JP5336387B2 - Method for machining inorganic and non-metallic workpieces - Google Patents
Method for machining inorganic and non-metallic workpieces Download PDFInfo
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- JP5336387B2 JP5336387B2 JP2009543086A JP2009543086A JP5336387B2 JP 5336387 B2 JP5336387 B2 JP 5336387B2 JP 2009543086 A JP2009543086 A JP 2009543086A JP 2009543086 A JP2009543086 A JP 2009543086A JP 5336387 B2 JP5336387 B2 JP 5336387B2
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
Description
本発明は、一般的には、ワークピースを機械加工するための方法及び機械加工作業中に利用される流体に関する。 The present invention relates generally to a method for machining a workpiece and fluid utilized during machining operations.
研削、ラッピング及び研磨作業を広範に含む、機械加工作業は、所望の表面仕上げを得るため、及び部品を成形するために、様々な産業にわたって幅広く使用されている。機械加工作業は、多種多様な最終用途に配置される非金属、無機部品（例えば、ガラス、ガラスセラミック及びセラミック部品）に関して幅広く利用されている。例えば、ガラス及びガラスセラミック部品は、商業的応用及び住宅応用の両方において建築材料として幅広く利用されている。また、ガラス材料は、電子部品実装、光応用及び太陽光応用において、並びに照明応用及び建築応用における先端材料として、並びにフラットパネルディスプレイとして益々、幅広く利用されている。 Machining operations, including a wide range of grinding, lapping and polishing operations, are widely used across various industries to obtain the desired surface finish and to form parts. Machining operations are widely used for non-metallic, inorganic parts (eg, glass, glass-ceramic and ceramic parts) placed in a wide variety of end uses. For example, glass and glass ceramic parts are widely used as building materials in both commercial and residential applications. Glass materials are also increasingly being used in electronic component mounting, optical and solar applications, as leading materials in lighting and architectural applications, and as flat panel displays.
ガラス、ガラスセラミック及びセラミックに関する適用を要求する上で必要とされる様々な設計品質が、材料の高い除去率によって理想的に特徴付けられ、好ましくない引っかき傷、孔食、磨耗又は他の表面欠陥機構に起因する表面欠陥を制御し、又は最小化する正確な機械加工作業についての必要性をさらに高めている。 The various design qualities required in demanding applications for glass, glass ceramics and ceramics are ideally characterized by high material removal rates, and undesired scratches, pitting, wear or other surface defects It further increases the need for precise machining operations to control or minimize surface defects due to mechanisms.
特に平坦なワークピースの前処理に関して、砥粒が所定の位置に固定されている固定研磨材の使用を組み込んだラッピング及び研磨作業が幅広く使用されている。ここで、固定研磨材は、一般に、２種類の研磨材要素である、結合研磨材（ｂｏｎｄｅｄ ａｂｒａｓｉｖｅ）又は被覆された研磨材被覆された研磨材（ｃｏａｔｅｄ ａｂｒａｓｉｖｅ）要素の１つと定義されている。被覆された研磨材被覆された研磨材は、一般に、砥粒が結合される可撓性の裏打ちを有するが、一方、結合研磨材は、一般に、粒間の結合層を形成するマトリクスなどによって一緒に結合される砥粒からなる。このような固定研磨材は、砥粒が、一般に、多くの場合、流体懸濁液（例えば、水性懸濁液）において遊離している、遊離研磨材又は研磨スラリーと対比されるべきである。固定研磨材は、潜在的に改良された平面性及び改良された処理制御を含む、機械加工作業の間に多くの利点を提供する。 Lapping and polishing operations that incorporate the use of fixed abrasives, in which abrasive grains are fixed in place, are widely used, particularly for pre-processing of flat workpieces. Here, a fixed abrasive is generally defined as one of two types of abrasive elements, a bonded abrasive or a coated abrasive-coated abrasive element. Coated abrasives Coated abrasives generally have a flexible backing to which the abrasive grains are bonded, while bonded abrasives are generally joined together by a matrix or the like that forms a bonded layer between the grains. It consists of abrasive grains bonded to. Such fixed abrasives should be contrasted with free abrasives or abrasive slurries where the abrasive grains are generally free in fluid suspensions (eg, aqueous suspensions). Fixed abrasives offer many advantages during machining operations, including potentially improved planarity and improved process control.
しかしながら、特に、ガラス、ガラスセラミック及びセラミック部品に関して、当該技術分野における、固定研磨材要素を利用する改良された機械加工作業についての必要性が存在し続けている。 However, there continues to be a need in the art for improved machining operations utilizing fixed abrasive elements, particularly with respect to glass, glass ceramic and ceramic parts.
