JP2010103749A - Crystal oscillator for surface mounting - Google Patents
Crystal oscillator for surface mounting Download PDFInfo
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- JP2010103749A JP2010103749A JP2008273136A JP2008273136A JP2010103749A JP 2010103749 A JP2010103749 A JP 2010103749A JP 2008273136 A JP2008273136 A JP 2008273136A JP 2008273136 A JP2008273136 A JP 2008273136A JP 2010103749 A JP2010103749 A JP 2010103749A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
本発明は表面実装用の水晶発振器（以下、表面実装発振器とする）を技術分野とし、特に水晶振動子の電気的特性（振動特性）が測定される水晶検査端子を設けた表面実装発振器に関する。 The present invention relates to a surface mount crystal oscillator (hereinafter referred to as a surface mount oscillator), and more particularly to a surface mount oscillator provided with a crystal inspection terminal for measuring the electrical characteristics (vibration characteristics) of a crystal resonator.
（発明の背景）
表面実装発振器は小型・軽量であることから、特に携帯電話に代表される携帯型の電子機器に周波数及び時間の基準源として広く用いられている。このようなものの一つに、水晶片とＩＣチップとを容器本体に収容して密閉封入し、水晶検査端子を外表面に設けた表面実装発振器がある。
(Background of the Invention)
Since the surface-mounted oscillator is small and light, it is widely used as a frequency and time reference source, particularly in portable electronic devices typified by cellular phones. As one of such devices, there is a surface mount oscillator in which a crystal piece and an IC chip are accommodated in a container body and hermetically sealed, and a crystal inspection terminal is provided on the outer surface.
（従来技術の一例）
第５図及び第６図は一従来例を説明する表面実装用発振器の図で、第５図（ａ）は水晶振動子の測定時の正面図、第５図（ｂ）は同測定後の正面図、第５図（ｃ）は底面図、第６図は水晶振動子の平面図である。
(Example of conventional technology)
FIGS. 5 and 6 are diagrams of a surface-mount oscillator for explaining one conventional example. FIG. 5 (a) is a front view when measuring a crystal resonator, and FIG. 5 (b) is a diagram after the measurement. FIG. 5 (c) is a bottom view and FIG. 6 is a plan view of a crystal resonator.
表面実装発振器は容器本体１にＩＣチップ２と水晶片３とを収容し、開口端面にカバー４を接合してなる。容器本体１は底壁１ａ、中間枠壁１ｂ及び上枠壁１ｃからなり、凹部及び段部を有する。これらは、多層構造としたセラミックの焼成によって形成される。ＩＣチップ２は発振回路を構成する増幅器等の各素子を集積し、水晶端子５を含む各ＩＣ端子を回路機能面としての一主面に有する。 The surface-mount oscillator is formed by housing an IC chip 2 and a crystal piece 3 in a container body 1 and bonding a cover 4 to an opening end face. The container body 1 includes a bottom wall 1a, an intermediate frame wall 1b, and an upper frame wall 1c, and has a recess and a step. These are formed by firing a ceramic having a multilayer structure. The IC chip 2 integrates each element such as an amplifier constituting the oscillation circuit, and has each IC terminal including the crystal terminal 5 on one main surface as a circuit function surface.
そして、容器本体１の凹部底面に、ＩＣチップ２の一主面側が例えばバンプ６を用いた超音波熱圧着によって固着される（所謂フリップチップボンディング）。ＩＣチップ２の各ＩＣ端子（例えば電源、アース、出力、ＡＦＣ端子）は容器本体１の外底面の４隅に形成された実装端子７に積層面及び図示しない４角部の円弧状の電極貫通孔（所謂スルーホール）を経て電気的に接続する。 Then, one main surface side of the IC chip 2 is fixed to the bottom surface of the concave portion of the container body 1 by, for example, ultrasonic thermocompression using bumps 6 (so-called flip chip bonding). Each IC terminal (for example, power supply, ground, output, AFC terminal) of the IC chip 2 passes through the mounting terminals 7 formed at the four corners of the outer bottom surface of the container body 1 and passes through the arcuate electrodes on the laminated surface and the four corners (not shown). Electrical connection is made through a hole (so-called through hole).
