JP5079159B2 - 反射板用ポリアミド組成物、反射板、該反射板を備えた発光装置、ならびに該発光装置を備えた照明装置および画像表示装置 - Google Patents
反射板用ポリアミド組成物、反射板、該反射板を備えた発光装置、ならびに該発光装置を備えた照明装置および画像表示装置 Download PDFInfo
- Publication number
- JP5079159B2 JP5079159B2 JP2012107797A JP2012107797A JP5079159B2 JP 5079159 B2 JP5079159 B2 JP 5079159B2 JP 2012107797 A JP2012107797 A JP 2012107797A JP 2012107797 A JP2012107797 A JP 2012107797A JP 5079159 B2 JP5079159 B2 JP 5079159B2
- Authority
- JP
- Japan
- Prior art keywords
- reflector
- polyamide
- acid
- polyamide composition
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004952 Polyamide Substances 0.000 title claims abstract description 133
- 229920002647 polyamide Polymers 0.000 title claims abstract description 133
- 239000000203 mixture Substances 0.000 title claims abstract description 77
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 33
- 238000002844 melting Methods 0.000 claims abstract description 27
- 230000008018 melting Effects 0.000 claims abstract description 27
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000002245 particle Substances 0.000 claims description 15
- 125000001142 dicarboxylic acid group Chemical group 0.000 claims description 13
- 125000004427 diamine group Chemical group 0.000 claims description 11
- 239000012779 reinforcing material Substances 0.000 claims description 11
- KKEYFWRCBNTPAC-UHFFFAOYSA-N terephthalic acid group Chemical group C(C1=CC=C(C(=O)O)C=C1)(=O)O KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 11
- 239000000395 magnesium oxide Substances 0.000 claims description 8
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 8
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 8
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical group OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 claims description 7
- GAGWMWLBYJPFDD-UHFFFAOYSA-N 2-methyloctane-1,8-diamine Chemical group NCC(C)CCCCCCN GAGWMWLBYJPFDD-UHFFFAOYSA-N 0.000 claims description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims description 6
- 239000003365 glass fiber Substances 0.000 claims description 6
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical group NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 claims description 6
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 5
- 239000000347 magnesium hydroxide Substances 0.000 claims description 5
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 5
- 239000010456 wollastonite Substances 0.000 claims description 5
- 229910052882 wollastonite Inorganic materials 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 239000003566 sealing material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 27
- 239000004065 semiconductor Substances 0.000 description 27
- 238000007789 sealing Methods 0.000 description 25
- -1 Aliphatic dicarboxylic acids Chemical class 0.000 description 24
- 238000006116 polymerization reaction Methods 0.000 description 18
- 239000003795 chemical substances by application Substances 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 16
- 239000000758 substrate Substances 0.000 description 16
- 238000012360 testing method Methods 0.000 description 16
- 150000001875 compounds Chemical class 0.000 description 14
- 238000000465 moulding Methods 0.000 description 11
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 10
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical group OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 238000005286 illumination Methods 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 239000000523 sample Substances 0.000 description 8
- 238000001746 injection moulding Methods 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- 238000005452 bending Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000004611 light stabiliser Substances 0.000 description 6
- 239000007790 solid phase Substances 0.000 description 6
- 230000003746 surface roughness Effects 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000005711 Benzoic acid Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 5
- 235000010233 benzoic acid Nutrition 0.000 description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 5
- 150000004985 diamines Chemical class 0.000 description 5
- 238000002845 discoloration Methods 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 230000014759 maintenance of location Effects 0.000 description 5
- 239000000155 melt Substances 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- 230000009257 reactivity Effects 0.000 description 5
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical group NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 4
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 125000003277 amino group Chemical group 0.000 description 4
