JP5356842B2 - Light irradiation apparatus and light irradiation method - Google Patents

Light irradiation apparatus and light irradiation method Download PDF

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JP5356842B2
JP5356842B2 JP2009016282A JP2009016282A JP5356842B2 JP 5356842 B2 JP5356842 B2 JP 5356842B2 JP 2009016282 A JP2009016282 A JP 2009016282A JP 2009016282 A JP2009016282 A JP 2009016282A JP 5356842 B2 JP5356842 B2 JP 5356842B2
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light
condensing
condensing means
adhesive layer
light irradiation
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JP2010177322A (en
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仁彦 河崎
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Lintec Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a light irradiation apparatus and method of power saving type, capable of avoiding wasteful light irradiation by uniformizing as much as possible the light volume projected from a light emitting source. <P>SOLUTION: A light irradiation apparatus 10 performs light irradiation to an adhesive sheet S to which a semiconductor wafer W1 is pasted through an optical reactive type adhesive layer SA. It includes a light emitting source 11 extending in planner direction of the surface of the adhesive layer SA, a first condensing means 12 which condenses light from the light emitting source 11 to form line beam P, and a pair of second condensing means 13 which condenses such light that has not been condensed with the first condensing means, to be superposed on the line beam P. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

本発明は光照射装置及び光照射方法に係り、特に、半導体ウエハ等に貼付された光反応型の接着剤層を有する接着シートに光を照射することのできる光照射装置及び光照射方法に関する。   The present invention relates to a light irradiation apparatus and a light irradiation method, and more particularly to a light irradiation apparatus and a light irradiation method capable of irradiating light to an adhesive sheet having a photoreactive adhesive layer attached to a semiconductor wafer or the like.

半導体ウエハ（以下、単に、「ウエハ」と称する）の処理装置においては、ウエハの回路面に保護用の接着シートを貼付して裏面研削を行ったり、ダイシングテープを貼付して複数のチップに個片化したりする処理が行われる。このような処理に使用される接着シートには、接着剤に紫外線硬化型（光反応型）のものが採用されており、上記のような処理の後、紫外線照射装置により紫外線（光）を接着剤に照射することで、当該接着剤を硬化させて接着力を弱め、ウエハの破損を防止して容易に剥離できるようになっている。   In a processing apparatus for a semiconductor wafer (hereinafter simply referred to as “wafer”), a protective adhesive sheet is applied to the circuit surface of the wafer to perform back surface grinding, or a dicing tape is applied to a plurality of chips. A process of tidy up is performed. The adhesive sheet used for such treatment employs an ultraviolet curable (photoreactive) adhesive as the adhesive, and after the treatment as described above, the ultraviolet ray (light) is adhered by an ultraviolet irradiation device. By irradiating the adhesive, the adhesive is cured to weaken the adhesive force, and the wafer can be prevented from being broken and easily peeled off.

公知の紫外線照射装置としては、図５に示されるように、紫外線の発光源を構成する水銀ランプ３０と、当該水銀ランプ３０の光を集光させる集光板３１とを含む構成が知られており、当該紫外線照射装置が、リングフレームＲＦにウエハＷをマウントする接着シートＳに紫外線を照射することで、接着シートＳの接着剤層を硬化反応させるようになっている（例えば、特許文献１参照）。   As a known ultraviolet irradiation device, as shown in FIG. 5, a configuration including a mercury lamp 30 constituting an ultraviolet light source and a light collecting plate 31 for condensing the light of the mercury lamp 30 is known. The ultraviolet irradiation device irradiates the adhesive sheet S, which mounts the wafer W on the ring frame RF, with ultraviolet rays, thereby causing the adhesive layer of the adhesive sheet S to undergo a curing reaction (for example, see Patent Document 1). ).

特開平９−１６２１４１号公報JP-A-9-162141

しかしながら、上記のような紫外線照射装置は、接着シートＳの中央部における光量が高く、図５中左右両端に向かうに従ってその光量が低くなる傾向がある。これは、水銀ランプ３０の延出方向両端側から外側に向かって光が多く漏れてしまうことに起因する。
そのため、図５の光量グラフで示されるように、ウエハＷの端部に対応する接着シートＳへの必要光量を確保したときに、ウエハＷの内側における光量Ｑが無駄な電力消費になる、という不都合を招来する。 However, the ultraviolet irradiation device as described above has a high amount of light at the central portion of the adhesive sheet S, and the amount of light tends to decrease toward the left and right ends in FIG. This is because a large amount of light leaks outward from both ends of the mercury lamp 30 in the extending direction.
Therefore, as shown in the light amount graph of FIG. 5, when the necessary light amount to the adhesive sheet S corresponding to the end portion of the wafer W is secured, the light amount Q inside the wafer W is wasted power consumption. Inconvenience.