水晶片３は両主面の励振電極８ａから例えば一端部両側に引出電極８ｂを延出する。そして、引出電極８ｂを延出した一端部両側を導電性接着剤９によって段部に固着し、水晶保持端子１０に電気的・機械的に接続する。水晶保持端子１０はＩＣチップ２の水晶端子５に電気的に接続する。 The quartz crystal piece 3 has, for example, extraction electrodes 8b extending from the excitation electrodes 8a on both main surfaces to both sides of one end. Then, both sides of one end of the extraction electrode 8b are fixed to the stepped portion by the conductive adhesive 9, and are electrically and mechanically connected to the crystal holding terminal 10. The crystal holding terminal 10 is electrically connected to the crystal terminal 5 of the IC chip 2.
さらに、水晶保持端子１０は、水晶振動子（水晶片３）単体の電気的特性を測定するため、容器本体１の外底面に設けられた一対の水晶検査端子１１に電気的に接続する。各水晶検査端子１１は対向する辺縁中央部に形成され、外側面に設けた半円状のスルーホールによる導電路１２及び図示しない内部の回路パターンを経て一対の引出電極８ｂ即ち励振電極８ａ（要するに水晶片３）と電気的に接続する。なお、図中の符号１３は金属リングであり、シーム溶接によってカバー４が接合される。 Furthermore, the crystal holding terminal 10 is electrically connected to a pair of crystal inspection terminals 11 provided on the outer bottom surface of the container body 1 in order to measure the electrical characteristics of the crystal resonator (crystal piece 3) alone. Each crystal inspection terminal 11 is formed in the center part of the opposite edge, and passes through a conductive path 12 by a semicircular through hole provided on the outer surface and an internal circuit pattern (not shown), and a pair of extraction electrodes 8b, that is, excitation electrodes 8a ( In short, it is electrically connected to the crystal piece 3). In addition, the code | symbol 13 in a figure is a metal ring, and the cover 4 is joined by seam welding.
そして、例えばネットワークアナライザとした図示しない測定器のプローブを一対の水晶検査端子１１に当接し、水晶振動子の振動特性（電気的特性）を測定する。その後、容器本体１の外側面に露出した各導電路１２をレーザー等によって切断（分断）する。 Then, for example, a probe of a measuring instrument (not shown) such as a network analyzer is brought into contact with the pair of crystal inspection terminals 11 to measure the vibration characteristics (electrical characteristics) of the crystal resonator. Thereafter, each conductive path 12 exposed on the outer surface of the container body 1 is cut (divided) with a laser or the like.
このようなものでは、水晶検査端子１１を容器本体１の外側面に設ける必要がなくなり、表面実装発振器の小型化（低背化）が可能となる。なぜなら、水晶検査端子１１を容器本体１の外側面に設けた場合は、水晶振動子の振動特性を測定するプローブの当接を確保するのに水晶検査端子１１も相応に大きくなる。このため、表面実装発振器の小型化、特に低背化が困難になる。しかし、上記のように水晶検査端子１１を容器本体の外底面に設けることでこの問題が解消されるからである。 In such a case, it is not necessary to provide the crystal inspection terminal 11 on the outer surface of the container body 1, and the surface mount oscillator can be reduced in size (reduced in height). This is because when the crystal inspection terminal 11 is provided on the outer surface of the container body 1, the crystal inspection terminal 11 is correspondingly increased in order to ensure contact of the probe for measuring the vibration characteristics of the crystal resonator. For this reason, it is difficult to reduce the size of the surface mount oscillator, in particular, to reduce its height. However, this problem is solved by providing the crystal inspection terminal 11 on the outer bottom surface of the container body as described above.
