JP5208704B2 - Oscillator module - Google Patents
Oscillator module Download PDFInfo
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- JP5208704B2 JP5208704B2 JP2008310420A JP2008310420A JP5208704B2 JP 5208704 B2 JP5208704 B2 JP 5208704B2 JP 2008310420 A JP2008310420 A JP 2008310420A JP 2008310420 A JP2008310420 A JP 2008310420A JP 5208704 B2 JP5208704 B2 JP 5208704B2
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- oscillator
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- metal cover
- oscillator module
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- 239000013078 crystal Substances 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 230000010355 oscillation Effects 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
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- Oscillators With Electromechanical Resonators (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
本発明は少なくとも水晶片とＩＣチップとを収容した表面実装水晶発振器（以下、表面実装発振器とする）を回路基板に搭載した発振器モジュールを技術分野とし、特に外部からの熱風による周波数変化を防止した発振器モジュールに関する。 The present invention has a technical field of an oscillator module in which a surface mount crystal oscillator (hereinafter referred to as a surface mount oscillator) containing at least a crystal piece and an IC chip is mounted on a circuit board, and particularly prevents frequency change due to hot air from the outside. The present invention relates to an oscillator module.
（発明の背景）
表面実装発振器は小型・軽量であることから、周波数や時間の基準源として各種の電子装置に内蔵される。このようなものの一つに、特に水晶振動子の周波数温度特性による周波数変化を補償した温度補償型があり、他の電子部品とともに回路基板に配置されて発振器モジュールを形成する。
(Background of the Invention)
Since surface-mounted oscillators are small and lightweight, they are built into various electronic devices as a reference source for frequency and time. One of these is a temperature compensation type that compensates for a frequency change caused by a frequency temperature characteristic of a crystal resonator, and is arranged on a circuit board together with other electronic components to form an oscillator module.
（従来技術の一例）
第４図及び第５図は一従来例を説明する図で、第４図は表面実装発振器の断面図、第５図（ａ）は発振器モジュールの断面図、同図（ｂ）は回路基板の一部平面図である。
(Example of conventional technology)
4 and 5 are diagrams for explaining a conventional example. FIG. 4 is a cross-sectional view of a surface mount oscillator, FIG. 5 (a) is a cross-sectional view of an oscillator module, and FIG. 5 (b) is a circuit board. FIG.
表面実装発振器はセラミックからなる凹状とした容器本体１の内底面に、ＩＣチップ２の回路機能面に露出したＩＣ端子をバンプ３を用いた超音波熱圧着によって固着する（フリップチップボンディング）。ＩＣチップ２は少なくとも発振回路を有し、ここでは温度補償機構を有する。そして、図示しない励振電極から引出電極の延出した水晶片４の一端部両側を内壁段部に導電性接着剤５によって固着し、金属カバー６を被せて密閉封入する。 In the surface mount oscillator, an IC terminal exposed on the circuit functional surface of the IC chip 2 is fixed to the inner bottom surface of the concave container body 1 made of ceramic by ultrasonic thermocompression bonding using the bumps 3 (flip chip bonding). The IC chip 2 has at least an oscillation circuit, and here has a temperature compensation mechanism. Then, both ends of one end portion of the crystal piece 4 where the extraction electrode extends from an excitation electrode (not shown) are fixed to the inner wall step portion with the conductive adhesive 5, and the metal cover 6 is covered and sealed.
容器本体１の外底面にはＩＣチップ２の各ＩＣ端子と電気的に接続する電源、出力、アース、及び制御端子（Ｖc）等の実装端子７を有する。そして、ここでは温度補償機構を有する温度補償型とするので、第６図に示した水晶振動子（ＡＴカット）に基づく周波数温度特性を補償して、規定の温度範囲内で発振周波数を一定（安定）にする。 On the outer bottom surface of the container body 1, there are mounting terminals 7 such as a power source, an output, a ground, and a control terminal (Vc) electrically connected to each IC terminal of the IC chip 2. Since the temperature compensation type having a temperature compensation mechanism is used here, the frequency temperature characteristic based on the crystal resonator (AT cut) shown in FIG. 6 is compensated, and the oscillation frequency is kept constant within a specified temperature range ( Stable).
発振器モジュール８は表面実装発振器９Ａ及びこれ以外の電子部品９を回路基板１０に、例えば半田リフローによって搭載される。回路基板１０は例えばガラスエポキシ基板に例えば銅箔からなる回路パターン１１を設けてなる。回路パターン１１は回路端子１１ａ、配線路１１ｂ及びアース電極１１ｃからなり、回路端子１１ａは表面実装発振器９Ａを含む電子部品９の実装端子７と半田リフローによって接続する。 In the oscillator module 8, a surface mount oscillator 9A and other electronic components 9 are mounted on a circuit board 10 by, for example, solder reflow. The circuit board 10 is formed, for example, by providing a circuit pattern 11 made of, for example, copper foil on a glass epoxy board. The circuit pattern 11 includes a circuit terminal 11a, a wiring path 11b, and a ground electrode 11c. The circuit terminal 11a is connected to the mounting terminal 7 of the electronic component 9 including the surface mount oscillator 9A by solder reflow.
