JP5303840B2 - 絶縁性高分子材料組成物 - Google Patents
絶縁性高分子材料組成物 Download PDFInfo
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- JP5303840B2 JP5303840B2 JP2007029892A JP2007029892A JP5303840B2 JP 5303840 B2 JP5303840 B2 JP 5303840B2 JP 2007029892 A JP2007029892 A JP 2007029892A JP 2007029892 A JP2007029892 A JP 2007029892A JP 5303840 B2 JP5303840 B2 JP 5303840B2
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- 239000002861 polymer material Substances 0.000 title claims description 43
- 239000000203 mixture Substances 0.000 title claims description 31
- 239000003795 chemical substances by application Substances 0.000 claims description 21
- 239000000944 linseed oil Substances 0.000 claims description 17
- 235000021388 linseed oil Nutrition 0.000 claims description 17
- 238000006243 chemical reaction Methods 0.000 claims description 14
- 150000002978 peroxides Chemical class 0.000 claims description 10
- 229920005862 polyol Polymers 0.000 claims description 8
- 150000003077 polyols Chemical class 0.000 claims description 8
- 150000002460 imidazoles Chemical class 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 239000004359 castor oil Substances 0.000 claims description 6
- 235000019438 castor oil Nutrition 0.000 claims description 6
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 24
- 229920000642 polymer Polymers 0.000 description 23
- 239000003822 epoxy resin Substances 0.000 description 19
- 229920000647 polyepoxide Polymers 0.000 description 19
- 230000000704 physical effect Effects 0.000 description 10
- 239000000126 substance Substances 0.000 description 8
- 238000005452 bending Methods 0.000 description 7
- 238000004898 kneading Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 5
- 239000003208 petroleum Substances 0.000 description 5
- 230000007613 environmental effect Effects 0.000 description 4
- 239000002683 reaction inhibitor Substances 0.000 description 4
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 3
- 239000001569 carbon dioxide Substances 0.000 description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 description 3
- 230000002542 deteriorative effect Effects 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- 241000196324 Embryophyta Species 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 230000036541 health Effects 0.000 description 2
- 239000005556 hormone Substances 0.000 description 2
- 229940088597 hormone Drugs 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- CABDEMAGSHRORS-UHFFFAOYSA-N oxirane;hydrate Chemical compound O.C1CO1 CABDEMAGSHRORS-UHFFFAOYSA-N 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 150000008442 polyphenolic compounds Chemical class 0.000 description 2
- 235000013824 polyphenols Nutrition 0.000 description 2
- 239000002689 soil Substances 0.000 description 2
- 241000894007 species Species 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 238000010792 warming Methods 0.000 description 2
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 235000004443 Ricinus communis Nutrition 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- PLOPBXQQPZYQFA-AXPWDRQUSA-N amlintide Chemical compound C([C@@H](C(=O)NCC(=O)N[C@@H](C)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](CO)C(=O)N[C@@H](CO)C(=O)N[C@@H]([C@@H](C)O)C(=O)N[C@@H](CC(N)=O)C(=O)N[C@@H](C(C)C)C(=O)NCC(=O)N[C@@H](CO)C(=O)N[C@@H](CC(N)=O)C(=O)N[C@@H]([C@@H](C)O)C(=O)N[C@@H](CC=1C=CC(O)=CC=1)C(N)=O)NC(=O)[C@H](CC(N)=O)NC(=O)[C@H](CC(N)=O)NC(=O)[C@H](CO)NC(=O)[C@H](CO)NC(=O)[C@H](CC=1NC=NC=1)NC(=O)[C@@H](NC(=O)[C@H](CC(C)C)NC(=O)[C@H](CC=1C=CC=CC=1)NC(=O)[C@H](CC(N)=O)NC(=O)[C@H](C)NC(=O)[C@H](CC(C)C)NC(=O)[C@H](CCCNC(N)=N)NC(=O)[C@H](CCC(N)=O)NC(=O)[C@@H](NC(=O)[C@H](C)NC(=O)[C@H]1NC(=O)[C@H]([C@@H](C)O)NC(=O)[C@H](C)NC(=O)[C@H]([C@@H](C)O)NC(=O)[C@H](CC(N)=O)NC(=O)[C@@H](NC(=O)[C@@H](N)CCCCN)CSSC1)[C@@H](C)O)C(C)C)C1=CC=CC=C1 PLOPBXQQPZYQFA-AXPWDRQUSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229920002988 biodegradable polymer Polymers 0.000 description 1
- 239000004621 biodegradable polymer Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000010169 landfilling Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000005445 natural material Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000019198 oils Nutrition 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
- C08L91/005—Drying oils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/20—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances liquids, e.g. oils
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
Description
次に、本実施の形態における絶縁性高分子材料組成物の実施例1,2を説明する。
本実施例1では、まず、エポキシ化亜麻仁油(ダイセル化学工業社製のダイマックL−500)に対して、硬化剤として種々のヒマシ油系ポリオール(伊藤製油社製のH−73X、H−92、H−102、H−410、AC−001、AC−005、H−368;以下、それぞれをポリオールP1〜P7と称する)を化学量論量添加(エポキシ当量において、オキシラン酸素がエポキシ基を構成する酸素とみなして計算し、その化学量論比に対し1.0として添加)すると共に、その硬化促進剤としてイミダゾール類(2−エチル−4−メチルイミダゾール)を後述の表1に示すように0.8phr添加して混練(添加量に応じた条件で混練)した後、その混練物に関して種々の硬化条件(温度,時間)で熱処理することにより、三次元架橋された絶縁性高分子材料組成物の試料S1〜S7をそれぞれ作成した。
本実施例2では、まず、エポキシ化亜麻仁油(ダイセル化学工業社製のダイマックL−500)100gに対して、硬化剤としてフェノール樹脂(住友ベークライト社製のフェノールホルムアルデヒド型ノボラック(PR−HF−3))61gを添加(すなわち、化学量論量添加(エポキシ当量において、オキシラン酸素がエポキシ基を構成する酸素とみなして計算し、その化学量論比に対し1.0として添加)すると共に、その硬化促進剤としてイミダゾール類(2−エチル−4−メチルイミダゾール(四国化成工業社製の2E4MZ))を添加(エポキシ樹脂100gに対して1.0g(phr))、反応助剤として種々のパーオキサイド(日本油脂社製のパーヘキサC、パークミルD、パーヘキシン25B;以下、それぞれをオキサイドO1〜O3と称する)を後述の表2に示すように0〜5.0phr添加して混練(添加量に応じた条件で混練)した後、その混練物に関して150℃,24時間で熱処理することにより、三次元架橋された絶縁性高分子材料組成物の試料S9〜S30をそれぞれ作成した。
Claims (3)
- 電圧機器の絶縁構成に用いられるものであって、
エポキシ化亜麻仁油に対し硬化剤としてヒマシ油系ポリオールまたはフェノール樹脂が添加され反応助剤としてパーオキサイドが添加された混練物から成り、
前記の混練物を熱処理により三次元架橋したことを特徴とする絶縁性高分子材料組成物。 - 前記の混練物は、硬化促進剤としてイミダゾール類が添加されたことを特徴とする請求項1記載の絶縁性高分子材料組成物。
- 前記パーオキサイドは0.5〜5phr添加したことを特徴とする請求項1または2記載の絶縁性高分子材料組成物。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007029892A JP5303840B2 (ja) | 2007-02-09 | 2007-02-09 | 絶縁性高分子材料組成物 |
EP08703366.8A EP2133377B1 (en) | 2007-02-09 | 2008-01-17 | Insulating polymer material composition |
PCT/JP2008/050511 WO2008096579A1 (ja) | 2007-02-09 | 2008-01-17 | 絶縁性高分子材料組成物 |
US12/526,146 US8461281B2 (en) | 2007-02-09 | 2008-01-17 | Insulating polymer material composition |