［発明の目的］
本発明は、このような不都合に着目して案出されたものであり、その目的は、発光源から被照射体に照射される光量をできるだけ平均化して無駄な光照射を回避することのできる省電力タイプの光照射装置及び光照射方法を提供することにある。 [Object of invention]
The present invention has been devised by paying attention to such inconveniences, and the object thereof is to average the amount of light irradiated from the light emitting source to the irradiated object as much as possible to avoid unnecessary light irradiation. An object of the present invention is to provide a power saving type light irradiation apparatus and light irradiation method.

前記目的を達成するため、本発明は、被照射体に光照射を行う光照射装置において、
前記被照射体の被照射面に相対する位置で当該被照射面に沿って直線状に延びる発光源と、前記発光源の延出方向に対して直交する方向に発せられる光のうち所定角度範囲内の光を集光して前記被照射面上にライン光を形成する第１集光手段と、前記第１集光手段で集光されなかった光の一部を集光して前記ライン光上に重ね合わせる第２集光手段とを備え、前記第１集光手段と第２集光手段とのうち少なくとも一方は、集光位置が調整可能に設けられる、という構成を採っている。 In order to achieve the above object, the present invention provides a light irradiation apparatus that performs light irradiation on an irradiated object.
A light emitting source extending linearly along the irradiated surface at a position opposite to the irradiated surface of the irradiated object, and a predetermined angular range among light emitted in a direction orthogonal to the extending direction of the light emitting source A first condensing unit that condenses light within the surface to form line light on the irradiated surface, and a part of the light that is not collected by the first condensing unit to collect the line light. and a second condensing means for superimposing on said first condensing means and at least one of the second condensing unit, adopts a configuration in which, condensed position is Ru provided adjustably.

また、本発明は、光反応型の接着剤層を介して半導体ウエハが貼付された接着シートに光照射を行う光照射装置において、前記接着剤層に相対する位置で当該接着剤層に沿って直線状に延びる発光源と、前記発光源の延出方向に対して直交する方向に発せられる光のうち所定角度範囲内の光を集光して前記接着剤層上にライン光を形成する第１集光手段と、前記第１集光手段で集光されなかった光の一部を集光して前記ライン光上に重ね合わせる第２集光手段とを備え、前記第２集光手段は、前記半導体ウエハの径方向外周部分に対応するライン光上に集光させ、前記第１集光手段と第２集光手段とのうち少なくとも一方は、集光位置が調整可能に設けられる、という構成を採っている。 Further, the present invention provides a light irradiation apparatus for irradiating light onto an adhesive sheet to which a semiconductor wafer is attached via a photoreactive adhesive layer, along the adhesive layer at a position facing the adhesive layer. A light emitting source extending in a straight line and a light within a predetermined angle range of light emitted in a direction perpendicular to the extending direction of the light emitting source is condensed to form line light on the adhesive layer. 1 light collecting means, and a second light collecting means for collecting a part of the light not collected by the first light collecting means and superimposing the light on the line light, the second light collecting means the is focused on the line light corresponding to the radial outer peripheral portion of the semiconductor wafer, at least one of the first focusing means and the second focusing means includes a condenser positions Ru provided adjustably, The structure is adopted.

また、本発明は、被照射体に光を照射する光照射方法において、前記被照射体の被照射面に相対する位置で当該被照射面に沿って直線状に延びる発光源を用い、前記発光源の延出方向に対して直交する方向に発せられる光のうち所定角度の範囲内の光を第１集光手段によって集光して前記被照射面上にライン光を形成し、前記第１集光手段によって集光されなかった光の一部を第２集光手段で集光して前記ライン光上に重ね合わせ、前記第１集光手段と第２集光手段とのうち少なくとも一方の集光位置を調整して光照射する、という手法を採っている。 Further, the present invention provides a light irradiation method for irradiating an irradiated object with light, using a light emitting source extending linearly along the irradiated surface at a position opposite to the irradiated surface of the irradiated object, Of the light emitted in a direction orthogonal to the extending direction of the source, the light within a predetermined angle range is condensed by the first condensing means to form line light on the irradiated surface, Part of the light that has not been collected by the light collecting means is condensed by the second light collecting means and superimposed on the line light, and at least one of the first light collecting means and the second light collecting means is collected . We light irradiation by adjusting the focusing position, adopt a method called.

