JP5194259B2 - 液体エーロゾル式パーティクル除去方法 - Google Patents
液体エーロゾル式パーティクル除去方法 Download PDFInfo
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- JP5194259B2 JP5194259B2 JP2009518320A JP2009518320A JP5194259B2 JP 5194259 B2 JP5194259 B2 JP 5194259B2 JP 2009518320 A JP2009518320 A JP 2009518320A JP 2009518320 A JP2009518320 A JP 2009518320A JP 5194259 B2 JP5194259 B2 JP 5194259B2
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
- B05B7/02—Spray pistols; Apparatus for discharge
- B05B7/08—Spray pistols; Apparatus for discharge with separate outlet orifices, e.g. to form parallel jets, i.e. the axis of the jets being parallel, to form intersecting jets, i.e. the axis of the jets converging but not necessarily intersecting at a point
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
- B05B7/02—Spray pistols; Apparatus for discharge
- B05B7/08—Spray pistols; Apparatus for discharge with separate outlet orifices, e.g. to form parallel jets, i.e. the axis of the jets being parallel, to form intersecting jets, i.e. the axis of the jets converging but not necessarily intersecting at a point
- B05B7/0807—Spray pistols; Apparatus for discharge with separate outlet orifices, e.g. to form parallel jets, i.e. the axis of the jets being parallel, to form intersecting jets, i.e. the axis of the jets converging but not necessarily intersecting at a point to form intersecting jets
- B05B7/0853—Spray pistols; Apparatus for discharge with separate outlet orifices, e.g. to form parallel jets, i.e. the axis of the jets being parallel, to form intersecting jets, i.e. the axis of the jets converging but not necessarily intersecting at a point to form intersecting jets with one single gas jet and several jets constituted by a liquid or a mixture containing a liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Description
本願発明に関連する発明の実施形態を以下に列挙する。
[実施形態1]
基板の表面からパーティクルを除去する方法であって、該表面からパーティクルを除去する強さで水及び張力活性化合物を含む液体エーロゾル小滴を該表面と接触させることを含む方法。
[実施形態2]
液体エーロゾル小滴が、該小滴の形成時に水及び張力活性化合物を含む、実施形態1に記載の方法。
[実施形態3]
水を含む液体組成物の少なくとも1つの流れを張力活性化合物蒸気含有気体の少なくとも1つの気体流と衝突させ、それによって水及び張力活性化合物を含む液体エーロゾル小滴を形成させることにより、液体エーロゾル小滴を形成させる、実施形態2に記載の方法。
[実施形態4]
少なくとも一方の流れが水を含むところの液体組成物の2つの流れを張力活性化合物蒸気含有気体の1つの気体流と衝突させ、それによって水及び張力活性化合物を含む液体エーロゾル小滴を形成させることにより、液体エーロゾル小滴を形成させる、実施形態2に記載の方法。
[実施形態5]
水及び張力活性化合物を含む液体組成物の少なくとも1つの流れを少なくとも1つの気体流と衝突させ、それによって水及び張力活性化合物を含む液体エーロゾル小滴を形成させることにより、液体エーロゾル小滴を形成させる、実施形態2に記載の方法。
[実施形態6]
少なくとも一方の流れが水及び張力活性化合物を含むところの液体組成物の2つの流れを1つの気体流と衝突させ、それによって水及び張力活性化合物を含む液体エーロゾル小滴を形成させることにより、液体エーロゾル小滴を形成させる、実施形態2に記載の方法。
[実施形態7]
気体が、窒素、圧縮乾燥空気、二酸化炭素及びアルゴンから成る群から選択される、実施形態3に記載の方法。
[実施形態8]
気体が、窒素、圧縮乾燥空気、二酸化炭素及びアルゴンから成る群から選択される、実施形態4に記載の方法。
[実施形態9]
気体が、窒素、圧縮乾燥空気、二酸化炭素及びアルゴンから成る群から選択される、実施形態5に記載の方法。
[実施形態10]
少なくとも一方の流れが水及び張力活性化合物を含むところの液体組成物の2つの流れを衝突させ、それによって水及び張力活性化合物を含む液体エーロゾル小滴を形成させることにより、液体エーロゾル小滴を形成させる、実施形態2に記載の方法。
[実施形態11]
液体エーロゾル小滴を張力活性化合物なしに形成させ、そして表面と接触させる前に張力活性化合物を含有する雰囲気に通す、実施形態1に記載の方法。
[実施形態12]
張力活性化合物が、イソプロピルアルコール、エチルアルコール、メチルアルコール、1−メトキシ−2−プロパノール、ジアセトンアルコール、エチレングリコール、テトラヒドロフラン、アセトン、ペルフルオロヘキサン、ヘキサン及びエーテルから成る群から選択される、実施形態1に記載の方法。
[実施形態13]
張力活性化合物がイソプロピルアルコールである、実施形態1に記載の方法。
[実施形態14]
液体エーロゾル小滴が、表面との接触時に、張力活性化合物を0.1から3vol%の濃度にて含む、実施形態1に記載の方法。
[実施形態15]
液体エーロゾル小滴が、表面との接触時に、張力活性化合物を1から3vol%の濃度にて含む、実施形態1に記載の方法。
[実施形態16]
液体エーロゾル小滴が、表面との接触時に、DI水及び張力活性化合物から成る、実施形態1に記載の方法。
[実施形態17]
