JP5450363B2 - ウェーハを保持するための容器 - Google Patents
ウェーハを保持するための容器 Download PDFInfo
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- JP5450363B2 JP5450363B2 JP2010273607A JP2010273607A JP5450363B2 JP 5450363 B2 JP5450363 B2 JP 5450363B2 JP 2010273607 A JP2010273607 A JP 2010273607A JP 2010273607 A JP2010273607 A JP 2010273607A JP 5450363 B2 JP5450363 B2 JP 5450363B2
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- 235000012431 wafers Nutrition 0.000 claims description 140
- 230000000452 restraining effect Effects 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 4
- 229920001169 thermoplastic Polymers 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 101000931462 Homo sapiens Protein FosB Proteins 0.000 description 1
- 102100020847 Protein FosB Human genes 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67353—Closed carriers specially adapted for a single substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D51/00—Closures not otherwise provided for
- B65D51/24—Closures not otherwise provided for combined or co-operating with auxiliary devices for non-closing purposes
- B65D51/26—Closures not otherwise provided for combined or co-operating with auxiliary devices for non-closing purposes with means for keeping contents in position, e.g. resilient means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D2251/00—Details relating to container closures
- B65D2251/04—Orienting or positioning means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Description
合、特に、1個のウェーハに対するウェーハ容器において、ウェーハの不十分な偏向や移動を軽減するため、ドアに面するウェーハ縁部に沿って追加支持体を設けることが望ましい。産業界で必要とされるものは、ウェーハ前縁部に沿った強固な支持および衝撃緩衝が可能な代替ウェーハ衝撃緩衝手段である。
細については、本発明と同一日に出願された『ウェーハ容器およびカムラッチ機構を備えるドア』という件名の米国特許出願第10/ で開示されているが、ここではこれは参照によって完全に取り込まれている。(図示されていない)封止手段は、筐体部分12内のドアフレーム44と封止的に係合するよう、ドア28の周縁42に設けられる。
、ウェーハ76から若干外側に離れるように広がる。この位置において、ウェーハ76は開口前部24に向けて動かないよう維持される。
的に、旋回心軸86の反対側にドア係合部分88とアーム90とを含む。アーム90は先端部94にウェーハ係合部分92を有する。ドア28が容器から除去される場合、ウェーハ76を挿入するようアーム90を適切な位置に設けるため、また先端部94がウェーハ76に向けて内側に向けて移動される場合、アーム90を側面18,20に向けて引っ張るような付勢力をもたらすため、バネ96は各アーム90と、側面18,20との間で結合される。ドア係合部分88を受け入れるため、ドア28はパッド98を有する。
Claims (4)
- ウェーハを保持するための容器であって、この容器が、
上面、底面、1対の対向面、背面、ドアフレームにより規定される対向開口前部を備える筐体部と、
前記対向開口前部を閉止するため、ドアフレームに対して封止的に係合可能なドアと、
前記筐体部の後部に取り付けられた少なくとも1個のウェーハ制止部と、互いに対向する一対の操作可能なウェーハ支持体とからなる筐体内におけるウェーハ制止システムであって、各ウェーハ支持体は筐体部に対して旋回心軸により旋回可能に取り付けられたアームを有し、同アームはドアに接触する第1の端を備えるとともに第2の端にウェーハ係合部分を備え、ウェーハ係合部分のそれぞれは筐体部の一対の対向面のそれぞれいずれかに対応するように配置され、ドアの開放時においてウェーハ係合部分は第1の位置にあって一対の対向面のそれぞれに接近した状態となり、ウェーハが容器内に挿入されることを可能にするとともに、ウェーハが対向開口前部に向かって移動することを許容し、筐体部のドアフレームを介してドアが係合される際、アームの第1端がドアに接触してアームが旋回し、内方に移動することによりウェーハ係合部分が第1の位置から第2の位置に移動し、この第2の位置においてウェーハ係合部分のそれぞれは一対の対向面のそれぞれから離間し、ウェーハの外周部に係合して同ウェーハが筐体部の対向開口前部に向かって移動することを制止することを特徴とする容器。 - 請求項1に記載の容器であって、前記筐体部とアームとの間には複数のバネが掛け渡され、ウェーハ係合部分を第1の位置に向けて付勢し、ドアがドアフレームに係合していない時にウェーハが筐体部内に挿入されることを可能とする容器。
- 軸方向において整合され、かつ水平方向において互いに離間して平行に配置されるウェーハを保持する容器であって、
閉じられた上面、閉じられた底面、互いに対向する1対の閉じられた面、閉じられた背面、ドアフレームにより画定される開口前部を備える筐体部と、
開口前部を閉止するため、ドアフレームに対して封止的に係合可能なドアと、
前記筐体部の閉じられた背面に近接して配置されたウェーハ制止部と、筐体部内の一側において上下方向に並ぶ複数の第1のウェーハ支持体と、筐体部の他側において上下方向
に並ぶ複数の第2のウェーハ支持体とからなるウェーハ制止システムとを備え、
