JP5355410B2 - Rfidシステム用のチップモジュール - Google Patents
Rfidシステム用のチップモジュール Download PDFInfo
- Publication number
- JP5355410B2 JP5355410B2 JP2009535587A JP2009535587A JP5355410B2 JP 5355410 B2 JP5355410 B2 JP 5355410B2 JP 2009535587 A JP2009535587 A JP 2009535587A JP 2009535587 A JP2009535587 A JP 2009535587A JP 5355410 B2 JP5355410 B2 JP 5355410B2
- Authority
- JP
- Japan
- Prior art keywords
- rfid
- antenna
- film
- strip
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/04—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07756—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being non-galvanic, e.g. capacitive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Details Of Aerials (AREA)
- Credit Cards Or The Like (AREA)
- Support Of Aerials (AREA)
Description
Claims (6)
- RFIDインレイの製造方法であって、
ストリップ状の支持フィルム(8)上に、複数のRFIDチップ(3)と、該複数のRFIDチップ(3)にそれぞれガルバニック接続された複数の結合アンテナ(4)と、を配置し、
前記支持フィルム(8)の下面に、ストリップ状の取り外し可能な分離材によって覆われる接着剤層(9)を設け、
前記分離材を取り外し、
前記支持フィルム(8)を、複数の平面RFIDアンテナ(6)を有するストリップ状のアンテナフィルム(7)上に配置し、
前記複数の結合アンテナ(4)と前記複数の平面RFIDアンテナ(6)とがそれぞれ誘導結合されるように、前記支持フィルム(8)を前記平面RFIDアンテナ(6)上に位置決めして接着し、
前記支持フィルム(8)と前記アンテナフィルム(7)とを一緒に切断する、
ことを特徴とする方法。 - 前記RFIDチップ(3)は平面状に形成された結合アンテナ(4)上に直接固定されている、請求項1記載の方法。
- 前記アンテナフィルム(7)が、分離材(11)により覆われた接着剤層(10)を背面に有する、請求項1または2記載の方法。
- 前記RFIDアンテナ(6)の結合領域(6.1)が前記結合アンテナ(4)の結合領域(4.1)よりも広い、請求項1〜3のいずれか1項に記載の方法。
- 請求項1〜4のいずれか1項に記載の方法で製造されたRFIDインレイを有するRFIDラベルであって、
前記RFIDインレイが下面に接着剤層を備えたストリップ状の被覆材と、前記接着剤層から取り外し可能なストリップ状の支持材と、の間に配置されていることを特徴とする、RFIDラベル。 - 請求項1〜4のいずれか1項に記載の方法で製造されたRFIDインレイを有するRFIDシステムであって、
前記支持フィルム(8)が包装手段のRFIDアンテナ(6)上に接着されており、前記結合アンテナ(4)がパッケージ手段のRFIDアンテナ(6)と誘導結合されていることを特徴とする、RFIDシステム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006052517A DE102006052517A1 (de) | 2006-11-06 | 2006-11-06 | Chipmodul für ein RFID-System |
DE102006052517.5 | 2006-11-06 | ||
PCT/EP2007/008948 WO2008055579A2 (de) | 2006-11-06 | 2007-10-16 | Chipmodul für ein rfid-system |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010508794A JP2010508794A (ja) | 2010-03-18 |
JP2010508794A5 JP2010508794A5 (ja) | 2012-09-13 |
JP5355410B2 true JP5355410B2 (ja) | 2013-11-27 |
Family
ID=39264964
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009535587A Expired - Fee Related JP5355410B2 (ja) | 2006-11-06 | 2007-10-16 | Rfidシステム用のチップモジュール |
Country Status (16)
Country | Link |
---|---|
US (1) | US9324017B2 (ja) |
EP (1) | EP2089838A2 (ja) |
JP (1) | JP5355410B2 (ja) |
KR (1) | KR101417163B1 (ja) |
CN (1) | CN101589403A (ja) |
AU (1) | AU2007316980A1 (ja) |
BR (1) | BRPI0718246A2 (ja) |
CA (1) | CA2668973A1 (ja) |
DE (1) | DE102006052517A1 (ja) |
IL (1) | IL198527A0 (ja) |
MX (1) | MX2009004451A (ja) |
MY (1) | MY154917A (ja) |
NZ (1) | NZ577472A (ja) |
RU (1) | RU2452016C2 (ja) |
WO (1) | WO2008055579A2 (ja) |
ZA (1) | ZA200903097B (ja) |
Families Citing this family (22)
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DE102006052517A1 (de) * | 2006-11-06 | 2008-05-08 | Bielomatik Leuze Gmbh + Co.Kg | Chipmodul für ein RFID-System |
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DE102007041751B4 (de) | 2007-09-04 | 2018-04-19 | Bielomatik Leuze Gmbh + Co. Kg | Verfahren und Vorrrichtung zur Herstellung eines RFID-Etiketts |
