JP4974284B2 - パッケージの封止方法 - Google Patents
パッケージの封止方法 Download PDFInfo
- Publication number
- JP4974284B2 JP4974284B2 JP2007143223A JP2007143223A JP4974284B2 JP 4974284 B2 JP4974284 B2 JP 4974284B2 JP 2007143223 A JP2007143223 A JP 2007143223A JP 2007143223 A JP2007143223 A JP 2007143223A JP 4974284 B2 JP4974284 B2 JP 4974284B2
- Authority
- JP
- Japan
- Prior art keywords
- lid
- seam
- package
- roller electrode
- joining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 28
- 238000007789 sealing Methods 0.000 title claims description 21
- 238000005304 joining Methods 0.000 claims description 20
- 238000005096 rolling process Methods 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 description 18
- 238000005219 brazing Methods 0.000 description 12
- 238000007747 plating Methods 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 229910015363 Au—Sn Inorganic materials 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 229910000833 kovar Inorganic materials 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 229910017944 Ag—Cu Inorganic materials 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000010897 surface acoustic wave method Methods 0.000 description 2
- 238000005253 cladding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000010349 pulsation Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
2、57、64、67、68 リッド
3a、3b、58a、58b ローラ電極
4 母材
5 ろう材
52 シールリング
53 パッケージ
54 電子部品
55 ワイヤ
56 外リード
59 ステージ
Claims (3)
- 電子部品を収納するパッケージの開口部に矩形のリッドを載置し、このリッドの対向する2辺に一対のローラ電極を転接させつつ両電極間に通電し、前記2辺をパッケージにシーム接合するパッケージの封止方法において、一方の対向する2辺をシーム接合する第1の接合動作の後他方の対向する2辺をシーム接合する第2の接合動作を行い、前記第2の接合動作における通電が終了した後ローラ電極でのリッドへの押圧を一定時間維持し、前記第1の接合動作で接合された接合部の再溶融が凝固した後に前記ローラ電極を前記リッドから離間させることを特徴とするパッケージの封止方法。
- 前記一定時間維持する押圧は、ローラ電極の回転軸中心線の延長が上方から見て前記リッドの外縁よりも外側に位置した状態で行なわれることを特徴とする請求項1に記載のパッケージの封止方法。
- 第2の接合動作において、ローラ電極でのリッドへの押圧を一定時間維持した後、ローラ電極を前記第2の接合動作と反対の方向に微小距離転接させ、その後リッドから離間させることを特徴とする請求項1または請求項2のいずれかに記載のパッケージの封止方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007143223A JP4974284B2 (ja) | 2007-05-30 | 2007-05-30 | パッケージの封止方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007143223A JP4974284B2 (ja) | 2007-05-30 | 2007-05-30 | パッケージの封止方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008300497A JP2008300497A (ja) | 2008-12-11 |
JP4974284B2 true JP4974284B2 (ja) | 2012-07-11 |
Family
ID=40173749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007143223A Active JP4974284B2 (ja) | 2007-05-30 | 2007-05-30 | パッケージの封止方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4974284B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011060400A (ja) * | 2009-09-14 | 2011-03-24 | Nippon Avionics Co Ltd | 磁気ディスク装置の製造方法 |
JP6133685B2 (ja) * | 2013-05-17 | 2017-05-24 | 日本アビオニクス株式会社 | シーム溶接装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3194208B2 (ja) * | 1993-01-27 | 2001-07-30 | 日本アビオニクス株式会社 | シーム接合法 |
JP3757896B2 (ja) * | 2002-04-17 | 2006-03-22 | 株式会社大真空 | シーム溶接装置及びシーム溶接方法 |
JP2004179332A (ja) * | 2002-11-26 | 2004-06-24 | Kyocera Corp | 電子装置 |
JP4159531B2 (ja) * | 2004-10-15 | 2008-10-01 | 日本アビオニクス株式会社 | パッケージの封止方法 |
-
2007
- 2007-05-30 JP JP2007143223A patent/JP4974284B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2008300497A (ja) | 2008-12-11 |
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