- QMKYBPDZANOJGF-UHFFFAOYSA-N benzene-1,3,5-tricarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CC(C(O)=O)=C1 QMKYBPDZANOJGF-UHFFFAOYSA-N 0.000 description 4
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 4
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 4
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 4
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 229910052747 lanthanoid Inorganic materials 0.000 description 4
- 150000002602 lanthanoids Chemical class 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 4
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 4
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 4
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- SZHOJFHSIKHZHA-UHFFFAOYSA-N tridecanoic acid Chemical compound CCCCCCCCCCCCC(O)=O SZHOJFHSIKHZHA-UHFFFAOYSA-N 0.000 description 4
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 4
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 4
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical group 0.000 description 3
- 239000002981 blocking agent Substances 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 description 3
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- 239000004408 titanium dioxide Substances 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 2
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 2
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 2
- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 2
- GBURUDXSBYGPBL-UHFFFAOYSA-N 2,2,3-trimethylhexanedioic acid Chemical compound OC(=O)C(C)(C)C(C)CCC(O)=O GBURUDXSBYGPBL-UHFFFAOYSA-N 0.000 description 2
- BTUDGPVTCYNYLK-UHFFFAOYSA-N 2,2-dimethylglutaric acid Chemical compound OC(=O)C(C)(C)CCC(O)=O BTUDGPVTCYNYLK-UHFFFAOYSA-N 0.000 description 2
- JZUMVFMLJGSMRF-UHFFFAOYSA-N 2-Methyladipic acid Chemical compound OC(=O)C(C)CCCC(O)=O JZUMVFMLJGSMRF-UHFFFAOYSA-N 0.000 description 2
- HCUZVMHXDRSBKX-UHFFFAOYSA-N 2-decylpropanedioic acid Chemical compound CCCCCCCCCCC(C(O)=O)C(O)=O HCUZVMHXDRSBKX-UHFFFAOYSA-N 0.000 description 2
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 description 2
- WMRCTEPOPAZMMN-UHFFFAOYSA-N 2-undecylpropanedioic acid Chemical compound CCCCCCCCCCCC(C(O)=O)C(O)=O WMRCTEPOPAZMMN-UHFFFAOYSA-N 0.000 description 2
- NEQFBGHQPUXOFH-UHFFFAOYSA-N 4-(4-carboxyphenyl)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C=C1 NEQFBGHQPUXOFH-UHFFFAOYSA-N 0.000 description 2
- VTDMBRAUHKUOON-UHFFFAOYSA-N 4-[(4-carboxyphenyl)methyl]benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1CC1=CC=C(C(O)=O)C=C1 VTDMBRAUHKUOON-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 description 2
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical compound CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- 235000021314 Palmitic acid Nutrition 0.000 description 2
- 230000002292 Radical scavenging effect Effects 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- LJNQJJGMZWNULU-UHFFFAOYSA-N cyclodecane-1,1-dicarboxylic acid Chemical compound OC(=O)C1(C(O)=O)CCCCCCCCC1 LJNQJJGMZWNULU-UHFFFAOYSA-N 0.000 description 2
- WRJINBFZTQADKT-UHFFFAOYSA-N cycloheptane-1,1-dicarboxylic acid Chemical compound OC(=O)C1(C(O)=O)CCCCCC1 WRJINBFZTQADKT-UHFFFAOYSA-N 0.000 description 2
- XBZSBBLNHFMTEB-UHFFFAOYSA-N cyclohexane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCCC(C(O)=O)C1 XBZSBBLNHFMTEB-UHFFFAOYSA-N 0.000 description 2
- NZNMSOFKMUBTKW-UHFFFAOYSA-N cyclohexanecarboxylic acid Chemical compound OC(=O)C1CCCCC1 NZNMSOFKMUBTKW-UHFFFAOYSA-N 0.000 description 2
- RELFMIMPBVFVKQ-UHFFFAOYSA-N cyclooctane-1,1-dicarboxylic acid Chemical compound OC(=O)C1(C(O)=O)CCCCCCC1 RELFMIMPBVFVKQ-UHFFFAOYSA-N 0.000 description 2
- LNGJOYPCXLOTKL-UHFFFAOYSA-N cyclopentane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)C1 LNGJOYPCXLOTKL-UHFFFAOYSA-N 0.000 description 2
- JBDSSBMEKXHSJF-UHFFFAOYSA-N cyclopentanecarboxylic acid Chemical compound OC(=O)C1CCCC1 JBDSSBMEKXHSJF-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- GWZCCUDJHOGOSO-UHFFFAOYSA-N diphenic acid Chemical compound OC(=O)C1=CC=CC=C1C1=CC=CC=C1C(O)=O GWZCCUDJHOGOSO-UHFFFAOYSA-N 0.000 description 2
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000012765 fibrous filler Substances 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- KQNPFQTWMSNSAP-UHFFFAOYSA-N isobutyric acid Chemical compound CC(C)C(O)=O KQNPFQTWMSNSAP-UHFFFAOYSA-N 0.000 description 2
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 2
- 235000019341 magnesium sulphate Nutrition 0.000 description 2
- 238000010295 mobile communication Methods 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 2
- ABMFBCRYHDZLRD-UHFFFAOYSA-N naphthalene-1,4-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1 ABMFBCRYHDZLRD-UHFFFAOYSA-N 0.000 description 2
