JP5329083B2 - ポストおよびパッドを有する部品 - Google Patents
ポストおよびパッドを有する部品 Download PDFInfo
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- JP5329083B2 JP5329083B2 JP2007518347A JP2007518347A JP5329083B2 JP 5329083 B2 JP5329083 B2 JP 5329083B2 JP 2007518347 A JP2007518347 A JP 2007518347A JP 2007518347 A JP2007518347 A JP 2007518347A JP 5329083 B2 JP5329083 B2 JP 5329083B2
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- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
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- H01L2225/1047—Details of electrical connections between containers
- H01L2225/1058—Bump or bump-like electrical connections, e.g. balls, pillars, posts
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
- H01L2924/1533—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
- H01L2924/15331—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/181—Encapsulation
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- Computer Hardware Design (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
本願は、2004年6月25日に出願した米国特許仮出願第60/583,109号の出願日を主張し、その開示を参照により本明細書に組み込む。
本発明は、超小型電子アセンブリに有用な部品およびアセンブリ、そのような部品を組み込んだアセンブリ、ならびにそのような部品を作製する方法に関する。
Claims (14)
- 超小型電子素子を取り付けるための接続部品を含む、パッケージされた超小型電子素子であって、該接続部品は、
(a)上向きの内側面および下向きの外側面を有する誘電体層と、
(b)前記外側面とは離隔して前記誘電体層上に延びる導電性トレースと、
(c)前記導電性トレースから前記誘電体層を貫通し、前記誘電体層の前記外側面を超えて下向きに突出する導電性ポストであって、銅で形成されている、導電性ポストと、
(d)前記誘電体層の前記外側面に露出した導電性パッドであって、前記導電性パッドの少なくとも一部が前記導電性トレースの少なくとも一部によって前記ポストの少なくとも一部に電気的に接続される、導電性パッドであって、
前記誘電体層が、それを貫通して延びる長尺スロットを有し、前記誘電体層が、前記スロットの両側に1対のスロット縁領域を画定し、前記パッドが、前記スロット縁領域の少なくとも1つで露出するスロット縁パッドを含み、
前記誘電体層が複数の縁および前記縁と隣接する縁領域を有し、前記パッドの少なくとも一部が前記縁の第1縁に隣接する前記縁領域の第1縁領域に露出されている、導電性パッドとを含むものであり、
表面を有する超小型電子素子であって、前記誘電体層の前記内側面が前記表面に向かって上を向いた状態で、前記誘電体層が前記表面の一部分の上に載上し、前記表面の第1コンタクト領域が前記誘電体層の前記第1縁を超えて外側に突出し、前記超小型電子素子が前記第1コンタクト領域で前記表面に露出したコンタクトを有する、表面を有する超小型電子素子と、
前記コンタクトの少なくとも幾つかと前記パッドの少なくとも幾つかとの間に延びる長尺リードと
を含んでなる、パッケージされた超小型電子素子。 - 前記パッドが前記外面から上向きに後退した露出パッド面を画定する請求項1に記載のパッケージされた超小型素子。
- 前記パッドが少なくとも部分的に前記誘電体層を貫通して前記トレースから下向きに突出する請求項1に記載のパッケージされた超小型素子。
- 前記パッドが前記誘電体層の前記外面と略面一である下向きのパッド面を画定する請求項1に記載のパッケージされた超小型素子。
- 前記パッドが誘電体層を貫通して前記トレースから下向きに突出し、かつパッド突出距離だけ前記外面を越えて下向きに突出し、前記ポストが前記外面を越えてポスト突出距離だけ下向きに突出し、前記パッド突出距離が前記ポスト突出距離より小さい請求項1に記載のパッケージされた超小型素子。
- 前記ポストが回路パネルにはんだ接合するように適合された請求項1に記載のパッケージされた超小型素子。
- 前記ポストが前記トレースから下向きに延びる上部と、前記上部から下向きに突出する下部とを含み、前記上部が水平方向の寸法を有する端面を画定し、前記下部が前記上部の前記端面と隣接するベース面を画定し、前記ポストの前記ベース面が前記端面の水平方向の寸法より大きい水平方向の寸法を有する請求項1に記載のパッケージされた超小型素子。
- 前記上部の前記端面が前記誘電体層の前記外側面と略面一である請求項7に記載のパッケージされた超小型素子。