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CN101459273B (zh) * | 2008-12-24 | 2014-10-22 | 瑞化股份有限公司 | 无线射频识别询答器之天线构造及其制造方法 |
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DE202011004331U1 (de) * | 2011-03-23 | 2011-06-09 | Flexo-Print Bedienfelder GmbH, 33154 | Transpondertag |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
TWI453677B (zh) * | 2011-12-01 | 2014-09-21 | Mutual Pak Technology Co Ltd | 射頻識別標籤與具有其之衣物 |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD703208S1 (en) * | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
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US9172130B2 (en) * | 2013-03-13 | 2015-10-27 | Avery Dennison Corporation | RFID inlay incorporating a ground plane |
KR20190137184A (ko) | 2015-04-21 | 2019-12-10 | 도요세이칸 그룹 홀딩스 가부시키가이샤 | Rf 태그 |
CN110431559B (zh) * | 2016-09-09 | 2023-09-19 | 香港物流及供应链管理应用技术研发中心 | 射频通信设备及其使用方法 |
SE543748C2 (en) | 2019-11-08 | 2021-07-13 | Stora Enso Oyj | Rfid label |
DE102021131911B3 (de) | 2021-08-30 | 2022-10-06 | Bw Papersystems Stuttgart Gmbh | RFID-Konvertierungsanlage und Steuerungsverfahren für eine Mehrzahl von Inlay-Spendemodulen |
EP4339833A1 (en) * | 2022-09-19 | 2024-03-20 | Assa Abloy AB | Rfid assembly |
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-
2006
- 2006-11-06 DE DE102006052517A patent/DE102006052517A1/de not_active Withdrawn
-
2007
- 2007-10-16 WO PCT/EP2007/008948 patent/WO2008055579A2/de active Application Filing
- 2007-10-16 AU AU2007316980A patent/AU2007316980A1/en not_active Abandoned
- 2007-10-16 CA CA002668973A patent/CA2668973A1/en not_active Abandoned
- 2007-10-16 EP EP07819018A patent/EP2089838A2/de not_active Withdrawn
- 2007-10-16 RU RU2009121443/08A patent/RU2452016C2/ru not_active IP Right Cessation
- 2007-10-16 BR BRPI0718246-5A2A patent/BRPI0718246A2/pt not_active IP Right Cessation
- 2007-10-16 KR KR1020097007265A patent/KR101417163B1/ko not_active IP Right Cessation
- 2007-10-16 MY MYPI20091691A patent/MY154917A/en unknown
- 2007-10-16 JP JP2009535587A patent/JP5355410B2/ja not_active Expired - Fee Related
- 2007-10-16 US US12/513,681 patent/US9324017B2/en not_active Expired - Fee Related
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- 2007-10-16 CN CNA2007800410979A patent/CN101589403A/zh active Pending
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Also Published As
Publication number | Publication date |
---|---|
WO2008055579A2 (de) | 2008-05-15 |
EP2089838A2 (de) | 2009-08-19 |
IL198527A0 (en) | 2010-02-17 |
BRPI0718246A2 (pt) | 2014-01-07 |
KR101417163B1 (ko) | 2014-07-08 |
AU2007316980A1 (en) | 2008-05-15 |
CN101589403A (zh) | 2009-11-25 |
JP2010508794A (ja) | 2010-03-18 |
ZA200903097B (en) | 2010-03-31 |
MX2009004451A (es) | 2009-05-11 |
CA2668973A1 (en) | 2008-05-15 |
KR20090079196A (ko) | 2009-07-21 |
DE102006052517A1 (de) | 2008-05-08 |
NZ577472A (en) | 2012-04-27 |
US20100032487A1 (en) | 2010-02-11 |
RU2009121443A (ru) | 2010-12-20 |
WO2008055579A3 (de) | 2008-06-26 |
MY154917A (en) | 2015-08-28 |
US9324017B2 (en) | 2016-04-26 |
RU2452016C2 (ru) | 2012-05-27 |
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