更に、本発明は、光反応型の接着剤層を介して半導体ウエハが貼付された接着シートに光照射を行う光照射方法において、前記接着剤層に相対する位置で当該接着剤層に沿って直線状に延びる発光源を用い、前記発光源の延出方向に対して直交する方向に発せられる光のうち所定角度範囲内の光を第１集光手段によって集光して前記接着剤層上にライン光を形成し、前記第１集光手段で集光されなかった光の一部を第２集光手段で集光して前記ライン光上に重ね合わせ、前記第２集光手段は、前記半導体ウエハの径方向外周部分に対応するライン光上に集光させ、前記第１集光手段と第２集光手段とのうち少なくとも一方の集光位置を調整して光照射する、という手法を採ることが好ましい。 Furthermore, the present invention provides a light irradiation method in which light irradiation is performed on an adhesive sheet to which a semiconductor wafer is attached via a photoreactive adhesive layer, and the adhesive layer is positioned along the adhesive layer at a position facing the adhesive layer. A light source extending in a straight line is used, and light within a predetermined angle range is collected by the first light collecting means among the light emitted in a direction orthogonal to the extending direction of the light source. Line light is formed, a part of the light that has not been collected by the first light collecting means is condensed by the second light collecting means and superimposed on the line light, and the second light collecting means method wherein is focused on the corresponding line light radially outer peripheral portion of the semiconductor wafer, you light irradiation by adjusting at least one collection point of the first condenser means and the second focusing means, that It is preferable to adopt.

本発明によれば、第１集光手段で集光したライン光上に第２集光手段で集光したライン光を重ね合わせることで、第１集光手段だけでは光量が不足しがちな領域に光を補うことができる。これにより、従来例のように、ウエハＷの端部に対応する接着シートＳへの必要光量を確保したときに、中央部における無駄な光量Ｑを低く抑えることが可能となる。
特に、紫外線硬化型の接着シートが半導体ウエハに貼付されている場合においては、半導体ウエハの外周側における接着シートの光反応を確実に行うことができ、半導体ウエハに損傷等を与えることなく接着シートの剥離を容易且つ確実に行うことができる。
更に、第１集光手段と第２集光手段とのうち、少なくとも一方の集光位置を調整できる構成とした場合には、大きさが種々異なる被照射体に対応可能となり、光照射装置の汎用性を高めることが可能となる。 According to the present invention, by superimposing the line light condensed by the second light collecting means on the line light condensed by the first light collecting means, the area where the light quantity tends to be insufficient only by the first light collecting means. Can supplement the light. As a result, as in the conventional example, when the necessary light amount to the adhesive sheet S corresponding to the end portion of the wafer W is secured, it is possible to keep the wasteful light amount Q at the center portion low.
In particular, when an ultraviolet curable adhesive sheet is affixed to a semiconductor wafer, the adhesive sheet on the outer peripheral side of the semiconductor wafer can be reliably photoreacted without causing damage to the semiconductor wafer. Can be easily and reliably peeled off.
Furthermore, in the case where at least one condensing position of the first condensing means and the second condensing means can be adjusted, it is possible to deal with irradiated objects having different sizes, and the light irradiation apparatus It becomes possible to improve versatility.

本実施形態に係る光照射装置の概略正面図。The schematic front view of the light irradiation apparatus which concerns on this embodiment. 図１の光照射装置の概略斜視図1 is a schematic perspective view of the light irradiation device of FIG. 図１の光照射装置の一部断面側面図。The partial cross section side view of the light irradiation apparatus of FIG. 変形例を示す図１と同様の概略正面図。The schematic front view similar to FIG. 1 which shows a modification. 従来の光照射装置を示す概略正面図。The schematic front view which shows the conventional light irradiation apparatus.