- 前記誘電体層が前記第1縁とは反対側の第2縁および前記第2縁に隣接する第2縁領域を有し、前記超小型電子素子の前記表面が前記第2縁を越えて外側に突出する第2コンタクト領域を含み、前記パッドが前記第2縁領域で露出する第2縁パッドを含み、前記超小型電子素子が前記第2コンタクト領域で前記表面に露出する第2領域コンタクトを有し、前記パッケージされた超小型電子素子が、前記第2領域コンタクトの少なくとも幾つかから前記第2縁パッドの少なくとも幾つかまで延びる第2縁長尺リードをさらに含む請求項1に記載のパッケージされた超小型素子。
- 超小型電子素子を取り付けるための接続部品を含む、パッケージされた超小型電子素子であって、該接続部品は、
(a)上向きの内側面および下向きの外側面を有する誘電体層と、
(b)前記外側面とは離隔して前記誘電体層上に延びる導電性トレースと、
(c)前記導電性トレースから前記誘電体層を貫通し、前記誘電体層の前記外側面を超えて下向きに突出する導電性ポストであって、銅で形成されている、導電性ポストと、
(d)前記誘電体層の前記外側面に露出した導電性パッドであって、前記導電性パッドの少なくとも一部が前記導電性トレースの少なくとも一部によって前記ポストの少なくとも一部に電気的に接続される、導電性パッドであって、
前記誘電体層が、それを貫通して延びる長尺スロットを有し、前記誘電体層が、前記スロットの両側に1対のスロット縁領域を画定し、前記パッドが、前記スロット縁領域の少なくとも1つで露出するスロット縁パッドを含むものである、導電性パッドと、
表面を有する超小型電子素子であって、前記誘電体層の前記内側面が前記表面に向かって上を向いた状態で、前記誘電体層が前記表面の一部分の上に載上し、前記超小型電子素子が前記表面に露出しかつ前記スロットと整列したコンタクトを有する、表面を有する超小型電子素子と、
前記スロットを貫通して前記コンタクトの少なくとも幾つかから前記スロット縁パッドの少なくとも幾つかまで延びるスロット長尺リードと
を含んでなる、パッケージされた超小型電子素子。 - 前記長尺リードがワイヤボンドである請求項1、請求項9および請求項10のいずれかに記載のパッケージされた超小型素子。
- 前記トレースが前記誘電体層の前記内面上に延びる請求項1に記載のパッケージされた超小型素子。
- 前記パッドが下向きの露出表面を有し、前記パッドが第1金属を含み、第2金属の層が前記表面を被覆する請求項1に記載のパッケージされた超小型素子。
- 前記パッドが下向きの露出表面を有し、前記パッドの前記表面が略平坦である請求項1に記載のパッケージされた超小型素子。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US58310904P | 2004-06-25 | 2004-06-25 | |
US60/583,109 | 2004-06-25 | ||
PCT/US2005/022753 WO2006004672A1 (en) | 2004-06-25 | 2005-06-24 | Components with posts and pads |
Publications (2)
Publication Number | Publication Date |
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JP2008504696A JP2008504696A (ja) | 2008-02-14 |
JP5329083B2 true JP5329083B2 (ja) | 2013-10-30 |
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007518347A Active JP5329083B2 (ja) | 2004-06-25 | 2005-06-24 | ポストおよびパッドを有する部品 |
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JP (1) | JP5329083B2 (ja) |
WO (1) | WO2006004672A1 (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
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US8641913B2 (en) | 2003-10-06 | 2014-02-04 | Tessera, Inc. | Fine pitch microcontacts and method for forming thereof |
US7495179B2 (en) | 2003-10-06 | 2009-02-24 | Tessera, Inc. | Components with posts and pads |
US7709968B2 (en) | 2003-12-30 | 2010-05-04 | Tessera, Inc. | Micro pin grid array with pin motion isolation |
TWI483944B (zh) | 2004-03-30 | 2015-05-11 | Euro Celtique Sa | 含有小於25ppm14-羥可待因酮之羥可酮鹽酸鹽組成物、醫藥劑型、延遲釋出口服劑型及醫藥上可以接受的包裝 |
CN101874296B (zh) | 2007-09-28 | 2015-08-26 | 泰塞拉公司 | 利用成对凸柱进行倒装芯片互连 |
US20100044860A1 (en) * | 2008-08-21 | 2010-02-25 | Tessera Interconnect Materials, Inc. | Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layer |
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