JP5128968B2 - セラミックス押出成形用金型 - Google Patents
セラミックス押出成形用金型 Download PDFInfo
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- JP5128968B2 JP5128968B2 JP2008007996A JP2008007996A JP5128968B2 JP 5128968 B2 JP5128968 B2 JP 5128968B2 JP 2008007996 A JP2008007996 A JP 2008007996A JP 2008007996 A JP2008007996 A JP 2008007996A JP 5128968 B2 JP5128968 B2 JP 5128968B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B3/00—Producing shaped articles from the material by using presses; Presses specially adapted therefor
- B28B3/20—Producing shaped articles from the material by using presses; Presses specially adapted therefor wherein the material is extruded
- B28B3/26—Extrusion dies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B3/00—Producing shaped articles from the material by using presses; Presses specially adapted therefor
- B28B3/20—Producing shaped articles from the material by using presses; Presses specially adapted therefor wherein the material is extruded
- B28B3/26—Extrusion dies
- B28B3/2672—Means for adjusting the flow inside the die, e.g. using choke means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B3/00—Producing shaped articles from the material by using presses; Presses specially adapted therefor
- B28B3/20—Producing shaped articles from the material by using presses; Presses specially adapted therefor wherein the material is extruded
- B28B3/26—Extrusion dies
- B28B3/269—For multi-channeled structures, e.g. honeycomb structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
- B29C48/09—Articles with cross-sections having partially or fully enclosed cavities, e.g. pipes or channels
- B29C48/11—Articles with cross-sections having partially or fully enclosed cavities, e.g. pipes or channels comprising two or more partially or fully enclosed cavities, e.g. honeycomb-shaped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
- B29C48/12—Articles with an irregular circumference when viewed in cross-section, e.g. window profiles
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/341—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one carbide layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/347—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with layers adapted for cutting tools or wear applications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/022—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/60—Multitubular or multicompartmented articles, e.g. honeycomb
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Press-Shaping Or Shaping Using Conveyers (AREA)
Description
(比較例1)
ハニカム成形用の口金を作成する工程で、口金のステンレス製基材に対してECM加工を実施すると供給端部22の複数の裏孔が形成された表面に100μm程度の凹凸が生じる。この口金の平坦化処理を行わず、Niめっき膜(Niを成分として80(質量%)以上含む厚さ40μmの被膜)と更にこの上にW3C膜(W3Cを成分として70(質量%)以上含む厚さ10μmの被膜)をコートし、上記のセラミックス坏土を押出成形し、良否判定を行った。結果を表1に示す。上記Niめっき膜の表面粗さ(Ra)と、W3C膜とはステンレス製基材の表面粗さ(Ra)と等しいものであった。
ハニカム成形用の口金を作成する工程で、口金のステンレス製基材に対してECM加工を実施すると供給端部22の複数の裏孔が形成された表面に100μm程度の凹凸が生じる。この凹凸を削り取るため、研削加工により表面の凹凸を100μm程度除去し、平坦な面を出す。このときの凹凸の高低差は5μm程度となる。この状態では表面粗さ(Ra)は0.01μmRa程度となる口金表面が得られる。その後Niめっき膜(Niを成分として80(質量%)以上含む厚さ40μmの被膜)と更にこの上にW3C膜(W3Cを成分として70(質量%)以上含む厚さ10μmの被膜)をコートした。上記のセラミックス坏土を押出成形し、良否判定を行った。結果を表1に示す。上記Niめっき膜の表面粗さ(Ra)と、W3C膜とはステンレス製基材の表面粗さ(Ra)と等しいものであった。
ハニカム成形用の口金を作成する工程で、口金のステンレス製基材に対してECM加工を実施すると供給端部22の複数の裏孔が形成された表面に100μm程度の凹凸が生じる。この凹凸を削り取るため、研削加工により表面の凹凸を100μm程度除去し、平坦な面を出す。このときの凹凸の高低差は5μm程度となる。この状態では表面粗さ(Ra)は0.01μmRa程度となる口金表面が得られる。この表面をブラスト番手♯36により表面粗さ(Ra)を12μmとし、その後Niめっき膜(Niを成分として80(質量%)以上含む厚さ40μmの被膜)と更にこの上にW3C膜(W3Cを成分として70(質量%)以上含む厚さ10μmの被膜)をコートした。上記のセラミックス坏土を押出成形し、良否判定を行った。結果を表1に示す。上記Niめっき膜の表面粗さ(Ra)と、W3C膜とはステンレス製基材の表面粗さ(Ra)と等しいものであった。
ハニカム成形用の口金を作成する工程で、口金のステンレス製基材に対してECM加工を実施すると供給端部22の複数の裏孔が形成された表面に100μm程度の凹凸が生じる。この凹凸を削り取るため、研削加工により表面の凹凸を100μm程度除去し、平坦な面を出す。このときの凹凸の高低差は5μm程度となる。この状態では表面粗さ(Ra)は0.01μm程度となる口金表面が得られる。この表面をブラスト番手♯1000により表面粗さ(Ra)を0.05μmとし、その後Niめっき膜(Niを成分として80(質量%)以上含む厚さ40μmの被膜)と更にこの上にW3C膜(W3Cを成分として70(質量%)以上含む厚さ10μmの被膜)をコートした。上記のセラミックス坏土を押出成形し、良否判定を行った。結果を表1に示す。上記Niめっき膜の表面粗さと、W3C膜とはステンレス製基材の表面粗さ(Ra)と等しいものであった。
口金表面の表面粗さ(Ra)以外は実施例1と同様にして上記のセラミックス坏土を押出成形し、良否判定を行った。結果を表1に示す。各実施例の表面粗さ(Ra)は以下の通りである。
実施例2:ブラスト番手♯600によりステンレス製基材の表面粗さ(Ra)を0.5μmとし、その後Niめっき及びW3C膜をコートした。上記Niめっき膜の表面粗さ(Ra)と、W3C膜とはステンレス製基材の表面粗さ(Ra)と等しいものであった。
実施例3:ブラスト番手♯300によりステンレス製基材の表面粗さ(Ra)を1.0μmとし、その後Niめっき及びW3C膜をコートした。上記Niめっき膜の表面粗さ(Ra)と、W3C膜とはステンレス製基材の表面粗さ(Ra)と等しいものであった。
実施例5:ブラスト番手♯46によりステンレス製基材の表面粗さ(Ra)を10μmとし、その後Niめっき及びW3C膜をコートした。上記Niめっき膜の表面粗さ(Ra)と、W3C膜とはステンレス製基材の表面粗さ(Ra)と等しいものであった。
(実施例4)
ハニカム成形用口金を作成する工程で、口金のステンレス製基材に対してECM加工を実施すると供給端部22の複数の裏孔が形成された表面に100μm程度の凹凸が生じる。この凹凸を削り取るため、ワイヤー放電加工により表面の凹凸を200μm程度除去し、平坦な面を出す。このときの凹凸の高低差は20μm程度となる。ワイヤー放電加工を用いると、表面粗さ(Ra)は2.0μm程度となる口金表面が得られる。その後Niめっき膜(Niを成分として80(質量%)以上含む厚さ40μmの被膜)と更にこの上にW3C膜(W3Cを成分として70(質量%)以上含む厚さ10μmの被膜)をコートした。上記のセラミックス坏土を押出成形し、良否判定を行った。結果を表1に示す。上記Niめっき膜の表面粗さ(Ra)と、W3C膜とはステンレス製基材の表面粗さ(Ra)と等しいものであった。
Claims (6)
- 供給端部に設けられた、坏土が供給される複数の裏孔と、押出端部に設けられた、前記複数の裏孔と連通して前記坏土がセラミックス成形体として押出されるスリットと、を有した口金と、
前記口金の前記供給端部の外周側に配置され前記坏土の供給量を調整する裏押さえ板及び裏間座と、
前記口金の前記押出端部の外周側に配置され前記セラミックス成形体の形状及びサイズを規定する押さえ板及び間座と、を備え、
前記口金においては、
隣接する前記裏孔同士の中心間の距離が0.5〜1.8mmであるとともに、
前記口金の少なくとも前記供給端部の前記裏押さえ板と重なる部分は隣接する前記裏孔同士の中心間における高低差が65μm以下であり、表面粗さ(Ra)が0.05μm〜10μmの範囲であるセラミックス押出成形用金型。 - 前記口金はステンレス製基材上にNiを主成分とする第1被覆膜と前記第1被覆膜の上に更にW3Cを主成分とする第2被覆膜とで被覆されてなる請求項1に記載のセラミックス押出成形用金型。
- 前記口金の前記ステンレス製基材の表面粗さ(Ra)が0.05μm〜10μmの範囲にある請求項2に記載のセラミックス押出成形用金型。
- 前記口金の前記第1被覆膜の表面粗さ(Ra)が0.05μm〜10μmの範囲にある請求項2または3に記載のセラミックス押出成形用金型。
- 前記口金の前記第2被覆膜の表面粗さ(Ra)が0.05μm〜10μmの範囲にある請求項2〜4のいずれか1項に記載のセラミックス押出成形用金型。
- 前記セラミックス押出成形用金型が、セラミックスハニカム構造体の押出成形に用いられる請求項1〜5のいずれか1項に記載のセラミックス押出成型用金型。
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Application Number | Priority Date | Filing Date | Title |
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JP2008007996A JP5128968B2 (ja) | 2008-01-17 | 2008-01-17 | セラミックス押出成形用金型 |
US12/352,152 US8371835B2 (en) | 2008-01-17 | 2009-01-12 | Mold for extrusion forming of ceramic articles |
EP09250094.1A EP2082856B1 (en) | 2008-01-17 | 2009-01-14 | Mold for extrusion forming of ceramic articles |
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JP2008007996A JP5128968B2 (ja) | 2008-01-17 | 2008-01-17 | セラミックス押出成形用金型 |
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JP2009166386A JP2009166386A (ja) | 2009-07-30 |
JP5128968B2 true JP5128968B2 (ja) | 2013-01-23 |
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US (1) | US8371835B2 (ja) |
EP (1) | EP2082856B1 (ja) |
JP (1) | JP5128968B2 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
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US9796108B2 (en) | 2008-08-28 | 2017-10-24 | Corning Incorporated | Wear resistant coatings for tool dies |
JP5184400B2 (ja) * | 2009-02-18 | 2013-04-17 | 日本碍子株式会社 | ハニカム構造体成形用口金 |
US20100303945A1 (en) * | 2009-05-28 | 2010-12-02 | Citriniti Joseph H | Devices And Methods For Regulating Extruder Ceramic Batch Material |
JP5908345B2 (ja) * | 2011-06-07 | 2016-04-26 | 住友化学株式会社 | ハニカム構造体成形用金型及びこれを用いたハニカム構造体の製造方法 |
CN102241055A (zh) * | 2011-07-11 | 2011-11-16 | 新嘉理(江苏)陶瓷有限公司 | 干挂陶板挤出成型模具 |
WO2013008791A1 (ja) * | 2011-07-12 | 2013-01-17 | 住友化学株式会社 | ハニカム構造体成形用金型及びこれを用いたハニカム構造体の製造方法 |
US9475245B2 (en) * | 2012-05-08 | 2016-10-25 | Corning Incorporated | Honeycomb extrusion apparatus and methods |
CN102773987A (zh) * | 2012-07-30 | 2012-11-14 | 苏州萃智新技术开发有限公司 | 一种塑料造粒机模头 |
CN104797390B (zh) * | 2012-11-27 | 2018-05-01 | 陶氏环球技术有限责任公司 | 用于挤压研磨可挤压材料的双材料模具和方法 |
CN106827187B (zh) * | 2016-12-27 | 2019-05-07 | 兴化市天东软件科技有限公司 | 一种催化剂载体成型机构 |
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JPH0645130B2 (ja) | 1989-03-23 | 1994-06-15 | 日本碍子株式会社 | セラミックハニカム押出ダイスの製造法 |
US5256054A (en) * | 1990-11-30 | 1993-10-26 | Corning Incorporated | Method and apparatus for forming a uniform skin on a cellular substrate |
US5219509A (en) * | 1990-11-30 | 1993-06-15 | Corning Incorporated | Method for forming a uniform skin on a cellular substrate |
JP2925893B2 (ja) | 1993-08-13 | 1999-07-28 | 日本碍子株式会社 | ハニカム構造体押出装置およびそれを使用したハニカム構造体の製造方法 |
JP3745504B2 (ja) | 1997-07-18 | 2006-02-15 | 日本碍子株式会社 | ハニカム構造体押出用ダイスおよびその製造方法 |
JP3648031B2 (ja) | 1997-11-14 | 2005-05-18 | 日本碍子株式会社 | ハニカム成形用口金の製造法 |
JP2002283327A (ja) | 2001-03-28 | 2002-10-03 | Ngk Insulators Ltd | ハニカム構造体成形装置及び成形方法 |
JP4210446B2 (ja) * | 2001-09-19 | 2009-01-21 | 日本碍子株式会社 | ハニカム押出成形用口金及びその製造方法 |
EP1462230B1 (en) * | 2001-11-05 | 2010-07-14 | Ngk Insulators, Ltd. | Die for molding honeycomb structure and manufacturing method thereof |
JP4373294B2 (ja) * | 2004-07-09 | 2009-11-25 | 日本碍子株式会社 | ハニカム構造体成形用口金、及びその製造方法 |
JP4523378B2 (ja) * | 2004-10-21 | 2010-08-11 | 日本碍子株式会社 | セラミックス押出成形用金型 |
JP4975426B2 (ja) | 2006-12-19 | 2012-07-11 | 日本碍子株式会社 | ハニカム構造体成形用口金 |
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2008
- 2008-01-17 JP JP2008007996A patent/JP5128968B2/ja active Active
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2009
- 2009-01-12 US US12/352,152 patent/US8371835B2/en active Active
- 2009-01-14 EP EP09250094.1A patent/EP2082856B1/en active Active
Also Published As
Publication number | Publication date |
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EP2082856B1 (en) | 2016-04-27 |
EP2082856A3 (en) | 2011-11-30 |
JP2009166386A (ja) | 2009-07-30 |
US20090186116A1 (en) | 2009-07-23 |
US8371835B2 (en) | 2013-02-12 |
EP2082856A2 (en) | 2009-07-29 |
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