以下、本発明の好ましい実施の形態について図面を参照しながら説明する。   Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

図１ないし図３において、光照射装置１０は、リングフレームＲＦの内周側に光反応型（紫外線硬化型）の接着剤層ＳＡを上面側に有する接着シートＳを介してウエハＷ１が貼付された被照射体Ｗに対して光（紫外線）を照射する装置として構成されている。本実施形態では、接着シートＳは基材シートの一方の面に接着剤層ＳＡが形成され、当該接着剤層ＳＡが被照射面とされる。なお、接着剤層ＳＡは、正確には面ではないが、非常に薄い層なので、本発明においては面（被照射面）として説明する。また、被照射体Ｗは、図示しない支持手段を介して支持され、後述する発光源１１と第１、第２集光手段１２、１３に対して図３中左右方向に相対移動可能に設けられている。   1 to 3, the light irradiation apparatus 10 has a wafer W1 attached to the inner peripheral side of the ring frame RF via an adhesive sheet S having a photoreactive (ultraviolet curable) adhesive layer SA on the upper surface side. It is configured as a device for irradiating the irradiated object W with light (ultraviolet rays). In the present embodiment, the adhesive sheet S is formed with an adhesive layer SA on one surface of the base sheet, and the adhesive layer SA is an irradiated surface. Note that the adhesive layer SA is not a precise surface, but is a very thin layer, and in the present invention, it will be described as a surface (irradiated surface). Further, the irradiated object W is supported via a support means (not shown), and is provided so as to be relatively movable in the left-right direction in FIG. 3 with respect to a light emitting source 11 and first and second light collecting means 12 and 13 described later. ing.

前記光照射装置１０は、被照射体Ｗの図１中下方で光を発光する発光源１１と、この発光源１１を収容するように配置された第１集光手段１２と、図１中発光源１１の左右両側に一対配置された第２集光手段１３とを備えて構成されている。発光源１１は、接着剤層ＳＡに相対する位置で、当該接着剤層ＳＡに沿って直線状に延びるように配置され、図１中左右両端に電極１５が位置するようになっている。   The light irradiation device 10 includes a light emission source 11 that emits light below the irradiated object W in FIG. 1, a first light collecting unit 12 that is disposed so as to accommodate the light emission source 11, and a light emission in FIG. A pair of second condensing means 13 disposed on the left and right sides of the source 11 is provided. The light emitting source 11 is disposed so as to extend linearly along the adhesive layer SA at a position facing the adhesive layer SA, and the electrodes 15 are positioned at both left and right ends in FIG.

前記第１集光手段１２は、鏡や鏡面仕上げされた金属等からなり、発光源１１を収容する長さを有するとともに上方に向かうに従って開放幅が次第に大きく設けられた略Ｕ字状の形状をなし、発光源１１の延出方向（Ｙ軸方向）に対して直交する方向に発せられる光のうち所定角度の範囲内の光を集光して、図３中紙面直交方向に延びるライン光Ｐを形成するように設けられている。ここで、「所定角度の範囲」とは、図３に示されるように、発光源１１の中心と第１集光手段１２の開放側上端とを結ぶ２つの直線によって形成される角度θを円の角度から引いた範囲である。そして、被照射体Ｗは、接着剤層ＳＡが焦点Ｐを通過して相対移動するように構成されている。なお、第１集光手段１２は、図示しない調整手段を介して集光位置が調整可能に設けられており、これにより、ライン光Ｐの図３中左右方向の幅を変更できるように構成されている。   The first condensing means 12 is made of a mirror, mirror-finished metal or the like, has a length for accommodating the light emitting source 11, and has a substantially U-shaped shape with an opening width gradually increasing toward the upper side. None, line light P extending in a direction orthogonal to the plane of the paper in FIG. 3 by condensing light within a predetermined angle of light emitted in a direction orthogonal to the extending direction (Y-axis direction) of the light source 11 Are provided. Here, the “predetermined angle range” refers to an angle θ formed by two straight lines connecting the center of the light source 11 and the upper end of the first light collecting unit 12 as shown in FIG. This is the range subtracted from The irradiated object W is configured such that the adhesive layer SA moves relative to the focal point P. The first light condensing means 12 is provided so that the light condensing position can be adjusted via an adjusting means (not shown), whereby the width of the line light P in the left-right direction in FIG. 3 can be changed. ing.

