JP5436298B2 - 液体吐出記録ヘッド - Google Patents
液体吐出記録ヘッド Download PDFInfo
- Publication number
- JP5436298B2 JP5436298B2 JP2010072951A JP2010072951A JP5436298B2 JP 5436298 B2 JP5436298 B2 JP 5436298B2 JP 2010072951 A JP2010072951 A JP 2010072951A JP 2010072951 A JP2010072951 A JP 2010072951A JP 5436298 B2 JP5436298 B2 JP 5436298B2
- Authority
- JP
- Japan
- Prior art keywords
- recording head
- recording
- wiring board
- support plate
- cover plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000007788 liquid Substances 0.000 title claims description 24
- 239000000758 substrate Substances 0.000 claims description 56
- 238000009429 electrical wiring Methods 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 14
- 238000007599 discharging Methods 0.000 claims description 3
- 230000008602 contraction Effects 0.000 description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/145—Arrangement thereof
- B41J2/155—Arrangement thereof for line printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/1408—Structure dealing with thermal variations, e.g. cooling device, thermal coefficients of materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14387—Front shooter
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/20—Modules
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Description
液体を吐出するための複数の記録素子と吐出口とを備える記録素子基板と、
前記記録素子基板を配置する開口部と、前記記録素子基板の端部に設けられた複数の電極と電気的に接続される、前記開口部の縁に設けられた複数の電極端子と、を備える電気配線基板と、
該記録素子基板および前記電気配線基板を支持し、該電気配線基板の線膨張係数よりも低い線膨張係数の材料から構成される支持プレートと、
前記電気配線基板の線膨張係数よりも低い線膨張係数の材料から構成され、前記支持プレートの上の前記電気配線基板に重ねられ、前記支持プレートおよび前記電気配線基板の双方に固定されたカバープレートと、を備えている。
また本実施形態においては、記録ヘッドの短手方向の両端部においては、カバープレート118と支持プレート103とを接着固定していない。このような構成にすることで加熱時に電気配線基板に発生した応力を、記録ヘッドの短手方向に逃がすことができる点で好ましい。記録ヘッドの短手方向への伸びであればその伸び量が小さいため電気接続部への影響も小さい。
103 支持プレート
117、118 カバープレート
119 電気配線基板
123 電気配線基板の開口部
Claims (3)
- 液体を吐出するための複数の記録素子と吐出口とを備える記録素子基板と、
前記記録素子基板を配置する開口部と、前記記録素子基板の端部に設けられた複数の電極と電気的に接続される、前記開口部の縁に設けられた複数の電極端子と、を備える電気配線基板と、
該記録素子基板および前記電気配線基板を支持し、該電気配線基板の線膨張係数よりも低い線膨張係数の材料から構成される支持プレートと、
前記電気配線基板の線膨張係数よりも低い線膨張係数の材料から構成され、前記支持プレートの上の前記電気配線基板に重ねられ、前記支持プレートおよび前記電気配線基板の双方に固定されたカバープレートと、
を備える液体吐出記録ヘッド。 - 液体吐出記録ヘッドの少なくとも長手方向の両端部において、前記カバープレートと前記支持プレートとが固定されていることを特徴とする請求項1に記載の液体吐出記録ヘッド。
- 前記電気配線基板において前記開口部とは別に設けられた複数の開口部を用いて、前記カバープレートと前記支持プレートとが固定されていることを特徴とする請求項2に記載の液体吐出記録ヘッド。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010072951A JP5436298B2 (ja) | 2009-06-03 | 2010-03-26 | 液体吐出記録ヘッド |
US12/790,635 US8529020B2 (en) | 2009-06-03 | 2010-05-28 | Liquid discharge recording head |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009134074 | 2009-06-03 | ||
JP2009134074 | 2009-06-03 | ||
JP2010072951A JP5436298B2 (ja) | 2009-06-03 | 2010-03-26 | 液体吐出記録ヘッド |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011011538A JP2011011538A (ja) | 2011-01-20 |
JP5436298B2 true JP5436298B2 (ja) | 2014-03-05 |
Family
ID=43300451
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010072951A Expired - Fee Related JP5436298B2 (ja) | 2009-06-03 | 2010-03-26 | 液体吐出記録ヘッド |
Country Status (2)
Country | Link |
---|---|
US (1) | US8529020B2 (ja) |
JP (1) | JP5436298B2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5858622B2 (ja) * | 2011-02-10 | 2016-02-10 | キヤノン株式会社 | インクジェット記録装置 |
JP6195368B2 (ja) * | 2013-11-11 | 2017-09-13 | キヤノン株式会社 | 液体吐出ヘッド |
EP3148812B1 (en) | 2014-05-30 | 2020-12-23 | Hewlett-Packard Development Company, L.P. | Shroud for a printhead assembly module and printhead assembly module |
JP6750855B2 (ja) * | 2016-05-27 | 2020-09-02 | キヤノン株式会社 | 液体吐出ヘッドおよび液体吐出装置 |
JP6891033B2 (ja) * | 2017-04-21 | 2021-06-18 | キヤノン株式会社 | 液体吐出ヘッド |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6067984A (ja) * | 1983-09-24 | 1985-04-18 | シャープ株式会社 | 平面表示パネルの電極端子取出構造 |
US6722756B2 (en) * | 2002-07-01 | 2004-04-20 | Hewlett-Packard Development Company, L.P. | Capping shroud for fluid ejection device |
US7188925B2 (en) * | 2004-01-30 | 2007-03-13 | Hewlett-Packard Development Company, L.P. | Fluid ejection head assembly |
US7240991B2 (en) * | 2004-03-09 | 2007-07-10 | Hewlett-Packard Development Company, L.P. | Fluid ejection device and manufacturing method |
JP2005319611A (ja) * | 2004-05-06 | 2005-11-17 | Canon Inc | インクジェット記録ヘッドの製造方法 |
JP2006281737A (ja) * | 2005-04-05 | 2006-10-19 | Canon Inc | インクジェット記録ヘッド |
JP4757011B2 (ja) * | 2005-12-16 | 2011-08-24 | キヤノン株式会社 | インクジェット記録ヘッド、および製造方法 |
JP2007296638A (ja) * | 2006-04-27 | 2007-11-15 | Canon Inc | 液体吐出記録ヘッド、液体吐出記録ヘッドその製造方法、及び液体吐出記録装置 |
-
2010
- 2010-03-26 JP JP2010072951A patent/JP5436298B2/ja not_active Expired - Fee Related
- 2010-05-28 US US12/790,635 patent/US8529020B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20100309257A1 (en) | 2010-12-09 |
JP2011011538A (ja) | 2011-01-20 |
US8529020B2 (en) | 2013-09-10 |
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