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 2
- WPUMVKJOWWJPRK-UHFFFAOYSA-N naphthalene-2,7-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=CC2=CC(C(=O)O)=CC=C21 WPUMVKJOWWJPRK-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 2
- 229960002446 octanoic acid Drugs 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- WLJVXDMOQOGPHL-UHFFFAOYSA-N phenylacetic acid Chemical compound OC(=O)CC1=CC=CC=C1 WLJVXDMOQOGPHL-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 235000019260 propionic acid Nutrition 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 2
- 229910052761 rare earth metal Inorganic materials 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 238000007873 sieving Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000004590 silicone sealant Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000012756 surface treatment agent Substances 0.000 description 2
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 2
- 150000003609 titanium compounds Chemical class 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 description 2
- 229940005605 valeric acid Drugs 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- VBICKXHEKHSIBG-UHFFFAOYSA-N 1-monostearoylglycerol Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 description 1
- LNETULKMXZVUST-UHFFFAOYSA-N 1-naphthoic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=CC2=C1 LNETULKMXZVUST-UHFFFAOYSA-N 0.000 description 1
- RUFPHBVGCFYCNW-UHFFFAOYSA-N 1-naphthylamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1 RUFPHBVGCFYCNW-UHFFFAOYSA-N 0.000 description 1
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- JCUZDQXWVYNXHD-UHFFFAOYSA-N 2,2,4-trimethylhexane-1,6-diamine Chemical compound NCCC(C)CC(C)(C)CN JCUZDQXWVYNXHD-UHFFFAOYSA-N 0.000 description 1
- WKRCUUPMCASSBN-UHFFFAOYSA-N 2,2-diethylbutanedioic acid Chemical compound CCC(CC)(C(O)=O)CC(O)=O WKRCUUPMCASSBN-UHFFFAOYSA-N 0.000 description 1
- VECYFPCPMVHUEN-UHFFFAOYSA-N 2,2-dimethylheptane-1,7-diamine Chemical compound NCC(C)(C)CCCCCN VECYFPCPMVHUEN-UHFFFAOYSA-N 0.000 description 1
- QPIDRHUVWIFOBW-UHFFFAOYSA-N 2,2-dimethylhexane-1,6-diamine Chemical compound NCC(C)(C)CCCCN QPIDRHUVWIFOBW-UHFFFAOYSA-N 0.000 description 1
- RMIUJCRSUIITNG-UHFFFAOYSA-N 2,3-dimethylbutane-1,4-diamine Chemical compound NCC(C)C(C)CN RMIUJCRSUIITNG-UHFFFAOYSA-N 0.000 description 1
- KEEWXLYVPARTPY-UHFFFAOYSA-N 2,3-dimethylheptane-1,7-diamine Chemical compound NCC(C)C(C)CCCCN KEEWXLYVPARTPY-UHFFFAOYSA-N 0.000 description 1
- DPQHRXRAZHNGRU-UHFFFAOYSA-N 2,4,4-trimethylhexane-1,6-diamine Chemical compound NCC(C)CC(C)(C)CCN DPQHRXRAZHNGRU-UHFFFAOYSA-N 0.000 description 1
- AHBYWKWAVAMOMN-UHFFFAOYSA-N 2,4-diethylhexane-1,6-diamine Chemical compound CCC(CN)CC(CC)CCN AHBYWKWAVAMOMN-UHFFFAOYSA-N 0.000 description 1
- UVCBXTALTSTYBM-UHFFFAOYSA-N 2,4-dimethylheptane-1,7-diamine Chemical compound NCC(C)CC(C)CCCN UVCBXTALTSTYBM-UHFFFAOYSA-N 0.000 description 1
- KSQSUDDRZLCKSW-UHFFFAOYSA-N 2,4-dimethylhexane-1,6-diamine Chemical compound NCC(C)CC(C)CCN KSQSUDDRZLCKSW-UHFFFAOYSA-N 0.000 description 1
- SQAPJTNHAUBTOP-UHFFFAOYSA-N 2,4-dimethyloctane-1,8-diamine Chemical compound NCC(C)CC(C)CCCCN SQAPJTNHAUBTOP-UHFFFAOYSA-N 0.000 description 1
- XGKKWUNSNDTGDS-UHFFFAOYSA-N 2,5-dimethylheptane-1,7-diamine Chemical compound NCC(C)CCC(C)CCN XGKKWUNSNDTGDS-UHFFFAOYSA-N 0.000 description 1
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- NWYDEWXSKCTWMJ-UHFFFAOYSA-N 2-methylcyclohexane-1,1-diamine Chemical compound CC1CCCCC1(N)N NWYDEWXSKCTWMJ-UHFFFAOYSA-N 0.000 description 1
- ZSPDYGICHBLYSD-UHFFFAOYSA-N 2-methylnaphthalene-1-carboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C)=CC=C21 ZSPDYGICHBLYSD-UHFFFAOYSA-N 0.000 description 1
- ACEKLXGWCBIDGA-UHFFFAOYSA-N 2-methylpentane-1,4-diamine Chemical compound CC(N)CC(C)CN ACEKLXGWCBIDGA-UHFFFAOYSA-N 0.000 description 1
- UOBYKYZJUGYBDK-UHFFFAOYSA-N 2-naphthoic acid Chemical compound C1=CC=CC2=CC(C(=O)O)=CC=C21 UOBYKYZJUGYBDK-UHFFFAOYSA-N 0.000 description 1
- OWRGRHKXXGTEHA-UHFFFAOYSA-N 3,3-dimethylhexane-1,6-diamine Chemical compound NCCC(C)(C)CCCN OWRGRHKXXGTEHA-UHFFFAOYSA-N 0.000 description 1
- WTXAAHKEBFFHIC-UHFFFAOYSA-N 3,3-dimethyloctane-1,8-diamine Chemical compound NCCC(C)(C)CCCCCN WTXAAHKEBFFHIC-UHFFFAOYSA-N 0.000 description 1
- NEIQVECNZQYVDC-UHFFFAOYSA-N 3,4-dimethyloctane-1,8-diamine Chemical compound NCCC(C)C(C)CCCCN NEIQVECNZQYVDC-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- FRWWUJNIGJTYJY-UHFFFAOYSA-N 3-methyloctane-1,8-diamine Chemical compound NCCC(C)CCCCCN FRWWUJNIGJTYJY-UHFFFAOYSA-N 0.000 description 1
