JP5350550B2 - ビアを介して電力供給及び接地されるパッケージ - Google Patents
ビアを介して電力供給及び接地されるパッケージ Download PDFInfo
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- JP5350550B2 JP5350550B2 JP2013027597A JP2013027597A JP5350550B2 JP 5350550 B2 JP5350550 B2 JP 5350550B2 JP 2013027597 A JP2013027597 A JP 2013027597A JP 2013027597 A JP2013027597 A JP 2013027597A JP 5350550 B2 JP5350550 B2 JP 5350550B2
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Description
本発明のさらなる利点は、発明の詳細な説明を図面とともに参照することで明らかになるであろう。図面は、細部をより明瞭に示すためにスケールしていない。また、複数の図面を通して同じ番号は同じ要素を示している。
Claims (3)
- ワイヤボンド設計のパッケージ基板であって、
前面及び背面を有する基板と、
基板の前面上に配置され、少なくとも1つの電力表面及び少なくとも1つの接地面を有する導電性表面で覆われているダイ-アタッチ-パッドであって、パッケージ基板が設計される集積回路とほぼ同じ大きさのダイ-アタッチ-パッドと、
前面上のダイ-アタッチ-パッドの外側に配置された導電性ボンディングフィンガと、
背面上に配置された電気接続と、
前面と背面との間に配置された導電性トレースであって、前面上のボンディングフィンガ及び導電性表面を、背面上の電気接続に電気的に接続している導電性トレースと
を備えることを特徴とするワイヤボンド設計のパッケージ基板。 - 請求項1記載のワイヤボンド設計のパッケージ基板において、少なくとも1つの電力表面は、4つの電力表面を備えており、4つの電力表面のそれぞれ1つがダイ-アタッチ-パッドの4つの角の位置のそれぞれ1つに配置されていることを特徴とするワイヤボンド設計のパッケージ基板。
- 請求項1記載のワイヤボンド設計のパッケージ基板において、少なくとも1つの接地表面は、ダイ-アタッチ-パッドの少なくとも中央部分に配置された唯一の接地表面を備えることを特徴とする、ワイヤボンド設計のパッケージ基板。
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JP2014022402A (ja) | 2012-07-12 | 2014-02-03 | Toshiba Corp | 固体撮像装置 |
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CN102057481B (zh) | 2015-04-08 |
TWI453875B (zh) | 2014-09-21 |
JP5525530B2 (ja) | 2014-06-18 |
TW201011875A (en) | 2010-03-16 |
EP2338169A1 (en) | 2011-06-29 |
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