JP5324773B2 - 回路モジュールとその製造方法 - Google Patents
回路モジュールとその製造方法 Download PDFInfo
- Publication number
- JP5324773B2 JP5324773B2 JP2007288943A JP2007288943A JP5324773B2 JP 5324773 B2 JP5324773 B2 JP 5324773B2 JP 2007288943 A JP2007288943 A JP 2007288943A JP 2007288943 A JP2007288943 A JP 2007288943A JP 5324773 B2 JP5324773 B2 JP 5324773B2
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- Prior art keywords
- semiconductor chip
- board
- heat
- circuit board
- thermally conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H01L2924/143—Digital devices
- H01L2924/1433—Application-specific integrated circuit [ASIC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
20 ファン
30 底板(熱伝導性ボード)
32 回路基板
34 半導体チップ
36 ヒートシンク
38、40 熱伝導性の弾性部材
42 熱伝導性部材
44 回路基板の開口
46 ハンダ
48 ネジ
50 回路基板の上面
52 回路基板の下面
54 熱伝導性の弾性部材の上面
56 熱伝導性の弾性部材の下面
60 半導体チップの下面
62 回路基板の孔
64 熱伝導性ボードの孔
66 ヒートシンクの孔
Claims (7)
- 筐体の一部をなす熱伝導性ボードと、
前記熱伝導性ボード上の回路基板であって、開口と、当該開口を取り囲むように配置された複数の電極パッドを有する上面と、当該上面の反対側に位置する下面を有する、回路基板と、
前記回路基板の上面の前記複数の電極パッドにハンダ・ボールを用いてフリップ・チップ接続された半導体チップと、
前記半導体チップの上面に接合されたヒートシンクと、
前記熱伝導性ボードと半導体チップを熱的に接続し、かつ弾性を有する熱伝導性部材であって、前記回路基板の開口を貫通し、その一方の面が前記半導体チップの下面に接し、他方の面が前記熱伝導性ボードの表面に接する、熱伝導性部材と、
前記半導体チップの周りにおいて前記回路基板を厚さ方向に貫通し、前記ヒートシンクと前記熱伝導性ボードを互いに向き合うように接続して固定し、同時に前記ヒートシンクから前記熱伝導性ボードへ熱伝導させるための複数の金属ネジと
を備える、回路モジュール。 - 前記弾性を有する熱伝導性部材は、熱伝導性部材とその上面および下面に設けられた熱伝導性の弾性部材を含む、請求項1の回路モジュール。
- 前記熱伝導性部材は金属を含む、請求項2の回路モジュール。
- 前記ヒートシンクは複数のフィンを有する、請求項1の回路モジュール。
- 前記ヒートシンクは前記半導体チップの上面に熱伝導性部材を介して接合する、請求項1の回路モジュール。
- 回路モジュールの製造方法であって、
筐体の一部をなす熱伝導性ボードを準備するステップと、
回路基板を準備するステップであって、当該回路基板は、開口と、当該開口を取り囲むように配置された複数の電極パッドを有する上面と、当該上面の反対側に位置する下面を有し、さらに前記上面の前記複数の電極パッドにハンダ・ボールを用いてフリップ・チップ接続された半導体チップを有する、ステップと、
前記熱伝導性ボードの表面と前記回路基板上の半導体チップを、熱伝導性部材を用いて接合するステップであって、当該熱伝導性部材は、前記基板の開口を貫通し、その一方の面が前記半導体チップの下面に接し、他方の面が前記熱伝導性ボードの表面に接しかつ弾性を有する、ステップと、
前記半導体チップの上面にヒートシンクを接合するステップと、
前記ヒートシンクと前記熱伝導性ボードを複数の金属ネジを用いて接続するステップであって、当該金属ネジは、前記半導体チップの周りにおいて前記回路基板を厚さ方向に貫通し、前記ヒートシンクと前記熱伝導性ボードを互いに向き合うように接続して固定し、同時に前記ヒートシンクから前記熱伝導性ボードへ熱伝導させる、ステップと
を含む、製造方法。 - 前記熱伝導性ボードの表面と前記回路基板上の半導体チップを接合するステップは、 前記回路基板の開口に、前記半導体チップの下面に接するまで、第1の熱伝導性の弾性部材を挿入するステップと、
前記熱伝導性ボードを前記回路基板の下方に置き、前記回路基板の開口下の前記熱伝導性ボードの表面の領域に第2の熱伝導性の弾性部材を配置するステップと、
前記第1および第2の熱伝導性の弾性部材の間に、当該2つの弾性部材の表面に接するように、導電性部材を設置するステップと
を含む、請求項6の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007288943A JP5324773B2 (ja) | 2007-11-06 | 2007-11-06 | 回路モジュールとその製造方法 |
US12/263,558 US7782621B2 (en) | 2007-11-06 | 2008-11-03 | Circuit module and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007288943A JP5324773B2 (ja) | 2007-11-06 | 2007-11-06 | 回路モジュールとその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009117612A JP2009117612A (ja) | 2009-05-28 |
JP5324773B2 true JP5324773B2 (ja) | 2013-10-23 |
Family
ID=40587887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007288943A Expired - Fee Related JP5324773B2 (ja) | 2007-11-06 | 2007-11-06 | 回路モジュールとその製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7782621B2 (ja) |