前記第２集光手段１３は、鏡や鏡面仕上げされた金属等からなり、互いに向き合う方向に開放側が位置し、開放幅が次第に大きく設けられた略Ｕ字状の形状に設けられている。この第２集光手段１３は、図１に示されるように、第１集光手段１２の左右に設けられ、第１集光手段１２で集光されなかった光の一部を集光してライン光Ｐ上に重ね合わせる作用を奏するようになっている。本実施形態では、特に限定されるものではないが、各第２集光手段１３は、下端側が相互に接近するように湾曲した形状に設けられている。なお、図１中右側の第２集光手段１３は、ウエハＷ１の左側外周領域に貼付された接着シートＳ部分に対応するライン光上に光を集光させる一方、左側の第２集光手段１３は、ウエハＷ１の右側外周領域に貼付された接着シートＳ部分に対応するライン光上に光を集光させるように構成されている。なお、各第２集光手段１３は、図示しない調整手段を介して集光位置が調整可能に設けられており、これにより、ウエハＷ１の大きさが種々変化しても、その大きさに対応して適切な部分に光を集光できるように構成されている。   The second condensing means 13 is made of a mirror, mirror-finished metal, or the like, and is provided in a substantially U-shape having an open side in a direction facing each other and an open width gradually increasing. As shown in FIG. 1, the second light collecting means 13 is provided on the left and right sides of the first light collecting means 12, and collects a part of the light that is not collected by the first light collecting means 12. An effect of superimposing on the line light P is achieved. In the present embodiment, although not particularly limited, each of the second light condensing means 13 is provided in a curved shape so that the lower end sides approach each other. Note that the second light collecting means 13 on the right side in FIG. 1 condenses the light on the line light corresponding to the adhesive sheet S portion attached to the left outer peripheral region of the wafer W1, while the second light collecting means on the left side. Reference numeral 13 is configured to condense light onto the line light corresponding to the adhesive sheet S portion attached to the right outer peripheral region of the wafer W1. Each of the second light condensing means 13 is provided so that the light condensing position can be adjusted via an adjusting means (not shown), so that even if the size of the wafer W1 changes variously, the size can be accommodated. And it is comprised so that light can be condensed to an appropriate part.

なお、光照射装置１０、被照射体Ｗを支持する図示しない支持手段は、窒素ガス等の不活性ガス雰囲気を形成可能な所定のケース内に配置され、これにより、大気中に含まれる酸素によって、その硬化阻害を未然に防止することができるよう構成される。   In addition, the light irradiation apparatus 10 and the support means (not shown) for supporting the irradiation object W are disposed in a predetermined case capable of forming an inert gas atmosphere such as nitrogen gas, and thereby, oxygen contained in the atmosphere. The curing inhibition can be prevented in advance.

前記光照射装置１０による接着シートＳへの光照射は、発光源１１が発光した状態で、被照射体Ｗを支持する図示しない支持手段が図２中矢印Ａ方向に向かって移動することによって行われる。このとき、接着剤層ＳＡは、図３に示される仮想平面Ｔ上を搬送されることとなる。被照射体Ｗが発光源１１上を通過するときに、ライン光Ｐが接着シートＳを下面側から走査し、これによって接着シートＳの接着剤層ＳＡが光硬化することとなる。この際、第２集光手段１３は、相対的に光量が不足しがちな部分、すなわち、ウエハＷ１の外周部に対応した接着シートＳ部分に補完的に照射されるため、図１に示されるように、中央部の光量に対して光量差が小さくなる結果、全体的に供給電力を下げても接着剤層ＳＡを光硬化させるに十分な光量を得ることができる。   Light irradiation to the adhesive sheet S by the light irradiation device 10 is performed by a support means (not shown) that supports the irradiated object W moving in the direction of arrow A in FIG. Is called. At this time, the adhesive layer SA is transported on the virtual plane T shown in FIG. When the irradiated object W passes over the light emitting source 11, the line light P scans the adhesive sheet S from the lower surface side, whereby the adhesive layer SA of the adhesive sheet S is photocured. At this time, the second light condensing means 13 irradiates a portion where the light amount tends to be relatively insufficient, that is, the adhesive sheet S portion corresponding to the outer peripheral portion of the wafer W1, so that it is shown in FIG. As described above, as a result of the light amount difference being small with respect to the light amount in the central portion, it is possible to obtain a sufficient light amount for photocuring the adhesive layer SA even if the supply power is reduced as a whole.

