JP5166024B2 - 荷物及び人を検査するための反射及び透過モードのテラヘルツ画像化 - Google Patents
荷物及び人を検査するための反射及び透過モードのテラヘルツ画像化 Download PDFInfo
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Description
1)ある体積又は領域内の、爆発物閾値を個々に満たす個々のピクセルの数が、ある総閾値よりも多い又は平均値であること、及び/又は
2)ある体積又は領域内の、爆発物閾値を個々に満たす個々のピクセルの体積又は領域が、十分に連続しており、良性材料の空隙を含まないこと、及び/又は
3)個々に警告するピクセルのグループの1次元、2次元又は3次元幾何学的形状が、ある閾値基準を満たすこと、及び/又は
4)データ・マップの個々の要素の空間的関係を、データ・マップ内のその空間的分布に相関させる他の基準。
レベル1: テスト対象の物品は、爆発構成が存在することも、存在しないこともある。
レベル2: システム10は、
テスト対象物品の1つ又は複数の空間位置からTHz波を取得するように、分離または1次元、2次元又は3次元配列構成された、透過構成された1つ又は複数のTD−THz送信機及び受信機、及び/又は
テスト対象物品の1つ又は複数の空間位置からTHz波を取得するように、分離または1次元、2次元又は3次元配列構成された、反射構成された1つ又は複数のTD−THz送信機及び受信機、並びに
任意選択で、試料内の単一点又は1次元、2次元又は3次元空間行列からの爆発物と良性材料との区別を提供できるデータを取得する1つ又は複数の他のセンサ(X線及びCT・X線など)
を使用する。これらのセンサは、レベル1からデータを取得し、レベル3にデータを供給する。
レベル3: ここでは、透過及び/又は反射THz波形の点、及び/又は1次元、2次元及び/又は3次元行列からなる未処理のデータ・マップが、レベル2からのテスト対象物品、及び/又は他のセンサ(X線、CT・X線センサ、質量分析及び金属検出など)からの等価のデータ・マップに空間的に相関される。
レベル4: このレベルでは、データ解析アルゴリズムが、レベル3からのデータ・マップを処理して、テスト対象物品に空間的に相関された物理的又は経験的パラメータの点、又は1次元、2次元若しくは3次元行列にする。
レベル5: 次いで、位置ごとの1つ又は複数の物理パラメータの1つ又は複数の点、並びに1次元、2次元及び3次元行列が、テスト対象物品内の位置に空間的に相関される。次いで、このマップ〔(p1,p2,…)及び/又は(p1,p2,…)i及び/又は(p1,p2,…)i,j及び/又は(p1,p2,…)i,j,k〕は、レベル6の爆発物検出アルゴリズムによって使用される。
レベル6: 1つのアルゴリズム、又は組み合わされたアルゴリズムの組は、レベル5からのデータ・マップを使用し、許容可能な真陽性及び偽陽性確率を達成するために、1つ又は複数のパラメータについての統計的多変数基準を、マップ全体又はマップの一部を解析するための1つ又は複数の規則と共に適用する。特定の具体例では、処理装置21は、テラヘルツ放射の飛行時間特性を解析するアルゴリズムで実施できる。飛行時間解析は、調査対象の物品のバルク特性を決定するために、3次元画像と組み合わすことができる。飛行時間は、調査される物品の成分又は材料の独特な特徴を取得するために、反射放射に相関されることもできる。
Claims (28)
- 物品を探知するためのシステムにおいて、該システムが、複数のテラヘルツ・モジュールと、処理装置とを含み、
前記複数のテラヘルツ・モジュールのそれぞれが、テラヘルツ放射の発生または受信のいずれか、或いは発生および受信の両方を行い、前記テラヘルツ放射の一部が前記物品から反射され、前記テラヘルツ放射の残りが前記物品を透過し、
前記処理装置が、透過および反射された前記テラヘルツ放射を複数のボクセルに変換して、該複数のボクセルの各ボクセルを、3次元マップ内の位置および材料の特性を示す特徴に割り当て、前記3次元マップ内の前記ボクセルの位置および前記複数のボクセルの各ボクセルの特徴に基づいて前記物品の特性を決定するようになっている、物品を探知するためのシステム。 - 前記透過テラヘルツ放射が、前記物品のスペクトルの特徴について解析されるようになっている請求項1に記載された物品を探知するためのシステム。
- 前記透過されたテラヘルツ放射が、前記透過されたテラヘルツ放射の減衰について解析されるようになっている請求項1に記載された物品を探知するためのシステム。
- 前記透過されたテラヘルツ放射が、前記透過されたテラヘルツ放射の時間遅延について解析されるようになっている請求項1に記載された物品を探知するためのシステム。
- 前記反射されたテラヘルツ放射が、前記物品と他の材料との少なくとも1つの界面により反射されたものである請求項1に記載された物品を探知するためのシステム。
- 前記反射されたテラヘルツ放射が、前記物品のスペクトルの特徴について解析されるようになっている請求項1に記載された物品を探知するためのシステム。
- 前記反射されたテラヘルツ放射が、前記反射されたテラヘルツ放射の時間遅延について解析されるようになっている請求項1に記載された物品を探知するためのシステム。
- 前記反射されたテラヘルツ放射が、前記反射されたテラヘルツ放射の減衰について解析されるようになっている請求項1に記載された物品を探知するためのシステム。
