JP4949362B2 - 発光装置及びこれを具備するバックライトユニット - Google Patents
発光装置及びこれを具備するバックライトユニット Download PDFInfo
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- JP4949362B2 JP4949362B2 JP2008311349A JP2008311349A JP4949362B2 JP 4949362 B2 JP4949362 B2 JP 4949362B2 JP 2008311349 A JP2008311349 A JP 2008311349A JP 2008311349 A JP2008311349 A JP 2008311349A JP 4949362 B2 JP4949362 B2 JP 4949362B2
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- 239000011347 resin Substances 0.000 claims description 41
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 26
- 239000000843 powder Substances 0.000 claims description 17
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 5
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- 238000010292 electrical insulation Methods 0.000 claims description 5
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45139—Silver (Ag) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S362/00—Illumination
- Y10S362/80—Light emitting diode
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Planar Illumination Modules (AREA)
Description
101a 第1電極
101b 第2電極
102 蛍光体層
103 パッケージ本体
104 外部端子用ブロック
104a 接続部
104b 絶縁性ブロック体
105a、105b ワイヤ
406 樹脂層
601 導光板
Claims (16)
- 互いに反対に位置した第1主面及び第2主面とその間に位置した複数の側面からなる構造を有する硬化性樹脂からなるパッケージ本体と、
互いに反対に位置し、各々前記パッケージ本体の第1主面及び第2主面側に形成された第1面及び第2面とその間に位置した側面からなる構造を有し、前記パッケージ本体の内部の両端に各々配置され、各々前記パッケージ本体の内部に位置したボンディング領域と、それに接続して外部に露出した端子領域を有する接続部を具備した第1外部端子用ブロック及び第2外部端子用ブロックと、
第1電極及び第2電極が形成された電極形成面と、これと反対に位置した光放出面を具備するが、前記パッケージ本体の内部において前記第1外部端子用ブロック及び前記第2外部端子用ブロックの間に配置され、前記第1電極及び前記第2電極が各々前記第1外部端子用ブロック及び前記第2外部端子用ブロックのボンディング領域に電気的に接続された発光ダイオードチップと、
前記外部端子用ブロックの第1面を覆うように形成された樹脂層と、
を含み、
前記パッケージ本体の第1主面及び前記発光ダイオードチップの光放出面が、前記外部端子用ブロックの第1面から外部に突出するように形成されたことを特徴とする発光装置。 - 前記発光ダイオードチップの光放出面は、前記パッケージ本体の第1主面と相互共面を成すことを特徴とする請求項1に記載の発光装置。
- 前記発光ダイオードチップの光放出面に形成された蛍光体層をさらに含み、前記蛍光体層の外部面と前記パッケージ本体の第1主面は相互共面を成すことを特徴とする請求項1に記載の発光装置。
- 前記パッケージ本体の第1主面に形成された蛍光体層をさらに含むことを特徴とする請求項1に記載の発光装置。
- 前記発光ダイオードチップは、青色光を放出することを特徴とする請求項3または4に記載の発光装置。
- 前記パッケージ本体を構成する硬化性樹脂には、電気的絶縁性を有する高反射性粉末が含有されることを特徴とする請求項1に記載の発光装置。
- 前記高反射性粉末は、TiO2粉末であることを特徴とする請求項6に記載の発光装置。
- 前記樹脂層には、電気的絶縁性を有する高反射性粉末が含有されたことを特徴とする請求項1に記載の発光装置。
- 前記高反射性粉末は、TiO2粉末であることを特徴とする請求項8に記載の発光装置。
- 前記第1外部端子用ブロック及び前記第2外部端子用ブロックは、前記接続部を有する絶縁性ブロック体からなることを特徴とする請求項1に記載の発光装置。
- 前記接続部は、前記第1外部端子用ブロック及び前記第2外部端子用ブロックの第2面に形成された電極層と、前記第2面から前記第1面まで延長される導電性ビアホールを含むことを特徴とする請求項10に記載の発光装置。
- 前記第1外部端子用ブロック及び前記第2外部端子用ブロックの導電性ビアホールは、前記パッケージ本体の側面に露出し、前記端子領域として提供されることを特徴とする請求項11に記載の発光装置。
- 前記絶縁性ブロック体は、セラミックスブロック体またはPCBブロックであることを特徴とする請求項11に記載の発光装置。
- 前記セラミックスブロック体は、多孔性構造物であることを特徴とする請求項13に記載の発光装置。
- 前記第1電極及び前記第2電極は、各々前記外部端子用ブロックのボンディング領域とワイヤボンディングにより電気的に接続されたことを特徴とする請求項1に記載の発光装置。
- 互いに反対に位置した第1及び第2主面とその間に位置した複数の側面からなる構造を有する硬化性樹脂からなるパッケージ本体と、
互いに反対に位置し、各々前記パッケージ本体の第1主面及び第2主面側に形成された第1面及び第2面とその間に位置した側面からなる構造を有し、前記パッケージ本体の内部の両端に各々配置され、各々前記パッケージ本体の内部に位置したボンディング領域と、それに接続され外部に露出した端子領域を有する接続部を具備した第1及び第2外部端子用ブロックと、
第1電極及び第2電極が形成された電極形成面と、これと反対に位置した光放出面を具備し、前記パッケージ本体の内部において前記第1外部端子用ブロック及び前記第2外部端子用ブロックの間に配置され、前記第1電極及び前記第2電極が各々前記第1外部端子用ブロック及び前記第2外部端子用ブロックのボンディング領域に電気的に接続した発光ダイオードチップと、前記外部端子用ブロックの第1面を覆うように形成された樹脂層と、を含み、前記パッケージ本体の第1主面及び前記発光ダイオードチップの光放出面は、前記外部端子用ブロックの第1面から外部に向かって突出するように形成されたことを特徴とする発光装置と、
前記発光装置の光放出面に隣接して配置され、前記発光装置から放出された光の経路を変更して出射させ、前記光放出面に向かう面に形成された溝を具備する導光板と、
を含み、
前記発光装置は、前記パッケージ本体の第1主面及び前記発光ダイオードチップの光放出面の突出した部分が前記溝に挿入されるように配置されたことを特徴とするバックライトユニット。
Applications Claiming Priority (2)
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KR1020080069185A KR20100008620A (ko) | 2008-07-16 | 2008-07-16 | 발광 장치 및 이를 구비하는 백라이트 유닛 |
KR10-2008-0069185 | 2008-07-16 |
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JP2010028071A JP2010028071A (ja) | 2010-02-04 |
JP4949362B2 true JP4949362B2 (ja) | 2012-06-06 |
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JP4903179B2 (ja) * | 2007-04-23 | 2012-03-28 | サムソン エルイーディー カンパニーリミテッド. | 発光装置及びその製造方法 |
US8408724B2 (en) * | 2008-12-26 | 2013-04-02 | Toshiba Lighting & Technology Corporation | Light source module and lighting apparatus |
EP2365525A3 (en) * | 2010-03-12 | 2013-05-29 | Toshiba Lighting & Technology Corporation | Illumination apparatus having an array of red and phosphour coated blue LEDs |
DE102010025319B4 (de) | 2010-06-28 | 2022-05-25 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines oberflächenmontierbaren Halbleiterbauelements und oberflächenmontierbare Halbleiterbauelemente |
US20120275157A1 (en) * | 2011-04-26 | 2012-11-01 | Yu-Mou Hsu | Lamp string structure for emitting light within wide area |
CN103137827B (zh) * | 2011-11-30 | 2016-02-10 | 展晶科技(深圳)有限公司 | 发光二极管封装结构及发光装置 |
KR102123039B1 (ko) * | 2013-07-19 | 2020-06-15 | 니치아 카가쿠 고교 가부시키가이샤 | 발광 장치 및 그 제조 방법 |
JP6303344B2 (ja) * | 2013-09-05 | 2018-04-04 | 日亜化学工業株式会社 | 発光装置 |
JP6256026B2 (ja) * | 2014-01-17 | 2018-01-10 | 日亜化学工業株式会社 | 発光装置及び発光装置の製造方法 |
KR101710871B1 (ko) | 2014-07-24 | 2017-02-28 | 조정권 | 조립식 컴퓨터 일체형 데스크 |
KR20160041108A (ko) * | 2014-10-06 | 2016-04-18 | 삼성전자주식회사 | 반도체 발광장치 |
JP6432280B2 (ja) * | 2014-10-24 | 2018-12-05 | 日亜化学工業株式会社 | 発光装置の製造方法 |
KR101710905B1 (ko) | 2015-05-15 | 2017-02-28 | 조정권 | 컴퓨터 결합 구조의 책상 |
KR101710900B1 (ko) | 2015-07-23 | 2017-02-28 | 조정권 | 퍼스널 컴퓨터 및 모니터 거치 구조의 책상 |
KR102025467B1 (ko) | 2017-04-28 | 2019-09-25 | 조정권 | 컴퓨터 일체형 조립 구조의 책상 |
KR102025469B1 (ko) | 2017-06-09 | 2019-09-25 | 조정권 | 컴퓨터 본체 또는 부품을 위한 수용 케이스 |
JP7032645B2 (ja) * | 2018-03-26 | 2022-03-09 | 日亜化学工業株式会社 | 発光モジュール及びその製造方法 |
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JP3992770B2 (ja) * | 1996-11-22 | 2007-10-17 | 日亜化学工業株式会社 | 発光装置及びその形成方法 |
JP2001077430A (ja) * | 1999-09-02 | 2001-03-23 | Citizen Electronics Co Ltd | 発光ダイオード |
JP3627592B2 (ja) * | 1999-10-08 | 2005-03-09 | 日亜化学工業株式会社 | 発光装置の製造方法 |
KR20030093774A (ko) | 2002-06-05 | 2003-12-11 | 광전자 주식회사 | 리드프레임, 상기 리드프레임을 이용한 칩 스케일 반도체패키지 및 그 제조방법 |
JP2004260048A (ja) * | 2003-02-27 | 2004-09-16 | Korai Kagi Kofun Yugenkoshi | マイクロタイプ発光装置 |
DE102004034166B4 (de) * | 2003-07-17 | 2015-08-20 | Toyoda Gosei Co., Ltd. | Lichtemittierende Vorrichtung |
JP4516337B2 (ja) | 2004-03-25 | 2010-08-04 | シチズン電子株式会社 | 半導体発光装置 |
JP2006278924A (ja) * | 2005-03-30 | 2006-10-12 | Toshiba Corp | 半導体発光装置及び半導体発光ユニット |
KR101055772B1 (ko) * | 2005-12-15 | 2011-08-11 | 서울반도체 주식회사 | 발광장치 |
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- 2008-07-16 KR KR1020080069185A patent/KR20100008620A/ko active IP Right Grant
- 2008-11-21 US US12/276,250 patent/US7942550B2/en not_active Expired - Fee Related
- 2008-12-05 JP JP2008311349A patent/JP4949362B2/ja not_active Expired - Fee Related
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US20100014279A1 (en) | 2010-01-21 |
US7942550B2 (en) | 2011-05-17 |
JP2010028071A (ja) | 2010-02-04 |
KR20100008620A (ko) | 2010-01-26 |
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