本発明の第１の態様によれば、流体が、固定研磨材要素とワークピースとの間に適用され、固定研磨材要素及びワークピースは、互いに対して動かされて、ワークピースから材料を除去する、ワークピースを機械加工するための方法が提供される。特定の態様によれば、ワークピースは、ガラス、ガラスセラミック又はセラミック部品から主に構成され、流体は目詰まり防止剤（ａｎｔｉ−ｃｌｏｇｇｉｎｇ ａｇｅｎｔ）を含む。目詰まり防止剤はリン含有有機化学物質から構成される。 According to a first aspect of the invention, a fluid is applied between the fixed abrasive element and the workpiece, and the fixed abrasive element and the workpiece are moved relative to each other to remove material from the workpiece. A method for machining a workpiece is provided. According to a particular aspect, the workpiece is mainly composed of glass, glass-ceramic or ceramic parts, and the fluid contains an anti-logging agent. The anti-clogging agent is composed of a phosphorus-containing organic chemical substance.
別の実施形態によれば、流体が、固定研磨材要素とガラスワークピースとの間に提供されて、固定研磨材要素及びガラスワークピースが、互いに対して平行移動して、ワークピースから材料を除去する、ガラスワークピースを機械加工する方法が提供される。目詰まり防止剤は、ホスホネート官能基を有する有機化学物質から構成されてもよい。 According to another embodiment, fluid is provided between the fixed abrasive element and the glass workpiece so that the fixed abrasive element and the glass workpiece translate relative to each other to transfer material from the workpiece. A method of machining a glass workpiece for removal is provided. The anti-clogging agent may be composed of an organic chemical having a phosphonate functional group.
本発明のさらに別の態様によれば、非研磨のラッピング流体が、固定研磨材要素とガラスワークピースとの間に提供されて、固定研磨材要素及びガラスワークピースが、互いに動かされる、ガラスワークピースを機械加工する方法が提供される。ラッピング流体は、概して、目詰まり防止剤及び潤滑性要素を含み、目詰まり防止剤は、ホスホネート官能基を有する有機化学物質を含み、潤滑性要素は、非イオン性官能性化学物質、アニオン性官能性化学物質、カチオン性官能性化学物質及び両性官能性化学物質からなる群から選択される。 According to yet another aspect of the present invention, a non-abrasive wrapping fluid is provided between the fixed abrasive element and the glass workpiece so that the fixed abrasive element and the glass workpiece are moved relative to each other. A method of machining a piece is provided. The wrapping fluid generally includes an anti-clogging agent and a lubricious element, the anti-clogging agent includes an organic chemical having a phosphonate functional group, and the lubricating element includes a nonionic functional chemical, an anionic functional Selected from the group consisting of sex chemicals, cationic functional chemicals and amphoteric functional chemicals.
本発明の態様によれば、ワークピースを機械加工するための方法が提供され、その方法は、固定研磨材要素とワークピースとの間に流体を適用することから開始する。一般に、固定研磨材要素は、上記のように定義される。つまり、砥粒が、所定の位置に固定される要素であり、一般に、互いに対して所定の位置に固定される（結合研磨材）か、又は互いに対して所定の位置に、かつ裏打ち部材に固定される（被覆された研磨材）。固定研磨材の実際の構造は、用途に依存して広範に変化させてもよい。例えば、被覆された研磨材は、紙、布、縫い付けられた布（ｓｔｉｔｃｈ ｂｏｎｄｅｄ ｃｌｏｔｈ）、不織布及び織布材料、繊維又はフィルムの裏打ちを利用してもよく、被覆された研磨材は、ベルト、ディスク、シート、接合スリーブ（ｉｎｔｅｒｌｉｎｅｄ ｓｌｅｅｖｅ）、ロール、フラップディスク、フラップホイール及び他の幾何学的形状を含む、いくつかの異なる幾何学的形をとってもよい。一方、結合研磨材は、典型的には、固体形態で、砥石ホイール、円筒ホイール、カップホイール、ディッシュホイール、セグメント、コーン、取り付けホイール並びに点状、れんが状及び棒状の形態などの組込構造である。結合研磨材要素の結合マトリクスは、ビトリファイド結合剤（ｖｉｔｒｉｆｉｅｄ ｂｏｎｄ）などのようなガラス相の形態であってもよいか、又は、樹脂接着剤の形態、あるいはそれらの組み合わせであってもよい。 According to an aspect of the present invention, a method for machining a workpiece is provided, the method starting with applying a fluid between a fixed abrasive element and the workpiece. In general, a fixed abrasive element is defined as described above. That is, the abrasive is an element that is fixed at a predetermined position, and is generally fixed at a predetermined position with respect to each other (bonded abrasive), or fixed at a predetermined position with respect to each other and on the backing member. (Coated abrasive). The actual structure of the fixed abrasive may vary widely depending on the application. For example, the coated abrasive may utilize paper, cloth, stitched cloth, nonwoven and woven materials, fiber or film backing, and the coated abrasive may be a belt It may take a number of different geometric shapes, including discs, sheets, interleaved sleeves, rolls, flap discs, flap wheels and other geometric shapes. On the other hand, bonded abrasives are typically in solid form, with built-in structures such as grindstone wheels, cylindrical wheels, cup wheels, dish wheels, segments, cones, mounting wheels and dot, brick and rod forms. is there. The bond matrix of the bonded abrasive element may be in the form of a glass phase, such as a vitrified bond, or in the form of a resin adhesive, or a combination thereof.
