JP5300434B2 - Surface mount crystal oscillator - Google Patents

Surface mount crystal oscillator Download PDF

Info

Publication number
JP5300434B2
JP5300434B2 JP2008295108A JP2008295108A JP5300434B2 JP 5300434 B2 JP5300434 B2 JP 5300434B2 JP 2008295108 A JP2008295108 A JP 2008295108A JP 2008295108 A JP2008295108 A JP 2008295108A JP 5300434 B2 JP5300434 B2 JP 5300434B2
Authority
JP
Japan
Prior art keywords
main surface
chip
main
recess
insulating cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008295108A
Other languages
Japanese (ja)
Other versions
JP2010124165A (en
Inventor
昭 寺西
善久 市川
康二 小山
勇司 今野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
Original Assignee
Nihon Dempa Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Dempa Kogyo Co Ltd filed Critical Nihon Dempa Kogyo Co Ltd
Priority to JP2008295108A priority Critical patent/JP5300434B2/en
Publication of JP2010124165A publication Critical patent/JP2010124165A/en
Application granted granted Critical
Publication of JP5300434B2 publication Critical patent/JP5300434B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Oscillators With Electromechanical Resonators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Description

本発明は容器本体１をＨ状とした表面実装水晶発振器（以下、表面実装発振器とする）を技術分野とし、特に発振周波数の変化及びＩＣチップの破損を防止した表面実装発振器に関する。   The present invention relates to a surface mount crystal oscillator (hereinafter referred to as a surface mount oscillator) having a container body 1 in an H shape, and more particularly to a surface mount oscillator that prevents a change in oscillation frequency and breakage of an IC chip.

（発明の背景）
表面実装発振器は小型・軽量であることから、特に携帯電話に代表される携帯型とした各種の電子機器に周波数や時間の基準源として内蔵される。このようなものの一つに、容器本体１をＨ状として水晶片とＩＣチップとをそれぞれ別個の凹所内に収容して一体化したものがある。 (Background of the Invention)
Since the surface-mounted oscillator is small and lightweight, it is built in as a frequency and time reference source in various portable electronic devices represented by mobile phones. As one of such devices, there is one in which the container body 1 is formed in an H shape and the crystal piece and the IC chip are accommodated in separate recesses and integrated.

（従来技術の一例）
第５図は一従来例を説明する図で、同図（ａ）は表面実装発振器の断面図、同図（ｂ）は同外底面図、同図（ｃ）は水晶片の平面図である。 (Example of conventional technology)
FIG. 5 is a diagram for explaining a conventional example. FIG. 5A is a cross-sectional view of a surface-mount oscillator, FIG. 5B is a bottom view of the same, and FIG. 5C is a plan view of a crystal piece. .

表面実装発振器は積層セラミックからなり、容器本体１に水晶片２とＩＣチップ３とを収容してなる。容器本体１は中央台座１ａの両主面に枠壁１（ｂｃ）を有し、それぞれ枠壁１（ｂｃ）で囲われた凹部を形成する。他主面の凹部における開口端面の４角部には実装端子４を有する。そして、一主面の凹部に水晶片２を、他主面の凹部にＩＣチップ３を収容してなる。   The surface mount oscillator is made of a laminated ceramic, and a crystal body 2 and an IC chip 3 are accommodated in a container body 1. The container main body 1 has frame walls 1 (bc) on both main surfaces of the central pedestal 1a, and each forms a recess surrounded by the frame wall 1 (bc). Mounting terminals 4 are provided at the four corners of the opening end face in the concave portion of the other main surface. The crystal piece 2 is accommodated in the recess on one main surface, and the IC chip 3 is accommodated in the recess on the other main surface.

