Ind Co Ltd | 液晶表示装置 |
JP3980462B2 (ja) * | 2002-10-30 | 2007-09-26 | 株式会社 日立ディスプレイズ | 画像表示装置 |
KR100726090B1 (ko) * | 2004-12-30 | 2007-06-08 | 엘지.필립스 엘시디 주식회사 | 박막 트랜지스터 어레이 기판 및 그 제조 방법 |
JP2007042775A (ja) * | 2005-08-02 | 2007-02-15 | Sanyo Epson Imaging Devices Corp | 保護ダイオード、保護ダイオードの製造方法、及び電気光学装置 |
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- 2013-06-26 JP JP2013134323A patent/JP5539574B2/ja active Active
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