さらに、特に、被覆された研磨材に関して、固定研磨材は、一般に、ピラミッド、マウンド、リッジなどの形態の盛り上がった表面特性又は他の表面特性のパターンを有する設計された研磨材の形態であってもよい。 Further, particularly with respect to coated abrasives, fixed abrasives are generally in the form of engineered abrasives having raised surface characteristics in the form of pyramids, mounds, ridges, etc. or other surface characteristic patterns. Also good.
ワークピースについては、一般的には、本発明の態様は、ガラス、ガラスセラミック又はセラミック組成物などの非金属、無機材料に限定される。前述のうち、ガラス及びガラスセラミック複合材などの重要なガラス相を有するこれらの組成物は、本発明の特定の実施形態によって機械加工される。実際に、多くの場合、ワークピースは、本質的にガラスからなってもよい。つまり、その機械加工性に実質的に影響を与える他の非アモルファス種を含まない。ガラスワークピースに関して、ガラスは、シリカ微細構造骨格を有するシリカベースであってもよい。シリカベースガラスの特定の種類としては、Ｂ2Ｏ3の重要な含有量並びに必要に応じて、Ｎａ2Ｏ／Ｋ2Ｏ及びＡｌ2Ｏ3などの他の酸化物を含むホウケイ酸ガラスが挙げられる。他の種類としては、Ｎａ2Ｏ、ＣａＯ、ＭｇＯ及びＡｌ2Ｏ3の重要な含有量を含むソーダ石灰ガラスが挙げられる。 For workpieces, in general, aspects of the present invention are limited to non-metallic, inorganic materials such as glass, glass ceramic or ceramic compositions. Of the foregoing, these compositions having important glass phases such as glass and glass-ceramic composites are machined according to certain embodiments of the present invention. Indeed, in many cases, the workpiece may consist essentially of glass. That is, it does not contain other non-amorphous species that substantially affect its machinability. For glass workpieces, the glass may be silica-based with a silica microstructure skeleton. Particular types of silica-based glasses include borosilicate glasses that contain a significant content of B 2 O 3 and optionally other oxides such as Na 2 O / K 2 O and Al 2 O 3. It is done. Other types include soda lime glass containing significant contents of Na 2 O, CaO, MgO and Al 2 O 3 .
ワークピースの実際の幾何学的形状は、管状、光ファイバー及び他の形状を含む、凸面又は凹面外形などの形態のように変化させてもよい。多くの場合、ワークピースの少なくとも１つの主要な表面は平面であり、その表面は、本明細書に開示される機械加工作業に供されてもよい。ワークピースは、ソーダ石灰ガラス（ｓｏｄａ−ｌｉｎｅ ｇｌａｓｓ）又はＩ線用ガラス（Ｉ−ｌｉｎｅ ｇｌａｓｓ）、石英ガラス、及びフッ化カルシウムなどのマイクロリソグラフィ部品、ウエハブランク基材（ｗａｆｅｒ ｂｌａｎｋ ｓｕｂｓｔｒａｔｅ）、レーザーウインドウの形態並びに他の形態であってもよい。ワークピースはまた、商業的及び住宅建築産業に利用されるような平面ガラスの形態であってもよく、ガラスセラミック組成物を広範に含んでもよい。さらに他の一般的なワークピースは、例えば、干渉フィルターから平行面ワークピースの範囲に及ぶ光学装置及びガラス機器についてのガラス部品を含む。 The actual geometric shape of the workpiece may be varied, such as in the form of a convex or concave profile, including tubular, optical fiber and other shapes. In many cases, at least one major surface of the workpiece is planar and that surface may be subjected to the machining operations disclosed herein. Workpieces include soda-line glass or I-line glass, quartz glass, and microlithographic parts such as calcium fluoride, wafer blank substrate, laser window As well as other forms. The workpiece may also be in the form of flat glass, such as used in the commercial and residential construction industries, and may include a wide range of glass ceramic compositions. Still other common workpieces include, for example, glass parts for optical devices and glass equipment ranging from interference filters to parallel surface workpieces.