また、表面実装発振器が他の電子部品とともにセット基板に搭載される際は、各導電路１２が切断されているため、セット基板の回路パターンが水晶検査端子１１と電気的に接触しても誤作動を引き起こすことがなくなる。さらに、接触しない場合であっても、水晶検査端子１１が浮遊容量を増加させて、電気的特性特に発振周波数に変化をもたらす、という問題が生じなくなる。
（従来技術の問題点）
しかしながら、上記構成の表面実装発振器では、実装端子７と水晶検査端子１１との間隔が狭くなる。そのため、表面実装発振器をセット基板に搭載する際に用いる半田や導電性接着剤等の導電接合材によって実装端子７と近接する水晶検査端子１１とが電気的に接続することがある。この結果、長さ方向の一対となる実装端子７がその間にある水晶検査端子１１を介して電気的に接続し、動作不良となる問題があった。
(Problems of conventional technology)
However, in the surface mount oscillator having the above configuration, the distance between the mounting terminal 7 and the crystal inspection terminal 11 is narrow. Therefore, the mounting terminal 7 and the crystal inspection terminal 11 adjacent to the mounting terminal 7 may be electrically connected by a conductive bonding material such as solder or conductive adhesive used when the surface mount oscillator is mounted on the set substrate. As a result, there is a problem that the pair of mounting terminals 7 in the length direction are electrically connected via the crystal inspection terminal 11 between them, resulting in malfunction.
また、表面実装発振器をセット基板に搭載する際に、１つの水晶検査端子１１がセット基板上の２つ以上の導電路と接触することで誤動作が引き起こされるという問題もあった。なお、水晶検査端子１１と電気的に接触するセット基板上の導電路が１つの場合は、導電路１２の切断（分断）によって、水晶検査端子１１と水晶振動子（水晶片３）とが電気的に独立しているため、誤動作が生じない。 Further, when the surface mount oscillator is mounted on the set substrate, there is a problem that one crystal inspection terminal 11 comes into contact with two or more conductive paths on the set substrate, thereby causing a malfunction. When there is one conductive path on the set substrate that is in electrical contact with the crystal inspection terminal 11, the crystal inspection terminal 11 and the crystal unit (crystal piece 3) are electrically connected by cutting (dividing) the conductive path 12. Therefore, no malfunction occurs.
（発明の目的）
本発明は、水晶振動子の振動特性を測定することが可能であって、誤作動が生じず確実にセット基板へ搭載できる表面実装発振器の提供を目的とする。
(Object of invention)
An object of the present invention is to provide a surface mount oscillator that can measure vibration characteristics of a crystal resonator and can be reliably mounted on a set substrate without causing malfunction.
本発明は、特許請求の範囲（請求項１）に示したように、底壁及び枠壁からなる凹状とした容器本体に、水晶片及び前記水晶片と電気的に接続して発振回路を形成するＩＣチップを収容し、前記容器本体にカバーを接合して前記水晶片及び前記ＩＣチップを密閉封入し、前記容器本体の外底面には前記ＩＣチップの各端子が電気的に接続する実装端子が形成された表面実装用の水晶発振器において、前記容器本体の外底面に予め形成されて前記水晶片の振動特性を測定後に覆われ又は削除される水晶検査端子を有する構成とする。 According to the present invention, as shown in the claims (Claim 1), a crystal body and an oscillation circuit are formed by electrically connecting the crystal piece and the crystal piece to a concave container body composed of a bottom wall and a frame wall. A mounting terminal that contains an IC chip to be sealed, a cover is joined to the container body, the crystal piece and the IC chip are hermetically sealed, and each terminal of the IC chip is electrically connected to the outer bottom surface of the container body The crystal oscillator for surface mounting in which is formed has a crystal inspection terminal which is formed in advance on the outer bottom surface of the container body and is covered or deleted after measuring the vibration characteristics of the crystal piece.
このような構成であれば、表面実装発振器を導電接合材によってセット基板に搭載する際に、水晶検査端子は覆われ又は削除されているため実装端子間は電気的に十分な間隔がある。したがって、導電接合材により複数の実装端子が電気的に接続することはない。 With such a configuration, when the surface mount oscillator is mounted on the set substrate with the conductive bonding material, the crystal inspection terminals are covered or removed, so that there is a sufficient electrical space between the mount terminals. Therefore, the plurality of mounting terminals are not electrically connected by the conductive bonding material.
さらに、表面実装発振器をセット基板に搭載する際、表面実装発振器が配置されるセット基板の表面部分に２つ以上の導電路が形成されていた場合であっても、これらの導電路が電気的に接触して誤作動を引き起こすことはない。 Further, when mounting the surface mount oscillator on the set substrate, even if two or more conductive paths are formed on the surface portion of the set substrate on which the surface mount oscillator is disposed, these conductive paths are electrically Will not cause malfunction.