従って、このような実施形態によれば、発光源１１の漏光を有効に利用することができ、光照射装置１０に対する供給電力の節減を図ることができるとともに、ウエハＷ１に対応する接着シートＳの全領域に必要量の紫外線を照射して接着シートＳの剥離を容易且つ確実に行うことができる。   Therefore, according to such an embodiment, the light leakage of the light source 11 can be used effectively, the power supplied to the light irradiation device 10 can be reduced, and the adhesive sheet S corresponding to the wafer W1 can be reduced. The adhesive sheet S can be easily and reliably peeled off by irradiating the entire region with a necessary amount of ultraviolet rays.

以上のように、本発明を実施するための最良の構成、方法等は、前記記載で開示されているが、本発明は、これに限定されるものではない。
すなわち、本発明は、主に特定の実施形態に関して特に図示、説明されているが、本発明の技術的思想及び目的の範囲から逸脱することなく、以上説明した実施形態に対し、形状、位置若しくは配置等に関し、必要に応じて当業者が様々な変更を加えることができるものである。 As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

例えば、本発明に係る光照射装置１０を構成する各部の相対位置、すなわちレイアウトは図示構成例に限定されるものではなく、上下若しくは左右に位置を変更することも可能である。従って、方向を示す用語は、装置各部のレイアウトの変更によって下面、下部、上下等になり得るものとなり、これら変更した態様は本発明と均等なものとして含まれる。
更に、図４に示されるように、第２集光手段１３を複数の分割型としてもよく、それらを個々に調整可能とすることも可能である。また、第２集光手段１３を第１集光手段の長さ方向両端側に一体的に設けることもできる。
また、発光源１１を構成する発光源としては、水銀ランプ、ハロゲンランプ、蛍光灯、メタルハライドランプ、発光ダイオード等の採用を妨げない。 For example, the relative position of each part constituting the light irradiation apparatus 10 according to the present invention, that is, the layout is not limited to the illustrated configuration example, and the position can be changed vertically or horizontally. Accordingly, the term indicating the direction can be the lower surface, the lower portion, the upper and lower sides, and the like by changing the layout of each part of the apparatus, and these changed modes are included as equivalent to the present invention.
Furthermore, as shown in FIG. 4, the second light collecting means 13 may be divided into a plurality of divided types, and they can be individually adjusted. Moreover, the 2nd condensing means 13 can also be integrally provided in the length direction both ends of the 1st condensing means.
Further, as the light source constituting the light source 11, adoption of a mercury lamp, a halogen lamp, a fluorescent lamp, a metal halide lamp, a light emitting diode or the like is not hindered.

更に、被照射体Ｗは、上記構成のものに限定されることはなく、ウエハＷ１は、シリコンウエハや化合物ウエハであってもよい。   Further, the irradiated object W is not limited to the one having the above configuration, and the wafer W1 may be a silicon wafer or a compound wafer.

１０ 光照射装置
１１ 発光源
１２ 第１集光手段
１３ 第２集光手段
Ｐ ライン光
Ｓ 接着シート
ＳＡ 接着剤層（被照射面）
Ｗ 被照射体
Ｗ１ 半導体ウエハ DESCRIPTION OF SYMBOLS 10 Light irradiation apparatus 11 Light emission source 12 1st condensing means 13 2nd condensing means P line light S Adhesive sheet SA Adhesive layer (irradiation surface)
W Object to be irradiated W1 Semiconductor wafer

Claims (4)

被照射体に光照射を行う光照射装置において、
前記被照射体の被照射面に相対する位置で当該被照射面に沿って直線状に延びる発光源と、
前記発光源の延出方向に対して直交する方向に発せられる光のうち所定角度範囲内の光を集光して前記被照射面上にライン光を形成する第１集光手段と、
前記第１集光手段で集光されなかった光の一部を集光して前記ライン光上に重ね合わせる第２集光手段とを備え、
前記第１集光手段と第２集光手段とのうち少なくとも一方は、集光位置が調整可能に設けられていることを特徴とする光照射装置。 In the light irradiation device for irradiating the irradiated object with light,
A light source extending linearly along the irradiated surface at a position opposite to the irradiated surface of the irradiated body;
First condensing means for condensing light within a predetermined angle range of light emitted in a direction perpendicular to the extending direction of the light emitting source to form line light on the irradiated surface;
Condenses a portion of the light which has not been condensed in the first condensing means and a second condensing means for superimposing on said line light,
At least one of said 1st condensing means and 2nd condensing means is provided so that a condensing position can be adjusted, The light irradiation apparatus characterized by the above-mentioned. 光反応型の接着剤層を介して半導体ウエハが貼付された接着シートに光照射を行う光照射装置において、
前記接着剤層に相対する位置で当該接着剤層に沿って直線状に延びる発光源と、
前記発光源の延出方向に対して直交する方向に発せられる光のうち所定角度範囲内の光を集光して前記接着剤層上にライン光を形成する第１集光手段と、
前記第１集光手段で集光されなかった光の一部を集光して前記ライン光上に重ね合わせる第２集光手段とを備え、
前記第２集光手段は、前記半導体ウエハの径方向外周部分に対応するライン光上に集光させ、
前記第１集光手段と第２集光手段とのうち少なくとも一方は、集光位置が調整可能に設けられていることを特徴とする光照射装置。 In a light irradiation device that performs light irradiation on an adhesive sheet to which a semiconductor wafer is attached via a photoreactive adhesive layer,
A light emitting source extending linearly along the adhesive layer at a position facing the adhesive layer;
First condensing means for condensing light within a predetermined angle range of light emitted in a direction perpendicular to the extending direction of the light emitting source to form line light on the adhesive layer;
A second condensing unit that condenses a part of the light not collected by the first condensing unit and superimposes the light on the line light;
The second condensing means condenses on the line light corresponding to the radially outer peripheral portion of the semiconductor wafer ,
At least one of said 1st condensing means and 2nd condensing means is provided so that a condensing position can be adjusted, The light irradiation apparatus characterized by the above-mentioned . 被照射体に光を照射する光照射方法において、
前記被照射体の被照射面に相対する位置で当該被照射面に沿って直線状に延びる発光源を用い、
前記発光源の延出方向に対して直交する方向に発せられる光のうち所定角度の範囲内の光を第１集光手段によって集光して前記被照射面上にライン光を形成し、
前記第１集光手段によって集光されなかった光の一部を第２集光手段で集光して前記ライン光上に重ね合わせ、
前記第１集光手段と第２集光手段とのうち少なくとも一方の集光位置を調整して光照射することを特徴とする光照射方法。 In the light irradiation method of irradiating the irradiated object with light,
Using a light emitting source extending linearly along the irradiated surface at a position opposite to the irradiated surface of the irradiated body,
Of the light emitted in a direction perpendicular to the extending direction of the light emitting source, the light within a predetermined angle range is condensed by the first condensing means to form line light on the irradiated surface,
A portion of the light that has not been collected by the first light collecting means is condensed by the second light collecting means and superimposed on the line light;
A light irradiating method characterized in that at least one of the first condensing means and the second condensing means is adjusted for light irradiation. 光反応型の接着剤層を介して半導体ウエハが貼付された接着シートに光照射を行う光照射方法において、In the light irradiation method of performing light irradiation on an adhesive sheet to which a semiconductor wafer is attached via a photoreactive adhesive layer,
前記接着剤層に相対する位置で当該接着剤層に沿って直線状に延びる発光源を用い、  Using a light emitting source extending linearly along the adhesive layer at a position facing the adhesive layer,
前記発光源の延出方向に対して直交する方向に発せられる光のうち所定角度範囲内の光を第１集光手段によって集光して前記接着剤層上にライン光を形成し、  Of the light emitted in a direction perpendicular to the extending direction of the light emitting source, the light within a predetermined angle range is condensed by the first light collecting means to form line light on the adhesive layer,
前記第１集光手段で集光されなかった光の一部を第２集光手段で集光して前記ライン光上に重ね合わせ、  A portion of the light that has not been collected by the first light collecting means is condensed by the second light collecting means and superimposed on the line light,
前記第２集光手段は、前記半導体ウエハの径方向外周部分に対応するライン光上に集光させ、  The second condensing means condenses on the line light corresponding to the radially outer peripheral portion of the semiconductor wafer,
前記第１集光手段と第２集光手段とのうち少なくとも一方の集光位置を調整して光照射することを特徴とする光照射方法。  A light irradiating method characterized in that at least one of the first condensing means and the second condensing means is adjusted for light irradiation.
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