水晶片２は両主面に励振電極５ａを有し、一端部両側に引出電極５ｂを延出する。そして、引出電極５ｂの延出した水晶片２の一端部両側が導電性接着剤６によって一主面の凹部内底面に固着される。一主面の開口端面には例えば図示しない金属リングが設けられ、シーム溶接によって金属カバー７が接合されて水晶片２を密閉封入する。   The crystal piece 2 has excitation electrodes 5a on both main surfaces, and extends extraction electrodes 5b on both sides of one end. Then, both ends of one end portion of the crystal piece 2 from which the extraction electrode 5 b extends are fixed to the bottom surface of the concave portion of one main surface by the conductive adhesive 6. For example, a metal ring (not shown) is provided on the opening end surface of one main surface, and a metal cover 7 is joined by seam welding to hermetically enclose the crystal piece 2.

ＩＣチップ３は少なくとも発振回路を集積化し、回路機能面の一主面にＩＣ端子（不図示）を有する。そして、バンプ８を用いた超音波熱圧着によって他主面の凹部内底面の図示しない回路端子にＩＣ端子を電気的に接続して固着される（所謂フリップチップボンディング）。   The IC chip 3 integrates at least an oscillation circuit and has an IC terminal (not shown) on one main surface of the circuit function. Then, the IC terminal is electrically connected and fixed to a circuit terminal (not shown) on the bottom surface of the recess of the other main surface by ultrasonic thermocompression using the bumps 8 (so-called flip chip bonding).

ＩＣ端子中の水晶端子は一主面の凹部の水晶片２と図示しない配線路によって電気的に接続する。また、ＩＣ端子中の電源、出力、アースやスタンバイ端子等の機能端子は他主面の開口端面のこれらに対応した実装端子４に、積層面及びスルーホール加工による端面を経て電気的に接続する。そして、この例では、ＩＣチップ３の保護樹脂９がＩＣチップ３を全体的に覆って塗布される。なお、回路機能面（一主面）のみにアンダーフィルとして注入される場合もある。
特開２００４−２８２６５９号公報 特開２００２−６４３３３号公報 The crystal terminal in the IC terminal is electrically connected to the crystal piece 2 in the concave portion on one main surface by a wiring path (not shown). Further, power terminals, output terminals, functional terminals such as ground and standby terminals in the IC terminals are electrically connected to mounting terminals 4 corresponding to the opening end surfaces of the other main surface through the laminated surface and end surfaces by through-hole processing. . In this example, the protective resin 9 of the IC chip 3 is applied so as to cover the entire IC chip 3. In some cases, the underfill is injected only into the circuit function surface (one main surface).
JP 2004-282659 A JP 2002-64333 A

（従来技術の問題点）
しかしながら、上記構成の表面実装発振器では、ＩＣチップ３を全体的に覆う保護樹脂９が大気等の環境状態によって湿気を吸収し、これにより誘電率が変化する。したがって、浮遊容量等の変化によって水晶振動子から見た直列等価容量も変化し、発振周波数が変化する問題があった。 (Problems of conventional technology)
However, in the surface mount oscillator having the above-described configuration, the protective resin 9 that covers the entire IC chip 3 absorbs moisture according to an environmental state such as the atmosphere, and thereby the dielectric constant changes. Therefore, there is a problem in that the series equivalent capacitance as seen from the quartz resonator also changes due to a change in stray capacitance and the oscillation frequency changes.

このことから、ＩＣチップ３を覆う保護樹脂９を排除することが考えられた。しかし、この場合には、表面実装発振器を製作する作業工程の移送中、例えばパーツフィーダ内でＩＣチップ３が他の表面実装発振器と接触して亀裂等を生じる。そして、ＩＣチップ３の電気的特性に障害を引き起こし、発振を停止させる等の問題があった。   From this, it was considered that the protective resin 9 covering the IC chip 3 was eliminated. However, in this case, during the transfer of the work process for manufacturing the surface mount oscillator, for example, the IC chip 3 comes into contact with another surface mount oscillator in the parts feeder, and a crack or the like is generated. Then, there are problems such as causing trouble in the electrical characteristics of the IC chip 3 and stopping the oscillation.