TW097104438A TW200849281A (en) | 2007-02-09 | 2008-02-05 | Composition of insulated polymer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007029892A JP5303840B2 (ja) | 2007-02-09 | 2007-02-09 | 絶縁性高分子材料組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008195759A JP2008195759A (ja) | 2008-08-28 |
JP5303840B2 true JP5303840B2 (ja) | 2013-10-02 |
Family
ID=39681490
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007029892A Expired - Fee Related JP5303840B2 (ja) | 2007-02-09 | 2007-02-09 | 絶縁性高分子材料組成物 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8461281B2 (ja) |
EP (1) | EP2133377B1 (ja) |
JP (1) | JP5303840B2 (ja) |
TW (1) | TW200849281A (ja) |
WO (1) | WO2008096579A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5532562B2 (ja) * | 2008-09-02 | 2014-06-25 | 株式会社明電舎 | 絶縁性高分子材料組成物 |
JP5499863B2 (ja) * | 2010-04-16 | 2014-05-21 | 中部電力株式会社 | 絶縁性高分子材料組成物及びその製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4375521A (en) * | 1981-06-01 | 1983-03-01 | Communications Technology Corporation | Vegetable oil extended polyurethane systems |
TW344191B (en) * | 1995-09-18 | 1998-11-01 | Ibm | Cross-linked biobased materials and uses thereof |
SG47174A1 (en) | 1995-09-18 | 1998-03-20 | Ibm | Cross-linked biobased materials and fabricating methods thereof |
TW354451B (en) * | 1995-09-18 | 1999-03-11 | Ibm | Method of fabricating cross-linked biobased materials and structures fabricated therewith a method comprising the step of: forming the mixture of polymer and cross-linked agent |
US5698631A (en) * | 1996-05-30 | 1997-12-16 | Uniroyal Chemical Company, Inc. | Epoxy resin compositions for encapsulating signal transmission devices |
US6194490B1 (en) * | 1998-02-27 | 2001-02-27 | Vantico, Inc. | Curable composition comprising epoxidized natural oils |
US7105628B2 (en) * | 2002-08-27 | 2006-09-12 | Acushnet Company | Compositions for golf equipment |
JP4369642B2 (ja) | 2001-03-29 | 2009-11-25 | 三井化学株式会社 | 電気ケーブル及び高電圧電源用モールド |
WO2004063245A1 (en) * | 2003-01-08 | 2004-07-29 | Texas Tech University | Castor oil/epoxidized soybean oil based elastomeric compositions |
JP2006241331A (ja) * | 2005-03-04 | 2006-09-14 | Osaka Univ | 硬化性油脂組成物 |
JP4961691B2 (ja) * | 2005-07-25 | 2012-06-27 | 株式会社明電舎 | 絶縁性高分子材料硬化物 |
JP4961692B2 (ja) * | 2005-07-25 | 2012-06-27 | 株式会社明電舎 | 碍子 |
JP2008037921A (ja) | 2006-08-02 | 2008-02-21 | Meidensha Corp | 絶縁性高分子材料組成物 |
-
2007
- 2007-02-09 JP JP2007029892A patent/JP5303840B2/ja not_active Expired - Fee Related
-
2008
- 2008-01-17 WO PCT/JP2008/050511 patent/WO2008096579A1/ja active Application Filing
- 2008-01-17 US US12/526,146 patent/US8461281B2/en not_active Expired - Fee Related
- 2008-01-17 EP EP08703366.8A patent/EP2133377B1/en not_active Not-in-force
- 2008-02-05 TW TW097104438A patent/TW200849281A/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US8461281B2 (en) | 2013-06-11 |
US20100324228A1 (en) | 2010-12-23 |
JP2008195759A (ja) | 2008-08-28 |
WO2008096579A1 (ja) | 2008-08-14 |
EP2133377A4 (en) | 2011-10-26 |
TWI373053B (ja) | 2012-09-21 |
EP2133377B1 (en) | 2016-01-06 |
TW200849281A (en) | 2008-12-16 |
EP2133377A1 (en) | 2009-12-16 |
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