- OLTBRQIRRDQOTO-UHFFFAOYSA-N 3-methylpentane-1,4-diamine Chemical compound CC(N)C(C)CCN OLTBRQIRRDQOTO-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- ULLJDGWZKSOING-UHFFFAOYSA-N 4,4-dimethyloctane-1,8-diamine Chemical compound NCCCC(C)(C)CCCCN ULLJDGWZKSOING-UHFFFAOYSA-N 0.000 description 1
- CPWPLIIHQWYLLH-UHFFFAOYSA-N 4,5-dimethyloctane-1,8-diamine Chemical compound NCCCC(C)C(C)CCCN CPWPLIIHQWYLLH-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- GUCABLZOWVOFSJ-UHFFFAOYSA-N 4-methyloctane-1,8-diamine Chemical compound NCCCC(C)CCCCN GUCABLZOWVOFSJ-UHFFFAOYSA-N 0.000 description 1
- WHLFXPIYRPOHGB-UHFFFAOYSA-N 4-methylpentane-1,4-diamine Chemical compound CC(C)(N)CCCN WHLFXPIYRPOHGB-UHFFFAOYSA-N 0.000 description 1
- MBRGOFWKNLPACT-UHFFFAOYSA-N 5-methylnonane-1,9-diamine Chemical compound NCCCCC(C)CCCCN MBRGOFWKNLPACT-UHFFFAOYSA-N 0.000 description 1
- XNQIUBJCXWNVIA-UHFFFAOYSA-N 6-methylnonane-1,8-diamine Chemical compound CC(N)CC(C)CCCCCN XNQIUBJCXWNVIA-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- XBPCUCUWBYBCDP-UHFFFAOYSA-N Dicyclohexylamine Chemical compound C1CCCCC1NC1CCCCC1 XBPCUCUWBYBCDP-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- DCXXMTOCNZCJGO-UHFFFAOYSA-N Glycerol trioctadecanoate Natural products CCCCCCCCCCCCCCCCCC(=O)OCC(OC(=O)CCCCCCCCCCCCCCCCC)COC(=O)CCCCCCCCCCCCCCCCC DCXXMTOCNZCJGO-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 238000012695 Interfacial polymerization Methods 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920003189 Nylon 4,6 Polymers 0.000 description 1
- QPTNVLKFMLEXEM-UHFFFAOYSA-N O.[Na].[PH2](=O)O Chemical compound O.[Na].[PH2](=O)O QPTNVLKFMLEXEM-UHFFFAOYSA-N 0.000 description 1
- REYJJPSVUYRZGE-UHFFFAOYSA-N Octadecylamine Chemical compound CCCCCCCCCCCCCCCCCCN REYJJPSVUYRZGE-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 239000004113 Sepiolite Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- ABPUBUORTRHHDZ-UHFFFAOYSA-N [4-(aminomethyl)-3-bicyclo[2.2.1]heptanyl]methanamine Chemical compound C1CC2(CN)C(CN)CC1C2 ABPUBUORTRHHDZ-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 229960000892 attapulgite Drugs 0.000 description 1
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000003484 crystal nucleating agent Substances 0.000 description 1
- 229920006039 crystalline polyamide Polymers 0.000 description 1
- VZFUCHSFHOYXIS-UHFFFAOYSA-N cycloheptane carboxylic acid Natural products OC(=O)C1CCCCCC1 VZFUCHSFHOYXIS-UHFFFAOYSA-N 0.000 description 1
- YMHQVDAATAEZLO-UHFFFAOYSA-N cyclohexane-1,1-diamine Chemical compound NC1(N)CCCCC1 YMHQVDAATAEZLO-UHFFFAOYSA-N 0.000 description 1
- QYQADNCHXSEGJT-UHFFFAOYSA-N cyclohexane-1,1-dicarboxylate;hydron Chemical compound OC(=O)C1(C(O)=O)CCCCC1 QYQADNCHXSEGJT-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- IJKVHSBPTUYDLN-UHFFFAOYSA-N dihydroxy(oxo)silane Chemical compound O[Si](O)=O IJKVHSBPTUYDLN-UHFFFAOYSA-N 0.000 description 1
- FSBVERYRVPGNGG-UHFFFAOYSA-N dimagnesium dioxido-bis[[oxido(oxo)silyl]oxy]silane hydrate Chemical compound O.[Mg+2].[Mg+2].[O-][Si](=O)O[Si]([O-])([O-])O[Si]([O-])=O FSBVERYRVPGNGG-UHFFFAOYSA-N 0.000 description 1
- OREAFAJWWJHCOT-UHFFFAOYSA-N dimethylmalonic acid Chemical compound OC(=O)C(C)(C)C(O)=O OREAFAJWWJHCOT-UHFFFAOYSA-N 0.000 description 1
- WEHWNAOGRSTTBQ-UHFFFAOYSA-N dipropylamine Chemical compound CCCNCCC WEHWNAOGRSTTBQ-UHFFFAOYSA-N 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- PWSKHLMYTZNYKO-UHFFFAOYSA-N heptane-1,7-diamine Chemical compound NCCCCCCCN PWSKHLMYTZNYKO-UHFFFAOYSA-N 0.000 description 1
- JVQUBHIPPUVHCN-UHFFFAOYSA-N hexane-1,2-diamine Chemical compound CCCCC(N)CN JVQUBHIPPUVHCN-UHFFFAOYSA-N 0.000 description 1
- HYQBVSXBLGKEDT-UHFFFAOYSA-N hexane-1,4-diamine Chemical compound CCC(N)CCCN HYQBVSXBLGKEDT-UHFFFAOYSA-N 0.000 description 1
- BBPXVYVXKAYBSS-UHFFFAOYSA-N hexane-2,5-diamine Chemical compound CC(N)CCC(C)N BBPXVYVXKAYBSS-UHFFFAOYSA-N 0.000 description 1
- DEIVNMVWRDMSMJ-UHFFFAOYSA-N hydrogen peroxide;oxotitanium Chemical compound OO.[Ti]=O DEIVNMVWRDMSMJ-UHFFFAOYSA-N 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
- 229960001545 hydrotalcite Drugs 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- VMPHSYLJUKZBJJ-UHFFFAOYSA-N lauric acid triglyceride Natural products CCCCCCCCCCCC(=O)OCC(OC(=O)CCCCCCCCCCC)COC(=O)CCCCCCCCCCC VMPHSYLJUKZBJJ-UHFFFAOYSA-N 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- DDLUSQPEQUJVOY-UHFFFAOYSA-N nonane-1,1-diamine Chemical compound CCCCCCCCC(N)N DDLUSQPEQUJVOY-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- ZWLPBLYKEWSWPD-UHFFFAOYSA-N o-toluic acid Chemical compound CC1=CC=CC=C1C(O)=O ZWLPBLYKEWSWPD-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052625 palygorskite Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229960003424 phenylacetic acid Drugs 0.000 description 1