（発明の目的）
本発明はＩＣチップを保護して亀裂等を防止し、発振周波数の変化を抑制して発振を確実に維持した表面実装発振器を提供することを目的とする。 (Object of invention)
It is an object of the present invention to provide a surface mount oscillator that protects an IC chip to prevent cracks and the like, suppresses a change in oscillation frequency, and reliably maintains oscillation.

本発明は、特許請求の範囲（請求項１）に示したように、中央台座の一主面と他主面とに枠壁で囲われた凹部を有する容器本体と、前記一主面の凹部に水晶片を収容して開口端面に金属カバーを接合して密閉封入し、他主面の凹部にＩＣチップを収容して開口端面の４角部に実装端子を有する表面実装水晶発振器において、前記他方の凹部は開口端面を絶縁カバーで覆って前記ＩＣチップを収容する空間部とし、前記絶縁カバーにおける４角部の一主面及び他主面には電気的に接続した補助端子を有し、前記一主面の補助端子は前記実装端子に電気的・機械的に接続した構成とする。   According to the present invention, as shown in claims (Claim 1), a container body having a recess surrounded by a frame wall on one main surface and the other main surface of a central pedestal, and a recess on the one main surface In the surface mount crystal oscillator, the crystal piece is accommodated and the metal cover is joined and hermetically sealed to the opening end surface, the IC chip is accommodated in the concave portion of the other main surface, and the mounting terminals are provided at the four corners of the opening end surface. The other concave portion has an opening end surface covered with an insulating cover to form a space for accommodating the IC chip, and has an auxiliary terminal electrically connected to one main surface and the other main surface of the four corners of the insulating cover, The auxiliary terminal on the one main surface is electrically and mechanically connected to the mounting terminal.

このような構成であれば、容器本体の他方の凹部は絶縁カバーで覆われたＩＣチップの空間部とするので、他方の凹部内の湿気等による誘電率の変化を抑制する。したがって、環境状態によっての浮遊容量の変化も小さく、水晶振動子から見た直列等価容量も一定になるので、発振周波数も安定になる。   With such a configuration, the other concave portion of the container body is a space portion of the IC chip covered with the insulating cover, so that a change in dielectric constant due to moisture or the like in the other concave portion is suppressed. Therefore, the change in the stray capacitance depending on the environmental state is small, and the series equivalent capacitance as seen from the crystal resonator is also constant, so that the oscillation frequency is also stabilized.

（実施態様項）
本発明の請求項２では、請求項１において、前記他主面の補助端子は前記実装端子よりも大きくする。これにより、表面実装発振器の小型化が促進して開口端面の４角部の実装端子が小さくなっても絶縁カバーの補助端子を大きくするので、セット基板に対する接合強度を確保できる。 (Embodiment section)
According to a second aspect of the present invention, in the first aspect, the auxiliary terminal on the other main surface is made larger than the mounting terminal. Thereby, even if the miniaturization of the surface mount oscillator is promoted and the mounting terminals at the four corners of the opening end face are reduced, the auxiliary terminal of the insulating cover is increased, so that the bonding strength to the set substrate can be ensured.

同請求項３では、請求項１において、前記一主面及び他主面の補助端子は同一大きさとし、前記実装端子よりも大きくする。これにより、請求項２での効果を維持した上で、両主面間で対称となって表裏の方向性がないので、作業性を高められる。   In the third aspect of the present invention, in the first aspect, the auxiliary terminals on the one main surface and the other main surface have the same size and are larger than the mounting terminals. As a result, while maintaining the effect of the second aspect, the workability is enhanced because the two main surfaces are symmetrical and have no front and back directions.

