JP5329028B2 - 電子部品実装構造体の製造方法 - Google Patents
電子部品実装構造体の製造方法 Download PDFInfo
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- JP5329028B2 JP5329028B2 JP2006251071A JP2006251071A JP5329028B2 JP 5329028 B2 JP5329028 B2 JP 5329028B2 JP 2006251071 A JP2006251071 A JP 2006251071A JP 2006251071 A JP2006251071 A JP 2006251071A JP 5329028 B2 JP5329028 B2 JP 5329028B2
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- electronic component
- solder particles
- electrodes
- electronic components
- adhesive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0224—Conductive particles having an insulating coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0425—Solder powder or solder coated metal powder
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
Description
であってもよい。
1が流動して半田粒子22同士がぶつかり合った程度では破れず(図1中に示す左側の部分拡大図参照)、接着剤20が第1の回路基板11と第2の回路基板13の接合に使用され、半田粒子22が対向する電極12,14の間に挟まれて押し潰されたときに初めて破れ、両回路基板11,13の電極12,14同士を接続する(図1中に示す右側の拡大図参照)。
11 第1の回路基板(第1の電子部品)
12 電極
13 第2の回路基板(第2の電子部品)
14 電極
20 電子部品実装用接着剤
20′ 接着剤硬化物
21 熱硬化性樹脂
22 半田粒子
22a 酸化膜
Claims (1)
- 第1の電子部品の電極と第2の電子部品の電極が電気的に接続され、熱硬化性樹脂を主成分とする電子部品実装用接着剤が熱硬化した接着剤硬化物によって両電子部品が接合された電子部品実装構造体の製造方法であって、第1の電子部品の電極を覆って電子部品実装用接着剤を塗布する接着剤塗布工程と、第1の電子部品の電極と第2の電子部品の電極の位置合わせをしたうえで両電極が近接するように両電子部品を相対的に近づけて加熱し、電子部品実装用接着剤を熱硬化させて両電子部品を接合する熱圧着工程とを含み、接着剤塗布工程において第1の電子部品に塗布される電子部品実装用接着剤には表面の水分を蒸発させるために酸素含有雰囲気中で加熱処理が施された後に熱硬化性樹脂に分散された半田粒子が含まれており、前記熱圧着工程において第1の電子部品の電極と第2の電子部品の電極が近接するように両電子部品を近づけた際、両電極の間に半田粒子を挟みこんで半田粒子の表面の酸化膜を破り、その酸化膜が破られ、且つ加熱によって溶融された半田粒子によって両電極を電気的に接続させることを特徴とする電子部品実装構造体の製造方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006251071A JP5329028B2 (ja) | 2006-09-15 | 2006-09-15 | 電子部品実装構造体の製造方法 |
EP07807671A EP2062468A1 (en) | 2006-09-15 | 2007-09-13 | Electronic components mounting adhesive, manufacturing method of an electronic components mounting adhesive, electronic components mounted structure, and manufacturing method of an electronic components mounted structure |
US12/096,446 US20090161328A1 (en) | 2006-09-15 | 2007-09-13 | Electronic components mounting adhesive, manufacturing method of an electronic components mounting adhesive, electronic components mounted structure, and manufacturing method of an electronic components mounted structure |
PCT/JP2007/068320 WO2008032866A1 (en) | 2006-09-15 | 2007-09-13 | Electronic components mounting adhesive, manufacturing method of an electronic components mounting adhesive, electronic components mounted structure, and manufacturing method of an electronic components mounted structure |
KR1020087014842A KR20090051002A (ko) | 2006-09-15 | 2007-09-13 | 전자 부품 실장용 접착제, 전자 부품 실장용 접착제의 제조방법, 전자 부품 실장 구조체, 및 전자 부품 실장구조체의 제조 방법 |
CN200780001653XA CN101361412B (zh) | 2006-09-15 | 2007-09-13 | 电子部件安装粘合剂、电子部件安装粘合剂的制作方法、电子部件安装结构及电子部件安装结构的制作方法 |
TW96134547A TW200816895A (en) | 2006-09-15 | 2007-09-14 | Electronic components mounting adhesive, manufacturing method of an electronic components mounting adhesive, electronic components mounted structure, and manufacturing method of an electronic components mounted structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006251071A JP5329028B2 (ja) | 2006-09-15 | 2006-09-15 | 電子部品実装構造体の製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2008069317A JP2008069317A (ja) | 2008-03-27 |
