JP5364886B2 - 触覚センサ - Google Patents
触覚センサ Download PDFInfo
- Publication number
- JP5364886B2 JP5364886B2 JP2009013677A JP2009013677A JP5364886B2 JP 5364886 B2 JP5364886 B2 JP 5364886B2 JP 2009013677 A JP2009013677 A JP 2009013677A JP 2009013677 A JP2009013677 A JP 2009013677A JP 5364886 B2 JP5364886 B2 JP 5364886B2
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- tactile sensor
- force
- fluid
- tactile
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000012530 fluid Substances 0.000 claims abstract description 51
- 230000001681 protective effect Effects 0.000 claims abstract description 40
- 229920000052 poly(p-xylylene) Polymers 0.000 claims abstract description 7
- 239000010408 film Substances 0.000 claims description 39
- 239000010409 thin film Substances 0.000 claims description 31
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 9
- 239000010703 silicon Substances 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 238000004891 communication Methods 0.000 claims description 5
- -1 polyparaxylylene Polymers 0.000 claims description 4
- 239000003921 oil Substances 0.000 claims description 3
- 238000005229 chemical vapour deposition Methods 0.000 abstract description 8
- 229920002545 silicone oil Polymers 0.000 abstract description 2
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- 230000035945 sensitivity Effects 0.000 description 18
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- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 16
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 16
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 14
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 14
- 239000002775 capsule Substances 0.000 description 12
- 238000001514 detection method Methods 0.000 description 11
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- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 8
- 239000010949 copper Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000009466 transformation Effects 0.000 description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
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- 239000012535 impurity Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 229920003319 Araldite® Polymers 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
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- 238000001312 dry etching Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
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- 239000012212 insulator Substances 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/205—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using distributed sensing elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/22—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring the force applied to control members, e.g. control members of vehicles, triggers
- G01L5/226—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring the force applied to control members, e.g. control members of vehicles, triggers to manipulators, e.g. the force due to gripping
- G01L5/228—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring the force applied to control members, e.g. control members of vehicles, triggers to manipulators, e.g. the force due to gripping using tactile array force sensors
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
- Manipulator (AREA)
Description
(1)第1実施形態
(1−1)全体構成
図1に示す触覚センサ1は、弾性体2と、前記弾性体2内に埋め込まれた複数のセンサユニット3とを備える。センサユニット3は、センサ部4、及び、前記センサ部4を覆う保護膜5を備える。
上記した触覚センサ1は、以下の手順により製造することができる。尚、触覚センサ1は、1個の弾性体2に複数のセンサユニット3を同時に埋め込むことができるものであるが、説明の便宜上、1個のセンサユニット3を埋め込む場合についてのみ、説明することとする。
上記のように構成された触覚センサ1では、予めセンサ部4に対し、所定の入力電圧が印加されている。この状態で、表面部8の表面すなわちセンサ表面に平行な力、すなわちせん断力Fsが加わった場合、壁部7が表面部8を当該せん断力Fsの方向にずらすようにして変形する。ここで、壁部7は、柔軟性を有する材料で形成されていることにより、せん断力Fsが小さくても、加えられたせん断力Fsの方向へ確実に変形し得る。
図21に示す触覚センサ60は、壁部7で囲まれた領域17a内に流路61が形成されている点において、上記第1実施形態と異なる。上記第1実施形態と同様の構成については、同様の符号を付し、簡単のため、説明を省略する。
図26に示す触覚センサ70は、壁部7に囲まれた領域17a内に流路71が形成されている点において、上記第1実施形態と異なる。上記第1実施形態と同様の構成については、同様の符号を付し、簡単のため、説明を省略する。
本発明は、上記した実施形態に限定されるものではなく、本発明の趣旨の範囲内で適宜変更することが可能である。
2 弾性体
4 センサ部
5 保護膜
17 内部空間
18 流体
61 流路
62 交差流路
63 連通路
O 中央
10 カンチレバー
11 ピエゾ抵抗層
Claims (8)
- 弾性体と、前記弾性体内に支持されたセンサ部と、前記センサ部を覆う保護膜とを備え、前記保護膜によって前記センサ部の周囲に内部空間が形成されていることを特徴とする触覚センサ。
- 前記内部空間内に、流体を充填したことを特徴とする請求項1記載の触覚センサ。
- 前記弾性体は、内部に流路が形成されており、前記流路に前記センサ部を設けたことを特徴とする請求項2記載の触覚センサ。
- 前記流路は、中央において直交する2本の交差流路と、前記交差流路の端部同士を連通する連通路とを有し、
前記センサ部が、前記中央からの距離が等しい位置に配置されたことを特徴とする請求項3記載の触覚センサ。 - 前記流路は、平行に形成された幅がそれぞれ異なる複数の平行流路からなることを特徴とする請求項3記載の触覚センサ。
- 前記センサ部は、シリコン薄膜で形成したカンチレバーを有し、前記カンチレバーの表面にピエゾ抵抗層が形成されていることを特徴とする請求項1〜5のうちいずれか1項に記載の触覚センサ。
- 前記保護膜はポリパラキシリレンにより形成されていることを特徴とする請求項1〜6のうちいずれか1項に記載の触覚センサ。
- 前記流体がシリコンオイルであることを特徴とする請求項2〜5のうちいずれか1項に記載の触覚センサ。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009013677A JP5364886B2 (ja) | 2009-01-23 | 2009-01-23 | 触覚センサ |
PCT/JP2010/050881 WO2010084981A1 (ja) | 2009-01-23 | 2010-01-25 | 触覚センサ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009013677A JP5364886B2 (ja) | 2009-01-23 | 2009-01-23 | 触覚センサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010169597A JP2010169597A (ja) | 2010-08-05 |
JP5364886B2 true JP5364886B2 (ja) | 2013-12-11 |
Family
ID=42356031
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009013677A Expired - Fee Related JP5364886B2 (ja) | 2009-01-23 | 2009-01-23 | 触覚センサ |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5364886B2 (ja) |
WO (1) | WO2010084981A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5867688B2 (ja) | 2011-09-22 | 2016-02-24 | 国立大学法人 東京大学 | 触覚センサ及び多軸触覚センサ |
JP6424405B2 (ja) * | 2015-03-13 | 2018-11-21 | セイコーインスツル株式会社 | 圧力センサ、触覚センサ、及び圧力センサの製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6034293A (ja) * | 1983-08-03 | 1985-02-21 | 株式会社日立製作所 | 皮膚感覚センサ |
JP3088528B2 (ja) * | 1991-12-04 | 2000-09-18 | キヤノン株式会社 | 微小液体流量検出素子、及び同素子を用いた微小液体供給装置 |
JPH0850142A (ja) * | 1994-08-04 | 1996-02-20 | Mitsubishi Electric Corp | 半導体加速度センサ及びその製造方法 |
JP4921185B2 (ja) * | 2006-01-20 | 2012-04-25 | 国立大学法人 東京大学 | 3次元構造体の製造方法 |
-
2009
- 2009-01-23 JP JP2009013677A patent/JP5364886B2/ja not_active Expired - Fee Related
-
2010
- 2010-01-25 WO PCT/JP2010/050881 patent/WO2010084981A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2010084981A1 (ja) | 2010-07-29 |
JP2010169597A (ja) | 2010-08-05 |
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