- 239000003279 phenylacetic acid Substances 0.000 description 1
- XRBCRPZXSCBRTK-UHFFFAOYSA-N phosphonous acid Chemical compound OPO XRBCRPZXSCBRTK-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- IUGYQRQAERSCNH-UHFFFAOYSA-N pivalic acid Chemical compound CC(C)(C)C(O)=O IUGYQRQAERSCNH-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 229910052903 pyrophyllite Inorganic materials 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- 239000012488 sample solution Substances 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 229910052624 sepiolite Inorganic materials 0.000 description 1
- 235000019355 sepiolite Nutrition 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- KOUDKOMXLMXFKX-UHFFFAOYSA-N sodium oxido(oxo)phosphanium hydrate Chemical compound O.[Na+].[O-][PH+]=O KOUDKOMXLMXFKX-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- XQQWBPOEMYKKBY-UHFFFAOYSA-H trimagnesium;dicarbonate;dihydroxide Chemical compound [OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[O-]C([O-])=O.[O-]C([O-])=O XQQWBPOEMYKKBY-UHFFFAOYSA-H 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31725—Of polyamide
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Led Device Packages (AREA)
- Polyamides (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
そこで、本発明のLED用反射板は、上記本発明の反射板用ポリアミド組成物を用いたLED用反射板である。本発明のLED用反射板は、例えばバックライト光源、照明、自動車の各種ランプなどに用いられるLED用の反射板として好適に使用できる。特に、表面実装に対応したLED用の反射板として好適に使用できる。
そこで、本発明の発光装置は、上記本発明のLED用反射板を備えた発光装置である。本発明の発光装置の例としては、バックライト光源、照明用光源、自動車の各種ランプの光源などが挙げられる。
半導体発光素子10は、発光ピーク波長を500nm以下の波長領域に有するものを好適に使用できる。単一の発光ピークを有する半導体発光素子に限られず、複数の発光ピークを有する半導体発光素子を用いることもできる。尚、複数の発光ピークを有する場合には、500nmよりも長波長の領域に1つまたは2つ以上の発光ピークを有していてもよい。また、可視光の長波長領域(501nm〜780nm)に発光ピークを有する半導体発光素子も用いることができる。
パッケージは半導体発光素子10が搭載される部材であり、一部または全体が上述の本発明のLED用反射板により形成される。
封止部材40は半導体発光素子10を被覆するように形成される部材であり、主として外部環境から半導体発光素子10を保護する目的で備えられる。
本発明はまた、上記の発光装置を備えた照明装置である。本発明の照明装置は、上記の高寿命の発光装置を用いているため、高寿命となる。本発明の照明装置は、公知方法に準じて構成することができ、例えば、従来のLED照明装置において、LED照明用光源に用いられている従来の発光装置を、上記の発光装置に置き換える等により構成することができる。
本発明はまた、上記の発光装置を備えた画像表示装置(例、携帯電話などの移動通信機器の小型ディスプレイ、デジタルカメラ、デジタルビデオカメラなどの撮影機器の小型ディスプレイ、カーナビゲーションシステムの小型ディスプレイ、パソコン、液晶TVなどの中型/大型ディスプレイ等)である。本発明の画像表示装置は、上記の高寿命の発光装置を用いているため、高寿命となる。本発明の画像表示装置は、公知方法に準じて構成することができ、例えば、従来の画像表示装置において、LEDバックライト光源に用いられている従来の発光装置を、上記の発光装置に置き換える等により構成することができる。
後述するポリアミドから一部を試料として取り、濃硫酸中、30℃にて、0.05,0.1,0.2,0.4g/dlの濃度の試料の固有粘度(ηinh)を測定し、これを濃度0に外挿した値を極限粘度[η]とした。
ηinh=[ln(t1/t0)]/c
〔式中、ηinhは固有粘度(dl/g)を表し、t0は溶媒の流下時間(秒)を表し、t1は試料溶液の流下時間(秒)を表し、cは溶液中の試料の濃度(g/dl)を表す。〕
後述するポリアミドから一部を試料として取り、メトラー・トレド(株)製の示差走査熱量分析装置(DSC822)を使用して、試料約10mgを、窒素雰囲気下で、30℃から360℃へ10℃/分の速度で加熱し、360℃で2分保持して試料を完全に融解させた後、10℃/分の速度で30℃まで冷却し30℃で2分保持した。再び10℃/分の速度で360℃まで昇温した時に現れる融解ピークのピーク温度を融点とした。融解ピークが複数ある場合は最も高温側の融解ピークのピーク温度を融点とした。
各実施例および比較例で得られたポリアミド組成物を用い、ポリアミドの融点よりも約20℃高いシリンダー温度で射出成形(金型温度:140℃)を行い、厚さ1mm、幅40mm、長さ100mmの試験片を作製し、試験片の460nmの波長での反射率を株式会社日立製作所製スペクトロフォトメーター(U−4000)により求めた。
各実施例および比較例で得られたポリアミド組成物を用い、ポリアミドの融点よりも約20℃高いシリンダー温度で射出成形(金型温度:140℃)を行い、厚さ1mm、幅40mm、長さ100mmの試験片を作製した。この試験片を熱風乾燥機中で170℃で2時間加熱処理した。加熱処理後の試験片の460nmの波長での反射率を株式会社日立製作所製スペクトロフォトメーター(U−4000)により求めた。
各実施例および比較例で得られたポリアミド組成物を用い、ポリアミドの融点よりも約20℃高いシリンダー温度で射出成形(金型温度:140℃)を行い、厚さ1mm、幅40mm、長さ100mmの試験片を作製した。この試験片をKF−1フィルター(ダイプラ・ウィンテス株式会社製)を備えた耐光性試験装置(ダイプラ・ウィンテス株式会社製スーパーウィン・ミニ)の、上部石英ガラス面から25cmの距離に設置し、24時間の光照射を行った。なお、試験片を設置した位置での300〜400nmの波長における照度は10mW/cm2であった。光照射後の試験片の460nmの波長での反射率を株式会社日立製作所製スペクトロフォトメーター(U−4000)により求めた。
各実施例および比較例で得られたポリアミド組成物を用い、ポリアミドの融点よりも約20℃高いシリンダー温度で射出成形(金型温度:140℃)を行い、厚さ1mm、幅10mm、長さ30mmの試験片を作製した。この試験片を用いて、株式会社島津製作所製オートグラフを使用して、23℃における曲げ破断歪みおよびウェルド曲げ破断歪みを測定した。
各実施例および比較例で得られたポリアミド組成物を用い、ポリアミドの融点よりも約20℃高いシリンダー温度で射出成形(金型温度:140℃)を行い、厚さ1mm、幅10mm、長さ30mmの試験片を作製した。この試験片を用いて、表面粗さを株式会社小坂研究所製表面粗さ測定器により求めた。なお、この表面粗さは、封止部材と基板との密着性の指標となる。例えば、本発明の構成例として示すSMDタイプの発光装置では、封止剤としてシリコーン樹脂を使用する際には、反射板表面の凹凸が50nmから500μm程度が最適とされ、表面性の凹凸がない場合には、シリコーン樹脂が凹凸に入り込むことができず、アンカリングされないため密着性が悪くなる。また、表面の凹凸が大きすぎると、凹凸部に入り込んだシリコーン樹脂が十分に基板とにアンカリングできないことから密着性が悪くなる。測定結果より、凹凸の粗さが良好なものを「○」、凹凸の粗さが大すぎるものを「×」として表1に示した。
(ポリアミド(a−1−i))
特開平7−228689号公報の実施例1に記載された方法に従って調製した、テレフタル酸単位と、1,9−ノナンジアミン単位および2−メチル−1,8−オクタンジアミン単位(1,9−ノナンジアミン単位:2−メチル−1,8−オクタンジアミン単位のモル比が85:15)からなる、極限粘度[η](濃硫酸中、30℃で測定)が0.9dl/g、融点が306℃、末端封止率が77%(末端封止剤:安息香酸)であるポリアミドを使用した。
テレフタル酸4788.3g(28.8モル)、1,10−デカンジアミン5093.4g(29.6モル)、末端封止剤としての安息香酸143.7g(1.18モル)、次亜リン酸ナトリウム一水和物10g、および蒸留水2.5Lを、内容積40Lのオートクレーブに入れ、窒素置換した。2時間かけて内部温度を200℃に昇温した。この時、オートクレーブは2MPaまで昇圧した。その後2時間、内部温度を230℃に保ち、水蒸気を徐々に抜いて圧力を2MPaに保ちながら反応させた。次いで、30分かけて圧力を1.2MPaまで下げ、プレポリマーを得た。このプレポリマーを1mm以下の大きさまで粉砕し、120℃、減圧下で12時間乾燥した。これを240℃、13.3Paの条件で10時間固相重合し、極限粘度[η](濃硫酸中、30℃で測定)が0.93dl/g、融点が315℃であるポリアミドを得、これを使用した。