配線路１１ｂは各回路端子１１ａから延出して他の電子部品の回路端子に接続する。アース電極１１ｃはこれらを除いて回路基板１０に全面的に形成される。そして、これらの発振器モジュール８とした回路基板１０は単独であるいは他の回路基板とともに電子装置に組み込まれる。
（従来技術の問題点）
しかしながら、上記構成の発振器モジュールは用途によって例えば空冷とするファンからの熱風にさらされ、表面実装発振器は時折瞬時にして温度変化を大きくする。これにより、発振周波数は周波数温度特性による周波数変化以上に変化し、周波数偏差規格を満足しなくなる。この場合、表面実装発振器を温度補償型としても、温度補償機構は温度変化に追従せず、前述と同様に周波数偏差規格を満足しなくなる問題があった。
(Problems of conventional technology)
However, the oscillator module having the above-described configuration is exposed to hot air from a fan, for example, air-cooled depending on the application, and the surface-mount oscillator sometimes instantaneously increases the temperature change. As a result, the oscillation frequency changes more than the frequency change due to the frequency temperature characteristic, and the frequency deviation standard is not satisfied. In this case, even if the surface mount oscillator is a temperature compensation type, the temperature compensation mechanism does not follow the temperature change, and there is a problem that the frequency deviation standard is not satisfied as described above.
（発明の目的）
本発明は水晶振動子に基づいた周波数温度特性を安定にして周波数偏差規格を満足する発振器モジュールを提供することを目的とする。
(Object of invention)
It is an object of the present invention to provide an oscillator module that stabilizes frequency temperature characteristics based on a crystal resonator and satisfies a frequency deviation standard.
本発明は、特許請求の範囲（請求項１）に示したように、外底面に実装端子を有する表面実装水晶発振器を含む電子部品が回路基板に搭載され、前記回路基板は前記電子部品の実装端子の接続される回路端子及び配線路を除いて全面的にアース電極が形成された発振器モジュールにおいて、前記表面実装水晶発振器は凹状とした金属カバーによって覆われ、前記金属カバーの開口端面は前記アース電極に電気的に接続した構成とする。 According to the present invention, an electronic component including a surface-mount crystal oscillator having a mounting terminal on an outer bottom surface is mounted on a circuit board as shown in the claims (Claim 1), and the circuit board is mounted on the electronic component. In the oscillator module in which the ground electrode is entirely formed except for the circuit terminals and wiring paths to which the terminals are connected, the surface-mounted crystal oscillator is covered with a concave metal cover, and the opening end face of the metal cover is the ground. It is configured to be electrically connected to the electrode.
このような構成であれば、表面実装発振器を覆う金属カバーは回路基板のアース電極に電気的に接続して熱的に結合する。したがって、例えばファンからの熱風は金属カバーによって遮蔽され、表面実装発振器への直接的な伝熱を避けられる。そして、熱風によって金属カバーに生じた熱は回路基板のアース電極を経て放熱される。これらから、熱風によっての表面実装発振器の急激な温度上昇を抑制するので、周波数温度特性が安定して周波数偏差規格を満足する。 With such a configuration, the metal cover covering the surface mount oscillator is electrically connected to and thermally coupled to the ground electrode of the circuit board. Therefore, for example, hot air from the fan is shielded by the metal cover, and direct heat transfer to the surface mount oscillator can be avoided. The heat generated in the metal cover by the hot air is radiated through the ground electrode of the circuit board. From these, since the rapid temperature rise of the surface mount oscillator due to hot air is suppressed, the frequency temperature characteristic is stabilized and the frequency deviation standard is satisfied.
（実施態様項）
本発明の請求項２では、前記表面実装水晶発振器は水晶片とＩＣチップとを容器本体に収容して少なくとも前記水晶片を密閉封入してなり、前記ＩＣチップは発振回路とともに温度補償機構を有する。この場合、前述のように熱風による急激な温度上昇を抑制して周波数温度特性が安定するので、温度補償機構による温度補償を確実にする。
(Embodiment section)
According to a second aspect of the present invention, the surface-mounted crystal oscillator includes a crystal piece and an IC chip accommodated in a container body, and at least the crystal piece is hermetically sealed. The IC chip has a temperature compensation mechanism together with an oscillation circuit. . In this case, as described above, the temperature temperature characteristic is stabilized by suppressing the rapid temperature rise caused by the hot air, so that the temperature compensation by the temperature compensation mechanism is ensured.
