JP5538361B2 - 透明バリア層システム - Google Patents
透明バリア層システム Download PDFInfo
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- JP5538361B2 JP5538361B2 JP2011504362A JP2011504362A JP5538361B2 JP 5538361 B2 JP5538361 B2 JP 5538361B2 JP 2011504362 A JP2011504362 A JP 2011504362A JP 2011504362 A JP2011504362 A JP 2011504362A JP 5538361 B2 JP5538361 B2 JP 5538361B2
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- layer
- transparent barrier
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- 230000004888 barrier function Effects 0.000 title claims description 95
- 239000000758 substrate Substances 0.000 claims description 58
- 230000004913 activation Effects 0.000 claims description 32
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims description 19
- 238000000576 coating method Methods 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 9
- 239000001301 oxygen Substances 0.000 claims description 9
- 229910052760 oxygen Inorganic materials 0.000 claims description 9
- 229920000642 polymer Polymers 0.000 claims description 9
- 229910007717 ZnSnO Inorganic materials 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 238000004544 sputter deposition Methods 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 239000011135 tin Substances 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 229910052845 zircon Inorganic materials 0.000 claims description 3
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 claims description 3
- 239000004812 Fluorinated ethylene propylene Substances 0.000 claims description 2
- 239000002033 PVDF binder Substances 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 claims description 2
- 229920009441 perflouroethylene propylene Polymers 0.000 claims description 2
- 230000035699 permeability Effects 0.000 claims description 2
- 239000012994 photoredox catalyst Substances 0.000 claims description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 2
- 238000000034 method Methods 0.000 description 43
- 230000005540 biological transmission Effects 0.000 description 18
- 230000008569 process Effects 0.000 description 18
- 239000000463 material Substances 0.000 description 17
- 230000009471 action Effects 0.000 description 14
- 230000007547 defect Effects 0.000 description 12
- 238000000151 deposition Methods 0.000 description 10
- 238000002834 transmittance Methods 0.000 description 9
- 230000008021 deposition Effects 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 238000001755 magnetron sputter deposition Methods 0.000 description 4
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000012466 permeate Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000005546 reactive sputtering Methods 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- KYKLWYKWCAYAJY-UHFFFAOYSA-N oxotin;zinc Chemical compound [Zn].[Sn]=O KYKLWYKWCAYAJY-UHFFFAOYSA-N 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
- C23C28/042—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material including a refractory ceramic layer, e.g. refractory metal oxides, ZrO2, rare earth oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
- C23C28/048—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material with layers graded in composition or physical properties