同請求項４では、請求項１において、前記絶縁カバーは前記ＩＣチップに対向するシールド電極が設けられ、前記実装端子中のアース端子に接続する。これにより、セット基板とＩＣチップとを電気的に隔絶するので、例えば浮遊容量の発生を防止して発振周波数を安定に維持できる。   In the fourth aspect of the present invention, in the first aspect, the insulating cover is provided with a shield electrode facing the IC chip, and is connected to a ground terminal in the mounting terminal. As a result, the set substrate and the IC chip are electrically isolated, so that, for example, stray capacitance can be prevented and the oscillation frequency can be maintained stably.

（第１実施形態）
第１図は本発明の第１実施形態を説明する表面実装発振器の断面図である。なお、前従来例と同一部分には同番号を付与してその説明は簡略又は省略する。 (First embodiment)
FIG. 1 is a sectional view of a surface mount oscillator for explaining a first embodiment of the present invention. In addition, the same number is attached | subjected to the same part as a prior art example, and the description is simplified or abbreviate | omitted.

水晶発振器は、前述したように、中央台座１ａの両主面に枠壁によって囲われた凹部を有する容器本体１と、一主面の凹部に収容して密閉封入された水晶片２と、他主面の凹部に収容されたＩＣチップ３とを備え、他方の凹部における開口端面の４角部には実装端子４を有する。   As described above, the crystal oscillator includes a container body 1 having recesses surrounded by frame walls on both main surfaces of the center pedestal 1a, a crystal piece 2 hermetically sealed in a recess on one main surface, and the like. IC chip 3 accommodated in the concave portion of the main surface, and mounting terminals 4 are provided at the four corners of the opening end surface of the other concave portion.

そして、この実施形態では、従来例でのＩＣチップ３の保護樹脂９は排除され、容器本体１の他主面の凹部は開口端面を絶縁カバー１０によって覆われる。これにより、他主面の凹部はフリップチップボンディングによって固着されたＩＣチップ３が収容される単なる空間部とする。   In this embodiment, the protective resin 9 of the IC chip 3 in the conventional example is excluded, and the recess on the other main surface of the container body 1 is covered with the insulating cover 10 at the opening end surface. As a result, the concave portion on the other main surface is a simple space portion in which the IC chip 3 fixed by flip chip bonding is accommodated.

絶縁カバー１０は例えばセラミックとし、４角部の両主面に補助端子１１を有する。補助端子１１は両主面間で電気的に接続し、例えば実装端子４よりも大きく、さらに同一の大きさとする。そして、絶縁カバー１０の一主面の補助端子１１はこれに対応した各実装端子４と鉛フリーを含む半田や共晶合金等によって電気的・機械的に接続する。   The insulating cover 10 is made of ceramic, for example, and has auxiliary terminals 11 on both main surfaces of the four corners. The auxiliary terminal 11 is electrically connected between both main surfaces, and is larger than, for example, the mounting terminal 4 and has the same size. Then, the auxiliary terminal 11 on one main surface of the insulating cover 10 is electrically and mechanically connected to each mounting terminal 4 corresponding thereto by solder, eutectic alloy or the like containing lead-free.

このような構成であれば、容器本体１の他方の凹部は絶縁カバー１０で覆われ、従来例の保護樹脂９を排除した単なるＩＣチップ３の空間部とする。したがって、他方の凹部内の環境状態に伴う湿気等による誘電率の変化を抑制する。これにより、これらによる浮遊容量の変化も小さくなって、水晶振動子から見た直列等価容量も一定になるので、発振周波数も安定になる。   With such a configuration, the other concave portion of the container body 1 is covered with the insulating cover 10 and is simply a space portion of the IC chip 3 excluding the conventional protective resin 9. Therefore, a change in dielectric constant due to moisture or the like accompanying the environmental state in the other recess is suppressed. As a result, the change in the stray capacitance due to these becomes small, and the series equivalent capacitance seen from the crystal resonator becomes constant, so that the oscillation frequency becomes stable.

