JP5525519B2 - 分離されたヒータを有するプリントヘッド - Google Patents
分離されたヒータを有するプリントヘッド Download PDFInfo
- Publication number
- JP5525519B2 JP5525519B2 JP2011514607A JP2011514607A JP5525519B2 JP 5525519 B2 JP5525519 B2 JP 5525519B2 JP 2011514607 A JP2011514607 A JP 2011514607A JP 2011514607 A JP2011514607 A JP 2011514607A JP 5525519 B2 JP5525519 B2 JP 5525519B2
- Authority
- JP
- Japan
- Prior art keywords
- heater
- layer
- dielectric layer
- cavity
- ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000007788 liquid Substances 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 32
- 238000010438 heat treatment Methods 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 21
- 238000000151 deposition Methods 0.000 claims description 10
- 238000000059 patterning Methods 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 7
- 239000003566 sealing material Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 131
- 239000000976 ink Substances 0.000 description 56
- 239000011241 protective layer Substances 0.000 description 17
- 238000000926 separation method Methods 0.000 description 16
- 238000010586 diagram Methods 0.000 description 13
- 230000006911 nucleation Effects 0.000 description 12
- 238000010899 nucleation Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000002161 passivation Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- 238000013461 design Methods 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 8
- 230000007480 spreading Effects 0.000 description 8
- 238000003892 spreading Methods 0.000 description 8
- 229910052581 Si3N4 Inorganic materials 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 230000004907 flux Effects 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- BLIQUJLAJXRXSG-UHFFFAOYSA-N 1-benzyl-3-(trifluoromethyl)pyrrolidin-1-ium-3-carboxylate Chemical compound C1C(C(=O)O)(C(F)(F)F)CCN1CC1=CC=CC=C1 BLIQUJLAJXRXSG-UHFFFAOYSA-N 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 5
- 238000007667 floating Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007641 inkjet printing Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000009834 vaporization Methods 0.000 description 3
- 230000008016 vaporization Effects 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910002058 ternary alloy Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910018503 SF6 Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 230000003090 exacerbative effect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910002059 quaternary alloy Inorganic materials 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 1
- 229960000909 sulfur hexafluoride Drugs 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/1412—Shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1637—Manufacturing processes molding
- B41J2/1639—Manufacturing processes molding sacrificial molding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
Description
4 シリコン基板
6 従来のヒータスタック
8 電気抵抗ヒータ層
10 誘電体断熱(熱障壁)層
12 導電層
14 ヒータ領域
16 絶縁性パッシベーション層
18 保護層
20 インクチャンバ
22 ノズルプレート
24 ノズル
26 矢印
30 本発明に係るシングルインクジェットイジェクタ
32 本発明に係る分離されたヒートスタック
34 本発明に係る分離されたヒータ領域
36 分離用キャビティ
38 下部誘電体保護層
40 矢印
42 横方向の矢印
44a、b 金属リード
46 犠牲層
48 突起
50a、b ビア
51 フォトレジスト層
52 開口部
54 絶縁性封止層
55 ヒートスプレッディング層
56 孔
58 支持体
60 ヒータに沿うストリップ
62 電流の矢印
64 熱流の矢印
66 反動の矢印
68 熱流の矢印
80 インク
Claims (3)
- 第1の表面を含む基板;
前記第1の表面上に配置された第1の誘電体層;
前記第1の誘電体層を覆う第2の誘電体層であり、当該第2の誘電体層は、接触部で前記第1の誘電体層と接触し、且つキャビティ部で前記第1の誘電体層から離隔され、それにより、該キャビティ部において前記第1の誘電体層と当該第2の誘電体層との間にキャビティが形成され、該キャビティは複数の突起部を含む、第2の誘電体層;
前記第2の誘電体層上に配置され、電気コンタクト同士の間の長さ方向に沿って第1のエッジを含む加熱素子;
前記加熱素子の前記第1のエッジの外側に突出する前記複数の突起部で前記キャビティを封止する絶縁性封止材料;及び
前記加熱素子の上方に配置されたノズルを含むチャンバであり、当該チャンバが液体を受け入れる形状にされ、前記キャビティが前記液体から隔離される、チャンバ;
を有する液体イジェクタ。 - 前記基板の前記第1の表面に配置された電子回路であり、前記加熱素子と電気的に通信する電子回路、
を更に有する請求項1に記載のイジェクタ。 - 液体イジェクタ用の熱的に分離された加熱素子を形成する方法であって:
第1の表面を含む基板を用意する工程;
前記第1の表面上に犠牲材料層を堆積する工程;
パターニングされた犠牲材料層が複数の突起を含むように前記犠牲材料層をパターニングする工程;
前記パターニングされた犠牲材料層上に誘電体層を堆積する工程;
前記誘電体層上に加熱素子を形成する工程;
前記誘電体層の一部を除去して、前記パターニングされた犠牲材料層の前記複数の突起を露出させる開口部を形成する工程;
前記パターニングされた犠牲材料層を除去し、前記誘電体層と前記基板の前記第1の表面との間にキャビティを作り出す工程;及び