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/40—Coatings including alternating layers following a pattern, a periodic or defined repetition
- C23C28/42—Coatings including alternating layers following a pattern, a periodic or defined repetition characterized by the composition of the alternating layers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
Description
したがって本発明の基礎となる技術的課題は、従来技術の欠点を克服することの可能な透明バリア層システムを有するバリアシートを提供することである。殊に上記のバリア層システムが、酸素および水蒸気に対して極めて良好な阻止特性を有するようにする。さらに上記のバリアシートをロールツーロール方式で作製可能とする。また上記のバリア層システムが高いバリア作用を有するようにする。
P = P0・eEp/RT
である。
以下では有利な実施例に基づいて本発明を詳細に説明する。
Claims (15)
- 基板における透明バリア層システムにおいて、
該透明バリアシステムには一連の個別層が含まれており、
当該の個別層は、層Aと層Bとから交互に構成されており、
個別の層Aを有する前記の基板と、個別の層Bを有する前記の基板とは、水蒸気が透過する際の活性化エネルギが少なくとも1.5kJ/molの差分で異なっており、
前記の層Aには亜鉛、スズおよび酸素元素が含まれている、
ことを特徴とする
透明バリア層システム。 - 個別の層Aを有する前記の基板および個別の層Bを有する前記の基板を水蒸気が透過する際の活性化エネルギの差分は少なくとも5kJ/molである、
請求項1に記載の透明バリア層システム。 - 層Aはスパッタリングによって、または層BはPECVDによって積層される、
請求項1または2に記載の透明バリア層システム。 - 層BはマグネトロンPECVDによって積層される、
請求項3に記載の透明バリアシステム。 - 前記の層Bは、酸素、窒素、炭素元素のうちの少なくとも1つを含むジルコン、アルミニウム、亜鉛、スズ、ケイ素、チタンのグループの少なくとも1つの元素の化合物から構成される、
請求項1に記載の透明バリア層システム。 - 前記の層Bは、ケイ素、酸素および炭素元素を含む、
請求項5に記載の透明バリア層システム。 - 前記の基板側を向いた第1の個別層は層Aである、
請求項1から6までのいずれか1項に記載の透明バリア層システム。 - 前記の基板側を向いた第1の個別層は層Bである、
請求項1から6までのいずれか1項に記載の透明バリア層システム。 - 前記の基板は、ポリマシートである、
請求項1から8までのいずれか1項に記載の透明バリア層システム。 - 前記のポリマシートは、PET、PEN、ETFE、PC、PMMA、FEPまたはPVDFから構成される、
請求項9に記載の透明バリア層システム。 - 前記の基板は、保護すべき電子構成素子である、
請求項1から8までのいずれか1項に記載の透明バリア層システム。 - 前記の層AおよびBは、1つのコーティング装置にて直接前後して積層される、
請求項1から11までのいずれか1項に記載の透明バリア層システム。 - 前記の層AはZnSnO X から構成される、
請求項1に記載の透明バリア層システム。 - 前記の層BはSiO X C Y から構成される、
請求項6に記載の透明バリア層システム。 - 前記の層システムは、少なくとも層の列A−B−Aを含む、
請求項1に記載の透明バリア層システム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008019665.7 | 2008-04-18 | ||
DE102008019665A DE102008019665A1 (de) | 2008-04-18 | 2008-04-18 | Transparentes Barriereschichtsystem |
PCT/EP2009/002678 WO2009127373A1 (de) | 2008-04-18 | 2009-04-09 | Transparentes barriereschichtsystem |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011519318A JP2011519318A (ja) | 2011-07-07 |
JP5538361B2 true JP5538361B2 (ja) | 2014-07-02 |
Family
ID=40848367
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011504362A Expired - Fee Related JP5538361B2 (ja) | 2008-04-18 | 2009-04-09 | 透明バリア層システム |
Country Status (6)
Country | Link |
---|---|
US (1) | US20110033680A1 (ja) |
EP (1) | EP2288739A1 (ja) |
JP (1) | JP5538361B2 (ja) |
DE (1) | DE102008019665A1 (ja) |
TW (1) | TW200944617A (ja) |
WO (1) | WO2009127373A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2431995A1 (en) | 2010-09-17 | 2012-03-21 | Asociacion de la Industria Navarra (AIN) | Ionisation device |
DE102011017403A1 (de) * | 2011-04-18 | 2012-10-18 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Abscheiden eines transparenten Barriereschichtsystems |
DE102011017404A1 (de) * | 2011-04-18 | 2012-10-18 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Abscheiden eines transparenten Barriereschichtsystems |
JP6306392B2 (ja) * | 2014-03-27 | 2018-04-04 | 積水化学工業株式会社 | 積層バリアシート |
JP6497023B2 (ja) * | 2014-10-06 | 2019-04-10 | 凸版印刷株式会社 | ガスバリア性積層体 |