固定研磨材の粒子の組成物は、酸化アルミニウム、ジルコニア、酸化セリウム、酸化ケイ素、炭化ケイ素、炭化ホウ素、ガーネット、立方晶窒化ホウ素、ダイヤモンド及び使用される任意の他の一般的な研磨材を含んだ適切な材料の中で変更させてもよい。本発明の実施形態は、特に強力な研磨材を利用してそのような状況下でも高水準の効果を発揮する。ガーネットは勿論のこと、ダイヤモンド研磨材、炭化ホウ素（立方体状の炭化ホウ素を含む）及び炭化ケイ素のようなカーバイド研磨材も同様にそのような効果を発揮する。 Fixed abrasive particle composition includes aluminum oxide, zirconia, cerium oxide, silicon oxide, silicon carbide, boron carbide, garnet, cubic boron nitride, diamond and any other common abrasive used However, it may be changed in appropriate materials. Embodiments of the present invention exhibit a high level of effect even under such circumstances using a particularly powerful abrasive. Not only garnet, but also diamond abrasives, carbide abrasives such as boron carbide (including cubic boron carbide) and silicon carbide exhibit such effects as well.
さらに、固定砥粒のメジアン粒径は、約０．０１ミクロン〜約１．５ミクロンの範囲内、典型的には、わずかに狭い範囲内、例えば、約０．１〜１．０ミクロン、０．１０〜０．５０ミクロンなどの範囲内であるように微粒であってもよい。１ミクロン未満のメジアン粒径の仕様は、一般に、精密表面仕上げが、低材料除去率で機械加工作業を実施することによって与えられる研磨処理を示す。しかしながら、他の実施形態によれば、固定研磨材のメジアン粒径は、２〜５０ミクロン、又は２〜１０ミクロンのオーダーのように１ミクロンより大きくてもよい。この場合、典型的に、機械加工作業は、ラッピング作業として特徴付けられる。 Further, the median particle size of the fixed abrasive is within the range of about 0.01 microns to about 1.5 microns, typically within a slightly narrow range, such as about 0.1 to 1.0 microns, 0 Fine particles may be used, such as within a range of .10 to 0.50 microns. A median particle size specification of less than 1 micron generally indicates a polishing process in which a precision surface finish is provided by performing machining operations with low material removal rates. However, according to other embodiments, the median particle size of the fixed abrasive may be greater than 1 micron, such as on the order of 2-50 microns, or 2-10 microns. In this case, the machining operation is typically characterized as a lapping operation.
様々なの実施形態によれば、ワークピースを機械加工するための方法は、固定研磨材要素とワークピースとの間に流体の適用を継続し、続いて、互いに対して固定研磨材要素及びワークピースが平行移動して、ワークピースから材料を除去する。これに関して、固定研磨材は固定して保持されて、ワークピースが平行移動されてもよく、ワークピースは固定して保持されて、固定研磨材要素が平行移動されてもよいか、あるいは、固定研磨材要素及びワークピースの両方が平行移動されてもよい。平行移動は、固定したワークピース上で閉ループ被覆された研磨材ベルトを平行移動する場合のように、直線移動のように異なる経路に沿って実施されてもよく、回転研削ディスク又はホイールの場合のように回転されてもよいか、又はワークピース若しくは固定研磨材要素が中心軸の周りを回りながら、固定研磨材要素を回転させる場合のように回転と軌道との組み合わせであってもよい。 According to various embodiments, a method for machining a workpiece continues to apply a fluid between a fixed abrasive element and the workpiece, followed by a fixed abrasive element and the workpiece relative to each other. Translate to remove material from the workpiece. In this regard, the fixed abrasive may be held fixed and the workpiece may be translated, the workpiece may be held fixed and the fixed abrasive element may be translated, or fixed. Both the abrasive element and the workpiece may be translated. Translation may be performed along different paths, such as linear movement, such as translating a closed-loop coated abrasive belt over a fixed workpiece, as in the case of a rotating grinding disc or wheel. Or a combination of rotation and trajectory, such as rotating a fixed abrasive element while the workpiece or fixed abrasive element rotates about a central axis.