JP (1) | JP5324773B2 (ja) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101601131A (zh) * | 2007-02-15 | 2009-12-09 | 日本电气株式会社 | 用于安装半导体封装的结构 |
JP4789997B2 (ja) * | 2008-11-20 | 2011-10-12 | 三菱電機株式会社 | 電子基板装置 |
JP2011082345A (ja) * | 2009-10-07 | 2011-04-21 | Panasonic Corp | 半導体装置 |
JP4818429B2 (ja) * | 2009-12-28 | 2011-11-16 | 株式会社東芝 | 電子機器 |
US8796842B2 (en) * | 2010-08-20 | 2014-08-05 | Ati Technologies Ulc | Stacked semiconductor chip device with thermal management circuit board |
US20130308274A1 (en) * | 2012-05-21 | 2013-11-21 | Triquint Semiconductor, Inc. | Thermal spreader having graduated thermal expansion parameters |
ITMI20130520A1 (it) * | 2013-04-05 | 2014-10-06 | St Microelectronics Srl | Realizzazione di un dissipatore di calore tramite saldatura ad onda |
DE102015200548A1 (de) * | 2015-01-15 | 2016-07-21 | Zf Friedrichshafen Ag | Anordnung zum Entwärmen von zumindest einem elektronischen Bauteil |
JP2016181624A (ja) * | 2015-03-24 | 2016-10-13 | シャープ株式会社 | 放熱モジュール、およびテレビジョン受像機 |
US10629513B2 (en) * | 2015-06-04 | 2020-04-21 | Eaton Intelligent Power Limited | Ceramic plated materials for electrical isolation and thermal transfer |
DE102016218207A1 (de) * | 2016-09-22 | 2018-03-22 | Robert Bosch Gmbh | Elektronische Baugruppe, insbesondere eine elektronische Leistungsbaugruppe für Hybridfahrzeuge oder Elektrofahrzeuge |
US10504813B2 (en) * | 2016-09-30 | 2019-12-10 | Astec International Limited | Heat sink assemblies for surface mounted devices |
CN113169156A (zh) * | 2018-09-19 | 2021-07-23 | 特斯拉公司 | 电子组件 |
US11011451B2 (en) * | 2018-12-05 | 2021-05-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated circuit package and method |
US11107962B2 (en) * | 2018-12-18 | 2021-08-31 | Soulnano Limited | UV LED array with power interconnect and heat sink |
CN110620089B (zh) * | 2019-08-15 | 2021-06-22 | 安徽国晶微电子有限公司 | 电源芯片封装结构 |
US11217909B2 (en) * | 2019-09-16 | 2022-01-04 | Teledyne Instruments, Inc. | Connector suitable for harsh environments |
WO2022140958A1 (en) * | 2020-12-28 | 2022-07-07 | Innoscience (Suzhou) Technology Co., Ltd. | Semiconductor package and method for manufacturing |
US11910518B2 (en) * | 2021-05-26 | 2024-02-20 | Huawei Technologies Canada Co., Ltd. | Method and apparatus for heat sink mounting |
US11996342B2 (en) * | 2021-08-30 | 2024-05-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor package comprising heat dissipation plates |
WO2023115379A1 (en) * | 2021-12-22 | 2023-06-29 | Intel Corporation | Liquid metal connection device and method |
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-
2007
- 2007-11-06 JP JP2007288943A patent/JP5324773B2/ja not_active Expired - Fee Related
-
2008
- 2008-11-03 US US12/263,558 patent/US7782621B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2009117612A (ja) | 2009-05-28 |
US20090116194A1 (en) | 2009-05-07 |
US7782621B2 (en) | 2010-08-24 |
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