KR102089409B1 (ko) * | 2016-03-31 | 2020-03-16 | 주식회사 엘지화학 | 배리어 필름 |
DE102016226191B4 (de) * | 2016-12-23 | 2018-12-13 | HS-Group GmbH | Verfahren und Vorrichtung zur Herstellung eines mit einer Sperrschicht und einer Schutzschicht beschichteten Substrats |
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US5100720A (en) * | 1987-10-07 | 1992-03-31 | Mitsubishi Monsanto Chemical Company Limited | Laminated film having gas barrier properties |
JP3319164B2 (ja) * | 1994-08-01 | 2002-08-26 | 凸版印刷株式会社 | 透明ガスバリア材 |
JP3070404B2 (ja) * | 1994-09-08 | 2000-07-31 | 凸版印刷株式会社 | 透明で印刷層を有するガスバリア性積層フィルム |
WO1996028587A1 (de) | 1995-03-14 | 1996-09-19 | Eidgenössische Materialprüfungs- und Forschungsanstalt Empa | Plasmakammer |
DE19650286C2 (de) | 1996-02-28 | 2002-07-11 | Fraunhofer Ges Forschung | Verpackungsmaterial |
JP4121608B2 (ja) * | 1998-03-17 | 2008-07-23 | 大日本印刷株式会社 | 酸化アルミニウム蒸着フィルム、それを使用した複合フィルムおよびその製造法 |
JP2000332277A (ja) * | 1999-05-17 | 2000-11-30 | Dainippon Printing Co Ltd | 太陽電池モジュ−ル用保護シ−トおよびそれを使用した太陽電池モジュ−ル |
JP4478255B2 (ja) * | 1999-09-09 | 2010-06-09 | 大日本印刷株式会社 | 酸化アルミニウム蒸着フィルムおよびその製造法 |
US6413645B1 (en) * | 2000-04-20 | 2002-07-02 | Battelle Memorial Institute | Ultrabarrier substrates |
US7083880B2 (en) * | 2002-08-15 | 2006-08-01 | Freescale Semiconductor, Inc. | Lithographic template and method of formation and use |
US7288311B2 (en) * | 2003-02-10 | 2007-10-30 | Dai Nippon Printing Co., Ltd. | Barrier film |
JP2004327402A (ja) * | 2003-04-28 | 2004-11-18 | Kureha Chem Ind Co Ltd | 防湿エレクトロルミネッセンス素子及びその製造方法 |
JP4349078B2 (ja) * | 2003-10-29 | 2009-10-21 | 凸版印刷株式会社 | 強密着蒸着フィルムの製造方法および強密着蒸着フィルム |
JP2005212230A (ja) * | 2004-01-29 | 2005-08-11 | Tomoegawa Paper Co Ltd | 透明ガスバリアフィルムおよびエレクトロルミネッセンス素子 |
DE102004005313A1 (de) | 2004-02-02 | 2005-09-01 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Herstellung eines Ultrabarriere-Schichtsystems |
JP5275543B2 (ja) * | 2005-08-31 | 2013-08-28 | 株式会社吉野工業所 | 高いバリア性を有する合成樹脂製容器 |
JP2007216435A (ja) * | 2006-02-14 | 2007-08-30 | Tomoegawa Paper Co Ltd | ガスバリアフィルム基板、電極付きガスバリアフィルム基板、及びそれらを用いた表示素子 |
DE102007019994A1 (de) * | 2007-04-27 | 2008-10-30 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Transparente Barrierefolie und Verfahren zum Herstellen derselben |
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2008
- 2008-04-18 DE DE102008019665A patent/DE102008019665A1/de not_active Ceased
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2009
- 2009-01-23 TW TW098102714A patent/TW200944617A/zh unknown
- 2009-04-09 US US12/937,655 patent/US20110033680A1/en not_active Abandoned
- 2009-04-09 JP JP2011504362A patent/JP5538361B2/ja not_active Expired - Fee Related
- 2009-04-09 EP EP09731834A patent/EP2288739A1/de not_active Withdrawn
- 2009-04-09 WO PCT/EP2009/002678 patent/WO2009127373A1/de active Application Filing
Also Published As
Publication number | Publication date |
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JP2011519318A (ja) | 2011-07-07 |
US20110033680A1 (en) | 2011-02-10 |
EP2288739A1 (de) | 2011-03-02 |
DE102008019665A1 (de) | 2009-10-22 |
WO2009127373A1 (de) | 2009-10-22 |
TW200944617A (en) | 2009-11-01 |
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