第１図（ａ）は本発明の一実施形態を説明する発振器モジュールの一部断面図、同図（ｂ）は回路基板の一部平面図である。なお、前従来例と同一部分には同番号を付与してその説明は簡略又は省略する。 FIG. 1 (a) is a partial sectional view of an oscillator module for explaining an embodiment of the present invention, and FIG. 1 (b) is a partial plan view of a circuit board. In addition, the same number is attached | subjected to the same part as a prior art example, and the description is simplified or abbreviate | omitted.
発振器モジュールは前述したように表面実装水晶発振器９Ａを含む電子部品を回路基板１０に搭載してなる。表面実装発振器９Ａは、外底面に実装端子７を有する容器本体１の内底面に発振回路及び温度補償機構を有するＩＣチップ２を固着する。そして、図示しない引出電極の延出した水晶片４の一端部両側を内壁段部に固着し、金属カバー５を被せて密閉封入する。 As described above, the oscillator module is formed by mounting electronic components including the surface-mounted crystal oscillator 9A on the circuit board 10. The surface mount oscillator 9A fixes the IC chip 2 having the oscillation circuit and the temperature compensation mechanism to the inner bottom surface of the container body 1 having the mounting terminals 7 on the outer bottom surface. Then, both ends of one end portion of the crystal piece 4 with an extension electrode (not shown) are fixed to the inner wall stepped portion, and the metal cover 5 is covered and hermetically sealed.
回路基板１０は、これも前述同様にガラスエポキシからなり、各電子部品の実装端子７が接続する回路端子１１ａ、回路端子１１ａから延出した配線路１１ｂ、及びこれらを除く全面的なアース電極１１ｃからなる回路パターンを有する。 The circuit board 10 is also made of glass epoxy as described above. The circuit terminal 11a to which the mounting terminals 7 of the respective electronic components are connected, the wiring path 11b extending from the circuit terminal 11a, and the entire ground electrode 11c excluding them are provided. A circuit pattern consisting of
そして、ここでは、表面実装発振器９Ａは金属カバー１２によって覆われる。金属カバー１２は凹状として開口端面が回路基板１０のアース電極１１ｃに電気的に接続する。例えば各電子部品を回路基板１０に搭載する際、金属カバー１２はこれらと同時に半田リフローによって接続する。なお、金属カバー１２は配線路１１ｂとの電気的接続を防止する切欠部１３を開口端面の枠壁に有する（第２図）。 Here, the surface mount oscillator 9 </ b> A is covered with a metal cover 12. The metal cover 12 has a concave shape, and the opening end face is electrically connected to the ground electrode 11 c of the circuit board 10. For example, when mounting each electronic component on the circuit board 10, the metal cover 12 is connected by solder reflow at the same time. The metal cover 12 has a notch 13 in the frame wall of the opening end face to prevent electrical connection with the wiring path 11b (FIG. 2).
このような構成であれば、効果の欄でも説明するように、表面実装発振器を覆う金属カバー１２は回路基板１０のアース電極１１ｃに電気的に接続して熱的に結合する。したがって、例えばファンからの熱風は金属カバー１２によって遮蔽され、表面実装発振器９Ａへの直接的な伝熱を避けられる。そして、熱風によって金属カバー１２に生じた熱は回路基板１０のアース電極１１ｃを経て放熱される。 With such a configuration, the metal cover 12 covering the surface-mounted oscillator is electrically connected to and thermally coupled to the ground electrode 11c of the circuit board 10 as described in the effect column. Therefore, for example, hot air from the fan is shielded by the metal cover 12, and direct heat transfer to the surface mount oscillator 9A can be avoided. The heat generated in the metal cover 12 by the hot air is radiated through the ground electrode 11 c of the circuit board 10.
これらから、熱風によっての表面実装発振器９ａの急激な温度上昇を抑制するので、周波数温度特性が安定する。そして、温度補償型とした場合でも、温度補償機構による温度補償を確実にする。したがって、周波数偏差規格を確実に満足できる。 From these, since the rapid temperature rise of the surface mount oscillator 9a due to hot air is suppressed, the frequency temperature characteristics are stabilized. Even in the case of the temperature compensation type, temperature compensation by the temperature compensation mechanism is ensured. Therefore, the frequency deviation standard can be surely satisfied.