特定の態様によれば、流体は目詰まり防止剤を含み、目詰まり防止剤は、一般に、リン含有有機化学物質を含む。リン含有有機化学物質は、ホスホネート、ホスフェート、ホスホルアミド、ホスホンアミド、チオホスフェート、チオホスホネート、及びホスファイトからなる群から選択される官能基を有してもよい。特定の実施形態によれば、官能基は、ホスホネートである。例えば、ホスホネートは、グリシン−Ｎ，Ｎ−ジ（ＧＤＭＰ）、アミノトリ（ＡＴＭＰ）、Ｎ−２ヒドロキシエチル−Ｎ，Ｎ−ジ（ＨＥＭＰＡ）、エチレンジアミンテトラ（ＥＤＴＭＰＡ）、ヘキサメチレンジアミンテトラ、ジエチレントリアミンペンタ、ホスホノギ酸塩、ヒドロキシホスホノ酢酸（ＨＰＡ）、２−ホスホノブタン−１，２，４−トリカルボン酸（ＰＢＴＣ）、１−ヒドロキシエチリジン−１，１’−ジホスホン酸（ＨＥＤＰ）及びそれらの塩からなる群から選択されてもよい。本明細書に記載される特定の作用実施形態によれば、目詰まり防止剤は、少なくともＨＥＤＰを含む。 According to certain embodiments, the fluid includes an anti-clogging agent, and the anti-clogging agent generally includes a phosphorus-containing organic chemical. The phosphorus-containing organic chemical may have a functional group selected from the group consisting of phosphonates, phosphates, phosphoramides, phosphonamides, thiophosphates, thiophosphonates, and phosphites. According to a particular embodiment, the functional group is a phosphonate. For example, phosphonates include glycine-N, N-di (GDMP), aminotri (ATMP), N-2hydroxyethyl-N, N-di (HEMPA), ethylenediaminetetra (EDTMPA), hexamethylenediaminetetra, diethylenetriaminepenta, It consists of phosphonoformate, hydroxyphosphonoacetic acid (HPA), 2-phosphonobutane-1,2,4-tricarboxylic acid (PBTC), 1-hydroxyethylidine-1,1′-diphosphonic acid (HEDP) and their salts. It may be selected from a group. According to certain working embodiments described herein, the anti-clogging agent comprises at least HEDP.
別の態様によれば、流体はまた、潤滑性要素を含んでもよく、その成分は、１）アルコール、チオール、エステル、アミド、アミン、アミンオキシド、又はイミド及びそれらの誘導体を含む、非イオン性官能性化学物質、２）ホスフェート、ホスホネート、スルフェート、スルホネート、又はカルボキシレート及びそれらの誘導体を含む、アニオン性官能性化学物質、３）第４級アミン又はアミン塩及びそれらの誘導体のようなカチオン性官能性化学物質、並びに４）プロプリオネート、ベタイン、グリシネート又はスルタイン（ｓｕｌｔａｉｎｅ）及びそれらの誘導体を含む、両性官能性化学物質、からなる群から選択される。 According to another aspect, the fluid may also include a lubricious element, the components of which are 1) non-ionic, including alcohols, thiols, esters, amides, amines, amine oxides, or imides and their derivatives. Functional chemicals, 2) Anionic functional chemicals, including phosphates, phosphonates, sulfates, sulfonates, or carboxylates and their derivatives, 3) Cationics such as quaternary amines or amine salts and their derivatives Selected from the group consisting of functional chemicals and 4) amphoteric functional chemicals, including proprionates, betaines, glycinates or sultaines and their derivatives.