（実施態様項）
本発明の請求項２では、請求項１において、前記実装端子と対応する位置の両主面に電気的に接続した一対の補助実装端子が設けられた補助底壁を、前記容器本体の外底面に固着する。これにより、水晶検査端子が確実に覆われ、請求項１での効果を確実にする。また、前記補助実装端子は、対応する前記実装端子と電気的に接続しているため、セット基板に対する実装端子としての役割を十分に発揮する。
(Embodiment section)
According to a second aspect of the present invention, in the first aspect, an auxiliary bottom wall provided with a pair of auxiliary mounting terminals electrically connected to both main surfaces at positions corresponding to the mounting terminals is defined as an outer bottom surface of the container body. It sticks to. Thereby, the crystal inspection terminal is reliably covered, and the effect of claim 1 is ensured. In addition, since the auxiliary mounting terminal is electrically connected to the corresponding mounting terminal, the auxiliary mounting terminal sufficiently plays a role as a mounting terminal for the set substrate.
本発明の請求項３では、請求項１において、前記水晶検査端子は絶縁膜で覆う。これにより、水晶検査端子が確実に覆われ、請求項１での効果を確実にする。また、絶縁膜は補助底壁に比較して無視できる程度の厚みなので、表面実装発振器の低背化を維持できる。 According to a third aspect of the present invention, in the first aspect, the crystal inspection terminal is covered with an insulating film. Thereby, the crystal inspection terminal is reliably covered, and the effect of claim 1 is ensured. Further, since the insulating film has a negligible thickness as compared with the auxiliary bottom wall, the surface mount oscillator can be kept low in height.
本発明の請求項４では、請求項１において、前記水晶検査端子は削り取られる。これにより、水晶検査端子が確実に削除され、請求項１での効果を確実にする。また、水晶検査端子は削り取られて厚みの付加はなく、表面実装発振器の低背化を維持できる。さらに、水晶検査端子が存在しないため、浮遊容量が増加することもない。 According to a fourth aspect of the present invention, in the first aspect, the crystal inspection terminal is scraped off. Thereby, the crystal inspection terminal is surely deleted, and the effect of claim 1 is ensured. In addition, the crystal inspection terminal is scraped off, so that the thickness is not added, and the low profile of the surface mount oscillator can be maintained. Furthermore, since there is no crystal inspection terminal, stray capacitance does not increase.
（第１実施形態、請求項１、２に相当）
第１図は本発明の第１実施形態を説明する表面実装発振器の組立分解図である。なお、従来例と同一部分には同番号を付与してその説明は簡略又は省略する。
(First embodiment, equivalent to claims 1 and 2)
FIG. 1 is an exploded view of a surface mount oscillator for explaining a first embodiment of the present invention. In addition, the same number is attached | subjected to the same part as a prior art example, and the description is simplified or abbreviate | omitted.
表面実装発振器は、前述したように、セラミックとした底壁１ａ及び中間枠壁１ｂ、上枠壁１ｃを積層してなる容器本体１の凹部底面にＩＣチップ２を、段部に水晶片３を固着し、カバー４を接合してなる。ＩＣチップ２の水晶端子５を除く各ＩＣ端子（電源、アース、出力、ＡＦＣ端子）は、容器本体１の外底面の４隅に設けられた実装端子７に積層面及びスルーホールを経て電気的に接続する。また、水晶保持端子１０は、水晶振動子（水晶片３）単体の電気的特性を測定するため、容器本体１の外底面に設けられた一対の水晶検査端子１１に電気的に接続する（前第５図参照）。 As described above, the surface mount oscillator includes the IC chip 2 on the bottom surface of the concave portion of the container body 1 formed by laminating the bottom wall 1a, the intermediate frame wall 1b, and the upper frame wall 1c made of ceramic, and the crystal piece 3 on the stepped portion. It adheres and the cover 4 is joined. Each IC terminal (power supply, ground, output, AFC terminal) except the crystal terminal 5 of the IC chip 2 is electrically connected to the mounting terminals 7 provided at the four corners of the outer bottom surface of the container body 1 through the laminated surface and through holes. Connect to. Further, the crystal holding terminal 10 is electrically connected to a pair of crystal inspection terminals 11 provided on the outer bottom surface of the container body 1 in order to measure the electrical characteristics of the crystal resonator (crystal piece 3) alone (front (See FIG. 5).
