JP5257574B2 - 無溶剤型導電性接着剤 - Google Patents
無溶剤型導電性接着剤 Download PDFInfo
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- JP5257574B2 JP5257574B2 JP2007318527A JP2007318527A JP5257574B2 JP 5257574 B2 JP5257574 B2 JP 5257574B2 JP 2007318527 A JP2007318527 A JP 2007318527A JP 2007318527 A JP2007318527 A JP 2007318527A JP 5257574 B2 JP5257574 B2 JP 5257574B2
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- silver powder
- conductive adhesive
- resistance value
- examples
- solventless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000853 adhesive Substances 0.000 title claims description 86
- 230000001070 adhesive effect Effects 0.000 title claims description 86
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 93
- 239000003822 epoxy resin Substances 0.000 claims description 26
- 229920000647 polyepoxide Polymers 0.000 claims description 26
- 239000002904 solvent Substances 0.000 claims description 17
- 229920001187 thermosetting polymer Polymers 0.000 claims description 16
- 239000003085 diluting agent Substances 0.000 claims description 7
- 230000000052 comparative effect Effects 0.000 description 12
- 239000003795 chemical substances by application Substances 0.000 description 10
- 239000003990 capacitor Substances 0.000 description 9
- 238000001723 curing Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000010410 layer Substances 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000002411 adverse Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- FKBMTBAXDISZGN-UHFFFAOYSA-N 5-methyl-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1C(C)CCC2C(=O)OC(=O)C12 FKBMTBAXDISZGN-UHFFFAOYSA-N 0.000 description 2
- -1 acid anhydride compound Chemical class 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 238000007665 sagging Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 238000004438 BET method Methods 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
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- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Description
9 分布定数型ノイズフィルタ
13 無溶剤型導電性接着剤
Claims (1)
- 銀粉末と熱硬化性エポキシ樹脂とを含有して溶剤と希釈剤とを含まない無溶剤型導電性接着剤において、前記銀粉末が0.15〜0.35m2/gの比表面積と5.5g/cm3以上のタップ密度とを有すると共に前記銀粉末と前記熱硬化性エポキシ樹脂との質量比率が86:14〜90:10であり、且つ、回転数1rpmにおける粘度計の数値と回転数10rpmにおける粘度計の数値の比が2以上4未満である無溶剤型導電性接着剤。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007318527A JP5257574B2 (ja) | 2007-12-10 | 2007-12-10 | 無溶剤型導電性接着剤 |
Applications Claiming Priority (1)
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JP2007318527A JP5257574B2 (ja) | 2007-12-10 | 2007-12-10 | 無溶剤型導電性接着剤 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009138155A JP2009138155A (ja) | 2009-06-25 |
JP5257574B2 true JP5257574B2 (ja) | 2013-08-07 |
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JP2007318527A Active JP5257574B2 (ja) | 2007-12-10 | 2007-12-10 | 無溶剤型導電性接着剤 |
Country Status (1)
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JP (1) | JP5257574B2 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5281529B2 (ja) * | 2009-09-28 | 2013-09-04 | 京都エレックス株式会社 | 加熱硬化型導電性ペースト組成物およびその導電性ペースト組成物を用いた電極並びに配線パターンの形成方法 |
JP5297344B2 (ja) * | 2009-11-04 | 2013-09-25 | 京都エレックス株式会社 | 加熱硬化型導電性ペースト組成物 |
JP6144048B2 (ja) * | 2011-01-27 | 2017-06-07 | 日立化成株式会社 | 導電性接着剤組成物及びその塗布方法、接続体、並びに太陽電池モジュール及びその製造方法 |
JP6105412B2 (ja) * | 2013-07-03 | 2017-03-29 | 早川ゴム株式会社 | フラットパネルディスプレイ用粘着テープ |
JP6383183B2 (ja) * | 2014-06-03 | 2018-08-29 | 太陽インキ製造株式会社 | 導電性接着剤およびそれを用いた電子部品 |
WO2019111778A1 (ja) * | 2017-12-04 | 2019-06-13 | 住友ベークライト株式会社 | ペースト状接着剤組成物、および半導体装置 |
JP2021050495A (ja) * | 2019-09-24 | 2021-04-01 | 株式会社竹中工務店 | 人工芝 |
CN113004844A (zh) * | 2019-12-19 | 2021-06-22 | 上海市塑料研究所有限公司 | 一种高散热导电胶及其制备方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3681907B2 (ja) * | 1998-11-02 | 2005-08-10 | 松下電器産業株式会社 | 導電性接着剤およびこれを用いた電子部品の実装方法 |
JP3854103B2 (ja) * | 2001-06-28 | 2006-12-06 | 住友ベークライト株式会社 | 導電性ペースト及び該ペーストを用いてなる半導体装置 |
JP2007005105A (ja) * | 2005-06-23 | 2007-01-11 | Fukuda Metal Foil & Powder Co Ltd | 導電性組成物 |
JP2007018932A (ja) * | 2005-07-08 | 2007-01-25 | Kyocera Chemical Corp | 回路基板の製造方法と回路基板 |
-
2007
- 2007-12-10 JP JP2007318527A patent/JP5257574B2/ja active Active
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JP2009138155A (ja) | 2009-06-25 |
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