JP5329028B2 true JP5329028B2 (ja) | 2013-10-30 |
Family
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Family Applications (1)
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JP2006251071A Active JP5329028B2 (ja) | 2006-09-15 | 2006-09-15 | 電子部品実装構造体の製造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20090161328A1 (ja) |
EP (1) | EP2062468A1 (ja) |
JP (1) | JP5329028B2 (ja) |
KR (1) | KR20090051002A (ja) |
CN (1) | CN101361412B (ja) |
TW (1) | TW200816895A (ja) |
WO (1) | WO2008032866A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101381249B1 (ko) * | 2010-03-29 | 2014-04-04 | 한국전자통신연구원 | 충진 조성물, 이를 포함하는 반도체 소자 및 반도체 소자의 제조 방법 |
JP5540916B2 (ja) * | 2010-06-15 | 2014-07-02 | デクセリアルズ株式会社 | 接続構造体の製造方法 |
JP5370300B2 (ja) * | 2010-07-16 | 2013-12-18 | パナソニック株式会社 | 電子部品接合方法 |
JP5850674B2 (ja) * | 2011-09-01 | 2016-02-03 | 積水化学工業株式会社 | 異方性導電材料及びその製造方法、並びに接続構造体 |
JP6231257B2 (ja) * | 2011-12-15 | 2017-11-15 | デクセリアルズ株式会社 | 導電性接着剤、及び電子部品の接続方法 |
JP6358535B2 (ja) * | 2013-04-26 | 2018-07-18 | パナソニックIpマネジメント株式会社 | 配線板間接続構造、および配線板間接続方法 |
KR101880047B1 (ko) * | 2017-04-26 | 2018-07-20 | (주)노피온 | 부품실장 공정시간 단축을 위한 이방성 도전 접착제의 제조방법 |
KR101880053B1 (ko) | 2017-04-26 | 2018-07-20 | (주)노피온 | 갭퍼를 포함하는 이방성 도전 접착제의 제조방법 및 갭퍼를 이용하는 부품 실장방법 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0265077A3 (en) * | 1986-09-25 | 1989-03-08 | Sheldahl, Inc. | An anisotropic adhesive for bonding electrical components |
JPH114064A (ja) * | 1997-06-12 | 1999-01-06 | Nec Corp | 異方性導電樹脂及びこれを用いた電子部品の実装構造 |
JP3996276B2 (ja) * | 1998-09-22 | 2007-10-24 | ハリマ化成株式会社 | ソルダペースト及びその製造方法並びにはんだプリコート方法 |
JP3101265B1 (ja) * | 1999-05-06 | 2000-10-23 | 東芝ケミカル株式会社 | 異方性導電接着剤 |
EP1137332B1 (en) * | 1999-09-02 | 2006-11-22 | Ibiden Co., Ltd. | Printed wiring board and method of producing the same and capacitor to be contained in printed wiring board |
JP2002263880A (ja) * | 2001-03-06 | 2002-09-17 | Hitachi Cable Ltd | Pbフリー半田、およびこれを使用した接続用リード線ならびに電気部品 |
JP2003100367A (ja) * | 2001-09-20 | 2003-04-04 | Denso Corp | 導電性接着剤、この接着剤を用いた回路基板間の接続方法および回路基板間の接続構造 |
JP3955302B2 (ja) * | 2004-09-15 | 2007-08-08 | 松下電器産業株式会社 | フリップチップ実装体の製造方法 |
KR100722493B1 (ko) * | 2005-09-02 | 2007-05-28 | 제일모직주식회사 | 절연 전도성 미립자 및 이를 이용한 이방 전도성 접착필름 |
-
2006
- 2006-09-15 JP JP2006251071A patent/JP5329028B2/ja active Active
-
2007
- 2007-09-13 KR KR1020087014842A patent/KR20090051002A/ko not_active Application Discontinuation
- 2007-09-13 US US12/096,446 patent/US20090161328A1/en not_active Abandoned
- 2007-09-13 CN CN200780001653XA patent/CN101361412B/zh active Active
- 2007-09-13 EP EP07807671A patent/EP2062468A1/en not_active Withdrawn
- 2007-09-13 WO PCT/JP2007/068320 patent/WO2008032866A1/en active Application Filing
- 2007-09-14 TW TW96134547A patent/TW200816895A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
EP2062468A1 (en) | 2009-05-27 |
WO2008032866A1 (en) | 2008-03-20 |
KR20090051002A (ko) | 2009-05-20 |
CN101361412B (zh) | 2011-08-24 |
JP2008069317A (ja) | 2008-03-27 |
TW200816895A (en) | 2008-04-01 |
US20090161328A1 (en) | 2009-06-25 |
CN101361412A (zh) | 2009-02-04 |
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