- 前記システムが、光パルスを発生させる発生源を更に含み、少なくとも1つのテラヘルツ・モジュールが、前記光パルスを処理してテラヘルツ放射を発生させるようになっている請求項1に記載された物品を探知するためのシステム。
- 前記システムが、連続波光放射を発生させる発生源を更に含み、少なくとも1つのテラヘルツ・モジュールが、前記連続波光放射を処理してテラヘルツ放射を発生させるようになっている請求項1に記載された物品を探知するためのシステム。
- 複数のテラヘルツ・モジュールが、テラヘルツ・モジュールの第1の配列として構成されている請求項1に記載された物品を探知するためのシステム。
- 前記システムが、テラヘルツ・モジュールの第2の配列を更に含み、前記テラヘルツ・モジュールの第2の配列のそれぞれのモジュールが、テラヘルツ放射の発生又は受信、或いは発生および受信の両方を行うようになっている請求項11に記載された物品を探知するためのシステム。
- 前記1つ又は複数のパラメータが、前記物品と空間的に関連付けされたものである請求項1に記載された物品を探知するためのシステム。
- 前記処理装置によって解析される前記テラヘルツ放射の情報を増大させるための1つ又は複数の他の診断装置を更に含む請求項1に記載された物品を探知するためのシステム。
- 前記他の診断装置が、質量分析、X線及び金属検出からなる群から選択される請求項14に記載された物品を探知するためのシステム。
- 前記処理装置が、前記テラヘルツ放射の飛行時間を解析し、前記反射された放射の飛行時間を相関させて、前記物品の構成部材に固有の特徴を得るようになっている請求項1に記載された物品を探知するためのシステム。
- 前記テラヘルツ・モジュールが、約0.01〜10THzで動作するようになっている請求項1に記載された物品を探知するためのシステム。
- 前記処理装置が、さらに、前記3次元マップ内の前記ボクセルの位置および前記複数のボクセルの各ボクセルの特徴に基づいて、前記物品が***装置であるか否かを決定するようになっている請求項1に記載された物品を探知するためのシステム。
- 前記処理装置が、さらに、前記3次元マップ内に位置付けられた前記ボクセルの数が閾値以上であるか否かに基づいて、前記物品の特性を決定するようになっている請求項18に記載された物品を探知するためのシステム。
- 前記処理装置が、さらに、前記3次元マップ内で前記複数のボクセルが十分連続しているか否かに基づいて、前記物品の特性を決定するようになっている請求項18に記載された物品を探知するためのシステム。
- 物品を探知する方法において、
複数のテラヘルツ・モジュールからテラヘルツ放射を発生させ、又は受信し、或いは発生および受信の両方を行い、前記テラヘルツ放射の一部が前記物品から反射され、前記テラヘルツ放射の残りが前記物品を透過する段階と、
透過および反射された前記テラヘルツ放射を複数のボクセルに変換する段階と、
前記複数のボクセルの各ボクセルを、3次元マップ内の位置および材料の特性を示す特徴に割り当てる段階と、
前記3次元マップ内の前記ボクセルの位置および前記複数のボクセルの各ボクセルの特徴に基づいて前記物品の特性を決定する段階と
を含む、物品を探知する方法。 - 前記方法が、光パルスを発生させる段階を更に含み、1つ又は複数のテラヘルツ・モジュールが、前記光パルスを処理して、テラヘルツ放射を発生させる請求項21に記載された物品を探知する方法。
- 前記方法が、連続波光放射を発生させる段階を更に含み、1つ又は複数のテラヘルツ・モジュールが、前記連続波光放射を処理してテラヘルツ放射を発生させる請求項21に記載された物品を探知する方法。
- 前記物品の構成部材成分に固有の特徴を得るために、前記テラヘルツ放射の飛行時間を解析し、前記反射された放射の飛行時間を相関させる段階を更に含む請求項21に記載された物品を探知する方法。
- 前記テラヘルツ・モジュールが、約0.01〜10THzで動作する請求項21に記載された物品を探知する方法。
- 前記3次元マップ内の前記ボクセルの位置および前記複数のボクセルの各ボクセルの特徴に基づいて、前記物品が***装置であるか否かを決定する段階を更に含む請求項21に記載された物品を探知する方法。
- 前記3次元マップ内に位置付けられた前記ボクセルの数が閾値以上であるか否かに基づいて、前記物品の特性を決定する段階を更に含む請求項26に記載された物品を探知する方法。
- 前記3次元マップ内で前記複数のボクセルが十分連続しているか否かに基づいて、前記物品の特性を決定する段階を更に含む請求項26に記載された物品を探知する方法。
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JP2008500541A (ja) | 2008-01-10 |
CA2567967C (en) | 2016-08-02 |
KR20070024645A (ko) | 2007-03-02 |
CA2567967A1 (en) | 2005-12-15 |
KR101332068B1 (ko) | 2013-11-22 |
CN101203742B (zh) | 2011-10-19 |
WO2005119214A1 (en) | 2005-12-15 |
EP1749201A1 (en) | 2007-02-07 |
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