（第２実施形態）
第２図は本実施例の第２実施形態を説明する表面実装発振器の図である。なお、前実施形態と同一部分の説明は省略又は簡略する。 (Second Embodiment)
FIG. 2 is a diagram of a surface mount oscillator for explaining the second embodiment of the present embodiment. In addition, description of the same part as previous embodiment is abbreviate | omitted or simplified.

第２実施形態では、容器本体１の他方の凹部を覆って接合される絶縁カバー１０はＩＣチップ３と対向する一主面にシールド電極１２としての金属膜を有する。ここでは、絶縁カバー１０は二層構造として積層面にシールド電極１２を形成する。そして、ＩＣチップ３を全面的に覆って実装端子４中のアース端子と電気的に接続する。   In the second embodiment, the insulating cover 10 that is joined to cover the other recess of the container body 1 has a metal film as the shield electrode 12 on one main surface facing the IC chip 3. Here, the insulating cover 10 has a two-layer structure, and the shield electrode 12 is formed on the laminated surface. Then, the IC chip 3 is entirely covered and electrically connected to the ground terminal in the mounting terminal 4.

このようにすれば、例えば表面実装発振器の搭載されるセット基板の配線パターンとＩＣチップ３とを電気的に隔絶するので、浮遊容量による周波数変化を防止できる。勿論、第１実施形態と同様に、ＩＣチップ３の亀裂を防止して発振を良好に維持する。なお、ＩＣチップ３を概ね覆うスペースが充分な場合は、絶縁カバー１０を単板として内面にシールド電極１２を形成してもよい。   In this way, for example, the wiring pattern of the set substrate on which the surface-mounted oscillator is mounted and the IC chip 3 are electrically isolated, so that the frequency change due to the stray capacitance can be prevented. Of course, as in the first embodiment, the crack of the IC chip 3 is prevented and oscillation is maintained satisfactorily. In addition, when the space which covers the IC chip 3 is sufficient, the shield electrode 12 may be formed on the inner surface with the insulating cover 10 as a single plate.

（他の事項）
上記実施形態では容器本体１における他方の凹部の開口端面は平坦状としたが、例えば第３図に示したように段差を設けて絶縁カバー１０の外周を接合してもよい。この場合、他主面の凹部の開口端面に対する絶縁カバー１０の位置決めを容易にする。この場合でも、他方の凹部の段部には実装端子４を有し、絶縁カバー１０の補助端子１１と電気的・機械的に接続する。 (Other matters)
In the above embodiment, the opening end face of the other recess in the container body 1 is flat. However, for example, as shown in FIG. 3, a step may be provided to join the outer periphery of the insulating cover 10. In this case, the insulating cover 10 can be easily positioned with respect to the opening end surface of the recess of the other main surface. Even in this case, the mounting terminal 4 is provided at the step of the other recess, and the auxiliary terminal 11 of the insulating cover 10 is electrically and mechanically connected.

また、他方の凹部を覆って接合される絶縁カバー１０には例えば十字状の切り込みを設けてもよい（第４図）。この場合、例えばセット基板をガラスエポキシ材等とした場合に生ずる熱膨張係数差による歪みを吸収して、セット基板へ接合する半田のクラックを防止する。また、ＩＣチップ３の動作による熱が切り込みによって外部に放出されて水晶片２への伝熱を抑制し、周波数温度特性を良好に維持する。   Further, for example, a cross-shaped cut may be provided in the insulating cover 10 to be joined to cover the other concave portion (FIG. 4). In this case, for example, the distortion due to the difference in thermal expansion coefficient that occurs when the set substrate is made of glass epoxy material or the like is absorbed, and the crack of the solder bonded to the set substrate is prevented. Further, heat generated by the operation of the IC chip 3 is released to the outside by cutting, and heat transfer to the crystal piece 2 is suppressed, and the frequency-temperature characteristics are favorably maintained.