そして、この実施形態では、容器本体１の底面には、補助実装端子１４を有して例えばセラミックからなる補助底壁１５を固着する。補助実装端子１４は容器本体１の実装端子７に対応する位置の４角部となる補助底壁１５の両主面に形成される。そして、両主面の補助実装端子１４は外側面等の図示しないスルーホールによって電気的に接続する。さらに、例えば半田によって、容器本体１の実装端子７と電気的・機械的に接続する。これにより、容器本体１の底面に露出して設けられた水晶検査端子１１を覆う。 In this embodiment, an auxiliary bottom wall 15 made of ceramic, for example, is fixed to the bottom surface of the container body 1 with the auxiliary mounting terminals 14. The auxiliary mounting terminals 14 are formed on both main surfaces of the auxiliary bottom wall 15 which are four corners at positions corresponding to the mounting terminals 7 of the container body 1. The auxiliary mounting terminals 14 on both main surfaces are electrically connected by a through hole (not shown) such as the outer surface. Further, the mounting terminal 7 of the container body 1 is electrically and mechanically connected by, for example, solder. This covers the crystal inspection terminal 11 provided exposed on the bottom surface of the container body 1.
このようなものでは、先ず、水晶振動子（水晶片３）の単独となる振動特性を、従来例同様に、水晶検査端子１１にプローブを当接して測定する。その後、前述した補助実装端子１４を有する補助底壁１５を容器本体１の外底面に固着し、水晶検査端子１１を覆う。そして、この状態でユーザに出荷され、図示しないセット基板に半田や導電性接着剤等の導電接合材によって搭載される。 In such a case, first, the vibration characteristics as a single crystal resonator (crystal piece 3) are measured by bringing the probe into contact with the crystal inspection terminal 11 as in the conventional example. Thereafter, the auxiliary bottom wall 15 having the auxiliary mounting terminal 14 described above is fixed to the outer bottom surface of the container body 1 to cover the crystal inspection terminal 11. In this state, the product is shipped to the user and mounted on a set substrate (not shown) with a conductive bonding material such as solder or conductive adhesive.
このような構成であれば、容器本体１の実装端子７は補助底壁によって覆われて、補助実装端子１４が実質的な実装端子７になる。したがって、発明の効果の欄でも記載するように、実装端子７（即ち補助実装端子１４）には電気的に十分な間隔がある。このため、表面実装発振器をセット基板に搭載する際、導電接合材によって２つの実装端子７（即ち補助実装端子１４）が電気的に接続することはない。 With this configuration, the mounting terminal 7 of the container body 1 is covered with the auxiliary bottom wall, and the auxiliary mounting terminal 14 becomes the substantial mounting terminal 7. Therefore, as described in the column of the effect of the invention, the mounting terminals 7 (that is, the auxiliary mounting terminals 14) have a sufficient electrical interval. For this reason, when the surface mount oscillator is mounted on the set substrate, the two mounting terminals 7 (that is, the auxiliary mounting terminals 14) are not electrically connected by the conductive bonding material.
また、表面実装発振器が配置されるセット基板の表面部分に２つ以上の導電パターンが形成されていた場合であっても、これらの導電パターンが電気的に接触して誤作動を引き起こすことはない。さらに、補助実装端子１４は、対応する実装端子７と電気的に接続しているため、セット基板に対する実装端子としての役割を十分に発揮する。 Further, even when two or more conductive patterns are formed on the surface portion of the set substrate on which the surface mount oscillator is disposed, these conductive patterns are not in contact with each other to cause malfunction. . Furthermore, since the auxiliary mounting terminal 14 is electrically connected to the corresponding mounting terminal 7, it fully exhibits the role as a mounting terminal for the set substrate.
