JP5096344B2 - 制御装置、殊に自動車用伝動装置のための制御装置 - Google Patents
制御装置、殊に自動車用伝動装置のための制御装置 Download PDFInfo
- Publication number
- JP5096344B2 JP5096344B2 JP2008532692A JP2008532692A JP5096344B2 JP 5096344 B2 JP5096344 B2 JP 5096344B2 JP 2008532692 A JP2008532692 A JP 2008532692A JP 2008532692 A JP2008532692 A JP 2008532692A JP 5096344 B2 JP5096344 B2 JP 5096344B2
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- Prior art keywords
- support
- printed circuit
- control device
- circuit board
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- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16H—GEARING
- F16H61/00—Control functions within control units of change-speed- or reversing-gearings for conveying rotary motion ; Control of exclusively fluid gearing, friction gearing, gearings with endless flexible members or other particular types of gearing
- F16H61/0003—Arrangement or mounting of elements of the control apparatus, e.g. valve assemblies or snapfittings of valves; Arrangements of the control unit on or in the transmission gearbox
- F16H61/0006—Electronic control units for transmission control, e.g. connectors, casings or circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
- Connection Of Motors, Electrical Generators, Mechanical Devices, And The Like (AREA)
- Control Of Transmission Device (AREA)
- Combinations Of Printed Boards (AREA)
Description
図1は、本発明の第1の実施例の部分断面図であり、
図2は、図1の実施例の、ケーシングカバーを取り除いた状態での平面図であり、
図3aは、本発明の第2の実施例の斜視図であり、
図3bは、図3aの実施例の部分断面図であり、
図4は、本発明の第3の実施例の部分断面図である。
Claims (12)
- 制御装置であって、殊に自動車用伝動装置のための制御装置であって、支持体(1)を備えており、該支持体上に電子式の回路部分(2)が設置されており、該支持体(1)上には電気的な接続部材(7)によって前記電子式の回路部分(2)と接続された少なくとも1つのフレキシブルなプリント回路基板(3)が配置されている形式のものにおいて、
中央に形成された第1の切欠き部(18)を有し、かつ前記電子式の回路部分(2)を囲むフレーム部分(5)が支持体(1)に配置されており、前記電子式の回路部分(2)は前記フレーム部分(5)の前記第1の切欠き部(18)内に配置されており、前記電子式の回路部分(2)と接続されている電気的な接続部材(7)は、前記フレーム部分(5)に前記第1の切欠き部とは別個に形成された少なくとも1つの第2の切欠き部(15)を通してフレキシブルなプリント回路基板(3)に電気的に接続されていることを特徴とする制御装置。 - フレーム部分(5)は、支持体(1)と逆の側でケーシングカバー(4)によって閉じられるようになっており、この場合にフレーム部分(5)と、ケーシングカバー(4)と支持体(1)とは、電子式の回路部分(2)の収容のためのケーシング内室(9)を画成している請求項1に記載の制御装置。
- フレキシブルなプリント回路基板(3)は、フレーム部分(5)、ケーシングカバー(4)及び支持体(1)によって画成されたケーシング内室(9)の外側に配置されている請求項2に記載の制御装置。
- フレーム部分(5)は該フレーム部分の環状の支持領域(16)でもって、支持体(1)の、電子式の回路部分(2)の装着される側の面に、前記回路部分(2)の外側で接触していて、そこで特に前記支持体(1)と溶接結合されている請求項1に記載の制御装置。
- フレーム部分(5)は第1の壁区分(11)と、該第1の壁区分(11)からケーシングカバー(4)に向かって延びる第2の壁区分(12)を備えており、前記第1の壁区分(11)は、支持体に向いた第1の面(11a)とケーシング内室(9)に向いた第2の面(11b)を有している請求項1に記載の制御装置。
- 前記第2の切欠き部(15)は、フレーム部分(5)の第1の壁区分(11)に設けられており、該第1の壁区分(11)はフレキシブルなプリント回路基板(3)上に直接に載せられ若しくは間接的に載せられている請求項5に記載の制御装置。
- フレーム部分(5)の第1の壁区分(11)は、該フレーム部分(5)の前記第2の切欠き部(15)及びフレキシブルなプリント回路基板(3)の接点面(30)を取り囲むシール手段(8)を介在して、フレキシブルなプリント回路基板(3)上に載せられている請求項6に記載の制御装置。
- フレーム部分(5)の第1の壁区分(11)は、電気的な接続部材(7)の通し案内のための孔(21)を備えたスペーサ(20)を介在して、フレキシブルなプリント回路基板(3)上に載せられており、この場合にシール手段(8)は前記第1の壁区分(11)と前記プリント回路基板(3)との間で前記スペーサ(20)の周囲を取り囲むように配置されている請求項7に記載の制御装置。
- フレーム部分(5)は、支持体(1)と溶接結合されるようになっている少なくとも1つの区分(16,25)を備えている請求項1に記載の制御装置。
- 複数のフレキシブルなプリント回路基板(3,3′,3″)を1つの支持体(1)上に配置してあり、この場合に、前記各プリント回路基板に接続されている電気的な接続部材(7)は、フレーム部分(5)の、前記各プリント回路基板に対応して設けられた前記第2の切欠き部(15,15′,15″)を通して回路部分(2)に電気的に接続されるようになっている請求項1から9のいずれか1項に記載の制御装置。
- 電気的な接続部材(7)はボンディングワイヤによって形成されている請求項1から10のいずれか1項に記載の制御装置。