シス:トランス比が70:30の1,4−シクロヘキサンジカルボン酸5111.2g(29.7モル)、1,9−ノナンジアミン4117.6g(26.0モル)、2−メチル−1,8−オクタンジアミン726.6g(4.59モル)、末端封止剤としての安息香酸224.2g(1.84モル)、次亜リン酸ナトリウム一水和物10g、および蒸留水2.5Lを、内容積40Lのオートクレーブに入れ、窒素置換した。2時間かけて内部温度を200℃に昇温した。この時、オートクレーブは2MPaまで昇圧した。その後2時間、内部温度を215℃に保ち、水蒸気を徐々に抜いて圧力を2MPaに保ちながら反応させた。次いで、30分かけて圧力を1.2MPaまで下げ、プレポリマーを得た。このプレポリマーを1mm以下の大きさまで粉砕し、120℃、減圧下で12時間乾燥した。これを230℃、13.3Paの条件で10時間固相重合し、末端封止剤単位が4.3モル%、極限粘度[η](濃硫酸中、30℃で測定)が0.87dl/g、融点が315℃であるポリアミドを得、これを使用した。
石原産業(株)製、「タイペークCR−90」(二酸化チタン:平均粒径0.25μm)
日東紡績(株)社製、「CS3J256」(ガラス繊維:GF)
キンセイマテック(株)社製、「SH−1250」(ワラストナイト:WS)
クラリアントジャパン(株)社製、「ナイロスタブS−EED」(2−エチル−2−エトキシ−オキザルアニリド)
協和化学工業(株)社製、「MF−150」(酸化マグネシウム:平均粒径0.71μm)
ポリアミド(A)、酸化チタン(B)、強化材(C)、光安定剤(D)、酸化マグネシウム(E)および離型剤を、表1に示す配合量にて、ふるい選別機を用いてドライブレンドした。得られた混合物を、2軸スクリュー型押出機を用いて、用いるポリアミドの融点より20℃高い温度で溶融混練し、ペレット状に押出してポリアミド組成物を調製した。得られたポリアミド組成物を使用し、前記した方法に従って所定形状の試験片を作製し、各種物性を評価した。結果を表1に示す。
発光装置は、図1に示すSMDタイプの発光装置1の構成とした。発光素子10には460nmに発光ピーク波長を持つ青色に発光するものを用いた。封止部材40はシリコーン(信越化学株式会社製:商品名KER2500)を用いた。リフレクタ30は、自社製3228サイズのリフレクタを使用した。
比較例6は、リフレクタ30の材料を比較例3に示すポリアミド組成物へ変更して、実施例9と同様に図1に示すSMDタイプの発光装置を作製した。
実施例9および比較例6の発光装置を、85℃、15mAで1000時間通電試験を行い、0時間の光度に対する1000時間後の光度を求めることで光度保持率(1000時間の光度/0時間の光度)を測定した。なお、各実施例および比較例ごとに150個の発光装置の光度を測定し、その平均値を各実施例および比較例の光度とした。
Claims (13)
- 融点280℃以上のポリアミド(A)を30質量%以上および酸化チタン(B)を37.5質量%以上含み、かつ前記ポリアミド(A)と前記酸化チタン(B)の合計含有量が75質量%以上である反射板用ポリアミド組成物であって、前記ポリアミド(A)の50質量%以上を、粒径範囲1mm以下の固形物として用いて得られる、反射板用ポリアミド組成物。
- 前記ポリアミド(A)のジカルボン酸単位が、テレフタル酸単位を50モル%以上含む請求項1に記載の反射板用ポリアミド組成物。
- 前記ポリアミド(A)のジカルボン酸単位が、1,4−シクロヘキサンジカルボン酸単位を50モル%より多く含む請求項1に記載の反射板用ポリアミド組成物。
- 前記ポリアミド(A)のジアミン単位が、炭素数4〜18の脂肪族ジアミン単位を50モル%以上含む請求項1に記載の反射板用ポリアミド組成物。
- 前記炭素数4〜18の脂肪族ジアミン単位が、1,9−ノナンジアミン単位および/または2−メチル−1,8−オクタンジアミン単位である請求項4に記載の反射板用ポリアミド組成物。
- さらに15質量%以下の強化材(C)を含む請求項1に記載の反射板用ポリアミド組成物。
- 前記強化材(C)が、ガラス繊維および/またはワラストナイトである請求項6に記載の反射板用ポリアミド組成物。
- さらに酸化マグネシウムおよび/または水酸化マグネシウムを含む請求項1に記載の反射板用ポリアミド組成物。
- 請求項1に記載の反射板用ポリアミド組成物を用いたLED用反射板。
- 紫外線を24時間照射後に測定するスペクトロフォトメーターによる波長460nmの光の反射率が、85%以上である請求項9に記載のLED用反射板。
- 請求項9に記載のLED用反射板を備えた発光装置。
- 請求項11に記載の発光装置を備えた照明装置。
- 請求項11に記載の発光装置を備えた画像表示装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012107797A JP5079159B2 (ja) | 2011-01-28 | 2012-05-09 | 反射板用ポリアミド組成物、反射板、該反射板を備えた発光装置、ならびに該発光装置を備えた照明装置および画像表示装置 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011017078 | 2011-01-28 | ||
JP2011017078 | 2011-01-28 | ||
JP2012107797A JP5079159B2 (ja) | 2011-01-28 | 2012-05-09 | 反射板用ポリアミド組成物、反射板、該反射板を備えた発光装置、ならびに該発光装置を備えた照明装置および画像表示装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012521898A Division JP5079172B2 (ja) | 2011-01-28 | 2012-01-20 | 反射板用ポリアミド組成物、反射板、該反射板を備えた発光装置、ならびに該発光装置を備えた照明装置および画像表示装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012167284A JP2012167284A (ja) | 2012-09-06 |
JP5079159B2 true JP5079159B2 (ja) | 2012-11-21 |
Family
ID=46580574
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012521898A Active JP5079172B2 (ja) | 2011-01-28 | 2012-01-20 | 反射板用ポリアミド組成物、反射板、該反射板を備えた発光装置、ならびに該発光装置を備えた照明装置および画像表示装置 |
JP2012107798A Active JP5922986B2 (ja) | 2011-01-28 | 2012-05-09 | 反射板用ポリアミド組成物、反射板、該反射板を備えた発光装置、ならびに該発光装置を備えた照明装置および画像表示装置 |
JP2012107797A Active JP5079159B2 (ja) | 2011-01-28 | 2012-05-09 | 反射板用ポリアミド組成物、反射板、該反射板を備えた発光装置、ならびに該発光装置を備えた照明装置および画像表示装置 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012521898A Active JP5079172B2 (ja) | 2011-01-28 | 2012-01-20 | 反射板用ポリアミド組成物、反射板、該反射板を備えた発光装置、ならびに該発光装置を備えた照明装置および画像表示装置 |
JP2012107798A Active JP5922986B2 (ja) | 2011-01-28 | 2012-05-09 | 反射板用ポリアミド組成物、反射板、該反射板を備えた発光装置、ならびに該発光装置を備えた照明装置および画像表示装置 |
Country Status (7)
Country | Link |
---|---|
US (3) | US9822949B2 (ja) |
EP (3) | EP2644656B1 (ja) |
JP (3) | JP5079172B2 (ja) |
KR (3) | KR101324739B1 (ja) |
CN (3) | CN103328573B (ja) |
TW (3) | TWI583720B (ja) |
WO (1) | WO2012101997A1 (ja) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2644656B1 (en) * | 2011-01-28 | 2020-09-09 | Kuraray Co., Ltd. | Polyamide composition for reflector, reflector, light emitting device including the reflector, and lighting device and image display device each including the light emitting device |
FR2976946B1 (fr) | 2011-06-24 | 2014-01-24 | Arkema France | Composition comprenant un polyamide semi-aromatique et ses utilisations, notamment pour un reflecteur a diode electroluminescente |
KR101950539B1 (ko) * | 2011-08-19 | 2019-02-20 | 솔베이 스페셜티 폴리머즈 유에스에이, 엘.엘.씨. | Led 적용을 위한 향상된 폴리아미드 조성물 |
CN104471732B (zh) | 2012-06-04 | 2018-02-09 | 日本优必佳株式会社 | Led反射板用结晶性不饱和聚酯树脂组合物、包含前述组合物的粒状物、成型前述粒状物而成的led反射板、表面安装型发光装置以及具备该发光装置的照明装置及图像显示装置 |
JP6247905B2 (ja) * | 2012-11-12 | 2017-12-13 | 株式会社クラレ | ポリアミド樹脂組成物 |
EP2738203B1 (en) * | 2012-11-29 | 2018-04-18 | Solvay Specialty Polymers USA, LLC. | Polyester compositions with improved heat and light aging |
JP6613473B2 (ja) * | 2013-01-30 | 2019-12-04 | ディーエスエム アイピー アセッツ ビー.ブイ. | ポリアミドの調製プロセス |