前記開口部を充填するように封止層を堆積することによって前記キャビティを封止する工程;
を有する方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/143,880 | 2008-06-23 | ||
US12/143,880 US8540349B2 (en) | 2008-06-23 | 2008-06-23 | Printhead having isolated heater |
PCT/US2009/003625 WO2010011250A2 (en) | 2008-06-23 | 2009-06-17 | Printhead having isolated heater |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011525437A JP2011525437A (ja) | 2011-09-22 |
JP2011525437A5 JP2011525437A5 (ja) | 2012-05-24 |
JP5525519B2 true JP5525519B2 (ja) | 2014-06-18 |
Family
ID=41430793
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011514607A Expired - Fee Related JP5525519B2 (ja) | 2008-06-23 | 2009-06-17 | 分離されたヒータを有するプリントヘッド |
Country Status (4)
Country | Link |
---|---|
US (1) | US8540349B2 (ja) |
EP (1) | EP2313276B1 (ja) |
JP (1) | JP5525519B2 (ja) |
WO (1) | WO2010011250A2 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8414786B2 (en) * | 2008-11-05 | 2013-04-09 | Lexmark International, Inc. | Planar heater stack and method for making planar heater stack with cavity within planar heater substrata above substrate |
US8079672B2 (en) * | 2008-11-05 | 2011-12-20 | Lexmark International, Inc. | Heater stack and method for making heater stack with cavity between heater element and substrate |
US8172370B2 (en) * | 2008-12-30 | 2012-05-08 | Lexmark International, Inc. | Planar heater stack and method for making planar heater stack |
US20120091121A1 (en) * | 2010-10-19 | 2012-04-19 | Zachary Justin Reitmeier | Heater stack for inkjet printheads |
JP6465567B2 (ja) * | 2014-05-29 | 2019-02-06 | キヤノン株式会社 | 液体吐出ヘッド |
EP3212414B1 (en) * | 2014-10-30 | 2020-12-16 | Hewlett-Packard Development Company, L.P. | Ink jet printhead |
JP6431605B2 (ja) * | 2014-10-30 | 2018-11-28 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. | インクジェットプリントヘッド |
CN107531053B (zh) * | 2015-07-15 | 2019-10-18 | 惠普发展公司有限责任合伙企业 | 粘附和绝缘层 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6164759A (en) * | 1990-09-21 | 2000-12-26 | Seiko Epson Corporation | Method for producing an electrostatic actuator and an inkjet head using it |
JPH07227968A (ja) | 1994-02-21 | 1995-08-29 | Canon Inc | インクジェット記録ヘッド及びその製造方法 |
JPH0848038A (ja) * | 1994-08-08 | 1996-02-20 | Canon Inc | 液体噴射記録ヘッド用基体及びその製造方法及び液体噴射記録装置 |
US5706041A (en) | 1996-03-04 | 1998-01-06 | Xerox Corporation | Thermal ink-jet printhead with a suspended heating element in each ejector |
US5751315A (en) | 1996-04-16 | 1998-05-12 | Xerox Corporation | Thermal ink-jet printhead with a thermally isolated heating element in each ejector |
US5861902A (en) * | 1996-04-24 | 1999-01-19 | Hewlett-Packard Company | Thermal tailoring for ink jet printheads |
US6340223B1 (en) * | 1999-06-28 | 2002-01-22 | Sharp Kabushiki Kaisha | Ink-jet head and fabrication method of the same |
JP2001096749A (ja) * | 1999-09-29 | 2001-04-10 | Sharp Corp | インクジェットヘッド及びその製造方法 |
US6273555B1 (en) | 1999-08-16 | 2001-08-14 | Hewlett-Packard Company | High efficiency ink delivery printhead having improved thermal characteristics |
US6755509B2 (en) | 2002-11-23 | 2004-06-29 | Silverbrook Research Pty Ltd | Thermal ink jet printhead with suspended beam heater |
US6692108B1 (en) | 2002-11-23 | 2004-02-17 | Silverbrook Research Pty Ltd. | High efficiency thermal ink jet printhead |
-
2008
- 2008-06-23 US US12/143,880 patent/US8540349B2/en not_active Expired - Fee Related
-
2009
- 2009-06-17 WO PCT/US2009/003625 patent/WO2010011250A2/en active Application Filing
- 2009-06-17 JP JP2011514607A patent/JP5525519B2/ja not_active Expired - Fee Related
- 2009-06-17 EP EP09745142A patent/EP2313276B1/en not_active Not-in-force
Also Published As
Publication number | Publication date |
---|---|
WO2010011250A2 (en) | 2010-01-28 |
US8540349B2 (en) | 2013-09-24 |
US20090315951A1 (en) | 2009-12-24 |
EP2313276A2 (en) | 2011-04-27 |
JP2011525437A (ja) | 2011-09-22 |
WO2010011250A3 (en) | 2010-04-15 |
EP2313276B1 (en) | 2012-10-03 |
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