JP5167087B2 - 温度検出モジュール - Google Patents
温度検出モジュール Download PDFInfo
- Publication number
- JP5167087B2 JP5167087B2 JP2008296401A JP2008296401A JP5167087B2 JP 5167087 B2 JP5167087 B2 JP 5167087B2 JP 2008296401 A JP2008296401 A JP 2008296401A JP 2008296401 A JP2008296401 A JP 2008296401A JP 5167087 B2 JP5167087 B2 JP 5167087B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature detection
- detection module
- flat circuit
- circuit body
- battery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001514 detection method Methods 0.000 title claims description 52
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 210000000078 claw Anatomy 0.000 description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 238000005485 electric heating Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
- Secondary Cells (AREA)
Description
2 カバー
4 フラット回路体
5 温度センサ
6 開口
7 突出部
8 バッテリ(電源装置)
9 電池(セル)
13 収容部
15 連結部
20 突起(位置決め手段)
21 孔部(位置決め手段)
Claims (4)
- 複数の突出部をなすように波形状に屈曲される可撓性のフラット回路体と、該突出部の先端内面に設けられる温度センサと、該突出部を一方の開口から収容して該突出部の先端側部分を他方の開口から外部に突出させる各収容部を有する絶縁性のカバーとで構成され、該突出部の先端外面を電源装置に突き当てて該先端側部分を弾性的に撓ませた状態で、該突出部の弾性力のみの力で該先端外面を該電源装置に密着させることを特徴とする温度検出モジュール。
- 前記フラット回路体が前記カバーに位置決め手段で位置決めされることを特徴とする請求項1記載の温度検出モジュール。
- 前記電源装置が複数のセルを集合させた組電池であり、前記フラット回路体の各突出部が各セル毎に接触することを特徴とする請求項1又は2記載の温度検出モジュール。
- 前記カバーの各収容部を連結する連結部が可撓性を有して、位置ずれを吸収可能であることを特徴とする請求項1〜3の何れかに記載の温度検出モジュール。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008296401A JP5167087B2 (ja) | 2008-11-20 | 2008-11-20 | 温度検出モジュール |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008296401A JP5167087B2 (ja) | 2008-11-20 | 2008-11-20 | 温度検出モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010122088A JP2010122088A (ja) | 2010-06-03 |
JP5167087B2 true JP5167087B2 (ja) | 2013-03-21 |
Family
ID=42323556
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008296401A Active JP5167087B2 (ja) | 2008-11-20 | 2008-11-20 | 温度検出モジュール |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5167087B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8859909B2 (en) | 2012-03-02 | 2014-10-14 | Amphenol Thermometrics, Inc. | Flexible cable for low profile electrical device |
JP6211493B2 (ja) | 2014-09-10 | 2017-10-11 | 矢崎総業株式会社 | 温度検出装置 |
KR20200098978A (ko) * | 2019-02-13 | 2020-08-21 | 주식회사 엘지화학 | 배터리 셀의 고온을 검출하는 배터리 모듈 |
CN112366385B (zh) * | 2020-09-30 | 2023-03-17 | 广东广晟通信技术有限公司 | 一种通讯设备的电池热保护机构 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4712929B2 (ja) * | 1999-09-21 | 2011-06-29 | パナソニック株式会社 | 組電池の異常温度検出装置 |
JP4506421B2 (ja) * | 2004-11-12 | 2010-07-21 | トヨタ自動車株式会社 | 二次電池構造体 |
JP4778481B2 (ja) * | 2007-06-07 | 2011-09-21 | 矢崎総業株式会社 | 温度検出器の取付構造 |
JP5001217B2 (ja) * | 2008-05-12 | 2012-08-15 | 矢崎総業株式会社 | 温度検出モジュールとその製造方法 |
JP5242237B2 (ja) * | 2008-05-13 | 2013-07-24 | 矢崎総業株式会社 | 温度検出モジュールの取付構造 |
-
2008
- 2008-11-20 JP JP2008296401A patent/JP5167087B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2010122088A (ja) | 2010-06-03 |
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