- 請求項1から11のいずれか1項に記載の制御装置の製造のための方法において、第1の工程で、フレキシブルなプリント回路基板(3)を支持体(1)上に固着し、次いでフレーム部分(5)を前記支持体(1)上に装着し、次いで電気的な接続部材(7)を、前記フレキシブルなプリント回路基板(3)と、前記フレーム部分(5)の前記装着の前に若しくは後に前記支持体(1)上に固着されている電子式の回路部分(2)と接続し、最終的にケーシングカバー(4)を前記フレーム部分(5)にかぶせることを特徴とする、制御装置の製造のための方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005046826.8 | 2005-09-29 | ||
DE102005046826A DE102005046826A1 (de) | 2005-09-29 | 2005-09-29 | Steuergerät, insbesondere für ein Kraftfahrzeuggetriebe |
PCT/EP2006/065172 WO2007036384A2 (de) | 2005-09-29 | 2006-08-09 | Steuergerät, insbesondere für ein kraftfahrzeuggetriebe |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009510348A JP2009510348A (ja) | 2009-03-12 |
JP5096344B2 true JP5096344B2 (ja) | 2012-12-12 |
Family
ID=37808242
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008532692A Expired - Fee Related JP5096344B2 (ja) | 2005-09-29 | 2006-08-09 | 制御装置、殊に自動車用伝動装置のための制御装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7859852B2 (ja) |
EP (1) | EP1932404B1 (ja) |
JP (1) | JP5096344B2 (ja) |
KR (1) | KR101034773B1 (ja) |
CN (1) | CN101278606B (ja) |
DE (2) | DE102005046826A1 (ja) |
WO (1) | WO2007036384A2 (ja) |
Families Citing this family (25)
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DE102006005181B4 (de) * | 2006-02-06 | 2016-02-25 | Robert Bosch Gmbh | Baueinheit mit wenigstens einem Steuergerätgehäuse und einem eine Leiterplatte enthaltenden Deckel und seine Verwendung als Bestandteil eines Bremssystems eines Kraftfahrzeugs |
DE102006033477B3 (de) * | 2006-07-19 | 2008-01-24 | Siemens Ag | Leiterträger und Anordnung mit Leiterträger |
DE102006049592A1 (de) | 2006-10-20 | 2008-04-30 | Conti Temic Microelectronic Gmbh | Steuergerät für ein Kraftfahrzeug |
DE102006049593A1 (de) * | 2006-10-20 | 2008-04-24 | Conti Temic Microelectronic Gmbh | Kompaktes Steuergerät für ein Kraftfahrzeug |
AU2008205387A1 (en) | 2007-01-05 | 2008-07-17 | Milestone Av Technologies Llc | Wall-avoiding self-balancing mount for tilt positioning of a flat panel electronic display |
DE102007032535B4 (de) * | 2007-07-12 | 2009-09-24 | Continental Automotive Gmbh | Elektronisches Modul für eine integrierte mechatronische Getriebesteuerung |
DE102007032594B4 (de) * | 2007-07-12 | 2009-04-09 | Continental Automotive Gmbh | Steuervorrichtung und Verfahren zur Herstellung einer Steuervorrichtung |
DE102007042593B4 (de) | 2007-09-07 | 2018-10-31 | Continental Automotive Gmbh | Modul für eine integrierte Steuerelektronik mit vereinfachtem Aufbau |
DE102007045511B4 (de) * | 2007-09-24 | 2015-03-12 | Continental Automotive Gmbh | Modul für eine integrierte Steuerelektronik mit vereinfachtem Aufbau |
JP5112908B2 (ja) * | 2008-02-22 | 2013-01-09 | 株式会社オートネットワーク技術研究所 | 車両用自動変速機の接続ユニット |
DE102009041756A1 (de) * | 2009-09-16 | 2011-03-17 | Wabco Gmbh | Kontaktierungsmodul für eine Getriebesteuerung, Getriebesteuerungsmodul und Verfahren zu deren Herstellung |
US8189336B2 (en) * | 2010-01-22 | 2012-05-29 | GM Global Technology Operations LLC | Composite cover with integral heat sink |
JP5126244B2 (ja) * | 2010-02-12 | 2013-01-23 | 株式会社村田製作所 | 回路モジュール |
DE102010030528A1 (de) * | 2010-06-25 | 2011-12-29 | Robert Bosch Gmbh | Eingekapseltes Steuerungsmodul für ein Kraftfahrzeug |
