JP5163780B2 - 圧電振動片 - Google Patents
圧電振動片 Download PDFInfo
- Publication number
- JP5163780B2 JP5163780B2 JP2011153618A JP2011153618A JP5163780B2 JP 5163780 B2 JP5163780 B2 JP 5163780B2 JP 2011153618 A JP2011153618 A JP 2011153618A JP 2011153618 A JP2011153618 A JP 2011153618A JP 5163780 B2 JP5163780 B2 JP 5163780B2
- Authority
- JP
- Japan
- Prior art keywords
- pair
- vibrating piece
- terminal electrodes
- electrodes
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims description 59
- 239000010453 quartz Substances 0.000 claims description 30
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 30
- 230000005284 excitation Effects 0.000 claims description 27
- 239000013078 crystal Substances 0.000 description 84
- 239000010931 gold Substances 0.000 description 61
- 229910052737 gold Inorganic materials 0.000 description 28
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 27
- 238000000034 method Methods 0.000 description 24
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 20
- 229910052751 metal Inorganic materials 0.000 description 20
- 239000002184 metal Substances 0.000 description 20
- 238000007747 plating Methods 0.000 description 19
- 239000011651 chromium Substances 0.000 description 18
- 238000000605 extraction Methods 0.000 description 18
- 230000035882 stress Effects 0.000 description 17
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 16
- 229910052804 chromium Inorganic materials 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 13
- 238000005219 brazing Methods 0.000 description 11
- 229910052759 nickel Inorganic materials 0.000 description 10
- 238000005530 etching Methods 0.000 description 9
- 230000000903 blocking effect Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 230000006355 external stress Effects 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 6
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 6
- 238000010030 laminating Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 229910000833 kovar Inorganic materials 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910004353 Ti-Cu Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
2 水晶振動片
21 基板
22,23 両主面
24 一側辺
25 他側辺
36,37 電極パッド
51 振動部
52 振動領域
53 接合部
54 一端部
55 他端部
56 中央部
61,62 励振電極
63,64 端子電極
65,66 引出電極
71 ポスト部
72 壁面
73 導電性バンプ
74 Cr−Au膜
75 金メッキ
76 金属部
81 切り欠き部
82,83 切り欠き部
84 貫通孔
9 ウエハ
91,92 両主面
93 Cr−Au膜
94 レジスト層
95 金メッキ
Claims (4)
- 圧電振動片において、
基板に、一対の励振電極が形成されて振動領域が構成された振動部と、外部と接合する一対の端子電極が形成された接合部とが一体的に設けられ、
前記一対の端子電極は、前記一対の励振電極にそれぞれ電気的に接続され、かつ、前記振動部への距離が遠近となるように並設され、
前記一対の端子電極では、前記基板上における前記振動部までの距離が長い端子電極が、前記距離が短い端子電極よりも大きく、
前記一対の端子電極は、前記接合部の両端部のうちの一端部に形成されたことを特徴とする圧電振動片。 - 請求項1に記載の圧電振動片において、
前記振動領域は、前記一対の端子電極を結ぶ仮想線と直交する仮想直交線上以外の位置に配されたことを特徴とする圧電振動片。 - 請求項1または2に記載の圧電振動片において、
前記一対の端子電極が形成された位置の前記基板が、凸状のポスト部に成形され、
前記一対の端子電極によって、前記導電性バンプが内包されたことを特徴とする圧電振動片。 - 請求項1乃至3のうちいずれか1つに記載の圧電振動片において、
ATカット水晶からなる水晶振動片であることを特徴とする圧電振動片。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011153618A JP5163780B2 (ja) | 2011-07-12 | 2011-07-12 | 圧電振動片 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011153618A JP5163780B2 (ja) | 2011-07-12 | 2011-07-12 | 圧電振動片 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009217049A Division JP4784685B2 (ja) | 2009-09-18 | 2009-09-18 | 圧電振動片 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011217406A JP2011217406A (ja) | 2011-10-27 |
JP5163780B2 true JP5163780B2 (ja) | 2013-03-13 |
Family
ID=44946594
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011153618A Active JP5163780B2 (ja) | 2011-07-12 | 2011-07-12 | 圧電振動片 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5163780B2 (ja) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001144578A (ja) * | 1999-11-15 | 2001-05-25 | Tokyo Denpa Co Ltd | 圧電振動子 |
JP2003332877A (ja) * | 2002-05-15 | 2003-11-21 | Nippon Dempa Kogyo Co Ltd | 水晶振動子 |
JP4087186B2 (ja) * | 2002-06-25 | 2008-05-21 | 日本電波工業株式会社 | 水晶振動子の保持構造 |
JP4449482B2 (ja) * | 2004-02-13 | 2010-04-14 | セイコーエプソン株式会社 | 圧電振動片、圧電振動片の製造方法、圧電振動子、及び圧電発振器 |
JP2006203700A (ja) * | 2005-01-21 | 2006-08-03 | Epson Toyocom Corp | 圧電基板の製造方法、圧電振動素子、圧電振動子、及び圧電発振器 |
JP2007124442A (ja) * | 2005-10-31 | 2007-05-17 | Epson Toyocom Corp | 圧電振動子 |
JP4600692B2 (ja) * | 2007-12-28 | 2010-12-15 | エプソントヨコム株式会社 | 水晶振動片、水晶デバイス、および水晶振動片の製造方法 |
-
2011
- 2011-07-12 JP JP2011153618A patent/JP5163780B2/ja active Active
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JP2011217406A (ja) | 2011-10-27 |
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