典型的には、潤滑性要素は、非イオン性及びアニオン性官能性化学物質から選択され、非イオン性官能性化学物質に関しては、アルコール、チオール、エステル、イミド、アミド、イミド及びそれらの誘導体からなる群から選択されてもよい。 Typically, the lubricious element is selected from nonionic and anionic functional chemicals, with respect to nonionic functional chemicals from alcohols, thiols, esters, imides, amides, imides and their derivatives. It may be selected from the group consisting of
流体は、好ましくは、担体溶媒として水を利用するが、グリコール、アルコール及びカーボネートのような他の適切な溶媒を使用してもよい。溶媒の使用において主に考慮されるのは、目詰まり防止剤及び潤滑性要素を可溶化する溶媒の能力である。溶媒はまた、溶媒和及び固定研磨材要素からの残渣を移動することによって目詰まり防止剤を補助する。目詰まり防止剤の具体的な濃度は、０．００１％ｗ／ｗ〜１０％ｗ／ｗ、例えば、０．１％ｗ／ｗ〜１．０％ｗ／ｗ（ｗ／ｗ＝目詰まり防止剤の質量／流体の質量）である。同様に、潤滑性要素は、典型的に、０．０１％ｗ／ｗ〜４９％ｗ／ｗの濃度で使用される。溶媒濃度は、１００％ｗ／ｗまでの濃度の差分であるとみなされる。ある実施形態において、溶媒及び潤滑性要素は、１００％ｗ／ｗまでの濃度の差分についてのエチレングリコールの使用の場合のように、同じものであると考えられる。使用できるｐＨ値、つまり、水素イオン濃度の負の対数は、１．０〜１４．０の範囲内であり、特定の流体についての特定のｐＨの範囲は、７．０〜１３．０である。流体のｐＨが、水に溶解された目詰まり防止剤のものを超える場合、塩基が所望のｐＨを達成するために使用される。本発明の目的のために、塩基はルイス塩基、又は電子密度を供与できる任意の化学物質とみなされる。適切な塩基の例としては、水酸化ナトリウム、アンモニア又はエタノールアミンが挙げられるが、多くの他のものも許容できる。好ましい塩基は、水酸化カリウムである。 The fluid preferably utilizes water as the carrier solvent, although other suitable solvents such as glycols, alcohols and carbonates may be used. A major consideration in the use of solvents is the ability of the solvent to solubilize the anti-clogging agent and the lubricious element. The solvent also assists the anti-clogging agent by moving solvates and residues from the fixed abrasive element. The specific concentration of the anti-clogging agent is 0.001% w / w to 10% w / w, for example, 0.1% w / w to 1.0% w / w (w / w = clogging prevention) Agent mass / fluid mass). Similarly, lubricious elements are typically used at concentrations of 0.01% w / w to 49% w / w. The solvent concentration is considered to be the concentration difference up to 100% w / w. In certain embodiments, the solvent and lubricity element are considered the same, as in the use of ethylene glycol for concentration differences up to 100% w / w. Usable pH values, ie, the negative logarithm of hydrogen ion concentration, is in the range of 1.0-14.0, and the specific pH range for a specific fluid is 7.0-13.0. . If the pH of the fluid exceeds that of an anti-clogging agent dissolved in water, a base is used to achieve the desired pH. For the purposes of the present invention, a base is considered a Lewis base or any chemical that can donate an electron density. Examples of suitable bases include sodium hydroxide, ammonia or ethanolamine, but many others are acceptable. A preferred base is potassium hydroxide.
組成物Ａ
０．１７５％ １−ヒドロキシエチリジン−１，１’−ジホスホン酸（ＨＥＤＰ）
０．１２５％ 水酸化カリウム（ＫＯＨ）
９９．７００％ 水
ｐＨ＝７．０
Composition A
0.175% 1-hydroxyethylidene-1,1′-diphosphonic acid (HEDP)
0.125% potassium hydroxide (KOH)
99.700% water pH = 7.0
組成物Ｂ
０．１７５％ １−ヒドロキシエチリジン−１，１’−ジホスホン酸（ＨＥＤＰ）
０．１８５％ 水酸化カリウム（ＫＯＨ）
０．１００％ Ｕｃｏｎ ５０−ＨＢ−６６０
９９．５４０％ 水
ｐＨ＝１１．０
Composition B
0.175% 1-hydroxyethylidene-1,1′-diphosphonic acid (HEDP)
0.185% Potassium hydroxide (KOH)
0.100% Ucon 50-HB-660
99.540% water pH = 11.0
組成物Ｃ
０．１７５％ １−ヒドロキシエチリジン−１，１’−ジホスホン酸（ＨＥＤＰ）
０．１８５％ 水酸化カリウム（ＫＯＨ）
０．２００％ Ｔｏｍａｈ ＡＯ−４０５
９９．４４０％ 水
ｐＨ＝１１．０
Composition C
0.175% 1-hydroxyethylidene-1,1′-diphosphonic acid (HEDP)
0.185% Potassium hydroxide (KOH)
0.200% Tomah AO-405
99.440% water pH = 11.0
組成物Ｄ
０．１７５％ １−ヒドロキシエチリジン−１，１’−ジホスホン酸（ＨＥＤＰ）
０．１２５％ 水酸化カリウム（ＫＯＨ）
０．２２０％ Ａｃｕｓｏｌ ４４５
９９．４８０％ 水
ｐＨ＝７．０
Composition D
0.175% 1-hydroxyethylidene-1,1′-diphosphonic acid (HEDP)
0.125% potassium hydroxide (KOH)
0.220% Acusol 445
99.480% water pH = 7.0
試験装置は、固定研磨材パッドを備えた生産サイズの両面ラッピング機械（Ｓｐｅｅｄｆａｍ １６Ｂ）であった。比較ラッピング試験を、担体流体として水及び冷却材のみで実施し、一方、上記の本発明の実施形態に対応する実施例では、上記の実施例に関連してリン含有有機化学物質、特にＨＥＤＰを組み込んだ。機械加工は、種々の光学ガラスであり、目的は、研磨工程前に迅速に材料（ｓｔｏｃｋ）を除去することであった。 The test equipment was a production size double-sided lapping machine (Speedfam 16B) with a fixed abrasive pad. Comparative lapping tests are performed with only water and coolant as the carrier fluid, while in the examples corresponding to the above embodiments of the present invention, phosphorus-containing organic chemicals, particularly HEDP, are associated with the above examples. Incorporated. Machining is a variety of optical glasses, the purpose of which was to remove material quickly before the polishing process.