WO2014129364A1 (ja) * | 2013-02-19 | 2014-08-28 | ユニチカ株式会社 | 半芳香族ポリアミド樹脂組成物 |
JP2014231603A (ja) * | 2013-04-30 | 2014-12-11 | 旭化成ケミカルズ株式会社 | ポリアミド樹脂組成物及び成形品 |
DE102013214896B4 (de) * | 2013-07-30 | 2021-09-09 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zum Herstellen eines Konverterelements und eines optoelektronischen Bauelements, Konverterelement und optoelektronisches Bauelement |
JP6383604B2 (ja) * | 2013-08-16 | 2018-08-29 | 旭化成株式会社 | 反射板用ポリアミド樹脂組成物、及び反射板 |
JP6241724B2 (ja) * | 2013-10-11 | 2017-12-06 | パナソニックIpマネジメント株式会社 | 光反射体用成形材料、光反射体及び照明器具 |
JP6461549B2 (ja) * | 2013-10-16 | 2019-01-30 | ユニチカ株式会社 | ポリアミド樹脂組成物およびそれを用いたレンズユニット用部品 |
KR20150062709A (ko) * | 2013-11-29 | 2015-06-08 | 제일모직주식회사 | 광안정성 및 내변색특성이 우수한 열가소성 수지 조성물 |
EP3083828B1 (en) * | 2013-12-20 | 2017-09-20 | Solvay Specialty Polymers USA, L.L.C. | Polyester compositions with improved whiteness |
CN104610739B (zh) * | 2015-01-21 | 2017-09-15 | 金发科技股份有限公司 | 一种反射板用聚酰胺组合物 |
DE202015006175U1 (de) | 2015-04-22 | 2015-10-19 | Gerhardi Kunststofftechnik Gmbh | Galvanisch dekoriertes Zierelement mit Konturlicht |
JP6570305B2 (ja) * | 2015-05-12 | 2019-09-04 | 三菱電機株式会社 | 表示装置 |
KR102430122B1 (ko) | 2015-06-29 | 2022-08-05 | 주식회사 쿠라레 | Led 반사판용 폴리아미드 조성물, led 반사판, 그 반사판을 구비한 발광 장치 |
WO2017002824A1 (ja) * | 2015-06-29 | 2017-01-05 | 株式会社クラレ | Led反射板用ポリアミド組成物、led反射板、該反射板を備えた発光装置 |
US10862014B2 (en) * | 2015-11-12 | 2020-12-08 | Advanced Semiconductor Engineering, Inc. | Optical device package and method of manufacturing the same |
KR102615918B1 (ko) * | 2017-09-25 | 2023-12-19 | 도요보 엠씨 가부시키가이샤 | 반방향족 폴리아미드 수지 조성물을 포함하는 성형품을 구성 성분으로서 갖는 성형체 |
JP7217233B2 (ja) * | 2017-10-30 | 2023-02-02 | 株式会社クラレ | 防水部品およびそれを備えた電子機器、インサート成形体の防水方法ならびに電子機器の防水方法 |
JP7260399B2 (ja) * | 2019-05-27 | 2023-04-18 | 帝人株式会社 | 半芳香族ポリアミド樹脂組成物及びその成形品 |
JP2021176136A (ja) * | 2020-05-01 | 2021-11-04 | 株式会社小糸製作所 | ブラケット部材 |
CN115838532B (zh) * | 2021-09-18 | 2024-03-01 | 珠海万通特种工程塑料有限公司 | 一种pa10t模塑复合材料及其制备方法和应用 |
CN113929901B (zh) * | 2021-10-25 | 2024-03-29 | 珠海万通特种工程塑料有限公司 | 一种聚酰胺树脂、其组合物及制备方法 |
CN115260758B (zh) * | 2022-08-24 | 2024-01-09 | 横店集团得邦工程塑料有限公司 | 一种高反射率耐热老化pa10t材料及其制备方法 |
Family Cites Families (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3839246A (en) * | 1973-08-09 | 1974-10-01 | Gen Electric | Two-part room temperature vulcanizable systems |
US4021415A (en) * | 1974-02-14 | 1977-05-03 | Chang William J H | Nitrile containing aromatic polyamide polymers |
EP0001322B1 (en) * | 1977-08-30 | 1981-10-21 | Imperial Chemical Industries Plc | Fire retardant polyamide composition |
US4923909A (en) * | 1985-09-03 | 1990-05-08 | The B. F. Goodrich Company | Method for the suspension of plastic additives with rheology agents |
JP3273688B2 (ja) | 1993-12-24 | 2002-04-08 | 株式会社クラレ | ポリアミド |
CA2137477C (en) | 1993-12-24 | 2002-05-07 | Hideaki Oka | Polyamide and polyamide composition |
JP3242781B2 (ja) | 1994-02-16 | 2001-12-25 | 株式会社クラレ | ポリアミド樹脂 |
US6207745B1 (en) * | 1998-02-04 | 2001-03-27 | Bp Amoco Corporation | Flame retardant anti-drip polyamide compositions |
JP4179703B2 (ja) * | 1998-07-30 | 2008-11-12 | 株式会社クラレ | ポリアミドの製造方法 |
SG87882A1 (en) * | 1999-01-29 | 2002-04-16 | Kuraray Co | Polyamide composition |
US6656589B2 (en) * | 2000-12-20 | 2003-12-02 | Mitsui Chemicals, Inc. | Polyamide resin pellet for a miniature part |
JP4892140B2 (ja) | 2001-03-30 | 2012-03-07 | 大塚化学株式会社 | Led反射板用樹脂組成物 |
CA2386717A1 (en) * | 2001-05-21 | 2002-11-21 | Kuraray Co., Ltd. | Polyamide composition |
JP2002374007A (ja) * | 2001-06-15 | 2002-12-26 | Toyoda Gosei Co Ltd | 発光装置 |
JP4117130B2 (ja) * | 2001-12-26 | 2008-07-16 | 大塚化学ホールディングス株式会社 | 紫外線発生源用反射板材料 |
WO2003085029A1 (fr) * | 2002-04-05 | 2003-10-16 | Mitsui Chemicals, Inc. | Composition de resine pour reflecteurs a diodes electroluminescentes |
CA2432522C (en) | 2002-06-21 | 2010-09-21 | Hideaki Oka | Polyamide composition |
JP2004075994A (ja) | 2002-06-21 | 2004-03-11 | Kuraray Co Ltd | ポリアミド組成物 |
ATE384338T1 (de) * | 2002-10-15 | 2008-02-15 | Solvay Advanced Polymers Llc | Anti-vergilbungs- polykondensationspolymerzusammensetzungen und gegenstände |
DE10308226A1 (de) * | 2003-02-25 | 2004-09-23 | Degussa Ag | Transparente Formmasse für optische Anwendungen |
US7354877B2 (en) * | 2003-10-29 | 2008-04-08 | Lockheed Martin Corporation | Carbon nanotube fabrics |
JP2005194513A (ja) | 2003-12-09 | 2005-07-21 | Mitsui Chemicals Inc | 反射板用樹脂組成物および反射板 |
US20070161741A1 (en) | 2003-12-09 | 2007-07-12 | Mitsui Chemicals, Inc. | Resin composition for reflector plate and reflector plate |
JP2006002113A (ja) | 2004-06-21 | 2006-01-05 | Kuraray Co Ltd | ポリアミド樹脂組成物およびその成形品 |