本発明の第１実施形態を説明する表面実装発振器の断面図である。It is sectional drawing of the surface mount oscillator explaining 1st Embodiment of this invention. 本発明の第２実施形態を説明する表面実装発振器の断面図である。It is sectional drawing of the surface mount oscillator explaining 2nd Embodiment of this invention. 本発明の他の実施形態を説明する表面実装発振器の断面図である。It is sectional drawing of the surface mount oscillator explaining other embodiment of this invention. 本発明のさらに他の実施形態を説明する水晶発振器の断面図である。It is sectional drawing of the crystal oscillator explaining further another embodiment of this invention. 従来例を説明する図で、同図（ａ）は表面実装発振器の断面図、同図（ｂ）は同外底面図、同図（ｃ）は水晶片の平面図である。FIG. 4A is a cross-sectional view of a surface mount oscillator, FIG. 2B is an outer bottom view, and FIG. 2C is a plan view of a crystal piece.

符号の説明Explanation of symbols

１ 容器本体、２ 水晶片、３ ＩＣチップ、４ 実装端子、５ 励振及び引出電極、６ 導電性接着剤、７ 金属カバー、８ バンプ、９ 保護樹脂、１０ 絶縁カバー、１１ 補助端子、１２ シールド電極、１３ 切り欠き。   DESCRIPTION OF SYMBOLS 1 Container body, 2 Crystal piece, 3 IC chip, 4 Mounting terminal, 5 Excitation and extraction electrode, 6 Conductive adhesive, 7 Metal cover, 8 Bump, 9 Protection resin, 10 Insulation cover, 11 Auxiliary terminal, 12 Shield electrode , 13 Notch.

Claims (4)

中央台座の一主面と他主面に枠壁で囲われた凹部をそれぞれ形成した容器本体を有し、前記一主面に形成した前記凹部に水晶片を収容して、前記容器本体の前記凹部の開口端面に金属カバーを接合して密閉封入し、また、前記他主面に形成した前記凹部にＩＣチップを収容し、前記他主面に形成した前記凹部の開口端面の４角部に実装端子を形成した表面実装水晶発振器において、前記他主面に形成した前記凹部の前記開口端面を絶縁カバーで覆って前記ＩＣチップを収容する空間部とし、前記絶縁カバーの一主面及び他主面の４角部に、前記両主面間を電気的に接続する補助端子を形成し、前記絶縁カバーの前記一主面に形成した前記補助端子を前記実装端子に接続したことを特徴とする表面実装水晶発振器。 Has a container body formed respectively a recess surrounded by the frame wall on one main surface and another main surface of the central pedestal, and accommodates crystal blank in the recess formed in the one main surface, wherein said container body bonding a metal cover to the opening end surface of the recess sealed encapsulated, also the housing the IC chip in the recess formed in the other major surface, the four corners of the opening end surface of the recess formed on the other major surface in the surface mount crystal oscillator to form a mounting terminal, wherein the opening end surface of the recess formed on the other major surface covered with an insulating cover and space for accommodating the IC chip, one main surface and another main of the insulation cover the four corners of the surface, said between both main surfaces to form an auxiliary terminal electrically connected, characterized in that said auxiliary terminal formed on the one main surface of the insulating cover and connected to said mounting terminals Surface mount crystal oscillator. 請求項１において、前記絶縁カバーの前記他主面に形成した前記補助端子の外形形状を前記実装端子の外形形状よりも大きく形成した表面実装水晶発振器。 According to claim 1, wherein the insulating said other main surface formed with said auxiliary greater surface mount crystal oscillator is also the outer shape than the outer shape of the mounting pin of the cover. 請求項１において、前記絶縁カバーの前記一主面及び前記他主面に形成した各前記補助端子の外形形状を同一の大きさとし、かつ、前記実装端子の外部形状よりも大きく形成した表面実装水晶発振器 According to claim 1, wherein the insulating cover one main surface and the formed on the other main surface of the outer shape of each of the auxiliary terminals same size Satoshi, and larger surface mount crystal than the external shape of the mounting pin Oscillator 請求項１において、前記絶縁カバーに前記ＩＣチップの主面に対面するシールド電極を設け、前記シールド電極を前記実装端子の内のアース端子に接続した表面実装水晶発振器。


According to claim 1, wherein the shield electrode against a surface on the main surface of the IC chip to the insulating cover is provided, the surface mount crystal oscillator connected to the ground terminal of said mounting terminals the shield electrode.