（第２実施形態、請求項１、３に相当）
第２図は本発明の第２実施形態を説明する表面実装発振器の図であり、第２図（ａ）は正面図、第２図（ｂ）は底面図である。なお、前実施形態と同一部分には同番号を付与してその説明は簡略又は省略する。
(Embodiment 2 corresponds to claims 1 and 3)
FIG. 2 is a view of a surface mount oscillator for explaining a second embodiment of the present invention, FIG. 2 (a) is a front view, and FIG. 2 (b) is a bottom view. In addition, the same number is given to the same part as previous embodiment, and the description is simplified or abbreviate | omitted.
第２実施形態では、第１実施形態と同様に、水晶振動子（水晶片３）の単独となる振動特性を、容器本体１の外底面に設けた水晶検査端子７にプローブを当接して測定する。そして、第１実施形態での補助底壁１５に代えて、ＣＶＤコーティングによる絶縁膜１６にて水晶検査端子１１を覆う。 In the second embodiment, as in the first embodiment, the vibration characteristics as a single crystal resonator (crystal piece 3) are measured by bringing a probe into contact with a crystal inspection terminal 7 provided on the outer bottom surface of the container body 1. To do. Then, instead of the auxiliary bottom wall 15 in the first embodiment, the crystal inspection terminal 11 is covered with an insulating film 16 by CVD coating.
このような構成であれば、第１実施形態と同様に、セット基板への搭載時の電気的短絡を防止する。そして、絶縁膜１６は補助底壁１５に比較して無視できる程度の厚みなので、表面実装発振器の低背化を維持できる。 With such a configuration, as in the first embodiment, an electrical short circuit when mounted on the set substrate is prevented. Since the insulating film 16 has a negligible thickness as compared with the auxiliary bottom wall 15, it is possible to maintain a low profile of the surface mount oscillator.
（第３実施形態、請求項１、４に相当）
第３図は本発明の第３実施形態を説明する表面実装発振器の図であり、第３図（ａ）は水晶振動子の測定時の底面図、第３図（ｂ）は同測定後の底面図である。なお、前実施形態と同一部分には同番号を付与してその説明は簡略又は省略する。
(Embodiment 3 corresponds to claims 1 and 4)
FIG. 3 is a diagram of a surface mount oscillator for explaining a third embodiment of the present invention. FIG. 3 (a) is a bottom view at the time of measuring a crystal resonator, and FIG. 3 (b) is a diagram after the measurement. It is a bottom view. In addition, the same number is given to the same part as previous embodiment, and the description is simplified or abbreviate | omitted.
第３実施形態では、各実施形態と同様に、水晶振動子（水晶片３）の単独となる振動特性を、容器本体１の外底面に設けた水晶検査端子１１にプローブを当接して測定する。そして、ここでは、レーザーやガスイオンの照射等によって水晶検査端子１１を削り取る。これにより、容器本体１の外底面には水晶検査端子１１は露出しない状態にする。 In the third embodiment, as in each embodiment, the vibration characteristics of the crystal resonator (crystal piece 3) alone are measured by contacting the probe with the crystal inspection terminal 11 provided on the outer bottom surface of the container body 1. . Here, the crystal inspection terminal 11 is scraped off by laser or gas ion irradiation. Thus, the crystal inspection terminal 11 is not exposed on the outer bottom surface of the container body 1.
このような構成であれば、各実施形態と同様に、セット基板への搭載時の電気的短絡を防止する。そして、容器本体１の外底面には水晶検査端子１１が存在しないため、浮遊容量が増加することもない。 With such a configuration, an electrical short circuit when mounted on a set substrate is prevented, as in each embodiment. Further, since the crystal inspection terminal 11 does not exist on the outer bottom surface of the container body 1, the stray capacitance does not increase.
（他の事項）
第１実施形態では補助底壁は平板面としたが、例えば第４図に示したように、補助底壁１５に４角部を除く十字状の溝１７を設けてもよい。これにより、例えばセラミックとした補助底壁と例えばガラスエポキシとしたセット基板との熱膨張係数差による導電接合材としての例えば半田に生ずる亀裂の発生を防止できる。
(Other matters)
In the first embodiment, the auxiliary bottom wall is a flat surface. However, as shown in FIG. 4, for example, the auxiliary bottom wall 15 may be provided with a cross-shaped groove 17 excluding the four corners. Thereby, it is possible to prevent the occurrence of cracks in, for example, solder as a conductive bonding material due to a difference in thermal expansion coefficient between an auxiliary bottom wall made of, for example, ceramic and a set substrate made of, for example, glass epoxy.