DE202004018390U1 (de) | 2004-11-27 | 2005-02-17 | Degussa Ag | Thermoplastische Kunststoffpulverformulierung für Beschichtungen mit einem metallischen, insbesondere edelstahlähnlichen Farbeindruck |
JP4525917B2 (ja) | 2005-03-18 | 2010-08-18 | 株式会社クラレ | Ledリフレクタ成形用ポリアミド樹脂組成物およびledリフレクタ |
CN101155878B (zh) * | 2005-04-15 | 2011-12-07 | 三井化学株式会社 | 反射板用树脂组合物及反射板 |
PT1767572E (pt) * | 2005-09-21 | 2010-02-25 | Raschig Gmbh | Formulações contendo estabilizadores contra a hidrólise |
KR100959636B1 (ko) | 2005-09-30 | 2010-05-26 | 니치아 카가쿠 고교 가부시키가이샤 | 발광장치 및 그것을 이용한 백라이트 유닛 |
US20090029138A1 (en) * | 2005-11-15 | 2009-01-29 | Takaaki Miyoshi | Resin Composition Having Excellent Heat Resistance |
JP5352087B2 (ja) * | 2005-12-26 | 2013-11-27 | 株式会社フジシールインターナショナル | シュリンクラベル |
JP2007218980A (ja) * | 2006-02-14 | 2007-08-30 | Idemitsu Kosan Co Ltd | 反射体及びその製造方法 |
EP2027602A4 (en) * | 2006-05-23 | 2012-11-28 | Cree Inc | LIGHTING DEVICE AND METHOD OF MAKING |
JP2008182172A (ja) * | 2006-12-27 | 2008-08-07 | Toyoda Gosei Co Ltd | Led反射板用樹脂組成物 |
JP5639326B2 (ja) * | 2007-03-29 | 2014-12-10 | 三井化学株式会社 | ポリアミドの製造方法 |
CN101679744B (zh) * | 2007-06-04 | 2013-09-25 | 旭化成化学株式会社 | 聚酰胺-聚苯醚树脂组合物和膜 |
CN101970535B (zh) * | 2008-03-12 | 2015-05-27 | 旭化成化学株式会社 | 聚酰胺、聚酰胺组合物及聚酰胺的制造方法 |
JP5599561B2 (ja) | 2008-07-22 | 2014-10-01 | 日立化成株式会社 | 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置 |
JP2010080793A (ja) * | 2008-09-26 | 2010-04-08 | Toyoda Gosei Co Ltd | 光反射部材及び発光装置 |
CN102639638A (zh) * | 2008-12-24 | 2012-08-15 | 第一毛织株式会社 | 尼龙类合金树脂组合物及其led(发光二极管)反射器 |
JP5221423B2 (ja) | 2009-03-11 | 2013-06-26 | 株式会社クラレ | ポリアミド組成物の製造方法、ポリアミド組成物およびポリアミド組成物からなる成形品 |
WO2011027562A1 (ja) * | 2009-09-07 | 2011-03-10 | 株式会社クラレ | Led用反射板およびそれを備える発光装置 |
EP2477243B1 (en) * | 2009-09-11 | 2016-01-06 | Asahi Kasei Chemicals Corporation | Reflector for light-emitting device, and light-emitting device |
JP5714834B2 (ja) * | 2010-04-14 | 2015-05-07 | 旭化成ケミカルズ株式会社 | ポリアミド組成物及びポリアミド組成物からなる成形体 |
KR101212917B1 (ko) | 2010-08-27 | 2012-12-14 | 도요보 가부시키가이샤 | 표면 실장형 led용 반사판에 사용하는 폴리아미드 수지 조성물 |
US20120165448A1 (en) | 2010-12-28 | 2012-06-28 | Cheil Industries Inc. | Polyamide Resin Composition |
KR101368315B1 (ko) * | 2010-12-31 | 2014-02-27 | 제일모직주식회사 | 밀드 피치계 탄소섬유를 포함하는 고열전도성 수지 조성물 |
EP2644656B1 (en) * | 2011-01-28 | 2020-09-09 | Kuraray Co., Ltd. | Polyamide composition for reflector, reflector, light emitting device including the reflector, and lighting device and image display device each including the light emitting device |
FR2976946B1 (fr) * | 2011-06-24 | 2014-01-24 | Arkema France | Composition comprenant un polyamide semi-aromatique et ses utilisations, notamment pour un reflecteur a diode electroluminescente |
-
2012
- 2012-01-20 EP EP12739656.2A patent/EP2644656B1/en active Active
- 2012-01-20 EP EP13174567.1A patent/EP2647670B1/en active Active
- 2012-01-20 KR KR1020137021702A patent/KR101324739B1/ko active IP Right Grant
- 2012-01-20 KR KR1020137021875A patent/KR101324741B1/ko active IP Right Grant
- 2012-01-20 CN CN201280006652.5A patent/CN103328573B/zh active Active
- 2012-01-20 US US13/989,952 patent/US9822949B2/en active Active
- 2012-01-20 KR KR1020137021877A patent/KR101830614B1/ko active IP Right Grant
- 2012-01-20 EP EP13174581.2A patent/EP2647671B1/en active Active
- 2012-01-20 CN CN201310380779.XA patent/CN103408930B/zh active Active
- 2012-01-20 JP JP2012521898A patent/JP5079172B2/ja active Active
- 2012-01-20 CN CN201310380694.1A patent/CN103396665B/zh active Active
- 2012-01-20 WO PCT/JP2012/000358 patent/WO2012101997A1/ja active Application Filing
- 2012-01-30 TW TW102118606A patent/TWI583720B/zh active
- 2012-01-30 TW TW102118607A patent/TWI570154B/zh active
- 2012-01-30 TW TW101102758A patent/TWI549988B/zh active
- 2012-05-09 JP JP2012107798A patent/JP5922986B2/ja active Active
- 2012-05-09 JP JP2012107797A patent/JP5079159B2/ja active Active
-
2013
- 2013-07-01 US US13/932,809 patent/US10480749B2/en active Active
- 2013-07-01 US US13/932,760 patent/US10407548B2/en active Active
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5079159B2 (ja) | 反射板用ポリアミド組成物、反射板、該反射板を備えた発光装置、ならびに該発光装置を備えた照明装置および画像表示装置 | |
JP5687626B2 (ja) | Led用反射板およびそれを備える発光装置 | |
KR102421217B1 (ko) | Led 반사판용 폴리아미드 조성물, led 반사판, 그 반사판을 구비한 발광 장치 | |
KR102430122B1 (ko) | Led 반사판용 폴리아미드 조성물, led 반사판, 그 반사판을 구비한 발광 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20120629 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120703 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120724 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120828 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120828 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150907 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5079159 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |