JP4973633B2 - ハンダボール印刷装置 - Google Patents
ハンダボール印刷装置 Download PDFInfo
- Publication number
- JP4973633B2 JP4973633B2 JP2008243680A JP2008243680A JP4973633B2 JP 4973633 B2 JP4973633 B2 JP 4973633B2 JP 2008243680 A JP2008243680 A JP 2008243680A JP 2008243680 A JP2008243680 A JP 2008243680A JP 4973633 B2 JP4973633 B2 JP 4973633B2
- Authority
- JP
- Japan
- Prior art keywords
- solder ball
- supply head
- solder
- filling member
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01016—Sulfur [S]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0557—Non-printed masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
以上、大まかなハンダボールの印刷の工程を述べたが、リペア部やリフロー部に関しては前述の装置とは別装置となるので、詳細な説明はしていない。
Claims (4)
- 基板のフラックスの印刷された電極パッド上にハンダボール供給ヘッドからハンダボールを供給して印刷を行うハンダボール印刷機において、
前記ハンダボール供給ヘッドが、ハンダボールを貯留するハンダボール貯留部と、
ハンダボール貯留部から所定量のハンダボールをマスク面に供給するためのシブ状体と、
前記ハンダボール供給ヘッドの進行方向に対して傾斜を有する半らせん状の線材で形成されたハンダボール充填部材とを備え、
前記ハンダボール充填部材は、前記シブ状体の下部に設けられ前記シブ状体から供給されたハンダボールをマスク面の開口部に供給するものと、前記ハンダボール供給ヘッドの移動方向で前記ハンダボール貯留部の前後に余分なハンダボールを掻き取るためのものとを含み、
さらに、前記ハンダボール貯留部又はハンダボール充填部材を前記ハンダボール供給ヘッドの移動方向に加振する水平方向加振器を前記ハンダボール供給ヘッドに設けた構成としたことを特徴とするハンダボール印刷機。 - 請求項1に記載のハンダボール印刷機において、
前記ハンダボール供給ヘッドを上下移動するヘッド上下駆動機構を備え、前記ヘッド上下駆動機構でハンダボール供給ヘッドに設けたハンダボール充填部材をマスク面に押付る押付力を作用させることで、前記ハンダボール充填部材を構成する線材をハンダボール供給ヘッドの移動方向に対して所定の角度で接触させることを特徴とするハンダボール印刷機。 - 請求項1に記載のハンダボール印刷機において、
前記シブ状体及びハンダボール充填部材が、厚さ0.05〜0.1mmの鋼板を用いて、0.1mm間隔に幅0.1mmで約5度〜35度の傾斜で充填部材取付部を除いてエッチング加工することで複数の線材を形成したことを特徴とするハンダボール印刷機。 - 請求項3に記載のハンダボール印刷機において、
前記ハンダボール供給ヘッドに設けた複数のハンダボール充填部材の線材の傾斜方向を互いに逆方向になるように設けてあることを特徴とするハンダボール印刷機。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008243680A JP4973633B2 (ja) | 2008-09-24 | 2008-09-24 | ハンダボール印刷装置 |
US12/543,585 US7896223B2 (en) | 2008-09-24 | 2009-08-19 | Solder ball printing apparatus |
TW098130588A TWI460800B (zh) | 2008-09-24 | 2009-09-10 | Solder ball printing device |
CN2009101691699A CN101685770B (zh) | 2008-09-24 | 2009-09-11 | 焊球印刷装置 |
KR1020090086281A KR101086376B1 (ko) | 2008-09-24 | 2009-09-14 | 땜납볼 인쇄장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008243680A JP4973633B2 (ja) | 2008-09-24 | 2008-09-24 | ハンダボール印刷装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010080468A JP2010080468A (ja) | 2010-04-08 |
JP4973633B2 true JP4973633B2 (ja) | 2012-07-11 |
Family
ID=42036614
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008243680A Expired - Fee Related JP4973633B2 (ja) | 2008-09-24 | 2008-09-24 | ハンダボール印刷装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7896223B2 (ja) |
JP (1) | JP4973633B2 (ja) |
KR (1) | KR101086376B1 (ja) |
CN (1) | CN101685770B (ja) |
TW (1) | TWI460800B (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5018062B2 (ja) * | 2006-12-15 | 2012-09-05 | 株式会社日立プラントテクノロジー | ハンダボール印刷装置 |
JP5141521B2 (ja) * | 2008-12-03 | 2013-02-13 | 株式会社日立プラントテクノロジー | ハンダボール印刷機 |
JP2010225680A (ja) * | 2009-03-19 | 2010-10-07 | Panasonic Corp | 半田ボール搭載装置及び半田ボール搭載方法 |
JP5206572B2 (ja) * | 2009-04-23 | 2013-06-12 | 株式会社日立プラントテクノロジー | ハンダボール印刷装置 |
JP5251699B2 (ja) * | 2009-04-23 | 2013-07-31 | 株式会社日立プラントテクノロジー | ハンダボール印刷装置およびハンダボール印刷方法 |
JP5808229B2 (ja) * | 2011-11-14 | 2015-11-10 | 株式会社日立製作所 | ハンダボール印刷機 |
JP2014011231A (ja) * | 2012-06-28 | 2014-01-20 | Hitachi Ltd | ハンダボール印刷搭載装置 |
JP6109609B2 (ja) | 2013-03-14 | 2017-04-05 | Aiメカテック株式会社 | ハンダボール印刷機およびハンダボール印刷方法 |
KR101475886B1 (ko) * | 2013-05-06 | 2014-12-23 | (주) 에스에스피 | 볼 공급장치 및 이를 이용한 솔더볼 범핑 방법 |
KR102082792B1 (ko) * | 2018-01-09 | 2020-02-28 | 주식회사 코세스 | 미리 정해진 패턴으로 분포된 다수의 수용부에 솔더볼을 안착시키는 솔더볼 처리 장치 |
KR102467030B1 (ko) | 2018-01-17 | 2022-11-14 | 삼성전자주식회사 | 반도체 패키지 및 그 패키지를 포함한 반도체 장치 |
JP7279978B2 (ja) * | 2020-11-26 | 2023-05-23 | Aiメカテック株式会社 | 検査・リペア装置 |
JP7072919B2 (ja) * | 2020-11-26 | 2022-05-23 | Aiメカテック株式会社 | 基板処理装置 |
CN113766823B (zh) * | 2021-09-10 | 2023-06-02 | 上海无线电设备研究所 | 一种基于smt返修台的bga植球装置及方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3440243B2 (ja) * | 2000-09-26 | 2003-08-25 | 株式会社アドバンストシステムズジャパン | スパイラルコンタクタ |
JP4186541B2 (ja) | 2002-07-29 | 2008-11-26 | 富士ゼロックス株式会社 | 画像処理装置 |
JP3770496B2 (ja) * | 2003-03-10 | 2006-04-26 | 日立金属株式会社 | 導電性ボールの搭載方法および搭載装置 |
CN1233029C (zh) * | 2003-04-11 | 2005-12-21 | 华中科技大学 | 焊球植入装置 |
JP2005343593A (ja) | 2004-06-01 | 2005-12-15 | Hitachi Ltd | エレベーター装置 |
TWI273666B (en) * | 2004-06-30 | 2007-02-11 | Athlete Fa Corp | Method and device for mounting conductive ball |
CN102413643A (zh) * | 2004-08-04 | 2012-04-11 | 揖斐电株式会社 | 焊球搭载方法及焊球搭载装置 |
JP4557821B2 (ja) * | 2005-06-30 | 2010-10-06 | アスリートFa株式会社 | 微小粒子の配置装置および方法 |
JP5018062B2 (ja) * | 2006-12-15 | 2012-09-05 | 株式会社日立プラントテクノロジー | ハンダボール印刷装置 |
JP4892372B2 (ja) * | 2007-02-21 | 2012-03-07 | 新光電気工業株式会社 | 導電性ボール載置装置及び導電性ボールの載置方法 |
-
2008
- 2008-09-24 JP JP2008243680A patent/JP4973633B2/ja not_active Expired - Fee Related
-
2009
- 2009-08-19 US US12/543,585 patent/US7896223B2/en not_active Expired - Fee Related
- 2009-09-10 TW TW098130588A patent/TWI460800B/zh not_active IP Right Cessation
- 2009-09-11 CN CN2009101691699A patent/CN101685770B/zh not_active Expired - Fee Related
- 2009-09-14 KR KR1020090086281A patent/KR101086376B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW201030868A (en) | 2010-08-16 |
CN101685770B (zh) | 2011-10-26 |
TWI460800B (zh) | 2014-11-11 |
US20100072259A1 (en) | 2010-03-25 |
KR101086376B1 (ko) | 2011-11-23 |
JP2010080468A (ja) | 2010-04-08 |
CN101685770A (zh) | 2010-03-31 |
KR20100034697A (ko) | 2010-04-01 |
US7896223B2 (en) | 2011-03-01 |
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