各ウェーハ支持体はウェーハ係合部分を備え、ウェーハ係合部分のそれぞれは筐体部の一対の対向面のそれぞれいずれかに対応するように配置され、各ウェーハ支持体は筐体部に対して旋回心軸により旋回可能に取り付けられたアームを有し、同アームはドアに接触する第1の端を備えるとともに各ウェーハ係合部分に連結されており、ドアフレームを介してドアが係合される際、アームの第1端がドアに接触してアームが旋回して、内方に移動することによりウェーハ係合部分が第1の位置から第2の位置に移動し、ウェーハ係合部分のそれぞれは第1の位置において第2の位置よりも一対の対向面のそれぞれに接近した状態となり、各ウェーハ係合部分が第1の位置にあるとき、ウェーハが容器内に挿入することを可能にするとともに、ウェーハが筐体部の開口全部に向かって移動することを許容し、ウェーハ係合部分が第2の位置にある時、操作可能なウェーハ係合部分の一部は筐体部の対抗面から離間しており、ウェーハ係合部分はウェーハの外周部に係合して同ウェーハが筐体部の対向開口前部に向かって移動することを制止することを特徴とする容器。 - 請求項3に記載の容器であって、前記筐体部とアームとの間には複数のバネが掛け渡され、ウェーハ係合部分を第1の位置に向けて付勢し、ドアがドアフレームに係合していない時にウェーハが筐体部内に挿入されることを可能とする容器。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US52081703P | 2003-11-16 | 2003-11-16 | |
US60/520,817 | 2003-11-16 | ||
US10/989,232 US7100772B2 (en) | 2003-11-16 | 2004-11-15 | Wafer container with door actuated wafer restraint |
US10/989,232 | 2004-11-15 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006540015A Division JP4927555B2 (ja) | 2003-11-16 | 2004-11-16 | ウェーハを保持するための容器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011082553A JP2011082553A (ja) | 2011-04-21 |
JP5450363B2 true JP5450363B2 (ja) | 2014-03-26 |
Family
ID=34595001
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006540015A Active JP4927555B2 (ja) | 2003-11-16 | 2004-11-16 | ウェーハを保持するための容器 |
JP2010273607A Active JP5450363B2 (ja) | 2003-11-16 | 2010-12-08 | ウェーハを保持するための容器 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006540015A Active JP4927555B2 (ja) | 2003-11-16 | 2004-11-16 | ウェーハを保持するための容器 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7100772B2 (ja) |
EP (1) | EP1694585A4 (ja) |
JP (2) | JP4927555B2 (ja) |
KR (2) | KR100853902B1 (ja) |
WO (1) | WO2005055279A2 (ja) |
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KR100927923B1 (ko) * | 2001-11-27 | 2009-11-19 | 엔테그리스, 아이엔씨. | 도어에 의해 구현되는 접지 경로를 포함하는 전방 개방웨이퍼 캐리어 |
US6644477B2 (en) * | 2002-02-26 | 2003-11-11 | Entegris, Inc. | Wafer container cushion system |
US7100772B2 (en) | 2003-11-16 | 2006-09-05 | Entegris, Inc. | Wafer container with door actuated wafer restraint |
-
2004
- 2004-11-15 US US10/989,232 patent/US7100772B2/en active Active
- 2004-11-16 JP JP2006540015A patent/JP4927555B2/ja active Active
- 2004-11-16 WO PCT/US2004/038452 patent/WO2005055279A2/en active Application Filing
- 2004-11-16 KR KR1020067009488A patent/KR100853902B1/ko active IP Right Grant
- 2004-11-16 EP EP04811236A patent/EP1694585A4/en not_active Withdrawn
- 2004-11-16 KR KR1020087011984A patent/KR100882393B1/ko not_active IP Right Cessation
-
2006
- 2006-09-01 US US11/514,796 patent/US7900776B2/en active Active
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2010
- 2010-12-08 JP JP2010273607A patent/JP5450363B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
EP1694585A2 (en) | 2006-08-30 |
US7100772B2 (en) | 2006-09-05 |
JP2007529880A (ja) | 2007-10-25 |
WO2005055279A2 (en) | 2005-06-16 |
KR100882393B1 (ko) | 2009-02-05 |
KR20060106833A (ko) | 2006-10-12 |
JP4927555B2 (ja) | 2012-05-09 |
KR20080091425A (ko) | 2008-10-13 |
JP2011082553A (ja) | 2011-04-21 |
WO2005055279A3 (en) | 2006-02-23 |
KR100853902B1 (ko) | 2008-08-25 |
US20050109667A1 (en) | 2005-05-26 |
US7900776B2 (en) | 2011-03-08 |
WO2005055279A9 (en) | 2005-07-28 |
EP1694585A4 (en) | 2008-05-28 |
US20060289333A1 (en) | 2006-12-28 |
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