JP5401699B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP5401699B2 JP5401699B2 JP2008239243A JP2008239243A JP5401699B2 JP 5401699 B2 JP5401699 B2 JP 5401699B2 JP 2008239243 A JP2008239243 A JP 2008239243A JP 2008239243 A JP2008239243 A JP 2008239243A JP 5401699 B2 JP5401699 B2 JP 5401699B2
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Description
また、図4は、図1、図2で半導体チップ10の部分を拡大して示した平面図である。なお、半導体パッケージ1は、この発明の半導体装置に対応する。
Claims (6)
- 半導体装置であって、
矩形状の基板と、
前記基板上の周縁領域に形成されたIO回路と、
前記基板上で前記周縁領域に取り囲まれた領域に形成され、複数の機能ブロックを含むコア回路とを備え、
前記複数の機能ブロックは、互いに異なる領域に形成され、各々が1または複数の動作周波数で動作し、共通の電源電圧を受け、
前記複数の機能ブロックは、
前記基板の第1の辺に沿った周縁領域に隣接して形成される第1の機能ブロックと、
前記基板の前記第1の辺と異なる前記基板の第2の辺に沿った周縁領域に隣接して形成され、前記第1の機能ブロックの1または複数の動作周波数のうちの最大動作周波数よりも低い最大動作周波数を有する第2の機能ブロックとを含み、
前記半導体装置は、さらに、
前記基板上に形成された表面保護膜と、
前記基板上に設けられ、前記電源電圧を供給するために前記複数の機能ブロックと接続された電源配線パターンとを備え、
前記電源配線パターンは、前記電源配線パターンの一部が前記表面保護膜から露出した部分でありかつ互いに離間して設けられた複数の第1のパッド、第2のパッド、および第3のパッドを含み、
前記複数の第1のパッドは、前記基板の4辺のうち少なくとも前記第1の辺および前記第2の辺に沿った周縁領域に設けられ、
前記第3のパッドは、前記第1の機能ブロックが形成された領域に設けられ、
前記第2のパッドは、前記第2の機能ブロックが形成された領域、または前記第2の機能ブロックが形成された領域と前記基板の前記第2の辺との間の周縁領域に設けられ、
前記半導体装置は、さらに、
外部から前記電源電圧の供給を受けるために前記第1のパッドに接続された第1のボンディングワイヤと、
前記第2および第3のパッド間を接続する第2のボンディングワイヤとを備える、半導体装置。 - 前記第1の機能ブロックの最大動作周波数は、前記複数の機能ブロックの各々の1または複数の動作周波数のうちで最大である、請求項1に記載の半導体装置。
- 半導体装置であって、
矩形状の基板と、
前記基板上の周縁領域に形成されたIO回路と、
前記基板上で前記周縁領域に取り囲まれた領域に形成され、複数の機能ブロックを含むコア回路とを備え、
前記複数の機能ブロックは、前記基板上の互いに異なる領域に形成され、共通の電源電圧を受け、
前記複数の機能ブロックは、
前記基板の第1の辺に沿った周縁領域に隣接して形成される第1の機能ブロックと、
前記基板の前記第1の辺と異なる前記基板の第2の辺に沿った周縁領域に隣接して形成され、前記第1の機能ブロックよりも消費電力が小さい第2の機能ブロックとを含み、
前記半導体装置は、さらに、
前記基板上に形成された表面保護膜と、
前記基板上に設けられ、前記電源電圧を供給するために前記複数の機能ブロックと接続された電源配線パターンとを備え、
前記電源配線パターンは、前記電源配線パターンの一部が前記表面保護膜から露出した部分でありかつ互いに離間して設けられた複数の第1のパッド、第2のパッド、および第3のパッドを含み、
前記複数の第1のパッドは、前記基板の4辺のうち少なくとも前記第1の辺および前記第2の辺に沿った周縁領域に設けられ、
前記第3のパッドは、前記第1の機能ブロックが形成された領域に設けられ、
前記第2のパッドは、前記第2の機能ブロックが形成された領域、または前記第2の機能ブロックが形成された領域と前記基板の前記第2の辺との間の周縁領域に設けられ、
前記半導体装置は、さらに、
外部から前記電源電圧の供給を受けるために前記第1のパッドに接続された第1のボンディングワイヤと、
前記第2および第3のパッド間を接続する第2のボンディングワイヤとを備える、半導体装置。 - 前記第1の機能ブロックの消費電力は、前記複数の機能ブロックの各々の消費電力のうちで最大である、請求項3に記載の半導体装置。
- 前記第2のパッドと前記基板の前記第2の辺に沿った周縁領域に設けられた前記第1のパッドとの距離は、前記第2のパッドと前記第3のパッドとの距離よりも短い、請求項1〜4のいずれか1項に記載の半導体装置。
- 前記第2のボンディングワイヤは、前記第2のパッドにボール接合され、前記第3のパッドにステッチ接合される、請求項5に記載の半導体装置。
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