また、第１実施形態から第３実施形態の表面実装発振器では、水晶検査端子１１は容器本体１の外側面に形成された導電路１２によって水晶片３と電気的に接続している。しかしながら、例えば、底壁１ｃに形成するスルーホール及び底壁１ｃ上の導電路、中間枠壁１ｂに形成するスルーホールによって、水晶検査端子１１が水晶片３と電気的に接続する場合においても適用できることは勿論である。 In the surface mount oscillators of the first to third embodiments, the crystal inspection terminal 11 is electrically connected to the crystal piece 3 through the conductive path 12 formed on the outer surface of the container body 1. However, the present invention is also applicable to the case where the crystal inspection terminal 11 is electrically connected to the crystal piece 3 by, for example, a through hole formed in the bottom wall 1c, a conductive path on the bottom wall 1c, and a through hole formed in the intermediate frame wall 1b. Of course you can.
１ 容器本体、２ ＩＣチップ、３ 水晶片、４ カバー、５ 水晶端子、６ バンプ、７ 実装端子、８ａ 励振電極、８ｂ 引出電極、９ 導電性接着剤、１０ 水晶保持端子、１１ 水晶検査端子、１２ 導電路、１３ 金属リング、１４ 補助実装端子、１５ 補助底壁、１６ 絶縁膜、１７ 十字状の溝。 DESCRIPTION OF SYMBOLS 1 Container body, 2 IC chip, 3 Crystal piece, 4 Cover, 5 Crystal terminal, 6 Bump, 7 Mounting terminal, 8a Excitation electrode, 8b Lead electrode, 9 Conductive adhesive, 10 Crystal holding terminal, 11 Crystal inspection terminal, 12 conductive path, 13 metal ring, 14 auxiliary mounting terminal, 15 auxiliary bottom wall, 16 insulating film, 17 cross-shaped groove.
Claims (4)
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| JP2008273136A JP2010103749A (en) | 2008-10-23 | 2008-10-23 | Crystal oscillator for surface mounting |
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| JP2008273136A JP2010103749A (en) | 2008-10-23 | 2008-10-23 | Crystal oscillator for surface mounting |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011149043A1 (en) * | 2010-05-28 | 2011-12-01 | 株式会社大真空 | Member for sealing piezoelectric vibration device, and piezoelectric vibration device |
| JP2012074978A (en) * | 2010-09-29 | 2012-04-12 | Kyocera Kinseki Corp | Manufacturing method of piezoelectric device |
| JP2014175848A (en) * | 2013-03-08 | 2014-09-22 | Nippon Dempa Kogyo Co Ltd | Surface-mounted low crystal oscillator |
| JP2015039133A (en) * | 2013-08-19 | 2015-02-26 | 日本特殊陶業株式会社 | Package |
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2008
- 2008-10-23 JP JP2008273136A patent/JP2010103749A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011149043A1 (en) * | 2010-05-28 | 2011-12-01 | 株式会社大真空 | Member for sealing piezoelectric vibration device, and piezoelectric vibration device |
| CN102918767A (en) * | 2010-05-28 | 2013-02-06 | 株式会社大真空 | Sealing member for piezoelectric resonator device, and piezoelectric resonator device |
| US8710718B2 (en) | 2010-05-28 | 2014-04-29 | Daishinku Corporation | Sealing member for piezoelectric resonator device, and piezoelectric resonator device |
| JP5741578B2 (en) * | 2010-05-28 | 2015-07-01 | 株式会社大真空 | Piezoelectric vibration device sealing member and piezoelectric vibration device |
| JP2012074978A (en) * | 2010-09-29 | 2012-04-12 | Kyocera Kinseki Corp | Manufacturing method of piezoelectric device |
| JP2014175848A (en) * | 2013-03-08 | 2014-09-22 | Nippon Dempa Kogyo Co Ltd | Surface-mounted low crystal oscillator |
| JP2015039133A (en) * | 2013-08-19 | 2015-02-26 | 日本特殊陶業株式会社 | Package |
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