DE102010039189A1 (de) | 2010-08-11 | 2012-02-16 | Robert Bosch Gmbh | Flexfolienkontaktierung |
JP5824672B2 (ja) * | 2011-02-24 | 2015-11-25 | パナソニックIpマネジメント株式会社 | パワーモジュール |
DE102011085629A1 (de) * | 2011-11-02 | 2013-05-02 | Robert Bosch Gmbh | Elektronikmodul zum Betrieb im Getriebe |
DE102011088969A1 (de) * | 2011-12-19 | 2013-06-20 | Robert Bosch Gmbh | Getriebesteuermodul |
DE102013215149A1 (de) * | 2013-08-01 | 2015-02-19 | Conti Temic Microelectronic Gmbh | Mehrstufiges Dichtsystem zum Einsatz in einem Kraftfahrzeugsteuergerät |
DE102013217363A1 (de) * | 2013-08-30 | 2015-03-05 | Robert Bosch Gmbh | Neuartige Anbindung einer flexiblen Leiterplatte an ein Steuergerätegehäuse |
DE102015205445A1 (de) | 2015-03-25 | 2016-09-29 | Robert Bosch Gmbh | Getriebesteuergerät für ein Getriebe eines Fahrzeugs |
DE102015205438A1 (de) | 2015-03-25 | 2016-09-29 | Robert Bosch Gmbh | Getriebesteuergerät für ein Getriebe eines Fahrzeugs |
DE102015218171B4 (de) * | 2015-09-22 | 2023-08-03 | Vitesco Technologies Germany Gmbh | Verfahren zur Herstellung einer elektronischen Komponente und elektronische Komponente |
DE102015224270B3 (de) * | 2015-12-04 | 2017-03-16 | Conti Temic Microelectronic Gmbh | Elektronische Komponente und Verfahren zu deren Herstellung |
DE102016209477A1 (de) * | 2016-05-31 | 2017-11-30 | Robert Bosch Gmbh | Stanzgitteranordnung für ein Getriebesteuermodul mit durch eine gekapselte Drahtbondverbindung verbundenen Cu- und Al-Stanzgittern |
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DE8309870U1 (de) | 1983-04-02 | 1983-10-06 | Standard Elektrik Lorenz Ag, 7000 Stuttgart | Metallgehäuse für elektrische Bauelemente |
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DE10315432A1 (de) * | 2003-04-03 | 2004-10-14 | Conti Temic Microelectronic Gmbh | Anordnung zum elektrischen Verbinden |
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-
2005
- 2005-09-29 DE DE102005046826A patent/DE102005046826A1/de not_active Withdrawn
-
2006
- 2006-08-09 US US11/720,801 patent/US7859852B2/en not_active Expired - Fee Related
- 2006-08-09 WO PCT/EP2006/065172 patent/WO2007036384A2/de active Application Filing
- 2006-08-09 EP EP06792749A patent/EP1932404B1/de not_active Expired - Fee Related
- 2006-08-09 KR KR1020087007644A patent/KR101034773B1/ko not_active IP Right Cessation
- 2006-08-09 JP JP2008532692A patent/JP5096344B2/ja not_active Expired - Fee Related
- 2006-08-09 CN CN2006800359713A patent/CN101278606B/zh not_active Expired - Fee Related
- 2006-08-09 DE DE502006004404T patent/DE502006004404D1/de active Active
Also Published As
Publication number | Publication date |
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EP1932404A2 (de) | 2008-06-18 |
EP1932404B1 (de) | 2009-07-29 |
CN101278606B (zh) | 2012-07-04 |
WO2007036384A3 (de) | 2007-05-24 |
KR101034773B1 (ko) | 2011-05-17 |
CN101278606A (zh) | 2008-10-01 |
KR20080049084A (ko) | 2008-06-03 |
US20100149763A1 (en) | 2010-06-17 |
DE502006004404D1 (de) | 2009-09-10 |
US7859852B2 (en) | 2010-12-28 |
JP2009510348A (ja) | 2009-03-12 |
DE102005046826A1 (de) | 2007-04-05 |
WO2007036384A2 (de) | 2007-04-05 |
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