比較ラッピング試験において、１回又は２回の生産サイクルの後、研磨パッドは、研削からの残渣を積み、１）平面性を悪化させ、２）研磨材をほとんど曝露させないため、材料除去を劇的に低下させるという２つの事柄を生じる。対照的に、ＨＥＤＰ添加剤により、１週間までの研削の間、材料除去性能が向上して維持された。さらに、ＨＥＤＰ添加剤により、潤滑剤を除いた場合、ただ水のみで効果的であることが見出された。 In a comparative lapping test, after one or two production cycles, the polishing pad accumulates residues from grinding, 1) deteriorates flatness, and 2) exposes little abrasive material, dramatically reducing material removal. There are two things that cause it to drop. In contrast, the HEDP additive improved and maintained material removal performance during up to 1 week of grinding. Furthermore, it has been found that with the HEDP additive, only the water is effective when the lubricant is removed.
本明細書の実施形態によれば、出願人らは、上記のワークピースの特定の固定研磨材の機械加工用途に関して、目詰まり防止剤を組み込んだ機械加工流体の利用が、機械加工性能に重要な影響を与えていることを発見した。例えば、必要に応じて、材料除去及び削りくず除去に役立つ流体添加剤とともに、機械加工作業に関して固定研磨材を利用することが、機械加工産業内において一般に公知である。さらに、特定の機械加工作業において、材料除去に役立つため、及び必要に応じて、遊離研磨材を利用するＣＭＰ作業の場合のように、ワークピースの平坦化に役立つために、機械加工を受けるワークピースとの化学的相互作用を有する化学物質種を利用することが所望されることが、一般に理解されている。対照的に、本発明の実施形態によれば、固定研磨材の機械加工作業において、上記の特定の目詰まり防止剤の利用が、固定研磨材の目詰まりを防止するのに重要な影響を与えることが、発見されている。 According to embodiments herein, Applicants have identified the use of machining fluids incorporating anti-clogging agents in machining performance for certain fixed abrasive machining applications of the above workpieces. I discovered that it has had a great influence. For example, it is generally known within the machining industry to utilize fixed abrasives for machining operations, with fluid additives that aid in material removal and shaving removal, if desired. In addition, in certain machining operations, the workpiece undergoes machining to help remove material and, if necessary, to help flatten the workpiece, such as in a CMP operation that utilizes loose abrasives. It is generally understood that it is desirable to utilize a chemical species that has a chemical interaction with the piece. In contrast, according to an embodiment of the present invention, the use of the specific anti-clogging agent has an important effect on preventing the clogging of the fixed abrasive in the machining operation of the fixed abrasive. It has been discovered.
ホウケイ酸ガラスを機械加工する特定の状況において、３Ｍ Ｔｒｉｚａｃｔパッドのような固定ダイヤモンドパッドが、研削作業に利用されている。しかしながら、機械加工の間、多くの場合、このようなパッドは、時々、２〜３サイクルのみの範囲内でワークピース（基材）から除去された材料を全体に積むか、又は詰まらせる。このような目詰まりは、ワークピースの平坦化に悪い影響を与えるなど、著しい悪影響を与える。目詰まり及び積載の問題に対処するために、パッドは、目詰まりした材料を除去するために、アルミナ仕上げパッドのようなセラミック部品で仕上げられてもよい。しかしながら、このような仕上げパッドは、一般に、すぐに擦り切れ、それらが本質的に仕上げ用途の状況における消耗品であるという事実を考慮して、購入するのに費用がかかる。出願人らは、例えば、Ｓａｂｅｒｌｕｂｅ ９０１６を含む、上記のような最先端の潤滑性流体と組み合わせて使用される場合でさえ、このようなパッドの多くの目詰まりを留意している。 In the specific situation of machining borosilicate glass, stationary diamond pads such as 3M Trizact pads are utilized for grinding operations. However, during machining, in many cases such pads sometimes load or clog material removed from the workpiece (substrate) within only a few cycles. Such clogging has a significant adverse effect, such as adversely affecting the flattening of the workpiece. To address clogging and loading problems, the pad may be finished with a ceramic component such as an alumina finish pad to remove clogged material. However, such finishing pads are generally expensive to purchase in view of the fact that they are frayed quickly and are essentially consumables in the context of finishing applications. Applicants have noted many clogs of such pads, even when used in combination with state-of-the-art lubricating fluids such as those described above, including Saberlube 9016, for example.
