JP5381816B2 - ワイヤボンディング方法 - Google Patents
ワイヤボンディング方法 Download PDFInfo
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- JP5381816B2 JP5381816B2 JP2010046935A JP2010046935A JP5381816B2 JP 5381816 B2 JP5381816 B2 JP 5381816B2 JP 2010046935 A JP2010046935 A JP 2010046935A JP 2010046935 A JP2010046935 A JP 2010046935A JP 5381816 B2 JP5381816 B2 JP 5381816B2
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
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- Wire Bonding (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Laser Beam Processing (AREA)
Description
14 ボール
16 第1の凹凸
22 第2の凹凸
26 第2の電極
28 第3の凹凸
30 屈曲部
Claims (5)
- ワイヤの先端に形成されたボールの表面にフェムト秒レーザを照射して縞状の第1の凹凸を形成する工程と、
前記ボールを第1の電極に接触させて超音波振動を印加しながら押し潰すことにより、前記ワイヤを前記第1の電極にボンディングする工程とを備え、
前記第1の凹凸が延びる方向は、前記超音波振動の振幅方向に直交することを特徴とするワイヤボンディング方法。 - 前記第1の電極の表面にフェムト秒レーザを照射して縞状の第2の凹凸を形成する工程を更に備え、
前記第2の凹凸が延びる方向は、前記超音波振動の振幅方向に直交することを特徴とする請求項1に記載のワイヤボンディング方法。 - 前記第1の電極の構造及び材質に応じて前記フェムト秒レーザの波長及び出力を調整して、前記第1の凹凸と前記第2の凹凸をほぼ等しい寸法にすることを特徴とする請求項2に記載のワイヤボンディング方法。
- 前記第1の凹凸を形成する前に、前記ワイヤの先端にフェムト秒レーザを照射して前記ボールを形成する工程を更に備えることを特徴とする請求項1〜3の何れか1項に記載のワイヤボンディング方法。
- 前記ワイヤを前記第1の電極にボンディングした後に前記ワイヤを第2の電極にボンディングして、前記第1の電極と前記第2の電極の間において前記ワイヤが屈曲部を有するループ状になるようにする工程と、
前記ワイヤを前記第2の電極にボンディングする前に、前記ワイヤの前記屈曲部となる部分にフェムト秒レーザを照射して屈曲方向に直交する縞状の第3の凹凸を形成する工程とを更に備えることを特徴とする請求項1〜4の何れか1項に記載のワイヤボンディング方法。
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JP2010046935A JP5381816B2 (ja) | 2010-03-03 | 2010-03-03 | ワイヤボンディング方法 |
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JP2010046935A JP5381816B2 (ja) | 2010-03-03 | 2010-03-03 | ワイヤボンディング方法 |
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JP5381816B2 true JP5381816B2 (ja) | 2014-01-08 |
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Families Citing this family (2)
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JP5546670B1 (ja) * | 2013-06-13 | 2014-07-09 | 田中電子工業株式会社 | 超音波接合用コーティング銅ワイヤの構造 |
CN109332901B (zh) * | 2018-09-14 | 2021-01-08 | 深圳市商德先进陶瓷股份有限公司 | 陶瓷劈刀及其制作方法和应用 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS6248033A (ja) * | 1985-08-28 | 1987-03-02 | Nec Corp | ワイヤボンデイング方法 |
JP4092256B2 (ja) * | 2003-06-04 | 2008-05-28 | 財団法人レーザー技術総合研究所 | 金属密着面表面処理方法 |
JP2006210534A (ja) * | 2005-01-26 | 2006-08-10 | Sumitomo Electric Hardmetal Corp | 実装工具 |
JP5597946B2 (ja) * | 2008-10-03 | 2014-10-01 | 日産自動車株式会社 | 金属の低温接合方法 |
JP5310515B2 (ja) * | 2009-12-07 | 2013-10-09 | 株式会社デンソー | ワイヤボンディング方法 |
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