（他の事項）
上記実施形態では、表面実装発振器と接続する回路基板１０の配線路１１ｂは同一面上にしたことにより、金属カバー１２には短絡を防止する切欠部を設けたが、第３図に示したようにしてもよい。すなわち、アース電極１１ｃと接続する回路端子１１ｃ′を除く回路端子１１は例えば貫通電極（ビアホール）１４によって積層面や裏面に延出してもよい。このようにすれば、金属カバー１２には切欠部１３を設けることなく、開口端面の全てを半田リフローによって封止し、熱風の侵入を防止できる。
(Other matters)
In the above embodiment, the wiring path 11b of the circuit board 10 connected to the surface mount oscillator is provided on the same surface, so that the metal cover 12 is provided with a cutout portion for preventing a short circuit. However, as shown in FIG. It may be. That is, the circuit terminals 11 except for the circuit terminal 11c ′ connected to the ground electrode 11c may extend to the laminated surface or the back surface by, for example, through electrodes (via holes) 14. In this way, without providing the notch 13 in the metal cover 12, all of the opening end face can be sealed by solder reflow to prevent hot air from entering.
また、表面実装発振器９Ａは両主面に凹部を有する容器本体として一主面の凹部に水晶片４を密閉封入し、他主面の凹部にＩＣチップ２を収容したものでもよく、必要に応じた形態にできる。 Further, the surface mount oscillator 9A may be a container body having recesses on both main surfaces, in which the crystal piece 4 is hermetically sealed in a recess on one main surface and the IC chip 2 is accommodated in a recess on the other main surface. Can be in different forms.
１ 容器本体、２ ＩＣチップ、３ バンプ、４ 水晶片、５ 導電性接着剤、６、１２ 金属カバー、７ 実装端子、８ 発振器モジュール、９Ａ 表面実装発振器、１０ 回路基板、１１ 回路パターン、１３ 切欠部、１４ 貫通電極。 DESCRIPTION OF SYMBOLS 1 Container body, 2 IC chip, 3 Bump, 4 Crystal piece, 5 Conductive adhesive, 6, 12 Metal cover, 7 Mounting terminal, 8 Oscillator module, 9A Surface mount oscillator, 10 Circuit board, 11 Circuit pattern, 13 Notch Part, 14 penetration electrode.
Claims (2)
前記表面実装水晶発振器は凹状とした金属カバーによって覆われ、前記金属カバーの開口端面は前記アース電極に電気的に接続したことを特徴とする発振器モジュール。 An electronic component including a surface-mounted crystal oscillator having a mounting terminal on an outer bottom surface is mounted on a circuit board, and the circuit board has a ground electrode over the entire surface except for a circuit terminal and a wiring path to which the mounting terminal of the electronic component is connected. In the formed oscillator module:
The surface-mount crystal oscillator is covered with a concave metal cover, and an open end surface of the metal cover is electrically connected to the ground electrode.
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| Application Number | Priority Date | Filing Date | Title |
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| JP2008310420A JP5208704B2 (en) | 2008-12-05 | 2008-12-05 | Oscillator module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008310420A JP5208704B2 (en) | 2008-12-05 | 2008-12-05 | Oscillator module |
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| JP2010136127A JP2010136127A (en) | 2010-06-17 |
| JP5208704B2 true JP5208704B2 (en) | 2013-06-12 |
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| JP2008310420A Active JP5208704B2 (en) | 2008-12-05 | 2008-12-05 | Oscillator module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10720886B2 (en) | 2018-02-28 | 2020-07-21 | Seiko Epson Corporation | Oscillator, electronic apparatus, and vehicle |
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| JP6523663B2 (en) * | 2014-11-28 | 2019-06-05 | 京セラ株式会社 | Piezoelectric device |
| JP2016103758A (en) * | 2014-11-28 | 2016-06-02 | 京セラクリスタルデバイス株式会社 | Piezoelectric device |
| WO2017110994A1 (en) * | 2015-12-25 | 2017-06-29 | 株式会社村田製作所 | High frequency module |
| CN111290475B (en) * | 2020-02-28 | 2021-02-09 | 成都金诺信高科技有限公司 | Device and method for improving frequency stability, storage medium and terminal |
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| JPH0955625A (en) * | 1995-08-11 | 1997-02-25 | Toyo Commun Equip Co Ltd | Oscillator |
| JP3891737B2 (en) * | 1999-04-19 | 2007-03-14 | シャープ株式会社 | Oscillator and method for adjusting oscillation characteristics thereof |
| JP2005039435A (en) * | 2003-07-17 | 2005-02-10 | Toyo Commun Equip Co Ltd | Surface-mounted piezoelectric oscillator |
| JP2005167507A (en) * | 2003-12-01 | 2005-06-23 | Toyo Commun Equip Co Ltd | Surface-mounting piezoelectric oscillator |
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| US10720886B2 (en) | 2018-02-28 | 2020-07-21 | Seiko Epson Corporation | Oscillator, electronic apparatus, and vehicle |
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