JP5243585B2 - 基板供給装置 - Google Patents
基板供給装置 Download PDFInfo
- Publication number
- JP5243585B2 JP5243585B2 JP2011197396A JP2011197396A JP5243585B2 JP 5243585 B2 JP5243585 B2 JP 5243585B2 JP 2011197396 A JP2011197396 A JP 2011197396A JP 2011197396 A JP2011197396 A JP 2011197396A JP 5243585 B2 JP5243585 B2 JP 5243585B2
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- JP
- Japan
- Prior art keywords
- surface plate
- substrate
- small surface
- pin
- small
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Robotics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Coating Apparatus (AREA)
Description
2…回転駆動部
3…回転テーブル
4…アーム
5…ガラス基板
6…小定盤
7…主定盤
8…ピン駆動機構
9…位置決め装置
10…エアシリンダ
11…溝
12…エアパッド
13…ダイヘッド
14…走行フレーム
15…ガイドレール
16…支持ピン
17…案内筒
18…スライダ
19…磁性金属片
20…シリンダ
21…フレーム
22…駆動ピン
23…永久磁石
24…ロボットハンド
Claims (4)
- 一体に回転および昇降可能に設けられ、回転軸周りに対称に配置された複数のアームと、
それぞれ、前記アームに遊びを有するように支持され、且つ、基板を吸着保持可能な複数の小定盤と、
前記アームの回転および昇降によって、前記基板を吸着保持している前記小定盤が載置され、且つ、前記基板を吸着保持している前記小定盤を前記遊びの範囲内で位置決めして保持する定盤保持機構を備える主定盤とを備えることを特徴とする基板供給装置。 - 前記小定盤は、表面に突出して前記基板を持ち上げられる支持ピンを内蔵し、
基板供給装置は、前記アームの1つが前記小定盤を前記主定盤の上に保持するとき、他の前記アームが支持する前記小定盤の下側に位置するように配置され、前記支持ピンを押し上げる駆動ピンを有する駆動機構をさらに備え、
前記駆動ピンと前記支持ピンとは、磁力により互いに吸着するように構成されていることを特徴とする請求項1に記載の基板供給装置。 - 前記定盤保持機構は、前記小定盤を空気圧によって支持するエアパッドを有することを特徴とする請求項1または2に記載の基板供給装置。
- 前記主定盤は、前記基板を加工する装置を支持することを特徴とする請求項1から3のいずれかに記載の基板供給装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011197396A JP5243585B2 (ja) | 2011-09-09 | 2011-09-09 | 基板供給装置 |
TW101121540A TWI421968B (zh) | 2011-09-09 | 2012-06-15 | 基板供給裝置 |
KR1020120064233A KR101318600B1 (ko) | 2011-09-09 | 2012-06-15 | 기판 공급장치 |
CN201210327831.0A CN102992642B (zh) | 2011-09-09 | 2012-09-06 | 基板供给装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011197396A JP5243585B2 (ja) | 2011-09-09 | 2011-09-09 | 基板供給装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013058690A JP2013058690A (ja) | 2013-03-28 |
JP5243585B2 true JP5243585B2 (ja) | 2013-07-24 |
Family
ID=47921832
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011197396A Active JP5243585B2 (ja) | 2011-09-09 | 2011-09-09 | 基板供給装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5243585B2 (ja) |
KR (1) | KR101318600B1 (ja) |
CN (1) | CN102992642B (ja) |
TW (1) | TWI421968B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102278083B1 (ko) * | 2019-05-23 | 2021-07-16 | 세메스 주식회사 | 기판 지지 유닛 및 이를 가지는 기판 처리 장치 |
KR102303595B1 (ko) * | 2019-06-12 | 2021-09-23 | 세메스 주식회사 | 지지유닛 및 기판 처리 장치 |
CN112191427A (zh) * | 2020-09-27 | 2021-01-08 | 铜陵市肆得科技有限责任公司 | 一种金属冲压件加工用喷涂设备 |
JP2023002003A (ja) * | 2021-06-22 | 2023-01-10 | 東京エレクトロン株式会社 | 載置台及び基板処理装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4419303B2 (ja) * | 2000-09-27 | 2010-02-24 | 東レ株式会社 | 塗布装置および塗布方法、ならびにカラーフィルター製造装置および製造方法 |
JP2003068620A (ja) * | 2001-08-28 | 2003-03-07 | Sendai Nikon:Kk | 露光装置 |
JP4880941B2 (ja) * | 2005-08-02 | 2012-02-22 | 株式会社日立ハイテクノロジーズ | 真空搬送装置およびこれを備えた荷電粒子線検査装置 |
JP4435730B2 (ja) * | 2005-11-22 | 2010-03-24 | アドバンスド・マスク・インスペクション・テクノロジー株式会社 | 基板検査装置 |
JP2007172292A (ja) * | 2005-12-22 | 2007-07-05 | Hitachi Ltd | 情報処理装置 |
JP4665037B2 (ja) * | 2009-02-06 | 2011-04-06 | 東京エレクトロン株式会社 | 基板処理システム |
-
2011
- 2011-09-09 JP JP2011197396A patent/JP5243585B2/ja active Active
-
2012
- 2012-06-15 TW TW101121540A patent/TWI421968B/zh active
- 2012-06-15 KR KR1020120064233A patent/KR101318600B1/ko active IP Right Grant
- 2012-09-06 CN CN201210327831.0A patent/CN102992642B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
JP2013058690A (ja) | 2013-03-28 |
KR101318600B1 (ko) | 2013-10-15 |
TWI421968B (zh) | 2014-01-01 |
CN102992642A (zh) | 2013-03-27 |
CN102992642B (zh) | 2015-01-14 |
TW201312689A (zh) | 2013-03-16 |
KR20130028634A (ko) | 2013-03-19 |
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