JP2008295108A 2008-11-19 2008-11-19 Surface mount crystal oscillator Expired - Fee Related JP5300434B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008295108A JP5300434B2 (en) 2008-11-19 2008-11-19 Surface mount crystal oscillator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008295108A JP5300434B2 (en) 2008-11-19 2008-11-19 Surface mount crystal oscillator

Publications (2)

Publication Number Publication Date
JP2010124165A JP2010124165A (en) 2010-06-03
JP5300434B2 true JP5300434B2 (en) 2013-09-25

Family

ID=42325112

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008295108A Expired - Fee Related JP5300434B2 (en) 2008-11-19 2008-11-19 Surface mount crystal oscillator

Country Status (1)

Country Link
JP (1) JP5300434B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013005099A (en) * 2011-06-14 2013-01-07 Nippon Dempa Kogyo Co Ltd Piezoelectric device and manufacturing method of the same
JP2016021768A (en) * 2015-09-09 2016-02-04 日本電波工業株式会社 Piezoelectric device and manufacturing method of the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000124737A (en) * 1998-10-15 2000-04-28 Nippon Dempa Kogyo Co Ltd Surface mounting piezoelectric oscillator
JP4310486B2 (en) * 1999-12-16 2009-08-12 株式会社村田製作所 Piezoelectric oscillator
JP2002261547A (en) * 2001-02-28 2002-09-13 Kyocera Corp Electronic component device
JP2004320674A (en) * 2003-04-21 2004-11-11 Matsushita Electric Ind Co Ltd Oscillator
JP2007093215A (en) * 2005-09-26 2007-04-12 Epson Toyocom Corp Probe pin, monitor electrode pad, package for surface mounting, and piezoelectric oscillator for surface mounting

Also Published As

Publication number Publication date
JP2010124165A (en) 2010-06-03

Similar Documents

Publication Publication Date Title
US7872537B2 (en) Surface-mount crystal oscillator
JP2010135890A (en) Crystal device
JP2009004900A (en) Surface-mounting crystal oscillator
JP4750177B2 (en) Crystal oscillator for surface mounting
JP5072436B2 (en) Crystal oscillator for surface mounting
JP2004048592A (en) Surface mount crystal oscillator
JP2003298000A (en) Sheet substrate for oscillator and method for manufacturing surface mounted crystal oscillator using the same
JP2009188633A (en) Surface-mount type crystal oscillator
JP4665861B2 (en) Surface mount electronic devices
JP4907962B2 (en) Surface mount crystal oscillator
JP5300434B2 (en) Surface mount crystal oscillator
JP2007082113A (en) Wireless module element and its mounting method
JP2008294585A (en) Crystal oscillator for surface mounting
JP2010103749A (en) Crystal oscillator for surface mounting
JP5468240B2 (en) Temperature compensated crystal oscillator for surface mounting
JP2010183349A (en) Crystal oscillator for surface mount
JP2009135562A (en) Crystal oscillator for surface mounting
JP2008252467A (en) Piezoelectric device for surface mounting
JP2005123736A (en) Surface mount crystal vibrator
JP2013126052A (en) Crystal oscillator
JP2010141421A (en) Surface mount crystal oscillator
JP2008252451A (en) Crystal oscillator for surface mounting
JP5613370B2 (en) Mounting method of surface mount crystal oscillator on set substrate
JP2004194046A (en) Crystal resonator and crystal oscillator using it
JP2010153966A (en) Surface mount crystal oscillator

Legal Events

Date Code Title Description
RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20110826

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20111114

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121016

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130305

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130403

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130521

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130618

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees