JP5113394B2 - 弾性波デバイス - Google Patents
弾性波デバイス Download PDFInfo
- Publication number
- JP5113394B2 JP5113394B2 JP2007012100A JP2007012100A JP5113394B2 JP 5113394 B2 JP5113394 B2 JP 5113394B2 JP 2007012100 A JP2007012100 A JP 2007012100A JP 2007012100 A JP2007012100 A JP 2007012100A JP 5113394 B2 JP5113394 B2 JP 5113394B2
- Authority
- JP
- Japan
- Prior art keywords
- sealing portion
- acoustic wave
- sealing
- substrate
- wave device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 229920000647 polyepoxide Polymers 0.000 description 7
- 238000010897 surface acoustic wave method Methods 0.000 description 6
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- 229910052802 copper Inorganic materials 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910007637 SnAg Inorganic materials 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
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- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
12 弾性波素子
14 配線
16、16a 空洞部
20 貫通電極
22 ハンダボール
24 電極パッド
26 第1封止部
28 第2封止部
30 第3封止部
31 第1樹脂膜
32 第4封止部
33 第2樹脂膜
35 第3樹脂膜
36 開口部
38 押し付けロール
40 保護フィルム
42 開口部
Claims (5)
- 基板上に設けられた弾性波素子と、
前記弾性波素子上に空洞部を有するように前記基板上に設けられた第1封止部と、
前記第1封止部上に設けられた第2封止部と、を具備し、
前記第1封止部および前記第2封止部は感光性樹脂からなり、
前記第2封止部の端面は前記基板上で且つ前記基板の端面より内側に位置し、
前記第1封止部は、前記基板側の幅が前記基板に反対側の幅よりも広くなるような段差を有するように、前記弾性波素子の機能部分を囲うように前記基板上に設けられた第3封止部と、前記機能部分上に空洞部を形成するように前記第3封止部上に設けられた第4封止部と、を有し、前記第3封止部の幅が前記第4封止部の幅よりも広く、
前記第3封止部は前記第4封止部との接触面に凸凹を有することを特徴とする弾性波デバイス。 - 前記段差の形状は階段形状またはラウンド形状であることを特徴とする請求項1記載の弾性波デバイス。
- 前記第3封止部の表面と前記第4封止部の側面との前記第4封止部側のなす角度は鋭角であることを特徴とする請求項1または2記載の弾性波デバイス。
- 前記第3封止部の表面と前記第4封止部の側面との前記第4封止部側のなす角度は鈍角であることを特徴とする請求項1または2記載の弾性波デバイス。
- 前記基板の表面と前記第3封止部の側面との前記第3封止部側のなす角度は鋭角であることを特徴とする請求項1から4のいずれか一項記載の弾性波デバイス。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007012100A JP5113394B2 (ja) | 2007-01-23 | 2007-01-23 | 弾性波デバイス |
KR1020080006676A KR100910425B1 (ko) | 2007-01-23 | 2008-01-22 | 탄성파 디바이스 |
US12/018,460 US7586240B2 (en) | 2007-01-23 | 2008-01-23 | Acoustic wave device |
CN2008100039576A CN101232276B (zh) | 2007-01-23 | 2008-01-23 | 声波器件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007012100A JP5113394B2 (ja) | 2007-01-23 | 2007-01-23 | 弾性波デバイス |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012191871A Division JP5521016B2 (ja) | 2012-08-31 | 2012-08-31 | 弾性波デバイス |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008182292A JP2008182292A (ja) | 2008-08-07 |
JP5113394B2 true JP5113394B2 (ja) | 2013-01-09 |
Family
ID=39640551
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007012100A Expired - Fee Related JP5113394B2 (ja) | 2007-01-23 | 2007-01-23 | 弾性波デバイス |
Country Status (4)
Country | Link |
---|---|
US (1) | US7586240B2 (ja) |
JP (1) | JP5113394B2 (ja) |
KR (1) | KR100910425B1 (ja) |
CN (1) | CN101232276B (ja) |
Families Citing this family (27)
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MX2010003700A (es) * | 2007-10-20 | 2010-04-21 | Airbiquity Inc | Se?alizacion en banda inalambrica con sistemas instalados en un vehiculo. |
JP4468456B2 (ja) * | 2008-01-07 | 2010-05-26 | 富士通メディアデバイス株式会社 | 弾性波デバイス及びその製造方法 |
JP5077714B2 (ja) * | 2008-02-18 | 2012-11-21 | 株式会社村田製作所 | 弾性波装置及びその製造方法 |
US8594138B2 (en) | 2008-09-15 | 2013-11-26 | Airbiquity Inc. | Methods for in-band signaling through enhanced variable-rate codecs |
US8073440B2 (en) | 2009-04-27 | 2011-12-06 | Airbiquity, Inc. | Automatic gain control in a personal navigation device |
JP5532685B2 (ja) * | 2009-06-01 | 2014-06-25 | 株式会社村田製作所 | 弾性波装置 |
JP2010278971A (ja) * | 2009-06-01 | 2010-12-09 | Murata Mfg Co Ltd | 弾性波装置 |
JP5521417B2 (ja) * | 2009-07-15 | 2014-06-11 | パナソニック株式会社 | 弾性波素子とこれを用いた電子機器 |
JP2011023929A (ja) * | 2009-07-15 | 2011-02-03 | Panasonic Corp | 弾性波素子とこれを用いた電子機器 |
US8418039B2 (en) | 2009-08-03 | 2013-04-09 | Airbiquity Inc. | Efficient error correction scheme for data transmission in a wireless in-band signaling system |
JP5338575B2 (ja) * | 2009-09-03 | 2013-11-13 | パナソニック株式会社 | 弾性波素子とこれを用いた電子機器 |
US8249865B2 (en) | 2009-11-23 | 2012-08-21 | Airbiquity Inc. | Adaptive data transmission for a digital in-band modem operating over a voice channel |
WO2011136070A1 (ja) * | 2010-04-27 | 2011-11-03 | 京セラ株式会社 | 弾性波装置およびその製造方法 |
JP5654303B2 (ja) * | 2010-09-21 | 2015-01-14 | 太陽誘電株式会社 | 電子部品およびその製造方法、並びに電子部品を備えた電子デバイス |
WO2012132147A1 (ja) * | 2011-03-28 | 2012-10-04 | 株式会社村田製作所 | 電子部品及びその製造方法 |
CN103748787B (zh) * | 2011-08-22 | 2017-04-12 | 京瓷株式会社 | 弹性波装置以及电子部件 |
US8848825B2 (en) | 2011-09-22 | 2014-09-30 | Airbiquity Inc. | Echo cancellation in wireless inband signaling modem |
JP5880683B2 (ja) * | 2012-02-14 | 2016-03-09 | 株式会社村田製作所 | 電子部品素子およびそれを備えた複合モジュール |
JP2014112921A (ja) * | 2014-02-03 | 2014-06-19 | Kyocera Corp | 弾性波装置および回路基板 |
CN107530006A (zh) * | 2015-04-17 | 2018-01-02 | 太阳诱电株式会社 | 振动波形传感器和波形分析装置 |
JP6189901B2 (ja) * | 2015-08-26 | 2017-08-30 | 京セラ株式会社 | 弾性波装置および回路基板 |
JP6608882B2 (ja) * | 2017-08-02 | 2019-11-20 | 京セラ株式会社 | 弾性波装置および回路基板 |
KR102163886B1 (ko) | 2017-12-19 | 2020-10-12 | 가부시키가이샤 무라타 세이사쿠쇼 | 탄성파 장치 |
JP6996467B2 (ja) * | 2017-12-19 | 2022-01-17 | 株式会社村田製作所 | 弾性波装置 |
CN111371428A (zh) * | 2018-12-26 | 2020-07-03 | 中芯集成电路(宁波)有限公司上海分公司 | 控制电路与表面声波滤波器的集成方法和集成结构 |
CN110649909B (zh) * | 2019-09-30 | 2022-05-03 | 中国电子科技集团公司第二十六研究所 | 一种声表面波滤波器件晶圆级封装方法及其结构 |
CN113140883B (zh) * | 2020-01-20 | 2022-08-09 | 开元通信技术(厦门)有限公司 | 射频滤波器的制备方法 |
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JP3291046B2 (ja) | 1992-12-18 | 2002-06-10 | ティーディーケイ株式会社 | 弾性表面波装置及びその製造方法 |
EP0794616B1 (en) * | 1996-03-08 | 2003-01-29 | Matsushita Electric Industrial Co., Ltd. | An electronic part and a method of production thereof |
JPH10270975A (ja) * | 1996-03-08 | 1998-10-09 | Matsushita Electric Ind Co Ltd | 電子部品とその製造方法 |
JP3196693B2 (ja) | 1997-08-05 | 2001-08-06 | 日本電気株式会社 | 表面弾性波装置およびその製造方法 |
JP3225906B2 (ja) | 1997-11-14 | 2001-11-05 | 日本電気株式会社 | 表面弾性波素子の実装構造および実装方法 |
JP2001094392A (ja) * | 1999-09-20 | 2001-04-06 | Toshiba Corp | 弾性表面波デバイスおよびその製造方法 |
DE10006446A1 (de) | 2000-02-14 | 2001-08-23 | Epcos Ag | Verkapselung für ein elektrisches Bauelement und Verfahren zur Herstellung |
JP2002026675A (ja) * | 2000-07-04 | 2002-01-25 | Hitachi Media Electoronics Co Ltd | 弾性表面波装置及びその製造方法 |
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JP2003115734A (ja) * | 2001-10-09 | 2003-04-18 | Matsushita Electric Ind Co Ltd | 弾性表面波装置とその製造方法 |
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JP2005033689A (ja) * | 2003-07-11 | 2005-02-03 | Toyo Commun Equip Co Ltd | 弾性表面波装置及びその製造方法 |
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JP4544965B2 (ja) * | 2004-10-27 | 2010-09-15 | 京セラ株式会社 | 弾性表面波装置およびその製造方法ならびにその弾性表面波装置を備えた通信装置 |
JP2006217226A (ja) * | 2005-02-03 | 2006-08-17 | Matsushita Electric Ind Co Ltd | 弾性表面波素子およびその製造方法 |
JP4706907B2 (ja) * | 2005-06-15 | 2011-06-22 | 株式会社村田製作所 | 圧電デバイスとその製造方法 |
CN101107776B (zh) * | 2005-06-16 | 2010-05-19 | 株式会社村田制作所 | 压电器件及其制作方法 |
-
2007
- 2007-01-23 JP JP2007012100A patent/JP5113394B2/ja not_active Expired - Fee Related
-
2008
- 2008-01-22 KR KR1020080006676A patent/KR100910425B1/ko not_active IP Right Cessation
- 2008-01-23 CN CN2008100039576A patent/CN101232276B/zh not_active Expired - Fee Related
- 2008-01-23 US US12/018,460 patent/US7586240B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US7586240B2 (en) | 2009-09-08 |
US20080174207A1 (en) | 2008-07-24 |
KR100910425B1 (ko) | 2009-08-04 |
CN101232276A (zh) | 2008-07-30 |
CN101232276B (zh) | 2010-08-18 |
JP2008182292A (ja) | 2008-08-07 |
KR20080069533A (ko) | 2008-07-28 |
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