ホウケイ酸ガラスの機械加工作業の状況における目詰まり防止剤の組み込みは、仕上げ作業の間の機械加工の期間を、非常に改良することが見出されている。実際、機械加工は、仕上げ処理をしない一週間全体で、作業可能であると見出され、１日あたり同じ数のサイクルでの当該分野の技術水準より９０％の向上を示す。 Incorporation of anti-clogging agents in the context of borosilicate glass machining operations has been found to greatly improve the duration of machining during finishing operations. In fact, machining is found to be workable throughout the week without finishing, showing a 90% improvement over the state of the art in the same number of cycles per day.
ホスホネート官能性化学物質のような官能性化学物質が、材料除去に役立つために、遊離研磨材スラリーを用いる機械加工作業の状況において利用されているが、本発明の態様は、固定研磨材機械加工の状況において目詰まり防止現象の利点がある。固定研磨材機械加工とのこのような組み合わせは、ガラス、ガラスセラミック及びセラミックのような無機、非金属ワークピースの処理可能性を著しく向上させる。 While functional chemicals, such as phosphonate functional chemicals, have been utilized in the context of machining operations using free abrasive slurries to aid in material removal, aspects of the present invention provide for fixed abrasive machining. In this situation, there is an advantage of the phenomenon of preventing clogging. Such a combination with fixed abrasive machining significantly improves the processability of inorganic, non-metallic workpieces such as glass, glass ceramic and ceramic.
本発明の実施形態は、ホスホネートベースの目詰まり防止剤及びそれらを組み込んだ組成物として例示して記載されているが、本発明は、示された詳細に制限されると意図されない。なぜなら、種々の変更及び代替物が、本発明の範囲から決して逸脱せずになされ得るからである。例えば、さらなる又は等価の代替物が提供されてもよく、さらなる又は等価の生産工程が利用されてもよい。同様に、本明細書に開示される本発明のさらなる変更及び等価物は、慣例の実験のみを用いて当業者が想到でき、全てのこのような変更及び等価物は、添付の特許請求の範囲に規定される本発明の範囲内であると考えられるからである。 While embodiments of the present invention have been illustrated and described as phosphonate-based clogging inhibitors and compositions incorporating them, the present invention is not intended to be limited to the details shown. This is because various changes and alternatives can be made without departing from the scope of the invention. For example, additional or equivalent alternatives may be provided, and additional or equivalent production processes may be utilized. Similarly, further modifications and equivalents of the invention disclosed herein can be devised by those skilled in the art using only routine experimentation, and all such modifications and equivalents are claimed in the appended claims. This is because it is considered to be within the scope of the present invention defined in the above.
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| US8603350B2 (en) * | 2009-07-17 | 2013-12-10 | Ohara Inc. | Method of manufacturing substrate for information storage media |
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2007
- 2007-12-13 WO PCT/US2007/087328 patent/WO2008079704A2/en active Application Filing
- 2007-12-13 US US11/955,749 patent/US8168075B2/en not_active Expired - Fee Related
- 2007-12-13 JP JP2009543086A patent/JP5336387B2/en not_active Expired - Fee Related
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Also Published As
| Publication number | Publication date |
|---|---|
| CA2672146A1 (en) | 2008-07-03 |
| TWI386468B (en) | 2013-02-21 |
| JP2010513693A (en) | 2010-04-30 |
| KR101131796B1 (en) | 2012-03-30 |
| EP2121244A2 (en) | 2009-11-25 |
| US8168075B2 (en) | 2012-05-01 |
| WO2008079704A3 (en) | 2008-12-24 |
| EP2121244B1 (en) | 2013-07-10 |
| WO2008079704A2 (en) | 2008-07-03 |
| KR20090082508A (en) | 2009-07-30 |
| TW200902657A (en) | 2009-01-16 |
| CA2672146C (en) | 2012-08-21 |
| CN101588894A (en) | 2009-11-25 |
| CN101588894B (en) | 2013-03-27 |
| US20080153397A1 (en) | 2008-06-26 |
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