液体エーロゾル小滴が、さらに、処理成分を含む、実施形態1に記載の方法。
[実施形態18]
処理成分が、水酸化アンモニウム及び過酸化水素を含む、実施形態17に記載の方法。
[実施形態19]
張力活性化合物が、気体中に1から3vol%の濃度にて存在する、実施形態3に記載の方法。
[実施形態20]
張力活性化合物が、気体中に1から3vol%の濃度にて存在する、実施形態4に記載の方法。
Claims (8)
- 基板の表面からパーティクルを除去する方法であって、該表面からパーティクルを除去する強さで水及び張力活性化合物を含む液体エーロゾル小滴を該表面と接触させることを含み、前記液体エーロゾル小滴は分離したオリフィスから生ずる組成物の2つの流れを衝突させることによって形成され、その衝突する一方の流れは張力活性化合物を含んでおり、前記液体エーロゾル小滴は、水を含むところの液体組成物の少なくとも一つの流れを、張力活性化合物蒸気含有気体の少なくとも1つの気体流と衝突させ、それによって水及び張力活性化合物を含む液体エーロゾル小滴を形成させる、方法。
- 気体が、窒素、圧縮乾燥空気、二酸化炭素及びアルゴンから成る群から選択される、請求項1に記載の方法。
- 張力活性化合物が、イソプロピルアルコール、エチルアルコール、メチルアルコール、1−メトキシ−2−プロパノール、ジアセトンアルコール、エチレングリコール、テトラヒドロフラン、アセトン、ペルフルオロヘキサン、ヘキサン及びエーテルから成る群から選択される、請求項1に記載の方法。
- 張力活性化合物がイソプロピルアルコールである、請求項1に記載の方法。
- 液体エーロゾル小滴が、表面との接触時に、DI水及び張力活性化合物から成る、請求項1に記載の方法。
- 液体エーロゾル小滴が、さらに、処理成分を含む、請求項1に記載の方法。
- 処理成分が、水酸化アンモニウム及び過酸化水素を含む、請求項6に記載の方法。
- 張力活性化合物が、気体中に1から3vol%の濃度にて存在する、請求項1に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US81917906P | 2006-07-07 | 2006-07-07 | |
US60/819,179 | 2006-07-07 | ||
PCT/US2007/015268 WO2008008216A2 (en) | 2006-07-07 | 2007-06-29 | Liquid aerosol particle removal method |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2013000819A Division JP5676658B2 (ja) | 2006-07-07 | 2013-01-08 | 液体エーロゾル式パーティクル除去方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009543345A JP2009543345A (ja) | 2009-12-03 |
JP2009543345A5 JP2009543345A5 (ja) | 2010-08-12 |
JP5194259B2 true JP5194259B2 (ja) | 2013-05-08 |
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JP2009518320A Active JP5194259B2 (ja) | 2006-07-07 | 2007-06-29 | 液体エーロゾル式パーティクル除去方法 |
JP2013000819A Active JP5676658B2 (ja) | 2006-07-07 | 2013-01-08 | 液体エーロゾル式パーティクル除去方法 |
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JP2013000819A Active JP5676658B2 (ja) | 2006-07-07 | 2013-01-08 | 液体エーロゾル式パーティクル除去方法 |
Country Status (6)
Country | Link |
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US (2) | US20080006303A1 (ja) |
JP (2) | JP5194259B2 (ja) |
KR (1) | KR101437071B1 (ja) |
CN (1) | CN101495248A (ja) |
TW (1) | TWI433733B (ja) |
WO (1) | WO2008008216A2 (ja) |
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JP4442911B2 (ja) * | 2007-03-19 | 2010-03-31 | 大日本スクリーン製造株式会社 | 基板処理装置 |
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2007
- 2007-06-29 JP JP2009518320A patent/JP5194259B2/ja active Active
- 2007-06-29 KR KR1020097001733A patent/KR101437071B1/ko active IP Right Grant
- 2007-06-29 CN CNA2007800282241A patent/CN101495248A/zh active Pending
- 2007-06-29 WO PCT/US2007/015268 patent/WO2008008216A2/en active Application Filing
- 2007-07-04 TW TW096124307A patent/TWI433733B/zh active
- 2007-07-06 US US11/825,508 patent/US20080006303A1/en not_active Abandoned
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Publication number | Publication date |
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JP5676658B2 (ja) | 2015-02-25 |
CN101495248A (zh) | 2009-07-29 |
WO2008008216A3 (en) | 2008-10-16 |
WO2008008216A2 (en) | 2008-01-17 |
JP2013102188A (ja) | 2013-05-23 |
TWI433733B (zh) | 2014-04-11 |
KR20090035548A (ko) | 2009-04-09 |
US20110180114A1 (en) | 2011-07-28 |
US20080006303A1 (en) | 2008-01-10 |
JP2009543345A (ja) | 2009-12-03 |
KR101437071B1 (ko) | 2014-09-02 |
TW200810848A (en) | 2008-03-01 |
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